JP2006191121A5 - - Google Patents

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Publication number
JP2006191121A5
JP2006191121A5 JP2006003008A JP2006003008A JP2006191121A5 JP 2006191121 A5 JP2006191121 A5 JP 2006191121A5 JP 2006003008 A JP2006003008 A JP 2006003008A JP 2006003008 A JP2006003008 A JP 2006003008A JP 2006191121 A5 JP2006191121 A5 JP 2006191121A5
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JP
Japan
Prior art keywords
semiconductor device
carrier
holder
alignment
clamping plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006003008A
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English (en)
Japanese (ja)
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JP2006191121A (ja
JP4440219B2 (ja
Filing date
Publication date
Priority claimed from US11/031,024 external-priority patent/US7258703B2/en
Application filed filed Critical
Publication of JP2006191121A publication Critical patent/JP2006191121A/ja
Publication of JP2006191121A5 publication Critical patent/JP2006191121A5/ja
Application granted granted Critical
Publication of JP4440219B2 publication Critical patent/JP4440219B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2006003008A 2005-01-07 2006-01-10 担持体上に半導体デバイスを位置合わせするための装置及び方法 Active JP4440219B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/031,024 US7258703B2 (en) 2005-01-07 2005-01-07 Apparatus and method for aligning devices on carriers

Publications (3)

Publication Number Publication Date
JP2006191121A JP2006191121A (ja) 2006-07-20
JP2006191121A5 true JP2006191121A5 (enExample) 2009-09-03
JP4440219B2 JP4440219B2 (ja) 2010-03-24

Family

ID=36653765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006003008A Active JP4440219B2 (ja) 2005-01-07 2006-01-10 担持体上に半導体デバイスを位置合わせするための装置及び方法

Country Status (7)

Country Link
US (1) US7258703B2 (enExample)
JP (1) JP4440219B2 (enExample)
KR (1) KR100799896B1 (enExample)
CN (1) CN100403510C (enExample)
MY (1) MY136858A (enExample)
SG (1) SG123786A1 (enExample)
TW (1) TWI286813B (enExample)

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US7258703B2 (en) * 2005-01-07 2007-08-21 Asm Assembly Automation Ltd. Apparatus and method for aligning devices on carriers
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DE202009018726U1 (de) * 2008-02-15 2012-11-27 Multitest Elektronische Systeme Gmbh Vorrichtung zum Ausrichten und Halten einer Mehrzahl singulierter Halbleiterbauelemente in Aufnahmetaschen eines Klemmträgers
KR100981130B1 (ko) 2008-09-10 2010-09-14 주식회사 하나엔-텍 케리어소켓의 포켓교체장치
KR101029369B1 (ko) * 2009-01-23 2011-04-13 (주) 에스에스피 자동화 장비의 자재 정렬장치
DE102009018393B4 (de) * 2009-04-22 2017-05-24 Atotech Deutschland Gmbh Verfahren, Haltemittel, Vorrichtung und System zum Transportieren eines flächigen Behandlungsgutes und Be- oder Entladeeinrichtung
US8522754B2 (en) * 2009-07-01 2013-09-03 International Engine Intellectual Property Company, Llc. Fuel injector clamp
MY152834A (en) 2009-08-18 2014-11-28 Multitest Elektronische Syst An elastic unit for clamping an electronic component and extending below an electronic component receiving volume of an align fixture
MY154258A (en) * 2009-08-18 2015-05-29 Multitest Elektronische Syst Elastic unit exerting two angled force components on an abutting section of an align fixture
MY152429A (en) * 2009-08-18 2014-09-30 Multitest Elektronische Syst Carrier for aligning electronic components with slidably arranged plates
MY160276A (en) * 2009-08-18 2017-02-28 Multitest Elektronische Systeme Gmbh An elastic unit as a separate elastic member to be mounted at an elastic unit receiving section of an align fixture
MY151553A (en) 2009-08-18 2014-06-13 Multitest Elektronische Syst Two abutting sections of an align fixture together floatingly engaging an electronic component
MY152434A (en) * 2009-08-18 2014-09-30 Multitest Elektronische Syst System for post-processing of electronic components
US8683674B2 (en) * 2010-12-07 2014-04-01 Centipede Systems, Inc. Method for stacking microelectronic devices
US20120249172A1 (en) * 2011-03-31 2012-10-04 Electro Scientific Industries, Inc. Alignment system for electronic device testing
CN102914951B (zh) * 2011-08-04 2014-11-12 上海微电子装备有限公司 用于光刻设备的预对准装置
CN102335972A (zh) * 2011-10-24 2012-02-01 无锡绿波新能源设备有限公司 真空吸盘
ITTO20120321A1 (it) * 2012-04-12 2013-10-13 Spea Spa Unita' di supporto e posizionamento di componenti a semiconduttore
KR101404979B1 (ko) * 2012-07-24 2014-06-10 (주)에이젯 반도체 디바이스 정렬 장치 및 정렬 방법
JP5986447B2 (ja) * 2012-07-25 2016-09-06 株式会社アルバック トレイ、基板の位置調整システム、及び露光装置
EP2765431B1 (en) * 2013-02-11 2016-05-25 Rasco GmbH Carrier for electronic components
ITTO20130324A1 (it) * 2013-04-22 2014-10-23 St Microelectronics Srl Dispositivo vibrante per il posizionamento di un pezzo miniaturizzato in una sede di test, e metodo di posizionamento
US9857419B2 (en) * 2013-07-12 2018-01-02 Delta Design, Inc. Micro-vision alignment system with guiding rings for IC testing
US10041973B2 (en) * 2013-09-04 2018-08-07 Infineon Technologies Ag Method and apparatus for dynamic alignment of semiconductor devices
EP2884293A1 (en) 2013-12-12 2015-06-17 Rasco GmbH Semiconductor device carrier
KR101748248B1 (ko) * 2014-03-25 2017-06-16 가부시키가이샤 어드밴티스트 핸들러 장치 및 시험 장치
US9772373B2 (en) * 2014-03-25 2017-09-26 Advantest Corporation Handler apparatus, device holder, and test apparatus
CN104605599B (zh) * 2015-02-12 2016-04-13 京东方科技集团股份有限公司 一种ic盘盒
DE102016004592B4 (de) 2016-04-14 2017-11-02 Mühlbauer Gmbh & Co. Kg System und Verfahren zum Ausrichten elektronischer Bauteile
US10473714B2 (en) * 2017-03-06 2019-11-12 Asm Technology Singapore Pte Ltd Method and apparatus for aligning electronic components
CN111742232A (zh) 2017-12-19 2020-10-02 波士顿半导体设备有限公司 无套件取放处理机
CN108922860B (zh) * 2018-08-27 2023-12-12 无锡中微高科电子有限公司 一种全阵列引脚陶瓷外壳的自动装片夹具
DE102020200817B3 (de) * 2020-01-23 2021-06-17 Lpkf Laser & Electronics Aktiengesellschaft Montageverfahren für eine integrierte Halbleiter-Waver-Vorrichtung und dafür verwendbare Montagevorrichtung
KR102291194B1 (ko) * 2020-03-09 2021-08-20 에이엠티 주식회사 미세 피치를 갖는 디바이스의 얼라인장치 및 그 방법
KR102295435B1 (ko) * 2020-03-12 2021-08-31 에이엠티 주식회사 미세 피치를 갖는 디바이스의 얼라인 및 테스트장치 그리고 디바이스의 얼라인방법
WO2022038700A1 (ja) * 2020-08-19 2022-02-24 株式会社新川 基板保持具、並びに、ボンディングシステム及びボンディング方法

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US7258703B2 (en) * 2005-01-07 2007-08-21 Asm Assembly Automation Ltd. Apparatus and method for aligning devices on carriers

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