JP4372010B2 - 流れ調整システム - Google Patents
流れ調整システム Download PDFInfo
- Publication number
- JP4372010B2 JP4372010B2 JP2004541523A JP2004541523A JP4372010B2 JP 4372010 B2 JP4372010 B2 JP 4372010B2 JP 2004541523 A JP2004541523 A JP 2004541523A JP 2004541523 A JP2004541523 A JP 2004541523A JP 4372010 B2 JP4372010 B2 JP 4372010B2
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- process fluid
- conditioning system
- reservoir
- fluid reservoir
- outlet
- Prior art date
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- Expired - Lifetime
Links
- 239000012530 fluid Substances 0.000 claims description 212
- 238000000034 method Methods 0.000 claims description 151
- 230000008569 process Effects 0.000 claims description 144
- 239000002002 slurry Substances 0.000 claims description 45
- 230000003750 conditioning effect Effects 0.000 claims description 31
- 238000004891 communication Methods 0.000 claims description 15
- 239000012528 membrane Substances 0.000 claims description 12
- 230000001105 regulatory effect Effects 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims 1
- 238000005498 polishing Methods 0.000 description 10
- 239000000126 substance Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000002572 peristaltic effect Effects 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000010349 pulsation Effects 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 239000004575 stone Substances 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 1
- 229920001774 Perfluoroether Polymers 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- -1 pump motor speed Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
- G05D7/06—Control of flow characterised by the use of electric means
- G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
- G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
- G05D7/0676—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on flow sources
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/206—Flow affected by fluid contact, energy field or coanda effect [e.g., pure fluid device or system]
- Y10T137/218—Means to regulate or vary operation of device
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Reciprocating Pumps (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Flow Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Sampling And Sample Adjustment (AREA)
- Catching Or Destruction (AREA)
Description
Claims (27)
- 流れ調整システムであって、
第1および第2の端部を有する実質的に堅い容器を備え、堅い容器の第1の端部は、入口および出口を有し、前記流れ調整システムがさらに、
堅い容器中に位置し、かつ入口および出口と流体連通しているプロセス流体溜めを含み、該プロセス流体溜めが、プロセス流体を堅い容器の内部から隔離しており、
堅い容器が該容器中に配置された可動部材を備え、第1の方向への可動部材の動きによって、プロセス流体が入口に引き込まれ、かつ第2の方向への可動部材の動きによって、プロセス流体が出口から排出される、流れ調整システム。 - 堅い容器が円筒を備える、請求項1に記載の流れ調整システム。
- プロセス流体溜めが、袋を含み、該袋が、堅い容器中に位置しかつ入口および出口と流体連通している、請求項1に記載の流れ調整システム。
- 可動部材が、円筒中に滑動可能なように配置されたプランジャを備える、請求項2に記載の流れ調整システム。
- プランジャを作動するためにプランジャに接続されたピストンをさらに備える、請求項4に記載の流れ調整システム。
- プランジャを作動するためにピストンに動作可能に接続されたステップモータをさらに備える、請求項5に記載の流れ調整システム。
- 入口および出口が、それぞれ入口逆止め弁および出口逆止め弁を含む、請求項1に記載の流れ調整システム。
- プランジャが、PFAで作られている、請求項4に記載の流れ調整システム。
- 袋が、PFAで作られている、請求項3に記載の流れ調整システム。
- 堅い容器中に位置している駆動流体溜めをさらに備える、請求項1に記載の流れ調整システム。
- 可動部材が、駆動流体溜めをプロセス流体溜めから隔てる膜を備える、請求項10に記載の流れ調整システム。
- 膜が、PFAで作られている、請求項11に記載の流れ調整システム。
- 選択的に作用流体溜めの中にまた作用流体溜めから外に作用流体を計量して供給するための、作用流体溜めと流体連通したポンプをさらに備え、作用流体溜めから外に作用流体を計量して供給することで、膜が第1の方向に変位してプロセス流体が入口に引き込まれ、かつ作用溜めの中に作用流体を計量して供給することで、膜が第2の方向に変位してプロセス流体が出口から排出される、請求項11に記載の流れ調整システム。
- 実質的に堅い容器と、
堅い容器で画定されたプロセス流体出口と、
堅い容器中に位置しかつプロセス流体出口と流体連通している可撓性プロセス流体溜めとを含み、該プロセス流体溜めが、プロセス流体を堅い容器の内部から隔離しており、
堅い容器が該容器中に位置しかつプロセス流体溜めを実質的に囲む作用流体溜めを備え、堅い容器が作用流体入口を画定し、作用流体溜めの中に入れられた作用流体が、プロセス流体溜めを押し付けて、プロセス流体溜めからプロセス流体出口を通してプロセス流体を排出する、流れ調整システム。 - 作用流体溜めの中に作用流体を計量して供給するように作用流体入口に接続されたポンプをさらに備える、請求項14に記載の流れ調整システム。
- プロセス流体出口に接続されたフィルタをさらに備える、請求項14に記載の流れ調整システム。
- プロセス流体溜めの中に含まれたプロセス流体を混合する混合機をさらに備える、請求項14に記載の流れ調整システム。
- 混合機が、超音波混合機を備える、請求項17に記載の流れ調整システム。
- 作用流体溜めが、使い捨てのバッグを備える、請求項14に記載の流れ調整システム。
- CMPツールへのプロセス流体の流れを調整する方法であって、
プロセス流体を含むプロセス流体溜めを設けるステップと、
可動部材を設けるステップと、
プロセス流体溜めと流体連通しているプロセス流体出口にCMPツールを接続するステップと、
可動部材を移動させて、それによってプロセス流体溜めをつぶして、プロセス流体溜めからCMPツールへ所望の流量でプロセス流体を排出するステップとを含み、プロセス流体溜めおよび可動部材が堅い部材中に位置しており、前記プロセス流体溜めは、プロセス流体を堅い容器の内部から隔離する、方法。 - プロセス流体を含むプロセス流体溜めを設けるステップが、
プロセス流体溜めと流体連通しているプロセス流体入口にプロセス流体の供給源を接続すること、
プロセス流体入口に接続された入口弁を開くこと、
プロセス流体出口に接続された出口弁を閉じること、および
所定量のプロセス流体をプロセス流体供給源からプロセス流体溜めに引き込むことを含む、請求項20に記載の方法。 - プロセス流体溜めをつぶすステップが、
入口弁を閉じること、および
出口弁を開くことを含む、請求項21に記載の方法。 - プロセス流体溜めからCMPツールにプロセス流体を排出するように可動部材を第2の方向に動かすステップと、
所定量のプロセス流体をプロセス流体供給源からプロセス流体溜めに引き込むステップにして、可動部材を第1の方向に動かすことを含むステップとをさらに有する、請求項21に記載の方法。 - プロセス流体を含むプロセス流体溜めを設けるステップが、プロセス流体を含んだ使い捨てのバッグを設けることを含む、請求項20に記載の方法。
- プロセス流体がスラリーである、請求項1に記載の流れ調整システム。
- プロセス流体がスラリーである、請求項14に記載の流れ調整システム。
- プロセス流体がスラリーである、請求項20に記載のCMPツールへのプロセス流体の流れを調整する方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/065,275 US7204679B2 (en) | 2002-09-30 | 2002-09-30 | Flow control system |
PCT/US2003/028397 WO2004030860A2 (en) | 2002-09-30 | 2003-09-10 | Flow control system |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006501075A JP2006501075A (ja) | 2006-01-12 |
JP4372010B2 true JP4372010B2 (ja) | 2009-11-25 |
Family
ID=32028515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004541523A Expired - Lifetime JP4372010B2 (ja) | 2002-09-30 | 2003-09-10 | 流れ調整システム |
Country Status (18)
Country | Link |
---|---|
US (1) | US7204679B2 (ja) |
EP (4) | EP2343156B1 (ja) |
JP (1) | JP4372010B2 (ja) |
KR (1) | KR100649468B1 (ja) |
CN (2) | CN101491889B (ja) |
AR (2) | AR041382A1 (ja) |
AT (1) | ATE485919T1 (ja) |
AU (1) | AU2003266022B2 (ja) |
BR (1) | BR0314955A (ja) |
CA (1) | CA2500543C (ja) |
DE (1) | DE60334712D1 (ja) |
DK (2) | DK2343156T3 (ja) |
HK (2) | HK1129628A1 (ja) |
MX (1) | MXPA05003444A (ja) |
MY (1) | MY135346A (ja) |
PL (3) | PL206361B1 (ja) |
RU (1) | RU2313004C2 (ja) |
WO (1) | WO2004030860A2 (ja) |
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US7980919B2 (en) * | 2005-01-18 | 2011-07-19 | Zhengcai Zhou | Blasting device for premixed abrasive slurry jet |
US7735563B2 (en) * | 2005-03-10 | 2010-06-15 | Hydril Usa Manufacturing Llc | Pressure driven pumping system |
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EP2223332A4 (en) * | 2007-12-06 | 2012-07-11 | Foresight Proc Llc | SYSTEMS AND METHODS FOR DELIVERING COMBINATIONS OF TREATMENT MATERIAL CONTAINING FLUID |
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KR20130090209A (ko) * | 2012-02-03 | 2013-08-13 | 삼성전자주식회사 | 기판처리장치 및 기판처리방법 |
AU2014236334B2 (en) * | 2013-03-14 | 2018-04-05 | Bio-Rad Laboratories, Inc. | Bottle pressurization delivery system |
US9770804B2 (en) | 2013-03-18 | 2017-09-26 | Versum Materials Us, Llc | Slurry supply and/or chemical blend supply apparatuses, processes, methods of use and methods of manufacture |
US9695674B2 (en) * | 2014-04-04 | 2017-07-04 | Onesubsea Ip Uk Limited | Subsea dosing pump |
US9689529B2 (en) * | 2014-05-08 | 2017-06-27 | Baker Hughes Incorporated | Oil injection unit |
JP6622578B2 (ja) * | 2015-12-08 | 2019-12-18 | 不二越機械工業株式会社 | ワーク加工装置およびこれに用いる薬液収納バッグ |
CN107096901A (zh) * | 2017-05-02 | 2017-08-29 | 重庆天运汽车配件有限公司 | 一种离心浇铸均匀进液装置 |
US11251047B2 (en) * | 2017-11-13 | 2022-02-15 | Applied Materials, Inc. | Clog detection in a multi-port fluid delivery system |
JP7194996B2 (ja) * | 2019-03-13 | 2022-12-23 | 株式会社松井製作所 | 流体研磨装置 |
JP7407439B2 (ja) * | 2019-10-24 | 2024-01-04 | 兵神装備株式会社 | 流体圧送装置 |
TWI742924B (zh) * | 2020-11-13 | 2021-10-11 | 國立勤益科技大學 | 自動擠膏拋光刀把 |
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-
2002
- 2002-09-30 US US10/065,275 patent/US7204679B2/en active Active
-
2003
- 2003-09-10 EP EP20100012713 patent/EP2343156B1/en not_active Expired - Lifetime
- 2003-09-10 DK DK10012713.3T patent/DK2343156T3/en active
- 2003-09-10 EP EP20080170886 patent/EP2108482A1/en not_active Withdrawn
- 2003-09-10 EP EP20100012714 patent/EP2347858A3/en not_active Withdrawn
- 2003-09-10 AT AT03799281T patent/ATE485919T1/de not_active IP Right Cessation
- 2003-09-10 BR BR0314955A patent/BR0314955A/pt not_active Application Discontinuation
- 2003-09-10 CA CA002500543A patent/CA2500543C/en not_active Expired - Lifetime
- 2003-09-10 PL PL388177A patent/PL206361B1/pl unknown
- 2003-09-10 DE DE60334712T patent/DE60334712D1/de not_active Expired - Lifetime
- 2003-09-10 CN CN2009100045957A patent/CN101491889B/zh not_active Expired - Lifetime
- 2003-09-10 PL PL388178A patent/PL206362B1/pl unknown
- 2003-09-10 MX MXPA05003444A patent/MXPA05003444A/es active IP Right Grant
- 2003-09-10 PL PL375436A patent/PL206360B1/pl unknown
- 2003-09-10 DK DK03799281.5T patent/DK1545835T3/da active
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