JP4403867B2 - 電子機器用ヒートシンク - Google Patents

電子機器用ヒートシンク Download PDF

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Publication number
JP4403867B2
JP4403867B2 JP2004114587A JP2004114587A JP4403867B2 JP 4403867 B2 JP4403867 B2 JP 4403867B2 JP 2004114587 A JP2004114587 A JP 2004114587A JP 2004114587 A JP2004114587 A JP 2004114587A JP 4403867 B2 JP4403867 B2 JP 4403867B2
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JP
Japan
Prior art keywords
cooling fluid
heat transfer
heat
flow path
transfer container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004114587A
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English (en)
Japanese (ja)
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JP2005302898A (ja
JP2005302898A5 (enExample
Inventor
茂俊 一法師
哲朗 大串
誠司 羽下
享 木村
山田　　晃
浩史 山渕
章浩 村端
秀夫 岡山
伸哲 上原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2004114587A priority Critical patent/JP4403867B2/ja
Publication of JP2005302898A publication Critical patent/JP2005302898A/ja
Publication of JP2005302898A5 publication Critical patent/JP2005302898A5/ja
Application granted granted Critical
Publication of JP4403867B2 publication Critical patent/JP4403867B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2004114587A 2004-04-08 2004-04-08 電子機器用ヒートシンク Expired - Fee Related JP4403867B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004114587A JP4403867B2 (ja) 2004-04-08 2004-04-08 電子機器用ヒートシンク

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004114587A JP4403867B2 (ja) 2004-04-08 2004-04-08 電子機器用ヒートシンク

Publications (3)

Publication Number Publication Date
JP2005302898A JP2005302898A (ja) 2005-10-27
JP2005302898A5 JP2005302898A5 (enExample) 2008-01-17
JP4403867B2 true JP4403867B2 (ja) 2010-01-27

Family

ID=35334056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004114587A Expired - Fee Related JP4403867B2 (ja) 2004-04-08 2004-04-08 電子機器用ヒートシンク

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JP (1) JP4403867B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9111911B2 (en) 2011-04-01 2015-08-18 Toyota Jidosha Kabushiki Kaisha Heat sink, and heat sink-equipped electronic component part

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4710621B2 (ja) * 2006-01-16 2011-06-29 三菱電機株式会社 放熱構造体
JP2007250753A (ja) * 2006-03-15 2007-09-27 Mitsubishi Electric Corp 冷却板
JP2007294891A (ja) * 2006-03-30 2007-11-08 Dowa Metaltech Kk 放熱器
JP5005356B2 (ja) * 2007-01-11 2012-08-22 株式会社ティラド ヘリボーンタイプ液冷ヒートシンク
JP5182604B2 (ja) * 2007-05-24 2013-04-17 三菱マテリアル株式会社 パワーモジュール用冷却器
JP4941398B2 (ja) * 2008-04-23 2012-05-30 株式会社デンソー 積層型冷却器
JP5949742B2 (ja) * 2008-12-09 2016-07-13 日本軽金属株式会社 液冷ジャケット
JP5136461B2 (ja) * 2009-02-26 2013-02-06 株式会社豊田自動織機 半導体装置
JP5344999B2 (ja) * 2009-06-09 2013-11-20 三菱電機株式会社 ヒートシンク
JP5343775B2 (ja) * 2009-09-08 2013-11-13 三菱電機株式会社 電力用半導体装置
US20110079376A1 (en) * 2009-10-03 2011-04-07 Wolverine Tube, Inc. Cold plate with pins
DE102009051864B4 (de) * 2009-11-04 2023-07-13 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Kühlvorrichtung für eine elektrische Einrichtung
US20130087313A1 (en) * 2010-06-29 2013-04-11 Timothy Michael Rau Fluid cooling module
JP5707916B2 (ja) * 2010-12-14 2015-04-30 トヨタ自動車株式会社 半導体冷却装置及びその製造方法
KR101314723B1 (ko) 2011-07-27 2013-10-08 주식회사 글로벌스탠다드테크놀로지 공정냉각시스템용 열교환기
JP6026772B2 (ja) * 2012-05-17 2016-11-16 株式会社ティラド ヒートシンク
JP6162558B2 (ja) * 2012-09-27 2017-07-12 京セラ株式会社 流路部材およびこれを用いた熱交換器ならびに半導体製造装置
JP2015126207A (ja) * 2013-12-27 2015-07-06 三菱電機株式会社 半導体装置
US10178805B2 (en) * 2014-05-23 2019-01-08 Tesla, Inc. Heatsink with internal cavity for liquid cooling
US10462939B2 (en) 2015-01-22 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
JP6635805B2 (ja) * 2016-01-26 2020-01-29 三菱電機株式会社 半導体装置
JP6680160B2 (ja) * 2016-09-16 2020-04-15 トヨタ自動車株式会社 沸騰冷却装置
US10785864B2 (en) * 2017-09-21 2020-09-22 Amazon Technologies, Inc. Printed circuit board with heat sink
KR102076110B1 (ko) * 2019-11-15 2020-02-11 방민철 반도체 제조를 위한 약액의 온도제어장치
JP7463825B2 (ja) * 2020-04-27 2024-04-09 富士電機株式会社 半導体モジュールおよび車両
JP2022109866A (ja) * 2021-01-15 2022-07-28 富士電機株式会社 鉄道車両
CN113974219A (zh) * 2021-07-22 2022-01-28 深圳市杰仕博科技有限公司 热空气加热雾化香味物质的装置
JP2023144740A (ja) * 2022-03-28 2023-10-11 株式会社レゾナック 冷却装置
CN115360156A (zh) * 2022-07-11 2022-11-18 南京航空航天大学 一种基于磁流体力学效应的芯片散热方法及其装置
JP7770284B2 (ja) * 2022-11-07 2025-11-14 三菱電機株式会社 冷却装置
US20240162117A1 (en) * 2022-11-14 2024-05-16 Semiconductor Components Industries, Llc Power electronics package with dual-single side cooling water jacket
CN116767478A (zh) * 2023-07-11 2023-09-19 苏州艾丽斯装备科技有限公司 一种混合动力游艇电力推进系统的能量控制方法
CN116884933B (zh) * 2023-09-08 2023-12-12 苏州韬盛电子科技有限公司 一种交错微流道散热结构及芯片散热系统
CN117542811B (zh) * 2024-01-10 2024-03-26 广东海洋大学 一种基于微纳结构的新型芯片冷却平台

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9111911B2 (en) 2011-04-01 2015-08-18 Toyota Jidosha Kabushiki Kaisha Heat sink, and heat sink-equipped electronic component part

Also Published As

Publication number Publication date
JP2005302898A (ja) 2005-10-27

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