JP4368499B2 - 弾性表面波素子の製造方法およびそれを用いた弾性表面波デバイスの製造方法 - Google Patents

弾性表面波素子の製造方法およびそれを用いた弾性表面波デバイスの製造方法 Download PDF

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Publication number
JP4368499B2
JP4368499B2 JP2000166359A JP2000166359A JP4368499B2 JP 4368499 B2 JP4368499 B2 JP 4368499B2 JP 2000166359 A JP2000166359 A JP 2000166359A JP 2000166359 A JP2000166359 A JP 2000166359A JP 4368499 B2 JP4368499 B2 JP 4368499B2
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substrate
acoustic wave
surface acoustic
wave element
cutting
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Expired - Lifetime
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JP2000166359A
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English (en)
Japanese (ja)
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JP2001060846A5 (enrdf_load_stackoverflow
JP2001060846A (ja
Inventor
慶治 大西
浩輝 佐藤
佳宏 冨田
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2000166359A priority Critical patent/JP4368499B2/ja
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Publication of JP2001060846A5 publication Critical patent/JP2001060846A5/ja
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  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2000166359A 1999-06-14 2000-06-02 弾性表面波素子の製造方法およびそれを用いた弾性表面波デバイスの製造方法 Expired - Lifetime JP4368499B2 (ja)

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JP2000166359A JP4368499B2 (ja) 1999-06-14 2000-06-02 弾性表面波素子の製造方法およびそれを用いた弾性表面波デバイスの製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP16668499 1999-06-14
JP11-166684 1999-06-14
JP2000166359A JP4368499B2 (ja) 1999-06-14 2000-06-02 弾性表面波素子の製造方法およびそれを用いた弾性表面波デバイスの製造方法

Related Child Applications (1)

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JP2008329986A Division JP4368930B2 (ja) 1999-06-14 2008-12-25 弾性表面波素子

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JP2001060846A JP2001060846A (ja) 2001-03-06
JP2001060846A5 JP2001060846A5 (enrdf_load_stackoverflow) 2009-02-19
JP4368499B2 true JP4368499B2 (ja) 2009-11-18

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JP2000166359A Expired - Lifetime JP4368499B2 (ja) 1999-06-14 2000-06-02 弾性表面波素子の製造方法およびそれを用いた弾性表面波デバイスの製造方法

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Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6426583B1 (en) 1999-06-14 2002-07-30 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave element, method for producing the same and surface acoustic wave device using the same
JP2004336503A (ja) 2003-05-09 2004-11-25 Fujitsu Media Device Kk 弾性表面波素子及びその製造方法
WO2006123653A1 (ja) * 2005-05-20 2006-11-23 Murata Manufacturing Co., Ltd. 圧電デバイス
JP2007134889A (ja) * 2005-11-09 2007-05-31 Shin Etsu Chem Co Ltd 複合圧電基板
JP5363092B2 (ja) * 2008-12-24 2013-12-11 日本碍子株式会社 表面弾性波フィルタ用複合基板の製造方法及び表面弾性波フィルタ用複合基板
JP2010166371A (ja) * 2009-01-16 2010-07-29 Murata Mfg Co Ltd 圧電デバイスの製造方法
WO2010087226A1 (ja) 2009-01-29 2010-08-05 株式会社村田製作所 複合基板の製造方法
JP5458651B2 (ja) * 2009-04-28 2014-04-02 株式会社村田製作所 弾性表面波素子用基板及び弾性表面波素子の製造方法
JP5399229B2 (ja) * 2009-12-25 2014-01-29 日本碍子株式会社 複合基板及びその製造方法
JP5794778B2 (ja) * 2010-12-25 2015-10-14 京セラ株式会社 電子装置
WO2013027760A1 (ja) * 2011-08-22 2013-02-28 京セラ株式会社 弾性波装置および電子部品
JP2015138929A (ja) * 2014-01-24 2015-07-30 東京エレクトロン株式会社 接合システム、接合方法、プログラム、コンピュータ記憶媒体
JP6310360B2 (ja) 2014-08-13 2018-04-11 太陽誘電株式会社 弾性波デバイス
JP6433930B2 (ja) * 2016-02-23 2018-12-05 太陽誘電株式会社 弾性波デバイス
CN111066244B (zh) * 2017-08-29 2023-03-24 株式会社村田制作所 弹性波装置、高频前端电路以及通信装置

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