JP4429369B2 - 金属ナノワイヤーの合成方法 - Google Patents

金属ナノワイヤーの合成方法 Download PDF

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Publication number
JP4429369B2
JP4429369B2 JP2008531153A JP2008531153A JP4429369B2 JP 4429369 B2 JP4429369 B2 JP 4429369B2 JP 2008531153 A JP2008531153 A JP 2008531153A JP 2008531153 A JP2008531153 A JP 2008531153A JP 4429369 B2 JP4429369 B2 JP 4429369B2
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Japan
Prior art keywords
substrate
heating
phthalocyanine
metal
organometallic
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JP2008531153A
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English (en)
Japanese (ja)
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JP2009509037A (ja
JP2009509037A5 (https=
Inventor
ハルチュンヤン、アヴェティック
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Honda Motor Co Ltd
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Honda Motor Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C23C18/1216—Metal oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/06—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemically Coating (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
JP2008531153A 2005-09-15 2006-08-31 金属ナノワイヤーの合成方法 Expired - Fee Related JP4429369B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/228,784 US7341944B2 (en) 2005-09-15 2005-09-15 Methods for synthesis of metal nanowires
PCT/US2006/034002 WO2007037906A2 (en) 2005-09-15 2006-08-31 Methods for synthesis of metal nanowires

Publications (3)

Publication Number Publication Date
JP2009509037A JP2009509037A (ja) 2009-03-05
JP2009509037A5 JP2009509037A5 (https=) 2009-08-20
JP4429369B2 true JP4429369B2 (ja) 2010-03-10

Family

ID=37855751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008531153A Expired - Fee Related JP4429369B2 (ja) 2005-09-15 2006-08-31 金属ナノワイヤーの合成方法

Country Status (3)

Country Link
US (1) US7341944B2 (https=)
JP (1) JP4429369B2 (https=)
WO (1) WO2007037906A2 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
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ATE532217T1 (de) * 2005-08-12 2011-11-15 Cambrios Technologies Corp Verfahren zur herstellung von transparente leiter auf nanodrahtbasis
DE602006006897D1 (de) * 2006-03-31 2009-07-02 Sony Deutschland Gmbh System zum Nachweis eines Lecks in einer Batterie
TWI426531B (zh) * 2006-10-12 2014-02-11 坎畢歐科技公司 以奈米線為主之透明導體及其應用
US8018568B2 (en) 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
CN103777417B (zh) 2007-04-20 2017-01-18 凯姆控股有限公司 复合透明导体及其形成方法
US20090011604A1 (en) * 2007-07-05 2009-01-08 Interuniversitair Microelektronica Centrum Vzw (Imec) Photon induced removal of copper
DE102008046858A1 (de) * 2008-09-12 2010-03-18 Epcos Ag Keramikmaterial, Verfahren zur Herstellung eines Keramikmaterials, elektrokeramisches Bauelement umfassend das Keramikmaterial
US8470204B2 (en) * 2009-04-23 2013-06-25 Dic Corporation Phthalocyanine nanowires, ink composition and electronic element each containing same, and method for producing phthalocyanine nanowires
KR101417882B1 (ko) * 2009-11-26 2014-07-09 디아이씨 가부시끼가이샤 광전 변환 소자용 재료 및 광전 변환 소자
WO2011097470A2 (en) * 2010-02-05 2011-08-11 Cambrios Technologies Corporation Photosensitive ink compositions and transparent conductors and method of using the same
US8651048B2 (en) * 2010-04-21 2014-02-18 University Of North Texas Controlled deposition of metal and metal cluster ions by surface field patterning in soft-landing devices
US10876202B2 (en) 2010-04-21 2020-12-29 University Of North Texas Controlled deposition of metal and metal cluster ions by surface field patterning in soft-landing devices
CN103429668B (zh) * 2011-05-19 2014-11-26 Dic株式会社 酞菁纳米棒及光电转换元件
SI23768B (sl) 2011-06-24 2020-07-31 Institut "Jožef Stefan" Postopek za sintezo kvazi enodimenzionalnih struktur 4d in 5d (Nb, Mo Ta, W) prehodnih kovin
CN103255374A (zh) * 2012-09-19 2013-08-21 苏州大学 一种制备有序一维有机纳米线阵列的方法
US10193162B2 (en) * 2014-03-27 2019-01-29 Kumiai Chemical Industry Co., Ltd. Electrode catalyst and method for producing the same
CN105294706B (zh) * 2015-11-03 2018-09-07 昆明学院 新晶体结构酞菁铁纳米线及其制备方法
CN105779938A (zh) * 2016-03-21 2016-07-20 王烨 利用薄膜沉积制备纳米柱形结构氧化锡的方法
EP3612210A4 (en) 2017-04-19 2021-01-27 Board Of Regents, The University Of Texas System MANIPULATED ANTIGEN RECEPTORS EXPRESSING IMMUNE CELLS
US12473336B2 (en) 2018-02-21 2025-11-18 Board Of Regents, The University Of Texas System Methods for activation and expansion of natural killer cells and uses thereof

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5872422A (en) 1995-12-20 1999-02-16 Advanced Technology Materials, Inc. Carbon fiber-based field emission devices
US6838720B2 (en) 2001-08-13 2005-01-04 Advanced Micro Devices, Inc. Memory device with active passive layers
US6740900B2 (en) * 2002-02-27 2004-05-25 Konica Corporation Organic thin-film transistor and manufacturing method for the same
JP3747440B2 (ja) * 2003-03-10 2006-02-22 独立行政法人科学技術振興機構 金属ナノワイヤーの製造方法
US8541054B2 (en) * 2003-09-08 2013-09-24 Honda Motor Co., Ltd Methods for preparation of one-dimensional carbon nanostructures
US7344753B2 (en) * 2003-09-19 2008-03-18 The Board Of Trustees Of The University Of Illinois Nanostructures including a metal

Also Published As

Publication number Publication date
US7341944B2 (en) 2008-03-11
WO2007037906A2 (en) 2007-04-05
WO2007037906A3 (en) 2007-09-20
JP2009509037A (ja) 2009-03-05
US20070059928A1 (en) 2007-03-15

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