JP4344875B2 - 複数のピクセルセンサの組を有する画像センサ - Google Patents
複数のピクセルセンサの組を有する画像センサ Download PDFInfo
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- JP4344875B2 JP4344875B2 JP2004094176A JP2004094176A JP4344875B2 JP 4344875 B2 JP4344875 B2 JP 4344875B2 JP 2004094176 A JP2004094176 A JP 2004094176A JP 2004094176 A JP2004094176 A JP 2004094176A JP 4344875 B2 JP4344875 B2 JP 4344875B2
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/762—Charge transfer devices
- H01L29/765—Charge-coupled devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/53—Control of the integration time
- H04N25/533—Control of the integration time by using differing integration times for different sensor regions
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N3/00—Scanning details of television systems; Combination thereof with generation of supply voltages
- H04N3/10—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical
- H04N3/14—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices
- H04N3/15—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices for picture signal generation
- H04N3/155—Control of the image-sensor operation, e.g. image processing within the image-sensor
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- Ceramic Engineering (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Description
Claims (10)
- 1または複数のピクセルセンサ(300,500)の組を有する画像センサであって、ピクセルセンサ(300,500)のそれぞれが、
第1ノード(316,516)に結合された光ダイオード(310,510)と、
前記第1ノード(316,516)に結合されたゲートと、第1制御ライン(324,524)に結合された第1端子と、第2ノード(318,518)に結合された第2端子とを有する第1トランジスタ(311,511)と、
前記第2ノード(318,518)に直結されたゲートと、前記第1ノード(316,516)に結合された第1端子と、第2制御ライン(328,528)に結合された第2端子とを有する第2トランジスタ(312,512)と、
第3制御ライン(326,526)に結合されたゲートと、前記第2ノード(318,518)に直結された第1端子と、第4制御ライン(320,520)に結合された第2端子とを有する第3トランジスタ(313,513)と、
を備える画像センサ。 - 前記第1、第2および第3トランジスタ(511,512,513)のみが、ピクセルセンサ(500)内のトランジスタである、請求項1に記載の画像センサ。
- 第5制御ライン(322)に結合されたゲートと、前記第2ノード(318)に結合された第1端子と、前記第4制御ライン(320)に結合された第2端子とを有する第4トランジスタ(314)をさらに備える、請求項1に記載の画像センサ。
- 前記第1、第2、第3および第4トランジスタ(311,312,313,314)のみが、前記ピクセルセンサ(300)内のトランジスタである、請求項3に記載の画像センサ。
- 前記ピクセルセンサの組が、
第1制御ライン(324,524)を含む列ラインの第1の組であって、前記第1の組内の各列ライン(324,524)がアレイの対応する列内にあるピクセルセンサにのみ結合する第1の組と、
第2制御ライン(328,528)を含む制御ラインの第2の組と、
第3制御ライン(326,526)を含む行ラインの第3の組であって、前記第3の組内の各行ライン(326,526)が、アレイの対応する行内にあるピクセルセンサにのみ結合する第3の組と、
第4制御ライン(320,520)を含む列ラインの第4の組であって、前記第4の組内の各列ライン(320,520)が、アレイの対応する列内にあるピクセルセンサにのみ結合する第4の組と、
をさらに備えるアレイを形成する、請求項1乃至請求項4のいずれかに記載の画像センサ。 - アレイの外側に制御回路をさらに備え、アレイの各列について、
前記制御回路が、第1の組からの列ラインの1つ(324,524)、および第4の組内の列ラインの対応する1つ(320,520)であり、
前記制御回路が、リセット動作時に前記ピクセルセンサ(300,500)の選択した1つを通る1方向の電流、および読出し動作時に前記ピクセルセンサ(300,500)の選択した1つを通る逆方向の電流を生成する、請求項5に記載の画像センサ。 - アレイの外側にある増幅器(710)の組をさらに備え、
リセット動作中において、増幅器(710)の各々が、第1の組内の列ライン(524)の対応する1つに結合された第1入力端子と、基準電圧を受け取るように結合された第2入力端子と、前記第4の組内の列ライン(520)の対応する1つを駆動するように結合された出力端子とを有する、請求項5に記載の画像センサ。 - ピクセルセンサを作動させるための方法であって、
ピクセルセンサ内の第1トランジスタ(311,511)および第2トランジスタ(313,513)を通る第1の方向に第1の電流を駆動するステップであって、ピクセルセンサ(300,500)内の光ダイオード(310,510)のノード(316,516)の電圧のリセットを制御し、前記第1トランジスタ(311,511)が、前記ノード(316,516)に結合されたゲートを有し、前記第2トランジスタ(313,513)が、ピクセルセンサの選択信号が印加されるゲートを有する、前記第1の電流を駆動するステップと、
光ダイオード(310,510)上の入射光の強度に応じて、前記ノード(316,516)上の電圧を変化させる積分動作を実行するステップと、
第1トランジスタ(311,511)および第2トランジスタ(313,513)を通る第2の方向に第2の電流を駆動するステップであって、前記第2の方向が前記第1の方向に対向する、前記第2の電流を駆動するステップと、
前記第2の電流に対する前記第1トランジスタ(311,511)の影響から、前記ノード(316,516)上の電圧を求めるステップと、
を有する方法。 - 前記第1の電流を駆動するステップが、
ピクセルセンサ内の第1トランジスタ(311,511)、および制御回路内の基準トランジスタ(338,538)を貫流する間に分割される第3の電流を駆動するステップと、
電圧をピクセルセンサ(300,500)内の第3トランジスタ(312,512)の第1端子に印加するステップであって、前記第3トランジスタ(312,512)が、前記ノード(316,516)に結合された第2端子と、前記第1トランジスタ(311,511)の端子に結合されたゲートとを有し、前記第3トランジスタ(312,512)が、前記ノード(316)上の電圧を基準トランジスタ(338,538)のゲート電圧に対応するレベルまでプルする、前記第1端子に印加するステップと、
を有する請求項8に記載の方法。 - 前記第1の電流を駆動するステップが、前記増幅器(710)の出力端子が第2トランジスタ(313,513)に結合され、前記増幅器(710)の第1入力端子が前記第1トランジスタ(311,511)の端子に結合され、前記増幅器(710)の第2入力端子が基準電圧を受け取るように結合されるように、ピクセルセンサ(300,500)の外側にある増幅器を接続するステップを有する、請求項8に記載の方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/406,698 US7215369B2 (en) | 2003-04-02 | 2003-04-02 | Compact pixel reset circuits using reversed current readout |
Publications (2)
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JP2004312724A JP2004312724A (ja) | 2004-11-04 |
JP4344875B2 true JP4344875B2 (ja) | 2009-10-14 |
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JP2004094176A Expired - Fee Related JP4344875B2 (ja) | 2003-04-02 | 2004-03-29 | 複数のピクセルセンサの組を有する画像センサ |
Country Status (4)
Country | Link |
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US (1) | US7215369B2 (ja) |
JP (1) | JP4344875B2 (ja) |
DE (1) | DE10360990B4 (ja) |
GB (2) | GB2423580B (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20040069183A (ko) * | 2001-12-21 | 2004-08-04 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 화상 픽업 장치 및 카메라 시스템 |
US7277129B1 (en) * | 2002-10-31 | 2007-10-02 | Sensata Technologies, Inc. | Pixel design including in-pixel correlated double sampling circuit |
US7280143B2 (en) * | 2003-04-14 | 2007-10-09 | Micron Technology, Inc. | CMOS image sensor with active reset and 4-transistor pixels |
US7274397B2 (en) * | 2003-08-11 | 2007-09-25 | Micron Technology, Inc. | Image sensor with active reset and randomly addressable pixels |
DE602004028652D1 (de) * | 2003-12-11 | 2010-09-23 | Advasense Technologics 2004 Lt | Erazittern |
JP2005242003A (ja) * | 2004-02-26 | 2005-09-08 | Agilent Technol Inc | Tftアレイおよびその試験方法、試験装置 |
US7652706B2 (en) * | 2006-02-15 | 2010-01-26 | Eastman Kodak Company | Pixel analog-to-digital converter using a ramped transfer gate clock |
US7847846B1 (en) * | 2006-05-16 | 2010-12-07 | University Of Rochester | CMOS image sensor readout employing in-pixel transistor current sensing |
US9609243B2 (en) | 2007-05-25 | 2017-03-28 | Uti Limited Partnership | Systems and methods for providing low-noise readout of an optical sensor |
US8130298B2 (en) * | 2008-02-07 | 2012-03-06 | International Business Machines Corporation | Wide dynamic range image sensor utilizing switch current source at pre-determined switch voltage per pixel |
US20100271517A1 (en) * | 2009-04-24 | 2010-10-28 | Yannick De Wit | In-pixel correlated double sampling pixel |
US8462250B2 (en) * | 2011-01-25 | 2013-06-11 | Aptina Imaging Corporation | Imager pixel architecture with enhanced column discharge and method of operation |
US8629928B1 (en) * | 2012-06-28 | 2014-01-14 | Pixim Israel Ltd. | Pixel and method for feedback based resetting of a pixel |
CN104813653B (zh) | 2012-11-27 | 2018-09-14 | 松下知识产权经营株式会社 | 固体摄像装置及其驱动方法 |
JP6418775B2 (ja) | 2014-04-18 | 2018-11-07 | キヤノン株式会社 | 光電変換装置、撮像システム、および光電変換装置の駆動方法 |
CN105744183B (zh) | 2014-12-26 | 2020-08-11 | 松下知识产权经营株式会社 | 摄像装置 |
JP6323813B2 (ja) * | 2014-12-26 | 2018-05-16 | パナソニックIpマネジメント株式会社 | 撮像装置 |
US9854190B2 (en) * | 2015-03-24 | 2017-12-26 | Semiconductor Components Industries, Llc | Imaging systems and methods for transient signal integrity verification |
WO2016191852A1 (en) * | 2015-06-02 | 2016-12-08 | Uti Limited Partnership | Image sensor circuits and methods |
FR3089682B1 (fr) * | 2018-12-05 | 2020-12-25 | Commissariat Energie Atomique | Matrice de pixels munie d’un suiveur de tension inversé |
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US5933190A (en) * | 1995-04-18 | 1999-08-03 | Imec Vzw | Pixel structure, image sensor using such pixel structure and corresponding peripheral circuitry |
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JPH1098176A (ja) * | 1996-09-19 | 1998-04-14 | Toshiba Corp | 固体撮像装置 |
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-
2003
- 2003-04-02 US US10/406,698 patent/US7215369B2/en active Active
- 2003-12-23 DE DE10360990A patent/DE10360990B4/de not_active Expired - Fee Related
-
2004
- 2004-02-19 GB GB0610139A patent/GB2423580B/en not_active Expired - Fee Related
- 2004-02-19 GB GB0403726A patent/GB2400173B/en not_active Expired - Fee Related
- 2004-03-29 JP JP2004094176A patent/JP4344875B2/ja not_active Expired - Fee Related
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Publication number | Publication date |
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GB2423580A (en) | 2006-08-30 |
GB2400173A (en) | 2004-10-06 |
GB0610139D0 (en) | 2006-06-28 |
GB0403726D0 (en) | 2004-03-24 |
GB2423580B (en) | 2006-11-29 |
DE10360990B4 (de) | 2007-07-19 |
GB2400173B (en) | 2006-08-02 |
US20040196397A1 (en) | 2004-10-07 |
JP2004312724A (ja) | 2004-11-04 |
US7215369B2 (en) | 2007-05-08 |
DE10360990A1 (de) | 2004-11-04 |
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