JP4392879B2 - 投影露光装置及びデバイスの製造方法 - Google Patents

投影露光装置及びデバイスの製造方法 Download PDF

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Publication number
JP4392879B2
JP4392879B2 JP29002998A JP29002998A JP4392879B2 JP 4392879 B2 JP4392879 B2 JP 4392879B2 JP 29002998 A JP29002998 A JP 29002998A JP 29002998 A JP29002998 A JP 29002998A JP 4392879 B2 JP4392879 B2 JP 4392879B2
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JP
Japan
Prior art keywords
optical system
light source
slit
reticle
exposure apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP29002998A
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English (en)
Japanese (ja)
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JP2000106339A5 (enExample
JP2000106339A (ja
Inventor
和生 佐野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
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Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP29002998A priority Critical patent/JP4392879B2/ja
Priority to US09/406,204 priority patent/US6323937B1/en
Publication of JP2000106339A publication Critical patent/JP2000106339A/ja
Priority to US09/977,998 priority patent/US6577381B2/en
Publication of JP2000106339A5 publication Critical patent/JP2000106339A5/ja
Application granted granted Critical
Publication of JP4392879B2 publication Critical patent/JP4392879B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70066Size and form of the illuminated area in the mask plane, e.g. reticle masking blades or blinds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70091Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/701Off-axis setting using an aperture
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70091Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/70108Off-axis setting using a light-guiding element, e.g. diffractive optical elements [DOEs] or light guides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70358Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP29002998A 1998-09-28 1998-09-28 投影露光装置及びデバイスの製造方法 Expired - Fee Related JP4392879B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP29002998A JP4392879B2 (ja) 1998-09-28 1998-09-28 投影露光装置及びデバイスの製造方法
US09/406,204 US6323937B1 (en) 1998-09-28 1999-09-28 Projection exposure apparatus, and device manufacturing method using the same
US09/977,998 US6577381B2 (en) 1998-09-28 2001-10-17 Projection exposure apparatus, and device manufacturing method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29002998A JP4392879B2 (ja) 1998-09-28 1998-09-28 投影露光装置及びデバイスの製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009209287A Division JP2009290243A (ja) 2009-09-10 2009-09-10 投影露光装置及びデバイスの製造方法

Publications (3)

Publication Number Publication Date
JP2000106339A JP2000106339A (ja) 2000-04-11
JP2000106339A5 JP2000106339A5 (enExample) 2005-10-27
JP4392879B2 true JP4392879B2 (ja) 2010-01-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP29002998A Expired - Fee Related JP4392879B2 (ja) 1998-09-28 1998-09-28 投影露光装置及びデバイスの製造方法

Country Status (2)

Country Link
US (2) US6323937B1 (enExample)
JP (1) JP4392879B2 (enExample)

Families Citing this family (19)

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JP4663047B2 (ja) * 1998-07-13 2011-03-30 株式会社半導体エネルギー研究所 レーザー照射装置及び半導体装置の作製方法
KR100827874B1 (ko) * 2000-05-22 2008-05-07 가부시키가이샤 니콘 노광 장치, 노광 장치의 제조 방법, 노광 방법, 마이크로 장치의 제조 방법, 및 디바이스의 제조 방법
KR100572253B1 (ko) * 2000-08-14 2006-04-19 이리스 엘엘씨 리소그래피장치, 디바이스 제조방법 및 그것에 의하여제조된 디바이스
US6473237B2 (en) * 2000-11-14 2002-10-29 Ball Semiconductor, Inc. Point array maskless lithography
JP4822486B2 (ja) * 2001-09-26 2011-11-24 Nltテクノロジー株式会社 半透過反射板及び半透過型液晶表示装置
JP4207478B2 (ja) * 2002-07-12 2009-01-14 株式会社ニコン オプティカルインテグレータ、照明光学装置、露光装置および露光方法
JP5653182B2 (ja) * 2003-05-22 2015-01-14 キヤノン株式会社 露光方法、露光装置及びデバイス製造方法
TWI233541B (en) * 2003-10-29 2005-06-01 Hannstar Display Corp An exposure method and an apparatus thereof
JP4458329B2 (ja) * 2003-12-26 2010-04-28 キヤノン株式会社 露光装置及びデバイス製造方法
CN100541722C (zh) 2004-03-26 2009-09-16 株式会社半导体能源研究所 激光辐照方法和激光辐照装置
US8525075B2 (en) 2004-05-06 2013-09-03 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus
CN101667538B (zh) * 2004-08-23 2012-10-10 株式会社半导体能源研究所 半导体器件及其制造方法
US20080090396A1 (en) * 2006-10-06 2008-04-17 Semiconductor Energy Laboratory Co., Ltd. Light exposure apparatus and method for making semiconductor device formed using the same
JP5007192B2 (ja) * 2006-10-06 2012-08-22 株式会社半導体エネルギー研究所 半導体装置の作製方法
WO2009135586A1 (en) * 2008-05-09 2009-11-12 Carl Zeiss Smt Ag Illumination system comprising a fourier optical system
JP6745647B2 (ja) * 2016-06-01 2020-08-26 キヤノン株式会社 走査露光装置および物品製造方法
EP3299780A1 (de) * 2016-09-26 2018-03-28 Berthold Technologies GmbH & Co. KG Verfahren und system zum spektroskopischen messen optischer eigenschaften von proben
JP7336922B2 (ja) * 2019-09-03 2023-09-01 キヤノン株式会社 露光装置及び物品の製造方法
JP7646402B2 (ja) * 2021-03-16 2025-03-17 キヤノン株式会社 照明光学系、露光装置、および物品の製造方法

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DE2210945C3 (de) 1972-03-07 1978-09-21 Gerhard 8200 Rosenheim Krause Belichtungsmefigerät
US4519692A (en) 1983-04-08 1985-05-28 Warner-Lambert Technologies, Inc. Exposure and camera control
US4822975A (en) 1984-01-30 1989-04-18 Canon Kabushiki Kaisha Method and apparatus for scanning exposure
JPS60158449A (ja) 1984-01-30 1985-08-19 Canon Inc 露光装置
US5171965A (en) 1984-02-01 1992-12-15 Canon Kabushiki Kaisha Exposure method and apparatus
JPH0614508B2 (ja) 1985-03-06 1994-02-23 キヤノン株式会社 ステップアンドリピート露光方法
EP0266203B1 (en) 1986-10-30 1994-07-06 Canon Kabushiki Kaisha An illumination device
US4884101A (en) 1987-02-03 1989-11-28 Nikon Corporation Apparatus capable of adjusting the light amount
JPS63193130A (ja) 1987-02-05 1988-08-10 Canon Inc 光量制御装置
US4804978A (en) 1988-02-19 1989-02-14 The Perkin-Elmer Corporation Exposure control system for full field photolithography using pulsed sources
JP2569711B2 (ja) 1988-04-07 1997-01-08 株式会社ニコン 露光制御装置及び該装置による露光方法
US5191374A (en) 1988-11-17 1993-03-02 Nikon Corporation Exposure control apparatus
JPH02177415A (ja) 1988-12-28 1990-07-10 Canon Inc 露光装置
JPH02177313A (ja) 1988-12-28 1990-07-10 Canon Inc 露光制御装置
US5475491A (en) 1989-02-10 1995-12-12 Canon Kabushiki Kaisha Exposure apparatus
JP2731953B2 (ja) 1989-08-07 1998-03-25 キヤノン株式会社 エネルギー量制御装置
US5250797A (en) 1990-10-05 1993-10-05 Canon Kabushiki Kaisha Exposure method and apparatus for controlling light pulse emission using determined exposure quantities and control parameters
US6078381A (en) * 1993-02-01 2000-06-20 Nikon Corporation Exposure method and apparatus
JP2862477B2 (ja) 1993-06-29 1999-03-03 キヤノン株式会社 露光装置及び該露光装置を用いてデバイスを製造する方法
JP3057998B2 (ja) 1994-02-16 2000-07-04 キヤノン株式会社 照明装置及びそれを用いた投影露光装置

Also Published As

Publication number Publication date
US20020024650A1 (en) 2002-02-28
JP2000106339A (ja) 2000-04-11
US6577381B2 (en) 2003-06-10
US6323937B1 (en) 2001-11-27

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