JP4435580B2 - 加圧水噴射装置及びそれを用いた基板洗浄装置 - Google Patents
加圧水噴射装置及びそれを用いた基板洗浄装置 Download PDFInfo
- Publication number
- JP4435580B2 JP4435580B2 JP2004001942A JP2004001942A JP4435580B2 JP 4435580 B2 JP4435580 B2 JP 4435580B2 JP 2004001942 A JP2004001942 A JP 2004001942A JP 2004001942 A JP2004001942 A JP 2004001942A JP 4435580 B2 JP4435580 B2 JP 4435580B2
- Authority
- JP
- Japan
- Prior art keywords
- water
- pressurized water
- pressurized
- cleaning
- annular electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims description 125
- 238000004140 cleaning Methods 0.000 title claims description 39
- 239000000758 substrate Substances 0.000 title claims description 34
- 230000005611 electricity Effects 0.000 claims description 40
- 230000003068 static effect Effects 0.000 claims description 40
- 238000002347 injection Methods 0.000 claims description 31
- 239000007924 injection Substances 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 5
- 238000004401 flow injection analysis Methods 0.000 claims description 2
- 238000005507 spraying Methods 0.000 claims description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 20
- 239000012498 ultrapure water Substances 0.000 description 20
- 239000007789 gas Substances 0.000 description 11
- 238000005406 washing Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000005684 electric field Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000003472 neutralizing effect Effects 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000008400 supply water Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004001942A JP4435580B2 (ja) | 2004-01-07 | 2004-01-07 | 加圧水噴射装置及びそれを用いた基板洗浄装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004001942A JP4435580B2 (ja) | 2004-01-07 | 2004-01-07 | 加圧水噴射装置及びそれを用いた基板洗浄装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005197444A JP2005197444A (ja) | 2005-07-21 |
| JP2005197444A5 JP2005197444A5 (enExample) | 2006-12-07 |
| JP4435580B2 true JP4435580B2 (ja) | 2010-03-17 |
Family
ID=34817311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004001942A Expired - Lifetime JP4435580B2 (ja) | 2004-01-07 | 2004-01-07 | 加圧水噴射装置及びそれを用いた基板洗浄装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4435580B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101856769B1 (ko) * | 2016-09-30 | 2018-06-19 | 세메스 주식회사 | 세정액 분사 장치 및 분사 방법 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4753757B2 (ja) * | 2006-03-15 | 2011-08-24 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| JP4592643B2 (ja) * | 2006-05-24 | 2010-12-01 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JP2010064035A (ja) * | 2008-09-12 | 2010-03-25 | Asahi Sunac Corp | 静電噴出装置 |
| JP5400995B2 (ja) * | 2009-09-05 | 2014-01-29 | 旭サナック株式会社 | 静電塗装スプレーガン |
| JP5894021B2 (ja) * | 2012-06-26 | 2016-03-23 | 旭サナック株式会社 | 噴霧液滴の電荷量測定方法、電荷量測定装置及びそれらを用いた噴霧液滴の電荷量制御装置 |
| JP2021064729A (ja) * | 2019-10-16 | 2021-04-22 | 旭サナック株式会社 | 液体噴射装置、および液体噴射方法 |
-
2004
- 2004-01-07 JP JP2004001942A patent/JP4435580B2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101856769B1 (ko) * | 2016-09-30 | 2018-06-19 | 세메스 주식회사 | 세정액 분사 장치 및 분사 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005197444A (ja) | 2005-07-21 |
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