JP4445281B2 - X線検出器パネル組立体を製造する方法及びデジタルx線パネル - Google Patents

X線検出器パネル組立体を製造する方法及びデジタルx線パネル Download PDF

Info

Publication number
JP4445281B2
JP4445281B2 JP2004033028A JP2004033028A JP4445281B2 JP 4445281 B2 JP4445281 B2 JP 4445281B2 JP 2004033028 A JP2004033028 A JP 2004033028A JP 2004033028 A JP2004033028 A JP 2004033028A JP 4445281 B2 JP4445281 B2 JP 4445281B2
Authority
JP
Japan
Prior art keywords
layer
detector
dam
moisture barrier
ray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004033028A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004245833A5 (enExample
JP2004245833A (ja
Inventor
マイケル・クレメント・デジュレ
チン−イウ・ウェイ
デビッド・フランシス・フォベア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JP2004245833A publication Critical patent/JP2004245833A/ja
Publication of JP2004245833A5 publication Critical patent/JP2004245833A5/ja
Application granted granted Critical
Publication of JP4445281B2 publication Critical patent/JP4445281B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/20Measuring radiation intensity with scintillation detectors
    • G01T1/2018Scintillation-photodiode combinations
    • G01T1/20188Auxiliary details, e.g. casings or cooling
    • G01T1/20189Damping or insulation against damage, e.g. caused by heat or pressure
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F30/00Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
    • H10F30/20Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
    • H10F30/29Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to radiation having very short wavelengths, e.g. X-rays, gamma-rays or corpuscular radiation
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/189X-ray, gamma-ray or corpuscular radiation imagers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/30Coatings

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Measurement Of Radiation (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2004033028A 2003-02-12 2004-02-10 X線検出器パネル組立体を製造する方法及びデジタルx線パネル Expired - Fee Related JP4445281B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/365,093 US7473903B2 (en) 2003-02-12 2003-02-12 Method and apparatus for deposited hermetic cover for digital X-ray panel

Publications (3)

Publication Number Publication Date
JP2004245833A JP2004245833A (ja) 2004-09-02
JP2004245833A5 JP2004245833A5 (enExample) 2007-03-22
JP4445281B2 true JP4445281B2 (ja) 2010-04-07

Family

ID=32736392

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004033028A Expired - Fee Related JP4445281B2 (ja) 2003-02-12 2004-02-10 X線検出器パネル組立体を製造する方法及びデジタルx線パネル

Country Status (4)

Country Link
US (1) US7473903B2 (enExample)
JP (1) JP4445281B2 (enExample)
DE (1) DE102004005883A1 (enExample)
FR (1) FR2851051A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170138403A (ko) 2015-04-20 2017-12-15 하마마츠 포토닉스 가부시키가이샤 방사선 검출기 및 그 제조 방법

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7492019B2 (en) * 2003-03-07 2009-02-17 Ic Mechanics, Inc. Micromachined assembly with a multi-layer cap defining a cavity
DE102005055176A1 (de) * 2005-11-18 2007-05-31 Siemens Ag Flachbilddetektor
JP2007149842A (ja) * 2005-11-25 2007-06-14 Sanyo Electric Co Ltd 半導体装置
DE102006022138A1 (de) * 2006-05-11 2007-11-15 Siemens Ag Szintillatorplatte
DE102006024893A1 (de) * 2006-05-24 2007-12-06 Siemens Ag Szintillatorplatte
DE102006038969B4 (de) * 2006-08-21 2013-02-28 Siemens Aktiengesellschaft Röntgenkonverterelement und Verfahren zu dessen Herstellung
JP5883556B2 (ja) * 2010-06-04 2016-03-15 浜松ホトニクス株式会社 放射線イメージセンサ
JP2012168128A (ja) * 2011-02-16 2012-09-06 Canon Inc 放射線検出装置及び放射線撮像システム
US8415628B1 (en) 2011-10-31 2013-04-09 General Electric Company Hermetically sealed radiation detector and methods for making
WO2014187502A1 (en) * 2013-05-24 2014-11-27 Teledyne Dalsa B.V. A moisture protection structure for a device and a fabrication method thereof
US10712454B2 (en) * 2014-07-25 2020-07-14 General Electric Company X-ray detectors supported on a substrate having a metal barrier
WO2016077906A1 (en) * 2014-11-21 2016-05-26 Teledyne Dalsa, Inc. Mammography detector with small chest distance
US10299744B2 (en) 2016-11-17 2019-05-28 General Electric Company Scintillator sealing for solid state x-ray detector
US10631801B2 (en) 2016-11-17 2020-04-28 General Electric Company Scintillator sealing for solid state X-ray detector
US9871073B1 (en) 2016-11-22 2018-01-16 General Electric Company Scintillator sealing for solid state X-ray detector
US9812510B1 (en) 2016-12-14 2017-11-07 General Electric Company Packaging organic photodetectors
JP6877289B2 (ja) * 2017-07-31 2021-05-26 キヤノン株式会社 放射線検出装置、放射線検出システム、及び放射線出装置の製造方法
KR102666048B1 (ko) * 2019-05-29 2024-05-13 엘지디스플레이 주식회사 디지털 엑스레이 검출기와 이를 포함하는 디지털 엑스레이 검출 장치 및 이의 제조 방법
CN114639689B (zh) * 2020-12-15 2025-03-18 京东方科技集团股份有限公司 平板探测器、其制作方法及x射线成像系统

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5187369A (en) * 1990-10-01 1993-02-16 General Electric Company High sensitivity, high resolution, solid state x-ray imaging device with barrier layer
US5179284A (en) * 1991-08-21 1993-01-12 General Electric Company Solid state radiation imager having a reflective and protective coating
US5231654A (en) * 1991-12-06 1993-07-27 General Electric Company Radiation imager collimator
US5231655A (en) * 1991-12-06 1993-07-27 General Electric Company X-ray collimator
US5463225A (en) * 1992-06-01 1995-10-31 General Electric Company Solid state radiation imager with high integrity barrier layer and method of fabricating
US5399884A (en) * 1993-11-10 1995-03-21 General Electric Company Radiation imager with single passivation dielectric for transistor and diode
US5435608A (en) * 1994-06-17 1995-07-25 General Electric Company Radiation imager with common passivation dielectric for gate electrode and photosensor
US5517031A (en) * 1994-06-21 1996-05-14 General Electric Company Solid state imager with opaque layer
US5430298A (en) * 1994-06-21 1995-07-04 General Electric Company CT array with improved photosensor linearity and reduced crosstalk
US6037609A (en) * 1997-01-17 2000-03-14 General Electric Company Corrosion resistant imager
US6167110A (en) * 1997-11-03 2000-12-26 General Electric Company High voltage x-ray and conventional radiography imaging apparatus and method
CN1130200C (zh) * 1998-05-15 2003-12-10 利兰·斯坦福青年大学托管委员会 用于治疗痴呆的糖皮质激素受体拮抗剂
US6172371B1 (en) * 1998-06-15 2001-01-09 General Electric Company Robust cover plate for radiation imager
US6414315B1 (en) * 1999-10-04 2002-07-02 General Electric Company Radiation imaging with continuous polymer layer for scintillator
US6396046B1 (en) 1999-11-02 2002-05-28 General Electric Company Imager with reduced FET photoresponse and high integrity contact via
US6350990B1 (en) * 1999-11-04 2002-02-26 General Electric Company End cap and sealing method for imager
US6353654B1 (en) * 1999-12-30 2002-03-05 General Electric Company Method and apparatus for compensating for image retention in an amorphous silicon imaging detector
JP4234304B2 (ja) * 2000-05-19 2009-03-04 浜松ホトニクス株式会社 放射線検出器
US6642524B2 (en) * 2002-01-09 2003-11-04 Ge Medical Systems Global Technology Company, Llc Scintillator sealing for solid state X-ray detector

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170138403A (ko) 2015-04-20 2017-12-15 하마마츠 포토닉스 가부시키가이샤 방사선 검출기 및 그 제조 방법
US10379229B2 (en) 2015-04-20 2019-08-13 Hamamatsu Photonics K.K. Radiation detector and method for producing same

Also Published As

Publication number Publication date
US20040155320A1 (en) 2004-08-12
FR2851051A1 (fr) 2004-08-13
US7473903B2 (en) 2009-01-06
DE102004005883A1 (de) 2004-08-26
JP2004245833A (ja) 2004-09-02

Similar Documents

Publication Publication Date Title
JP4445281B2 (ja) X線検出器パネル組立体を製造する方法及びデジタルx線パネル
JP3077941B2 (ja) 放射線検出素子及びその製造方法
JP3126715B2 (ja) シンチレータパネル及び放射線イメージセンサ
US7408177B2 (en) Scintillator panel and radiation image sensor
JP3405706B2 (ja) 放射線検出素子
JP4317921B2 (ja) X線検出器アセンブリ
EP1134596A2 (en) Radiation detection device and method of making the same
US7126130B2 (en) Direct scintillator coating for radiation detector assembly longevity
US20110147602A1 (en) Radiographic imaging apparatus, radiographic imaging system, and method of producing radiographic imaging apparatus
KR20010052994A (ko) 방사선 이미지 센서
JPH05242841A (ja) 防湿シール構造を有する平面x線イメージャ
JP4234304B2 (ja) 放射線検出器
TWI591368B (zh) Radiation detector and manufacturing method thereof
JP4099206B2 (ja) シンチレータパネル及び放射線イメージセンサ
JP3987438B2 (ja) シンチレータパネル及び放射線イメージセンサ
EP1300694B1 (en) Radiation detector and method of manufacture thereof
JP4512439B2 (ja) X線検出器アセンブリ
JP2004301516A (ja) 放射線検出装置
JP2014059246A (ja) 放射線検出器およびその製造方法
JP2004325126A (ja) 放射線検出装置
JP4283863B2 (ja) シンチレータパネル
JP4234303B2 (ja) 放射線検出器
EP4325255A1 (en) Manufacturing method of a radiation imaging apparatus
WO2019097847A1 (ja) 放射線撮像パネル、放射線撮像装置および放射線撮像システム
JP2007205935A (ja) 放射線検出器

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070206

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070206

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081202

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20090224

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20090227

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090402

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20090402

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20090402

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090512

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090810

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20090928

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20091222

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100115

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130122

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees