AU2002225952A1 - Method for making electronic devices including silicon and ltcc - Google Patents

Method for making electronic devices including silicon and ltcc

Info

Publication number
AU2002225952A1
AU2002225952A1 AU2002225952A AU2595202A AU2002225952A1 AU 2002225952 A1 AU2002225952 A1 AU 2002225952A1 AU 2002225952 A AU2002225952 A AU 2002225952A AU 2595202 A AU2595202 A AU 2595202A AU 2002225952 A1 AU2002225952 A1 AU 2002225952A1
Authority
AU
Australia
Prior art keywords
ltcc
electronic devices
devices including
including silicon
making electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002225952A
Other languages
English (en)
Inventor
Carol Gamlen
Charles M. Newton
Betty O'dowd
Randy T. Pike
Raymond C. Rumpf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harris Corp
Original Assignee
Harris Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harris Corp filed Critical Harris Corp
Publication of AU2002225952A1 publication Critical patent/AU2002225952A1/en
Abandoned legal-status Critical Current

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    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814Conductive parts
    • H01L21/4871Bases, plates or heatsinks
    • H01L21/4882Assembly of heatsink parts
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    • H01L21/34Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/18, H10D48/04 and H10D48/07, with or without impurities, e.g. doping materials
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
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  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Micromachines (AREA)
  • Ceramic Products (AREA)
AU2002225952A 2000-12-19 2001-12-10 Method for making electronic devices including silicon and ltcc Abandoned AU2002225952A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/741,754 2000-12-19
US09/741,754 US6809424B2 (en) 2000-12-19 2000-12-19 Method for making electronic devices including silicon and LTCC and devices produced thereby
PCT/US2001/046775 WO2002050888A2 (en) 2000-12-19 2001-12-10 Method for making electronic devices including silicon and ltcc

Publications (1)

Publication Number Publication Date
AU2002225952A1 true AU2002225952A1 (en) 2002-07-01

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Application Number Title Priority Date Filing Date
AU2002225952A Abandoned AU2002225952A1 (en) 2000-12-19 2001-12-10 Method for making electronic devices including silicon and ltcc

Country Status (7)

Country Link
US (2) US6809424B2 (enExample)
EP (1) EP1362368A2 (enExample)
JP (1) JP4454226B2 (enExample)
KR (1) KR100574582B1 (enExample)
CN (1) CN1494739A (enExample)
AU (1) AU2002225952A1 (enExample)
WO (1) WO2002050888A2 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6976527B2 (en) * 2001-07-17 2005-12-20 The Regents Of The University Of California MEMS microcapillary pumped loop for chip-level temperature control
JP3896840B2 (ja) * 2001-12-13 2007-03-22 ソニー株式会社 冷却装置、電子機器装置及び冷却装置の製造方法
US6741469B1 (en) * 2003-02-07 2004-05-25 Sun Microsystems, Inc. Refrigeration cooling assisted MEMS-based micro-channel cooling system
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US20020130408A1 (en) 2002-09-19
CN1494739A (zh) 2004-05-05
WO2002050888A2 (en) 2002-06-27
JP2004537156A (ja) 2004-12-09
WO2002050888A3 (en) 2003-08-07
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KR100574582B1 (ko) 2006-04-28
US6987033B2 (en) 2006-01-17

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