JP4355987B2 - スズ−亜鉛合金を電着するための水溶液 - Google Patents

スズ−亜鉛合金を電着するための水溶液 Download PDF

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Publication number
JP4355987B2
JP4355987B2 JP2000582620A JP2000582620A JP4355987B2 JP 4355987 B2 JP4355987 B2 JP 4355987B2 JP 2000582620 A JP2000582620 A JP 2000582620A JP 2000582620 A JP2000582620 A JP 2000582620A JP 4355987 B2 JP4355987 B2 JP 4355987B2
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JP
Japan
Prior art keywords
atom
alkyl group
represented
carbon atoms
tin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2000582620A
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English (en)
Japanese (ja)
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JP2002530528A (ja
JP2002530528A5 (enExample
Inventor
ジョーダン マンフレット
シュトルベ ゲルノット
Original Assignee
デーエル.−イーエンゲー.マックス シュレッター ゲーエムベーハー ウント ツェーオー.カーゲー
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Application filed by デーエル.−イーエンゲー.マックス シュレッター ゲーエムベーハー ウント ツェーオー.カーゲー filed Critical デーエル.−イーエンゲー.マックス シュレッター ゲーエムベーハー ウント ツェーオー.カーゲー
Publication of JP2002530528A publication Critical patent/JP2002530528A/ja
Publication of JP2002530528A5 publication Critical patent/JP2002530528A5/ja
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Publication of JP4355987B2 publication Critical patent/JP4355987B2/ja
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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/60Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
JP2000582620A 1998-11-12 1999-11-12 スズ−亜鉛合金を電着するための水溶液 Expired - Fee Related JP4355987B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19852219A DE19852219C1 (de) 1998-11-12 1998-11-12 Wäßrige Lösung zur elektrolytischen Abscheidung von Zinn-Zink-Legierungen und Verwendung der Lösung
DE19852219.3 1998-11-12
PCT/EP1999/008724 WO2000029645A2 (de) 1998-11-12 1999-11-12 Wässrige lösung zur elektrolytischen abscheidung von zinn-zink-legierungen

Publications (3)

Publication Number Publication Date
JP2002530528A JP2002530528A (ja) 2002-09-17
JP2002530528A5 JP2002530528A5 (enExample) 2007-01-11
JP4355987B2 true JP4355987B2 (ja) 2009-11-04

Family

ID=7887579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000582620A Expired - Fee Related JP4355987B2 (ja) 1998-11-12 1999-11-12 スズ−亜鉛合金を電着するための水溶液

Country Status (11)

Country Link
US (1) US6770185B2 (enExample)
EP (1) EP1137825B1 (enExample)
JP (1) JP4355987B2 (enExample)
KR (1) KR20010086017A (enExample)
CN (1) CN1195904C (enExample)
AT (1) ATE223979T1 (enExample)
AU (1) AU1775200A (enExample)
CZ (1) CZ296310B6 (enExample)
DE (2) DE19852219C1 (enExample)
PL (1) PL194304B1 (enExample)
WO (1) WO2000029645A2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002024979A1 (de) * 2000-09-20 2002-03-28 Dr.-Ing. Max Schlötter Gmbh & Co. Kg Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
CN101809200A (zh) * 2007-09-27 2010-08-18 日本油漆株式会社 表面处理金属材料和金属涂装物的制造方法
CN102443827A (zh) * 2011-12-19 2012-05-09 张家港舒马克电梯安装维修服务有限公司镀锌分公司 一种Sn-Zn合金电镀液
CN102634827B (zh) * 2012-05-07 2015-04-08 东莞市闻誉实业有限公司 一种锡-锌合金电镀方法
CN106498453B (zh) * 2016-09-14 2018-08-28 湖北大学 一种镀锡、锡合金的光亮剂及其制备方法和应用
JP2021116473A (ja) * 2020-01-27 2021-08-10 三菱マテリアル株式会社 錫又は錫合金電解めっき液、バンプの形成方法、及び回路基板の製造方法
WO2021153160A1 (ja) * 2020-01-27 2021-08-05 三菱マテリアル株式会社 錫又は錫合金電解めっき液、バンプの形成方法、及び回路基板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE415577B (sv) * 1977-09-15 1980-10-13 Magnusson H H Produkter Sett och elektrolyt for att fobereda en stalyta for lackering
GB2013241B (en) * 1977-11-16 1982-03-24 Dipsol Chem Electroplating bath for depositing tin or tin alloy with brightness
DE69106522T2 (de) * 1990-08-31 1995-07-20 Barry Beresford Thomas K Elektroplattierung.
DE4034304A1 (de) * 1990-10-29 1992-04-30 Henkel Kgaa Elektrolytzusatzmittel fuer ein faerbebad zur aluminiumeinfaerbung und verfahren zur einfaerbung von aluminium
GB2266894A (en) * 1992-05-15 1993-11-17 Zinex Corp Modified tin brightener for tin-zinc alloy electroplating bath
JP3279353B2 (ja) * 1992-09-25 2002-04-30 ディップソール株式会社 錫−亜鉛合金電気めっき浴
DE4446329A1 (de) * 1994-12-23 1996-06-27 Basf Ag Salze aromatischer Hydroxylverbindungen und deren Verwendung als Glanzbildner
JP3609565B2 (ja) * 1996-12-09 2005-01-12 株式会社大和化成研究所 錫−亜鉛合金めっき浴
JP3816241B2 (ja) * 1998-07-14 2006-08-30 株式会社大和化成研究所 金属を還元析出させるための水溶液

Also Published As

Publication number Publication date
DE59902696D1 (de) 2002-10-17
PL348755A1 (en) 2002-06-03
US20020046954A1 (en) 2002-04-25
JP2002530528A (ja) 2002-09-17
EP1137825A2 (de) 2001-10-04
WO2000029645A2 (de) 2000-05-25
PL194304B1 (pl) 2007-05-31
DE19852219C1 (de) 2000-05-11
WO2000029645A3 (de) 2000-09-14
ATE223979T1 (de) 2002-09-15
AU1775200A (en) 2000-06-05
US6770185B2 (en) 2004-08-03
CZ20011633A3 (cs) 2001-12-12
KR20010086017A (ko) 2001-09-07
EP1137825B1 (de) 2002-09-11
CN1321205A (zh) 2001-11-07
CN1195904C (zh) 2005-04-06
CZ296310B6 (cs) 2006-02-15

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