HK1129628A1 - A method of controlling the flow of slurry to a cmp tool - Google Patents

A method of controlling the flow of slurry to a cmp tool

Info

Publication number
HK1129628A1
HK1129628A1 HK09108929A HK09108929A HK1129628A1 HK 1129628 A1 HK1129628 A1 HK 1129628A1 HK 09108929 A HK09108929 A HK 09108929A HK 09108929 A HK09108929 A HK 09108929A HK 1129628 A1 HK1129628 A1 HK 1129628A1
Authority
HK
Hong Kong
Prior art keywords
slurry
controlling
flow
cmp tool
cmp
Prior art date
Application number
HK09108929A
Other languages
English (en)
Inventor
Matthew G Wheeler
Original Assignee
Emerson Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Emerson Electric Co filed Critical Emerson Electric Co
Publication of HK1129628A1 publication Critical patent/HK1129628A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D7/00—Control of flow
    • G05D7/06—Control of flow characterised by the use of electric means
    • G05D7/0617—Control of flow characterised by the use of electric means specially adapted for fluid materials
    • G05D7/0629—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means
    • G05D7/0676—Control of flow characterised by the use of electric means specially adapted for fluid materials characterised by the type of regulator means by action on flow sources
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/206—Flow affected by fluid contact, energy field or coanda effect [e.g., pure fluid device or system]
    • Y10T137/218—Means to regulate or vary operation of device

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Reciprocating Pumps (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Flow Control (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Catching Or Destruction (AREA)
HK09108929A 2002-09-30 2006-06-08 A method of controlling the flow of slurry to a cmp tool HK1129628A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/065,275 US7204679B2 (en) 2002-09-30 2002-09-30 Flow control system
HK06106579A HK1086523A1 (en) 2002-09-30 2006-06-08 Flow control system

Publications (1)

Publication Number Publication Date
HK1129628A1 true HK1129628A1 (en) 2009-12-04

Family

ID=32028515

Family Applications (2)

Application Number Title Priority Date Filing Date
HK09108929A HK1129628A1 (en) 2002-09-30 2006-06-08 A method of controlling the flow of slurry to a cmp tool
HK06106579A HK1086523A1 (en) 2002-09-30 2006-06-08 Flow control system

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK06106579A HK1086523A1 (en) 2002-09-30 2006-06-08 Flow control system

Country Status (18)

Country Link
US (1) US7204679B2 (xx)
EP (4) EP1545835B1 (xx)
JP (1) JP4372010B2 (xx)
KR (1) KR100649468B1 (xx)
CN (2) CN100528485C (xx)
AR (2) AR041382A1 (xx)
AT (1) ATE485919T1 (xx)
AU (1) AU2003266022B2 (xx)
BR (1) BR0314955A (xx)
CA (1) CA2500543C (xx)
DE (1) DE60334712D1 (xx)
DK (2) DK1545835T3 (xx)
HK (2) HK1129628A1 (xx)
MX (1) MXPA05003444A (xx)
MY (1) MY135346A (xx)
PL (3) PL206360B1 (xx)
RU (1) RU2313004C2 (xx)
WO (1) WO2004030860A2 (xx)

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WO2006076827A1 (fr) * 2005-01-18 2006-07-27 Zhengcai Zhou Dispositif de projection pour boue abrasive pre-melangee
US7735563B2 (en) * 2005-03-10 2010-06-15 Hydril Usa Manufacturing Llc Pressure driven pumping system
WO2006116428A2 (en) * 2005-04-25 2006-11-02 Advanced Technology Materials, Inc. Apparatus and process for storage and dispensing of chemical reagents and compositions
KR100806841B1 (ko) * 2006-09-11 2008-02-22 세메스 주식회사 슬러리 공급장치에서의 버블 댐퍼
TW200916183A (en) * 2007-05-09 2009-04-16 Advanced Tech Materials Systems and methods for material blending and distribution
US8507382B2 (en) * 2007-12-06 2013-08-13 Foresight Processing, Llc Systems and methods for delivery of fluid-containing process material combinations
US20100243087A1 (en) * 2009-03-03 2010-09-30 Millipore Corporation System and pump apparatus for processing fluid samples
SG176676A1 (en) * 2009-06-10 2012-01-30 Advanced Tech Materials Fluid processing systems and methods
US8308854B2 (en) * 2009-12-15 2012-11-13 Thermo Finnigan Llc Helium reclamation systems and methods for a gas chromatograph
RU2459978C1 (ru) * 2011-07-26 2012-08-27 Общество с ограниченной ответственностью "Купер" Насосная установка регулируемая, диафрагменная
KR20130090209A (ko) * 2012-02-03 2013-08-13 삼성전자주식회사 기판처리장치 및 기판처리방법
CN105188871B (zh) 2013-03-14 2018-01-12 生物辐射实验室股份有限公司 瓶子加压输送系统
US9770804B2 (en) 2013-03-18 2017-09-26 Versum Materials Us, Llc Slurry supply and/or chemical blend supply apparatuses, processes, methods of use and methods of manufacture
US9695674B2 (en) * 2014-04-04 2017-07-04 Onesubsea Ip Uk Limited Subsea dosing pump
US9689529B2 (en) * 2014-05-08 2017-06-27 Baker Hughes Incorporated Oil injection unit
JP6622578B2 (ja) * 2015-12-08 2019-12-18 不二越機械工業株式会社 ワーク加工装置およびこれに用いる薬液収納バッグ
CN107096901A (zh) * 2017-05-02 2017-08-29 重庆天运汽车配件有限公司 一种离心浇铸均匀进液装置
US11251047B2 (en) * 2017-11-13 2022-02-15 Applied Materials, Inc. Clog detection in a multi-port fluid delivery system
JP7194996B2 (ja) * 2019-03-13 2022-12-23 株式会社松井製作所 流体研磨装置
JP7407439B2 (ja) * 2019-10-24 2024-01-04 兵神装備株式会社 流体圧送装置
TWI742924B (zh) * 2020-11-13 2021-10-11 國立勤益科技大學 自動擠膏拋光刀把

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Also Published As

Publication number Publication date
JP4372010B2 (ja) 2009-11-25
HK1086523A1 (en) 2006-09-22
CN101491889B (zh) 2011-03-23
CN101491889A (zh) 2009-07-29
EP2108482A1 (en) 2009-10-14
CN1729082A (zh) 2006-02-01
ATE485919T1 (de) 2010-11-15
MY135346A (en) 2008-03-31
EP2343156A2 (en) 2011-07-13
KR20050055737A (ko) 2005-06-13
PL206361B1 (pl) 2010-07-30
DK2343156T3 (en) 2015-04-20
PL206360B1 (pl) 2010-07-30
RU2313004C2 (ru) 2007-12-20
DE60334712D1 (de) 2010-12-09
RU2005113299A (ru) 2005-09-20
EP2347858A2 (en) 2011-07-27
EP2347858A3 (en) 2012-05-02
WO2004030860A3 (en) 2004-09-30
EP2343156A3 (en) 2012-05-02
US7204679B2 (en) 2007-04-17
DK1545835T3 (da) 2011-01-31
EP1545835A2 (en) 2005-06-29
AU2003266022A1 (en) 2004-04-23
KR100649468B1 (ko) 2006-11-28
CN100528485C (zh) 2009-08-19
PL375436A1 (en) 2005-11-28
AU2003266022B2 (en) 2007-09-06
CA2500543C (en) 2009-03-24
PL206362B1 (pl) 2010-07-30
BR0314955A (pt) 2005-08-02
JP2006501075A (ja) 2006-01-12
EP2343156B1 (en) 2015-01-28
EP1545835B1 (en) 2010-10-27
US20040060607A1 (en) 2004-04-01
WO2004030860A2 (en) 2004-04-15
AR071409A2 (es) 2010-06-16
AR041382A1 (es) 2005-05-18
CA2500543A1 (en) 2004-04-15
MXPA05003444A (es) 2005-07-05

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20230909