JP4421294B2 - 半導体ウエハの識別 - Google Patents

半導体ウエハの識別 Download PDF

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Publication number
JP4421294B2
JP4421294B2 JP2003533207A JP2003533207A JP4421294B2 JP 4421294 B2 JP4421294 B2 JP 4421294B2 JP 2003533207 A JP2003533207 A JP 2003533207A JP 2003533207 A JP2003533207 A JP 2003533207A JP 4421294 B2 JP4421294 B2 JP 4421294B2
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JP
Japan
Prior art keywords
semiconductor wafer
magnetic
wafer
region
magnetic means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003533207A
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English (en)
Japanese (ja)
Other versions
JP2005507158A5 (https=
JP2005507158A (ja
Inventor
マウツ、カール
ジークス、ジェイソン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
NXP USA Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NXP USA Inc filed Critical NXP USA Inc
Publication of JP2005507158A publication Critical patent/JP2005507158A/ja
Publication of JP2005507158A5 publication Critical patent/JP2005507158A5/ja
Application granted granted Critical
Publication of JP4421294B2 publication Critical patent/JP4421294B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/06187—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with magnetically detectable marking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2003533207A 2001-09-28 2002-09-12 半導体ウエハの識別 Expired - Fee Related JP4421294B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/966,046 US6759248B2 (en) 2001-09-28 2001-09-28 Semiconductor wafer identification
PCT/US2002/029073 WO2003030081A2 (en) 2001-09-28 2002-09-12 Semiconductor wafer identification

Publications (3)

Publication Number Publication Date
JP2005507158A JP2005507158A (ja) 2005-03-10
JP2005507158A5 JP2005507158A5 (https=) 2006-01-05
JP4421294B2 true JP4421294B2 (ja) 2010-02-24

Family

ID=25510852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003533207A Expired - Fee Related JP4421294B2 (ja) 2001-09-28 2002-09-12 半導体ウエハの識別

Country Status (7)

Country Link
US (1) US6759248B2 (https=)
EP (1) EP1449162A2 (https=)
JP (1) JP4421294B2 (https=)
KR (1) KR20040050068A (https=)
AU (1) AU2002333613A1 (https=)
TW (1) TWI256720B (https=)
WO (1) WO2003030081A2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3809353B2 (ja) * 2001-08-02 2006-08-16 キヤノン株式会社 Ｉｄ付き加工物の製造方法
US20040064801A1 (en) * 2002-09-30 2004-04-01 Texas Instruments Incorporated Design techniques enabling storing of bit values which can change when the design changes
DE10325541A1 (de) * 2003-06-04 2005-01-13 Infineon Technologies Ag Elektronisches Bauteil, sowie Halbleiterwafer und Bauteilträger zur Herstellung des Bauteils
US7531907B2 (en) * 2005-04-29 2009-05-12 Hitachi Global Storage Technologies Netherlands B.V. System and method for forming serial numbers on HDD wafers
CN102769068B (zh) * 2012-05-09 2015-12-16 镇江环太硅科技有限公司 太阳能电池用多晶硅片的编码方法
US10522472B2 (en) 2016-09-08 2019-12-31 Asml Netherlands B.V. Secure chips with serial numbers
US10418324B2 (en) 2016-10-27 2019-09-17 Asml Netherlands B.V. Fabricating unique chips using a charged particle multi-beamlet lithography system

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4095095A (en) * 1976-03-31 1978-06-13 Tokyo Shibaura Electric Co., Ltd. Apparatus for manufacturing semiconductor devices
GB1584343A (en) * 1977-06-07 1981-02-11 Tokyo Shibaura Electric Co Apparatus for marking identification symbols on wafer
CA2011296A1 (en) * 1989-05-15 1990-11-15 Douglas C. Bossen Presence/absence bar code
US6307241B1 (en) * 1995-06-07 2001-10-23 The Regents Of The Unversity Of California Integrable ferromagnets for high density storage
TW392218B (en) * 1996-12-06 2000-06-01 Toshiba Mechatronics Kk Apparatus and method for marking of identifier onto semiconductor wafer
JPH10256105A (ja) * 1997-03-11 1998-09-25 Super Silicon Kenkyusho:Kk レーザマークを付けたウェーハ
DE19733410A1 (de) * 1997-08-01 1999-02-18 Siemens Ag Wafermarkierung
JP3090113B2 (ja) * 1998-02-13 2000-09-18 日本電気株式会社 半導体装置の製造方法
US6268641B1 (en) * 1998-03-30 2001-07-31 Kabushiki Kaisha Toshiba Semiconductor wafer having identification indication and method of manufacturing the same
US6063685A (en) * 1998-08-07 2000-05-16 Advanced Micro Devices, Inc. Device level identification methodology
JP2000077312A (ja) * 1998-09-02 2000-03-14 Mitsubishi Electric Corp 半導体装置
US6197481B1 (en) * 1998-09-17 2001-03-06 Taiwan Semiconductor Manufacturing Company Wafer alignment marks protected by photoresist
EP1046192A1 (en) * 1998-10-20 2000-10-25 Koninklijke Philips Electronics N.V. Method of manufacturing a semiconductor device in a silicon body, a surface of said silicon body being provided with an alignment grating and an at least partially recessed oxide pattern
US6312876B1 (en) * 1999-07-08 2001-11-06 Taiwan Semiconductor Manufacturing Company Method for placing identifying mark on semiconductor wafer
US6383888B1 (en) * 2001-04-18 2002-05-07 Advanced Micro Devices, Inc. Method and apparatus for selecting wafer alignment marks based on film thickness variation

Also Published As

Publication number Publication date
US6759248B2 (en) 2004-07-06
AU2002333613A1 (en) 2003-04-14
WO2003030081A3 (en) 2003-08-21
TWI256720B (en) 2006-06-11
JP2005507158A (ja) 2005-03-10
WO2003030081A2 (en) 2003-04-10
KR20040050068A (ko) 2004-06-14
US20030064531A1 (en) 2003-04-03
EP1449162A2 (en) 2004-08-25

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