JP4438038B2 - 面型受光素子、およびその製造方法 - Google Patents

面型受光素子、およびその製造方法 Download PDF

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Publication number
JP4438038B2
JP4438038B2 JP2000218131A JP2000218131A JP4438038B2 JP 4438038 B2 JP4438038 B2 JP 4438038B2 JP 2000218131 A JP2000218131 A JP 2000218131A JP 2000218131 A JP2000218131 A JP 2000218131A JP 4438038 B2 JP4438038 B2 JP 4438038B2
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JP
Japan
Prior art keywords
substrate
light
electrode
receiving element
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2000218131A
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English (en)
Japanese (ja)
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JP2002033505A (ja
JP2002033505A5 (enExample
Inventor
敏彦 尾内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2000218131A priority Critical patent/JP4438038B2/ja
Publication of JP2002033505A publication Critical patent/JP2002033505A/ja
Publication of JP2002033505A5 publication Critical patent/JP2002033505A5/ja
Application granted granted Critical
Publication of JP4438038B2 publication Critical patent/JP4438038B2/ja
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
JP2000218131A 2000-07-19 2000-07-19 面型受光素子、およびその製造方法 Expired - Fee Related JP4438038B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000218131A JP4438038B2 (ja) 2000-07-19 2000-07-19 面型受光素子、およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000218131A JP4438038B2 (ja) 2000-07-19 2000-07-19 面型受光素子、およびその製造方法

Publications (3)

Publication Number Publication Date
JP2002033505A JP2002033505A (ja) 2002-01-31
JP2002033505A5 JP2002033505A5 (enExample) 2007-09-06
JP4438038B2 true JP4438038B2 (ja) 2010-03-24

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ID=18713129

Family Applications (1)

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JP2000218131A Expired - Fee Related JP4438038B2 (ja) 2000-07-19 2000-07-19 面型受光素子、およびその製造方法

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JP (1) JP4438038B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220244111A1 (en) * 2021-02-01 2022-08-04 Fuji Electric Co., Ltd. Semiconductor device and temperature measurement method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004090976A2 (en) * 2003-04-02 2004-10-21 Sun Microsystems, Inc. Optical communication between face-to-face semiconductor chips
US7723206B2 (en) * 2007-12-05 2010-05-25 Fujifilm Corporation Photodiode
JP5486542B2 (ja) 2011-03-31 2014-05-07 浜松ホトニクス株式会社 フォトダイオードアレイモジュール及びその製造方法
JP6944315B2 (ja) * 2017-09-05 2021-10-06 浜松ホトニクス株式会社 光検出素子

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639163A (ja) * 1986-06-30 1988-01-14 Nec Corp 半導体受光素子
JP2642645B2 (ja) * 1987-11-19 1997-08-20 株式会社日立製作所 半導体基板の製造方法及び半導体装置の製造方法
JP2651323B2 (ja) * 1992-07-22 1997-09-10 浜松ホトニクス株式会社 半導体エネルギー検出器
JPH06151946A (ja) * 1992-11-12 1994-05-31 Nippon Telegr & Teleph Corp <Ntt> 半導体受光素子およびその製造方法
JPH07153986A (ja) * 1993-12-01 1995-06-16 Fujitsu Ltd 赤外線検知装置
JP3236774B2 (ja) * 1996-02-16 2001-12-10 日本電信電話株式会社 半導体集積回路
JP3610235B2 (ja) * 1998-07-22 2005-01-12 キヤノン株式会社 面型発光素子装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220244111A1 (en) * 2021-02-01 2022-08-04 Fuji Electric Co., Ltd. Semiconductor device and temperature measurement method
US12163845B2 (en) * 2021-02-01 2024-12-10 Fuji Electric Co., Ltd. Semiconductor device and temperature measurement method

Also Published As

Publication number Publication date
JP2002033505A (ja) 2002-01-31

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