JP4344631B2 - 有機物薄膜堆積用分子線源 - Google Patents
有機物薄膜堆積用分子線源 Download PDFInfo
- Publication number
- JP4344631B2 JP4344631B2 JP2004065318A JP2004065318A JP4344631B2 JP 4344631 B2 JP4344631 B2 JP 4344631B2 JP 2004065318 A JP2004065318 A JP 2004065318A JP 2004065318 A JP2004065318 A JP 2004065318A JP 4344631 B2 JP4344631 B2 JP 4344631B2
- Authority
- JP
- Japan
- Prior art keywords
- molecular
- heater
- thin film
- guide
- organic thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000427 thin-film deposition Methods 0.000 title claims description 17
- 239000000463 material Substances 0.000 claims description 70
- 239000010408 film Substances 0.000 claims description 55
- 238000010438 heat treatment Methods 0.000 claims description 44
- 239000010409 thin film Substances 0.000 claims description 17
- 238000004804 winding Methods 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 9
- 239000011368 organic material Substances 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 14
- 238000001704 evaporation Methods 0.000 description 11
- 230000008020 evaporation Effects 0.000 description 9
- 238000001816 cooling Methods 0.000 description 6
- 230000020169 heat generation Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- 238000005401 electroluminescence Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000001376 precipitating effect Effects 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 208000031481 Pathologic Constriction Diseases 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000036262 stenosis Effects 0.000 description 1
- 208000037804 stenosis Diseases 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/54—Organic compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
- C30B23/06—Heating of the deposition chamber, the substrate or the materials to be evaporated
- C30B23/063—Heating of the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Electroluminescent Light Sources (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004065318A JP4344631B2 (ja) | 2004-03-02 | 2004-03-09 | 有機物薄膜堆積用分子線源 |
| US11/183,720 US7369758B2 (en) | 2004-03-02 | 2005-07-18 | Molecular beam source for use in accumulation of organic thin-films |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004057049 | 2004-03-02 | ||
| JP2004065318A JP4344631B2 (ja) | 2004-03-02 | 2004-03-09 | 有機物薄膜堆積用分子線源 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005281710A JP2005281710A (ja) | 2005-10-13 |
| JP2005281710A5 JP2005281710A5 (enExample) | 2006-02-09 |
| JP4344631B2 true JP4344631B2 (ja) | 2009-10-14 |
Family
ID=35180433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004065318A Expired - Fee Related JP4344631B2 (ja) | 2004-03-02 | 2004-03-09 | 有機物薄膜堆積用分子線源 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7369758B2 (enExample) |
| JP (1) | JP4344631B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100688969B1 (ko) * | 2005-10-24 | 2007-03-08 | 삼성전자주식회사 | 표시장치용 기판의 제조장치 및 제조방법 |
| GB0619160D0 (en) * | 2006-09-28 | 2006-11-08 | Oxford Instr Plasma Technology | Valve assembly |
| FR2956411B1 (fr) * | 2010-02-16 | 2012-04-06 | Astron Fiamm Safety | Systeme de chauffage d'une source de depot en phase vapeur |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH654596A5 (de) * | 1983-09-05 | 1986-02-28 | Balzers Hochvakuum | Verdampferzelle. |
| US5336324A (en) * | 1991-12-04 | 1994-08-09 | Emcore Corporation | Apparatus for depositing a coating on a substrate |
| US5253266A (en) * | 1992-07-20 | 1993-10-12 | Intevac, Inc. | MBE effusion source with asymmetrical heaters |
| US5820681A (en) | 1995-05-03 | 1998-10-13 | Chorus Corporation | Unibody crucible and effusion cell employing such a crucible |
| JP2003002778A (ja) | 2001-06-26 | 2003-01-08 | International Manufacturing & Engineering Services Co Ltd | 薄膜堆積用分子線セル |
| JP3684343B2 (ja) | 2001-09-25 | 2005-08-17 | 株式会社日本ビーテック | 薄膜堆積用分子線源セル |
| DE10211573A1 (de) * | 2002-03-15 | 2003-10-16 | Unaxis Balzers Ag | Vakuumverdampfungseinrichtung |
-
2004
- 2004-03-09 JP JP2004065318A patent/JP4344631B2/ja not_active Expired - Fee Related
-
2005
- 2005-07-18 US US11/183,720 patent/US7369758B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US7369758B2 (en) | 2008-05-06 |
| US20050247267A1 (en) | 2005-11-10 |
| JP2005281710A (ja) | 2005-10-13 |
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