JP4379878B2 - エアーギャップを選択的に形成する方法及び当該方法により作製された装置 - Google Patents
エアーギャップを選択的に形成する方法及び当該方法により作製された装置 Download PDFInfo
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- JP4379878B2 JP4379878B2 JP2004287734A JP2004287734A JP4379878B2 JP 4379878 B2 JP4379878 B2 JP 4379878B2 JP 2004287734 A JP2004287734 A JP 2004287734A JP 2004287734 A JP2004287734 A JP 2004287734A JP 4379878 B2 JP4379878 B2 JP 4379878B2
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- layer
- etching
- liner
- air gap
- laminate
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- 229910004298 SiO 2 Inorganic materials 0.000 claims description 49
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 40
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- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 claims description 35
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- 239000004020 conductor Substances 0.000 claims description 16
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
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- 150000001875 compounds Chemical class 0.000 claims description 4
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
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- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 2
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- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
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- 150000002739 metals Chemical class 0.000 description 1
- YTCQFLFGFXZUSN-BAQGIRSFSA-N microline Chemical compound OC12OC3(C)COC2(O)C(C(/Cl)=C/C)=CC(=O)C21C3C2 YTCQFLFGFXZUSN-BAQGIRSFSA-N 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
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- 238000009832 plasma treatment Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
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- 238000001179 sorption measurement Methods 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 1
Images
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- Micromachines (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US50758403P | 2003-09-30 | 2003-09-30 | |
| EP03447239A EP1521301A1 (en) | 2003-09-30 | 2003-09-30 | Method of formation of airgaps around interconnecting line |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005175435A JP2005175435A (ja) | 2005-06-30 |
| JP2005175435A5 JP2005175435A5 (enExample) | 2005-11-04 |
| JP4379878B2 true JP4379878B2 (ja) | 2009-12-09 |
Family
ID=34740672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004287734A Expired - Fee Related JP4379878B2 (ja) | 2003-09-30 | 2004-09-30 | エアーギャップを選択的に形成する方法及び当該方法により作製された装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4379878B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100712517B1 (ko) * | 2005-07-14 | 2007-04-30 | 삼성전자주식회사 | 에어 갭 구조를 갖는 반도체 소자의 인터포저 |
| JP4735314B2 (ja) * | 2006-02-14 | 2011-07-27 | ソニー株式会社 | 半導体装置およびその製造方法 |
| FR2916303B1 (fr) * | 2007-05-15 | 2009-07-31 | Commissariat Energie Atomique | Procede de fabrication de cavites d'air utilisant des nanotubes |
| JP2010258215A (ja) | 2009-04-24 | 2010-11-11 | Renesas Electronics Corp | 半導体装置及び半導体装置の製造方法 |
| KR102190654B1 (ko) * | 2014-04-07 | 2020-12-15 | 삼성전자주식회사 | 반도체 장치 및 이의 제조 방법 |
-
2004
- 2004-09-30 JP JP2004287734A patent/JP4379878B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005175435A (ja) | 2005-06-30 |
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