JP4425245B2 - 容量性超音波振動子およびその製造方法 - Google Patents

容量性超音波振動子およびその製造方法 Download PDF

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Publication number
JP4425245B2
JP4425245B2 JP2006181649A JP2006181649A JP4425245B2 JP 4425245 B2 JP4425245 B2 JP 4425245B2 JP 2006181649 A JP2006181649 A JP 2006181649A JP 2006181649 A JP2006181649 A JP 2006181649A JP 4425245 B2 JP4425245 B2 JP 4425245B2
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Japan
Prior art keywords
layer
ultrasonic transducer
capacitive ultrasonic
patterned
metal layer
Prior art date
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Expired - Fee Related
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JP2006181649A
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English (en)
Japanese (ja)
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JP2007124613A (ja
JP2007124613A5 (enExample
Inventor
チャン・ミン−ウェイ
グウォ・ツン−ジュ
デン・ツェ−ミン
チュン・チェン−ユアン
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Industrial Technology Research Institute ITRI
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Industrial Technology Research Institute ITRI
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
JP2006181649A 2005-10-28 2006-06-30 容量性超音波振動子およびその製造方法 Expired - Fee Related JP4425245B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094137938A TWI268183B (en) 2005-10-28 2005-10-28 Capacitive ultrasonic transducer and method of fabricating the same

Publications (3)

Publication Number Publication Date
JP2007124613A JP2007124613A (ja) 2007-05-17
JP2007124613A5 JP2007124613A5 (enExample) 2009-02-26
JP4425245B2 true JP4425245B2 (ja) 2010-03-03

Family

ID=37996106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006181649A Expired - Fee Related JP4425245B2 (ja) 2005-10-28 2006-06-30 容量性超音波振動子およびその製造方法

Country Status (4)

Country Link
US (2) US20070097791A1 (enExample)
JP (1) JP4425245B2 (enExample)
KR (1) KR100791821B1 (enExample)
TW (1) TWI268183B (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITRM20060238A1 (it) * 2006-05-03 2007-11-04 Esaote Spa Trasduttore ultracustico capacitivo multipiano
US7721397B2 (en) * 2007-02-07 2010-05-25 Industrial Technology Research Institute Method for fabricating capacitive ultrasonic transducers
US8815653B2 (en) 2007-12-03 2014-08-26 Kolo Technologies, Inc. Packaging and connecting electrostatic transducer arrays
CN101874287B (zh) 2007-12-03 2012-08-29 科隆科技公司 静电换能器及阵列中的贯穿晶片互连
US8816281B2 (en) 2011-03-28 2014-08-26 Tokyo Electron Limited Ion energy analyzer and methods of manufacturing the same
JP5896665B2 (ja) * 2011-09-20 2016-03-30 キヤノン株式会社 電気機械変換装置の製造方法
EP2973767B1 (en) 2013-03-14 2017-11-22 Volcano Corporation Method of coating wafer-scale transducer
US10058892B2 (en) 2015-05-20 2018-08-28 uBeam Inc. Membrane bonding
US10065854B2 (en) * 2015-05-20 2018-09-04 uBeam Inc. Membrane bonding with photoresist
US10315224B2 (en) 2015-05-20 2019-06-11 uBeam Inc. Ultrasonic transducer
KR102244601B1 (ko) * 2019-05-29 2021-04-26 인하대학교 산학협력단 정전용량형 미세가공 초음파 트랜스듀서 및 그 제조방법
CN110510573B (zh) * 2019-08-30 2023-01-10 中国科学院深圳先进技术研究院 一种电容式微机械超声换能器及其制备方法和应用
TWI738290B (zh) * 2020-04-10 2021-09-01 友達光電股份有限公司 換能裝置、換能結構及其製造方法
TWI718073B (zh) * 2020-06-19 2021-02-01 友達光電股份有限公司 電容式換能裝置及其製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1975801A (en) 1930-12-15 1934-10-09 Sound Lab Corp Ltd Microphone
US4262399A (en) 1978-11-08 1981-04-21 General Electric Co. Ultrasonic transducer fabricated as an integral park of a monolithic integrated circuit
US5619476A (en) * 1994-10-21 1997-04-08 The Board Of Trustees Of The Leland Stanford Jr. Univ. Electrostatic ultrasonic transducer
US5894452A (en) 1994-10-21 1999-04-13 The Board Of Trustees Of The Leland Stanford Junior University Microfabricated ultrasonic immersion transducer
US6295247B1 (en) 1998-10-02 2001-09-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined rayleigh, lamb, and bulk wave capacitive ultrasonic transducers
JP3440037B2 (ja) 1999-09-16 2003-08-25 三洋電機株式会社 半導体装置、半導体エレクトレットコンデンサマイクロホンおよび半導体エレクトレットコンデンサマイクロホンの製造方法。
US6443901B1 (en) * 2000-06-15 2002-09-03 Koninklijke Philips Electronics N.V. Capacitive micromachined ultrasonic transducers
ITRM20030318A1 (it) 2003-06-25 2004-12-26 Esaote Spa Trasduttore ultracustico capacitivo microlavorato e
JP4193615B2 (ja) 2003-07-04 2008-12-10 セイコーエプソン株式会社 超音波変換装置
WO2005077012A2 (en) 2004-02-06 2005-08-25 Georgia Tech Research Corporation Cmut devices and fabrication methods
US8008835B2 (en) 2004-02-27 2011-08-30 Georgia Tech Research Corporation Multiple element electrode cMUT devices and fabrication methods
US7646133B2 (en) 2004-02-27 2010-01-12 Georgia Tech Research Corporation Asymmetric membrane cMUT devices and fabrication methods
US7530952B2 (en) 2004-04-01 2009-05-12 The Board Of Trustees Of The Leland Stanford Junior University Capacitive ultrasonic transducers with isolation posts
US7251884B2 (en) 2004-04-26 2007-08-07 Formfactor, Inc. Method to build robust mechanical structures on substrate surfaces
US7470232B2 (en) 2004-05-04 2008-12-30 General Electric Company Method and apparatus for non-invasive ultrasonic fetal heart rate monitoring
TWI260940B (en) 2005-06-17 2006-08-21 Ind Tech Res Inst Method for producing polymeric capacitive ultrasonic transducer

Also Published As

Publication number Publication date
US7937834B2 (en) 2011-05-10
US20080235936A1 (en) 2008-10-02
KR20070045898A (ko) 2007-05-02
TWI268183B (en) 2006-12-11
TW200716265A (en) 2007-05-01
JP2007124613A (ja) 2007-05-17
US20070097791A1 (en) 2007-05-03
KR100791821B1 (ko) 2008-01-04

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