JP4419203B2 - COATING APPARATUS, COATING METHOD, AND METHOD FOR PRODUCING PLASMA DISPLAY MEMBER AND APPARATUS - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is used in the manufacturing field of, for example, a plasma display, a color filter for a color liquid crystal display, an optical filter, a printed circuit board, an integrated circuit, a semiconductor, and the like. The present invention relates to a coating apparatus and a coating method for forming a coating film while discharging a coating solution, and an improvement in a manufacturing apparatus and a manufacturing method for a member for a plasma display using these apparatuses and methods.
[0002]
[Prior art]
In recent years, displays have gradually become diversified in their systems, and one of the current attention is a plasma display that is larger than a conventional cathode ray tube and can be reduced in thickness and weight. This is because a partition having grooves extending in one direction in a striped pattern at a constant pitch is formed on a glass substrate, and further, phosphors of R, G, and B are filled in the grooves of the partition, and an arbitrary portion is emitted by ultraviolet rays. And a predetermined color pattern is projected. Usually, the side with the partition is called the back plate, and the side with the electrode that determines the part to be issued is called the front plate.
[0003]
Here, as an important method of forming a partition pattern on the back plate, a partition paste is uniformly applied, dried and molded with a uniform film thickness, and then striped grooves with a predetermined pitch are formed by a sandblast method or the like. The mainstream is engraving and baking by post-processing such as photolithography. The thickness of the partition wall coating film is as thick as 100 to 200 μm even after firing. As a means for uniformly applying the partition wall paste to this film thickness, a screen printing method can be used according to the paste viscosity of thousands to tens of thousands cps. In general, a method of coating is also used. However, with this method, the number of coatings reaches 10 to 20 times, and in recent years, the introduction of a roll method and a die coating method that can complete the coating in one time has been started actively in order to reduce costs and improve quality. .
[0004]
Among these, the die coating method using a die can be applied only once, and (1) since the die as an applicator is not in contact with the glass substrate, there is no screen unevenness on the coated surface and the quality is improved. (2) Since there are no consumables such as screens, there is an advantage that the cost can be eliminated.
[0005]
In such a die coating method,
(A) When the substrate is flowed in one direction, there is a problem that the area occupied by the coater including the substrate transfer device increases. In addition, as shown in Japanese Patent Application Laid-Open Nos. 8-182953 and 9-150102, shapes of a transfer device (loader) for loading a substrate into a coating apparatus and a transfer device (unloader) for carrying it out are provided. Therefore, installing two devices having the same function is wasteful in terms of equipment, and it is desirable to reduce the number of components as much as possible to reduce the cost.
[0006]
(B) In order to make the clearance between the die and the substrate constant, in JP-A-10-421, etc., the substrate thickness is measured in advance, and the vertical position of the die is changed based on the thickness. The technology to be shown is shown. In order to increase the accuracy, it is necessary to measure the substrate thickness in advance in the entire coating area on the die coater table on which coating is performed. However, it is desired to efficiently perform this to shorten the tact.
[0007]
(C) When a large amount of coating is performed continuously, the coating thickness distribution is first measured to confirm the coating conditions. Usually, the coating thickness distribution is measured by drying until the end of drying. I have to wait about hours. Therefore, in order to improve productivity, it is desired that the coating thickness distribution can be measured in a wet state immediately after coating, and the dead time is greatly reduced.
[0008]
[Problems to be solved by the invention]
The present invention has been made based on the above-mentioned circumstances. The object of the present invention is as follows. 1) As a coating facility including a substrate transfer device, the number of components is reduced and the area occupied by the device is also reduced. Reducing,
2) The substrate thickness is measured in advance on the coater table with high accuracy in the entire application area, and based on this, the clearance is kept constant accurately and uniformly applied,
3) Enables film thickness measurement in the wet state immediately after application, greatly reduces the time required for film thickness distribution check time for application condition confirmation before mass application, improves productivity, and reduces the variety of products To be able to increase production efficiency even during production,
It is an object of the present invention to provide a coating apparatus and a coating method capable of performing the above, and a plasma display member manufacturing method and manufacturing apparatus using these coating methods and apparatuses.
[0009]
[Means for Solving the Problems]
The object of the present invention is achieved by the means described below.
[0012]
( 1 ) Application liquid supply means for supplying an application liquid, an applicator having a discharge port for discharging the application liquid supplied from the application liquid supply means, a mounting table for mounting a member to be applied, and the applicator And a moving means for relatively moving at least one of the mounting tables to form a coating film on the coated member, the coating member before coating on the mounting table . Height detector for detecting height distribution and height distribution of coating film surface after coating, height distribution of coating film surface after coating detected by same height detector, and coated member before coating A coating apparatus, further comprising a calculation means for calculating a coating thickness distribution from a difference in height distribution .
[0013]
( 2 ) A plasma display member manufacturing apparatus that manufactures a plasma display member using the coating apparatus according to (1 ) .
[0018]
( 3 ) The member to be coated is moved by relatively moving at least one of the applicator and the mounting table while discharging a coating liquid from a discharge port extending in one direction of the coating device to the member to be coated. in the coating method of forming a coating film, by detecting the height distribution of the height distribution and the coating film surface after coating of該被applying member before application on the table with the same height detectors, these A coating method characterized in that a coating thickness distribution is calculated from the difference between the two .
[0019]
( 4 ) A method for producing a member for a plasma display, wherein the member for a plasma display is produced using the coating method according to the above ( 3 ).
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
[0021]
FIG. 1 is a schematic perspective view when the coating apparatus of the present invention is applied to a die coater.
[0022]
In FIG. 1, the die coater 1 includes a die 21 that is a coating liquid discharge unit, a table 110, a die lifting / lowering unit 120, a coating liquid supply unit 130, and a transfer machine 10.
[0023]
The table 110 is constituted by a suction plate 24 on a slide leg 112 guided by a pair of guide groove rails 111 on the base 23 and reciprocates in directions indicated by arrows A and B. The suction plate 24 is a substrate mounting table, and a substrate is sucked and held on the suction plate 24 by suction holes (not shown) provided on the surface.
[0024]
Further, a pair of guide groove rails 111 are provided in the casing 115, and a slide leg 112 is connected to the ball screw 113 via a nut-shaped connector 114 in the meantime. On the other hand, one end of the ball screw 113 is rotatably connected to an AC servo motor 116 disposed at the end of the base 23, whereby the reciprocating motion of the table 110 is freely controlled.
[0025]
Next, the die lifting / lowering unit 120 includes an inverted L-shaped support column 25, a lifting / lowering device 30 that is fixed thereto and lifts the die 21 on the suction plate 24, and a die holding member that connects the die 21 and the lifting / lowering device 30. 26, and the die 21 can be moved up and down freely in the vertical direction. Further, since the die holding member 26 is rotatably connected to the lifting device 30 at the longitudinal center of the die 21, the length of the die 21 depends on the amount of contact between the linear actuators 27 </ b> A and 27 </ b> B and the die holding member 26. The vertical position of both ends of the direction can be freely adjusted, and the lower surface of the die 21 and the suction disk 24 can be arranged in parallel.
[0026]
Further, a substrate thickness meter 50 is provided on the side surface of the base 23 facing the transfer machine 10. The substrate thickness meter 50 includes a sensor 51 and a gantry 52 that holds the sensor 51 at an arbitrary position. The substrate thickness is measured by turning the measurement surface of the sensor 51 to the lower surface side of the substrate. As the sensor 51, various types such as a laser method, a capacitance method, an ultrasonic method, and the like are used, but a laser focus type is a non-contact and even if a target is a normal glass substrate, a coating film is previously applied on one side. Even if a substrate is attached, it is particularly preferable because the substrate thickness can be accurately measured by detecting the substrate front and back positions from the glass substrate surface side. The laser focus method is based on the principle of measuring the distance between the sensor and the object by obtaining the laser reflection position on the object to be measured based on the laser focus position.
[0027]
The coating liquid supply unit 130 includes a tank 135 that supplies the coating liquid, a syringe pump 131 that sends the coating liquid at a constant volume, a suction hose 133 that connects the tank 135 and the syringe pump 131, a syringe pump 131 and the die 21. In addition, open / close valves 134A and 134B are provided in the middle of each supply hose 132 and suction hose 133. By the operation of the syringe pump 131 and the on-off valves 134A and 134B, the coating liquid in the tank 135 can be supplied to the die 21 with a constant volume.
[0028]
In addition to the configuration using a syringe pump, the coating liquid supply unit 130 may be configured by air pressure feeding in addition to a gear pump, a diaphragm pump, and a tube pump. The tank 135 is a sealed container and is preferably pressurized with a constant pressure of air or an inert gas such as N2. The applied pressure is preferably 0.02 to 1 MPa, more preferably 0.1 to 0.5 MPa.
[0029]
The transfer machine 10 disposed upstream of the die coater 20 in the substrate transport direction includes an articulated arm type robot 11 and a hand 12, and receives the substrate 40 from the upstream device (not shown) onto the hand 12. Then, it is gripped and conveyed to the die coater 1. The robot 11 may be of any type such as a multi-joint arm type or a cylindrical coordinate type.
[0030]
Next, a coating method using the coating apparatus of the present invention will be described.
[0031]
First, the robot 11 is driven in accordance with a signal from a sequencer (not shown) as programmed in advance, and the substrate 40 in the upstream device (not shown) is gripped and taken out by the hand 12. Then, the hand 12 holding the substrate 40 is caused to perform a combined operation of rotation and rectilinear movement, and the substrate 40 is moved directly above the thickness gauge 50 to measure the thickness of the substrate 40. At this time, the thickness of the substrate 40 to be measured may be one point, or the substrate thickness profile may be obtained by measuring a plurality of points. Further, a plurality of substrate thickness profiles may be measured. The direction in which a plurality of substrate thicknesses are measured is usually the substrate longitudinal direction, but may be measured in the substrate width direction. Now, when the measurement of the substrate thickness is completed, the hand 112 holding the substrate 40 is stopped at a position near the suction plate 24 (table 110) at the origin position, and then raised on the surface of the suction plate 24 in advance. The substrate 40 is transferred onto the lift pins 29 that are being moved. When the hand 12 is retracted to return to the origin position, the lift pin 29 is lowered and the substrate 40 is placed on the suction plate 24, and positioning on the suction plate 24 is performed by a positioning device (not shown). In this state, a suction source such as a vacuum pump is operated to suck and hold the substrate 40 on the suction disk 24. Next, the suction plate 24 (table 110) is moved at a high speed in the direction A in FIG. 1 to the coating start position, and in parallel with this, the substrate thickness measured by the substrate thickness meter 50 and the previously given die are used. Based on the value of the clearance between the 21 and the substrate 40, the die 21 is lowered until a predetermined clearance is obtained between the substrate 40 and the die 21.
[0032]
Until the above operation, the coating liquid supply unit 130 operates the syringe pump 131 with the on-off valve 134A closed and 134B opened, and sucks and supplies a predetermined amount of coating liquid from the tank 135 to the syringe pump side. When the filling of the syringe pump with the coating liquid is completed, the on-off valve 134A is opened and 134B is closed.
[0033]
Next, the suction plate 24 (table 110) starts to move from the application start position in the A direction at a predetermined application speed. At substantially the same time, the syringe pump 131 is operated, the coating liquid is sent from the syringe pump side to the die 21 side at a predetermined speed, and the coating liquid is discharged from the discharge port of the die 21. At this time, a coating film is formed on the substrate 40 as the suction plate 24 (table 110) moves. Here, the die 21 is adjusted based on the value of the substrate thickness profile in the substrate longitudinal direction measured by the substrate thickness meter 50 so that the clearance between the lower end surface of the die 21 and the suction plate 24 is always kept constant. Elevation control (following control) may be performed. When the profile control is performed, the clearance is always constant, so that the coating can be performed at a higher speed.
[0034]
Next, when the coating end portion of the substrate 40 comes directly below the discharge port of the die 21, the syringe pump 131 is stopped to stop the discharge of the coating liquid, and at the same time, the die 21 is raised to complete the coating. To do. Thereafter, the suction plate 24 (table 110) moves at high speed to the end position. When the suction disk 24 stops, it passes under the die 21 in the direction B of FIG. 1 and moves to the origin position at a high speed. When the suction plate 24 (table 110) stops at the origin position, the suction of the substrate 40 is released, the lift pins 29 are raised, the substrate 40 is lifted, and the substrate 40 on which the coating film is formed by the hand 12 of the transfer machine 10 is removed. Take it out and transport it to the next process.
[0035]
In the present embodiment shown in FIG. 1, the substrate 40 can be loaded into and removed from the coater 1 from the substrate loading side by a single transfer machine 10. With this arrangement, the area occupied by the apparatus can be reduced and the apparatus can be made compact.
[0036]
FIG. 2 is a plan view showing an apparatus configuration to which the present invention can be applied. However, since the cassette 210, the coater 1 and the dryer 200 are arranged around the transfer machine 10, substrate loading → coating → drying → cassette storage It is possible to perform consistent work in a compact manner. As the dryer 200, any device may be used, such as a hot dryer, a hot plate, or a device using infrared rays as a heating source, or a vacuum dryer that performs heating and drying in an atmosphere reduced from atmospheric pressure.
[0037]
3 is a front view showing an example in which another embodiment of the present invention is applied to the coater 1 of FIG. 1, and FIG. 4 is a plan view thereof. Here, the substrate surface height measuring device 300 is attached to the support column 25 of the coater 1, and a laser displacement meter 302 for measuring the distance from the substrate 40, a bracket 308 to which the displacement meter 302 can be attached and moved up and down freely, It comprises a movable body 304 that moves the bracket 308 and the displacement meter 302 along the guide rail 306 in the substrate width direction (perpendicular to the paper surface). The movable body 304 is connected to a drive portion including a ball screw and a motor (not shown) and can freely reciprocate in the substrate width direction. On the opposite side of the column 25, the die 21 is attached to the lifting device 30 via a die holding member 26. The lifting device 30 moves the die 21 freely in the vertical direction by a motor and a ball screw (not shown).
[0038]
A coating method using the coating apparatus shown in this embodiment will be described. First, the substrate 40 to be coated is transferred from the transfer machine 10 to the suction disk 24 at the origin position and fixed by suction. The suction disk 24 is moved in the direction A in FIG. 3, and the height distribution S <b> 1 of the substrate 40 in the substrate traveling direction is measured from the distance between the displacement meter 302 located at the center in the substrate width direction and the surface of the substrate 40. Before this, since the height distribution S0 in the substrate running direction on the surface of the suction plate 24 is measured in advance from the distance between the surface of the suction plate 24 and the displacement meter 302, the difference in the distance distribution in the substrate running direction between S1 and S20 is calculated. Then, the thickness distribution (profile) S2 of the substrate can be known. When the measurement is completed, the suction plate 24 moves to the end point position and stops. From the measured thickness distribution S2 of the substrate 40 in the traveling direction or the height distribution S1 of the substrate 40 in the substrate traveling direction, the die 21 is lowered so that the distance (clearance) between the lower end surface of the die 21 and the substrate 40 is constant. The position is determined by the lifting device 30. Next, the suction plate 24 is moved in the direction B in FIG. 3 which is the opposite direction to the measurement of the substrate thickness. When the application start position of the substrate 40 reaches directly below the discharge port of the die 21, the application liquid is added to the die. Application is carried out by discharging from 21. During the application, the measured thickness distribution S2 of the traveling direction of the substrate 40 or the substrate traveling direction so that the distance (clearance) between the discharge port surface of the die 21 and the substrate 40 is constant. The position of the die 21 may be moved in the vertical direction from the height distribution S1 of the substrate 40. When the application end position of the substrate 40 comes directly under the discharge port of the die 21, the discharge of the application liquid is stopped, and the die 21 is also raised almost simultaneously to complete the application. Even if the application is completed, the suction plate 24 moves to the starting origin position and stops, releases the suction of the substrate 40, raises the lift pins 29, lifts the substrate 40, and coats the coating film with the hand 12 of the transfer machine 10. The substrate 40 on which is formed is taken out and transported to the next step. In this embodiment, there is only one displacement meter 302, but a plurality of displacement meters 302 are provided, for example, the height and thickness of both ends in the width direction of the substrate 40 are measured, and the discharge port surface of the die 21 is adjusted according to the profile. By controlling the height of both end positions in the longitudinal direction (substrate width direction), the clearance between the substrate 40 and the discharge port surface of the die 40 may be constant over the substrate width direction. Further, the displacement meter 302 may be disposed anywhere on the substrate 40. According to the substrate surface height measuring instrument 300 of the present embodiment, the substrate surface height on the suction plate 24 can be accurately measured regardless of the presence or absence of the coating film, so compared with the case of measuring the substrate thickness, The clearance between the discharge port surface of the die 21 and the substrate surface can be set more accurately.
[0039]
Next, a method for measuring the coating thickness will be described with reference to FIG. The process is as described above until application. After the application is completed, the suction plate 24 moves to the origin position and stops. Next, in a state where the substrate 40 on which the coating film is formed is adsorbed to the adsorption plate 24 as it is, the movement in the direction A of FIG. 3 is started again, and the surface of the coating film on the substrate 40 and the displacement meter 302 in the substrate running direction. From the distance, the height distribution S3 of the coating film surface (coating liquid surface) on the substrate 40 in the substrate running direction is measured. When the measurement is completed, the suction plate 24 moves to the end point position and stops. Then, the difference between the height distribution S3 of the coating film surface on the substrate 40 in the substrate running direction and the height distribution S1 of the substrate 40 in the substrate running direction before application is taken to obtain a coating film applied on the substrate 40. A thickness distribution of the (coating liquid) in the substrate running direction, that is, a coating thickness distribution S4 can be obtained. Further, when obtaining the coating thickness distribution in the substrate width direction, the suction plate 24 is first moved and stopped until the position P1 to be measured on the substrate 40 before coating is directly below the displacement meter 302. Next, the displacement meter 302 is moved in the width direction of the substrate 40 (longitudinal direction of the die 21) in a range including both ends of the substrate, and the height of the substrate 40 in the substrate width direction is determined from the distance between the surface of the substrate 40 and the displacement meter 302. The distribution W1 is measured. Next, after applying to the substrate 40 by the method described above, the suction disk 24 is moved again so that the position P1 to be measured on the substrate 40 is directly below the displacement meter 302, and then the displacement meter 302 is moved. The height distribution W2 of the substrate 40 in the substrate width direction is measured from the distance between the coating liquid surface (coating film surface) on the substrate 40 and the displacement meter 302 by moving the substrate in the range including both ends of the substrate in the substrate width direction. . The difference between W2 and W1 is taken to obtain the thickness distribution in the substrate width direction of the coating liquid surface (coating surface), that is, the coating thickness distribution W3.
[0040]
When measuring the coating thickness, the position of the displacement meter 302 when measured with the displacement meter 302 in the substrate running direction is not limited to the central portion, but may be a position where measurement is desired in the substrate width direction. Further, measurement may be performed at a plurality of locations in the substrate width direction.
[0041]
When measuring with a displacement meter in the substrate width direction, a plurality of arbitrary locations may be selected as the measurement location.
[0042]
Further, measurement in the substrate running direction and width direction may be performed sequentially, and either order may be performed first.
[0043]
Any displacement meter that can measure the coating thickness may be used as long as it can be measured. However, the above-described laser focus type is preferable because it is not easily affected by the surface state of the measurement position and can be measured with high accuracy. In addition, a laser that uses diffuse reflection or regular reflection may be used. What is necessary is just to use not only a laser but the thing using an electrostatic capacitance, and non-contact type things, such as an air micro.
[0044]
The coating liquid to which the present invention can be applied has a viscosity of 1 cps to 100,000 cps, desirably 10 cps to 50,000 cps, and Newtonian is preferable from the viewpoint of coating properties, but it can also be applied to a coating liquid having thixotropy. As a substrate, in addition to glass, a metal plate such as aluminum, a ceramic plate, a silicon wafer, and the like, as well as a substrate on which some coating film is formed in the previous step, may be used. Further, as a coating state to be used, the clearance is 40 to 500 μm, more preferably 80 to 300 μm, the coating speed is 0.1 m / min to 10 m / min, more preferably 0.5 m / min to 6 m / min, the die lip The gap is 50 to 1000 μm, more preferably 100 to 600 μm, and the coating thickness is 5 to 400 μm, more preferably 20 to 250 μm.
[0045]
【Example】
After the photosensitive silver paste is screen-printed to a thickness of 5 μm on the entire surface of a soda glass substrate having a width of 340 mm × 440 mm × thickness of 2.8 mm, it is exposed using a photomask, and undergoes development and baking processes, Striped 1920 silver electrodes with a pitch of 220 μm were formed. A glass paste made of glass and a binder was screen-printed on the electrode and then fired to form a dielectric layer having a thickness of 10 μm. Next, a die having a discharge width of 430 mm and a lip gap (shim thickness) of 500 μm is attached to the die coater shown in FIG. 1, and a photosensitive solution having a viscosity of 20000 cps composed of glass powder and a photosensitive organic component is applied to the coating solution supply line from the tanks 135 to 21. The glass paste was filled. Then, the substrate formed up to the dielectric layer is put into a die coater by the transfer machine 10 and the thickness of the substrate is measured, and the clearance between the die 21 and the dielectric layer is considered in consideration of the thickness of the dielectric layer and 10 μm. After lowering the die 21 to 350 μm, the above photosensitive glass paste was applied at a coating thickness of 300 μm and a coating speed of 1 m / min. The coated substrate was taken out by the transfer machine 10 at the same position where the substrate was put, put into a drying furnace using a radiation heater, and dried at 100 ° C. for 20 minutes. When the coating thickness distribution after drying was measured over the entire surface of the substrate, it was within the range of 140 μm ± 3 μm. Next, exposure was performed using a photomask designed to form a partition between adjacent electrodes, and development and firing were performed to form a partition. The shape of the partition walls was a pitch of 220 μm, a line width of 30 μm, a height of 130 μm, and the number of partition walls was 1921. After that, phosphor pastes of R, G, B are sequentially applied by screen printing, dried at 80 ° C. for 15 minutes, and finally baked at 460 ° C. for 15 minutes to produce a defect-free plasma display back plate. It was.
[0046]
【The invention's effect】
1) Since the substrate transfer device is used as a substrate loading / unloading unit and the substrate is loaded and unloaded from one side of the coater, the number of components is reduced and the area occupied by the device is also reduced. And as a result, the manufacturing cost can be reduced.
[0047]
2) After measuring the substrate thickness in the entire coating area when moving the substrate in one direction, coating was performed when returning in the opposite direction, so the measurement of the substrate thickness and the clearance accordingly Thus, it is possible to efficiently carry out the coating while keeping the temperature constant, and to improve the productivity.
[0048]
3) Before coating, measure the substrate height distribution on the suction table (table) in the coating area and then apply, and immediately measure the height of the coating solution (coating film) at the same substrate position. Since the coating thickness distribution is calculated from the difference in height, it is possible to measure the film thickness in the wet state immediately after coating, and the time required for the film thickness distribution check time to check the coating conditions before mass coating Can be greatly reduced, productivity can be improved, and production efficiency can be improved even in the case of high-mix low-volume production.
[0049]
Since the plasma display member is manufactured by the manufacturing apparatus and the manufacturing method of the member for plasma display using the coating apparatus and the coating method having the above excellent effects, the plasma such as the back plate having high productivity and high quality. A display member can be manufactured.
[Brief description of the drawings]
FIG. 1 is an overall perspective view showing an example of a substrate transfer apparatus and a die coater according to the present invention.
FIG. 2 is a schematic plan view showing an example of an overall arrangement including a substrate transfer apparatus and a die coater according to the present invention.
FIG. 3 is a front view showing an embodiment of a coating apparatus according to the present invention.
4 is a plan view of the coating apparatus shown in FIG. 3. FIG.
[Explanation of symbols]
1: Coater 10: Transfer machine 11: Robot 12: Hand 20: Die coater 21: Die 23: Base 24: Suction board A, B: Suction board traveling direction 25: Support column 26: Die holding material 27A, 27B: Linear actuator 29: Lift pin 30: Lifting device 35: Horizontal bar 40: Substrate 110: Table 111: Guide groove rail 112: Slide leg 113: Ball screw 114: Connector 115: Casing 116: AC servo motor 120: Die lifting unit 130: Coating liquid Supply section 131: Syringe pump 132: Supply hose 133: Suction hose 134A, 134B: Open / close valve 135: Tank 200: Dryer 210: Cassette 300: Substrate surface height measuring instrument 302: Displacement meter 306: Guide rail 304: Movable body

Claims (4)

Application liquid supply means for supplying an application liquid, an applicator having a discharge port for discharging the application liquid supplied from the application liquid supply means, a mounting table on which a member to be applied is mounted, and the applicator and mounting table In a coating apparatus comprising a moving means for forming a coating film on the coated member by relatively moving at least one of the coated member, the height distribution of the coated member on the mounting table before coating And a height detector for detecting the height distribution of the coating film surface after coating, the height distribution of the coating film surface after coating detected by the same height detector, and the height of the coated member before coating A coating apparatus, further comprising a calculation means for calculating a coating thickness distribution from the distribution difference . An apparatus for manufacturing a plasma display member, wherein the apparatus for manufacturing a plasma display is manufactured using the coating apparatus according to claim 1 . While discharging a coating liquid from a discharge port extending in one direction of the applicator to a member to be coated fixed on the mounting table, at least one of the applicator and the mounting table is relatively moved to coat the coating member. In the coating method for forming the coating material, the height distribution of the coated member before coating on the mounting table and the height distribution of the coating film surface after coating are detected using the same height detector, and from these differences A coating method characterized by calculating a coating thickness distribution . A method for producing a member for a plasma display, comprising producing a member for a plasma display using the coating method according to claim 3 .

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