JP4440219B2 - 担持体上に半導体デバイスを位置合わせするための装置及び方法 - Google Patents

担持体上に半導体デバイスを位置合わせするための装置及び方法 Download PDF

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Publication number
JP4440219B2
JP4440219B2 JP2006003008A JP2006003008A JP4440219B2 JP 4440219 B2 JP4440219 B2 JP 4440219B2 JP 2006003008 A JP2006003008 A JP 2006003008A JP 2006003008 A JP2006003008 A JP 2006003008A JP 4440219 B2 JP4440219 B2 JP 4440219B2
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Japan
Prior art keywords
semiconductor device
carrier
holder
alignment
pocket
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Active
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JP2006003008A
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English (en)
Japanese (ja)
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JP2006191121A (ja
JP2006191121A5 (enExample
Inventor
チー・ワ・チェン
ジョセフ・ホイ・シェン・タン
トニー・ティム・ワイ・マック
チ・ハン・レン
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ASM Assembly Automation Ltd
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ASM Assembly Automation Ltd
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Publication of JP2006191121A5 publication Critical patent/JP2006191121A5/ja
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433Sockets for IC's or transistors
    • G01R1/0441Details
    • G01R1/045Sockets or component fixtures for RF or HF testing
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F9/00Methods or devices for treatment of the eyes; Devices for putting in contact-lenses; Devices to correct squinting; Apparatus to guide the blind; Protective devices for the eyes, carried on the body or in the hand
    • A61F9/02Goggles
    • A61F9/025Special attachment of screens, e.g. hinged, removable; Roll-up protective layers
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F9/00Methods or devices for treatment of the eyes; Devices for putting in contact-lenses; Devices to correct squinting; Apparatus to guide the blind; Protective devices for the eyes, carried on the body or in the hand
    • A61F9/02Goggles
    • A61F9/027Straps; Buckles; Attachment of headbands
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F9/00Methods or devices for treatment of the eyes; Devices for putting in contact-lenses; Devices to correct squinting; Apparatus to guide the blind; Protective devices for the eyes, carried on the body or in the hand
    • A61F9/02Goggles
    • A61F9/029Additional functions or features, e.g. protection for other parts of the face such as ears, nose or mouth; Screen wipers or cleaning devices
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61FFILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, e.g. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS
    • A61F2250/00Special features of prostheses classified in groups A61F2/00 - A61F2/26 or A61F2/82 or A61F9/00 or A61F11/00 or subgroups thereof
    • A61F2250/0058Additional features; Implant or prostheses properties not otherwise provided for
    • A61F2250/0073Force-limiting means
    • A61F2250/0074Torque-limiting means

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Vascular Medicine (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • Ophthalmology & Optometry (AREA)
  • Biomedical Technology (AREA)
  • Veterinary Medicine (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Otolaryngology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2006003008A 2005-01-07 2006-01-10 担持体上に半導体デバイスを位置合わせするための装置及び方法 Active JP4440219B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/031,024 US7258703B2 (en) 2005-01-07 2005-01-07 Apparatus and method for aligning devices on carriers

Publications (3)

Publication Number Publication Date
JP2006191121A JP2006191121A (ja) 2006-07-20
JP2006191121A5 JP2006191121A5 (enExample) 2009-09-03
JP4440219B2 true JP4440219B2 (ja) 2010-03-24

Family

ID=36653765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006003008A Active JP4440219B2 (ja) 2005-01-07 2006-01-10 担持体上に半導体デバイスを位置合わせするための装置及び方法

Country Status (7)

Country Link
US (1) US7258703B2 (enExample)
JP (1) JP4440219B2 (enExample)
KR (1) KR100799896B1 (enExample)
CN (1) CN100403510C (enExample)
MY (1) MY136858A (enExample)
SG (1) SG123786A1 (enExample)
TW (1) TWI286813B (enExample)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7258703B2 (en) * 2005-01-07 2007-08-21 Asm Assembly Automation Ltd. Apparatus and method for aligning devices on carriers
US7726540B2 (en) * 2005-12-12 2010-06-01 Asm Assembly Automation Ltd. Apparatus and method for arranging devices for processing
JP2008003049A (ja) * 2006-06-26 2008-01-10 Micronics Japan Co Ltd プローブ組立体
US8011058B2 (en) * 2006-10-31 2011-09-06 Asm Assembly Automation Ltd Singulation handler system for electronic packages
US7965091B2 (en) * 2007-04-30 2011-06-21 Electro Scientific Industries, Inc. Test plate for electronic handler
KR100885492B1 (ko) * 2007-06-04 2009-02-24 (주)케이엔씨 반도체 소자 영상 검사용 클램핑 장치
KR100901523B1 (ko) * 2007-07-16 2009-06-08 (주)테크윙 테스트핸들러용 개방기 및 버퍼테이블
DE202009018726U1 (de) * 2008-02-15 2012-11-27 Multitest Elektronische Systeme Gmbh Vorrichtung zum Ausrichten und Halten einer Mehrzahl singulierter Halbleiterbauelemente in Aufnahmetaschen eines Klemmträgers
KR100981130B1 (ko) 2008-09-10 2010-09-14 주식회사 하나엔-텍 케리어소켓의 포켓교체장치
KR101029369B1 (ko) * 2009-01-23 2011-04-13 (주) 에스에스피 자동화 장비의 자재 정렬장치
DE102009018393B4 (de) * 2009-04-22 2017-05-24 Atotech Deutschland Gmbh Verfahren, Haltemittel, Vorrichtung und System zum Transportieren eines flächigen Behandlungsgutes und Be- oder Entladeeinrichtung
US8522754B2 (en) * 2009-07-01 2013-09-03 International Engine Intellectual Property Company, Llc. Fuel injector clamp
MY152834A (en) 2009-08-18 2014-11-28 Multitest Elektronische Syst An elastic unit for clamping an electronic component and extending below an electronic component receiving volume of an align fixture
MY154258A (en) * 2009-08-18 2015-05-29 Multitest Elektronische Syst Elastic unit exerting two angled force components on an abutting section of an align fixture
MY152429A (en) * 2009-08-18 2014-09-30 Multitest Elektronische Syst Carrier for aligning electronic components with slidably arranged plates
MY160276A (en) * 2009-08-18 2017-02-28 Multitest Elektronische Systeme Gmbh An elastic unit as a separate elastic member to be mounted at an elastic unit receiving section of an align fixture
MY151553A (en) 2009-08-18 2014-06-13 Multitest Elektronische Syst Two abutting sections of an align fixture together floatingly engaging an electronic component
MY152434A (en) * 2009-08-18 2014-09-30 Multitest Elektronische Syst System for post-processing of electronic components
US8683674B2 (en) * 2010-12-07 2014-04-01 Centipede Systems, Inc. Method for stacking microelectronic devices
US20120249172A1 (en) * 2011-03-31 2012-10-04 Electro Scientific Industries, Inc. Alignment system for electronic device testing
CN102914951B (zh) * 2011-08-04 2014-11-12 上海微电子装备有限公司 用于光刻设备的预对准装置
CN102335972A (zh) * 2011-10-24 2012-02-01 无锡绿波新能源设备有限公司 真空吸盘
ITTO20120321A1 (it) * 2012-04-12 2013-10-13 Spea Spa Unita' di supporto e posizionamento di componenti a semiconduttore
KR101404979B1 (ko) * 2012-07-24 2014-06-10 (주)에이젯 반도체 디바이스 정렬 장치 및 정렬 방법
JP5986447B2 (ja) * 2012-07-25 2016-09-06 株式会社アルバック トレイ、基板の位置調整システム、及び露光装置
EP2765431B1 (en) * 2013-02-11 2016-05-25 Rasco GmbH Carrier for electronic components
ITTO20130324A1 (it) * 2013-04-22 2014-10-23 St Microelectronics Srl Dispositivo vibrante per il posizionamento di un pezzo miniaturizzato in una sede di test, e metodo di posizionamento
US9857419B2 (en) * 2013-07-12 2018-01-02 Delta Design, Inc. Micro-vision alignment system with guiding rings for IC testing
US10041973B2 (en) * 2013-09-04 2018-08-07 Infineon Technologies Ag Method and apparatus for dynamic alignment of semiconductor devices
EP2884293A1 (en) 2013-12-12 2015-06-17 Rasco GmbH Semiconductor device carrier
KR101748248B1 (ko) * 2014-03-25 2017-06-16 가부시키가이샤 어드밴티스트 핸들러 장치 및 시험 장치
US9772373B2 (en) * 2014-03-25 2017-09-26 Advantest Corporation Handler apparatus, device holder, and test apparatus
CN104605599B (zh) * 2015-02-12 2016-04-13 京东方科技集团股份有限公司 一种ic盘盒
DE102016004592B4 (de) 2016-04-14 2017-11-02 Mühlbauer Gmbh & Co. Kg System und Verfahren zum Ausrichten elektronischer Bauteile
US10473714B2 (en) * 2017-03-06 2019-11-12 Asm Technology Singapore Pte Ltd Method and apparatus for aligning electronic components
CN111742232A (zh) 2017-12-19 2020-10-02 波士顿半导体设备有限公司 无套件取放处理机
CN108922860B (zh) * 2018-08-27 2023-12-12 无锡中微高科电子有限公司 一种全阵列引脚陶瓷外壳的自动装片夹具
DE102020200817B3 (de) * 2020-01-23 2021-06-17 Lpkf Laser & Electronics Aktiengesellschaft Montageverfahren für eine integrierte Halbleiter-Waver-Vorrichtung und dafür verwendbare Montagevorrichtung
KR102291194B1 (ko) * 2020-03-09 2021-08-20 에이엠티 주식회사 미세 피치를 갖는 디바이스의 얼라인장치 및 그 방법
KR102295435B1 (ko) * 2020-03-12 2021-08-31 에이엠티 주식회사 미세 피치를 갖는 디바이스의 얼라인 및 테스트장치 그리고 디바이스의 얼라인방법
WO2022038700A1 (ja) * 2020-08-19 2022-02-24 株式会社新川 基板保持具、並びに、ボンディングシステム及びボンディング方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3870416A (en) * 1974-01-09 1975-03-11 Bell Telephone Labor Inc Wafer alignment apparatus
JPH088293B2 (ja) * 1987-09-01 1996-01-29 住友電気工業株式会社 チップ実装装置
JPH03133784A (ja) * 1989-10-16 1991-06-06 Nec Kyushu Ltd 半導体装置用トレー
JPH0831544B2 (ja) * 1993-06-29 1996-03-27 山一電機株式会社 Icキャリア
US5697748A (en) * 1993-07-15 1997-12-16 Applied Materials, Inc. Wafer tray and ceramic blade for semiconductor processing apparatus
DE19509999C2 (de) * 1995-03-22 1998-04-16 David Finn Verfahren und Vorrichtung zur Herstellung einer Transpondereinheit sowie Transpondereinheit
US5688127A (en) * 1995-07-24 1997-11-18 Vlsi Technology, Inc. Universal contactor system for testing ball grid array (BGA) devices on multiple handlers and method therefor
JP3314663B2 (ja) * 1997-05-22 2002-08-12 松下電器産業株式会社 チップのボンディング装置
US6082547A (en) * 1998-03-27 2000-07-04 Fluoroware, Inc. Adapter jig
KR200169340Y1 (ko) * 1999-08-28 2000-02-15 아남반도체주식회사 반도체패키지 제조용 범용 보트 캐리어
US6375791B1 (en) * 1999-12-20 2002-04-23 Lsi Logic Corporation Method and apparatus for detecting presence of residual polishing slurry subsequent to polishing of a semiconductor wafer
US6338297B1 (en) * 2000-05-26 2002-01-15 Industrial Technology Research Institute Precise and rapid positioning mechanism for stencil printing
US6709877B2 (en) * 2001-07-23 2004-03-23 Asm Assembly Automation Limited Apparatus and method for testing semiconductor devices
US6991960B2 (en) * 2001-08-30 2006-01-31 Micron Technology, Inc. Method of semiconductor device package alignment and method of testing
JP3565201B2 (ja) * 2001-11-20 2004-09-15 松下電器産業株式会社 チップの実装方法
US20050072714A1 (en) * 2003-10-06 2005-04-07 Eleveld Martin J. Standard tray carrier for aligning trays
US7258703B2 (en) * 2005-01-07 2007-08-21 Asm Assembly Automation Ltd. Apparatus and method for aligning devices on carriers

Also Published As

Publication number Publication date
MY136858A (en) 2008-11-28
SG123786A1 (en) 2006-07-26
US7258703B2 (en) 2007-08-21
CN1819136A (zh) 2006-08-16
KR20060081356A (ko) 2006-07-12
JP2006191121A (ja) 2006-07-20
CN100403510C (zh) 2008-07-16
TWI286813B (en) 2007-09-11
KR100799896B1 (ko) 2008-01-31
TW200629465A (en) 2006-08-16
US20060154386A1 (en) 2006-07-13

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