JP4344593B2 - Mini-environment device, thin plate manufacturing system, and atmosphere replacement method for clean container - Google Patents

Description

  The present invention is a device for handling thin plate-like objects such as a semiconductor wafer, a liquid crystal panel substrate, an organic electroluminescence display substrate, an inorganic electroluminescence display substrate, a plasma display substrate, a field emitting display substrate in a harmless or low harm gas atmosphere, The present invention relates to a manufacturing system and a method for replacing the atmosphere of a pollution-preventing clean container that houses and transports these thin plate-like objects.

  In particular, the present invention includes a mini-environment device that provides a highly clean environment for taking out and processing a thin plate from a clean container used for transporting the thin plate between manufacturing processes. The present invention relates to a manufacturing system and a method for replacing an atmosphere in a clean container. The present invention can be applied to any thin plate-like object that requires a high clean environment when transporting and processing. In the following description, a thin plate-like object will be described by taking a member for an electronic device such as a silicon wafer or a liquid crystal substrate, particularly a semiconductor wafer (hereinafter referred to as a wafer), but this is an example and does not limit the present invention.

  In the manufacturing process of an electronic device, an electronic device manufacturing apparatus provided with a processing chamber for processing or surface-treating the surface of a thin plate is used. For example, in the production process of a semiconductor wafer, if dust or minute organic matter adheres to the wafer and is contaminated, the production yield (non-defective product rate) decreases. Therefore, when transporting, processing and storing wafers, a high clean environment is required to prevent these contaminations.

  Among electronic devices, processing of semiconductor wafers in particular has been performed in a clean room with high cleanliness. Since there is no risk of contamination in a clean room with high cleanliness, open cassettes, which are open storage containers, have been widely used as containers for storing a plurality of semiconductor wafers. However, a mini-environment system has been proposed as a means for reducing the cost of maintaining a clean room with a high degree of cleanliness and making a high-performance semiconductor device inexpensively. In the mini-environment method, a high-clean room called a mini-environment room is provided in a clean room that is not very clean, and the wafer is taken out of the clean container (in a high-clean environment) and transferred to the processing chamber. To process the wafer.

  Up to the mini-environment chamber, the wafer is hermetically stored in a clean container that can be hermetically sealed, and the clean container is transported and transported by AGV, OHT, or manpower. In this way, the wafer is prevented from being contaminated by dust even when it is transported via a relatively clean place. As a hermetic clean container for carrying such wafers, the SMIF (Standard Mechanical Interface) method is widely used for 200 mm semiconductor wafers, and the FOUP (Front Opening Unified Pod) method is used for 300 mm semiconductor wafers. Has been.

  The clean container containing the thin plate is placed on the load port, and the lid on the mini-environment chamber side is opened while being blocked from the outside air. The thin plate-like object in the clean container is taken out from the clean container by a transporter provided in the mini-environment chamber and transferred to the processing chamber. When the surface processing or surface treatment of the thin plate-like material is performed in the processing chamber and the predetermined surface treatment is completed, the thin plate-like material is taken out of the processing chamber by the transporter and returned to the clean container.

  A plurality of wafers accommodated in the clean container are transferred one by one from the clean container into the mini-environment. In order to prevent dust floating in the atmosphere from adhering to the wafer during such transfer, the dust generated with the opening / closing operation of the cleaning container, the operation of the load port, the operation of the transfer device, etc. Dust flowing in from the low cleanliness area becomes a problem.

  FIG. 1 is a diagram showing an example of a conventionally used thin plate manufacturing system, and is a side view with a part omitted. In the figure, reference numeral 10 denotes an entire thin plate manufacturing system, and 11 is a mini-environment device for maintaining an internal highly clean environment. The mini-environment device 11 includes a mini-environment chamber 11-1 that separates an external low-clean area from an internal high-clean area by a housing. Reference numeral 12 denotes a clean container called a FOUP that stores a thin plate-like object, and 13 is provided at the boundary between the mini-environment chamber 11-1 and the low-clean chamber, and the lid of the clean container 12 on the mini-environment chamber 11-1 side is provided. It is a load port for opening / closing the attachment / detachment. When the wafer is not moved, the opening of the load port is closed, whereby dust can be prevented from flowing from the low clean chamber into the mini-environment chamber 11-1.

  14 is a transfer of the thin plate-like material such as taking out the thin plate-like material from the clean container 12 in the mini-environment chamber 11-1 and transporting it to the processing chamber for processing, or returning it to the clean container 12 It is the conveyance machine which performs. Reference numeral 15 denotes a fan filter unit (cleaning means) composed of a fan (blower) and a filter for keeping the mini-environment chamber 11-1 clean, and a constant clean air flow is always generated in the mini-environment chamber 11-1. Supplying and floating dust can be blown in a certain direction and discharged to the outside. Reference numeral 16 denotes a processing chamber for processing or surface-treating the surface of the thin plate.

  The cleaning means for supplying the clean air flow into the mini-environment chamber 11-1 includes a blower and a ULPA filter, a chemical filter, or the like, and is installed in the upper portion of the mini-environment chamber 11-1. Air outside the mini-environment chamber 11-1 is taken into the blower and passes through the filter to become highly clean air. This clean airflow flows from the upper part to the lower part of the mini-environment chamber 11-1, and the dust floating in the mini-environment chamber 11-1 is exhausted along with this airflow at the lower part of the mini-environment chamber 11-1. It is discharged to the outside via.

  The processing of the thin plate in the thin plate manufacturing system 10 shown in FIG. 1 is performed as follows. When the cleaning container 12 containing the thin plate is placed on the load port 13, the lid is opened by the load port 13. The thin plate-like object in the clean container 12 is transferred to the processing chamber 16 by the transporter 14. When the processing or surface treatment of the thin plate is finished in the processing chamber 16, the thin plate is returned to the clean container 12 by the transfer device 14 and the lid is closed.

  When the processed thin plate is stored in the clean container 12 in an air environment and stored in a sealed state, it is transported to the thin plate manufacturing system 10 again, and is unnecessary and electronic during storage until the next processing is started. Reactants which are not preferable in the manufacture of a device (especially, a natural oxide film in a semiconductor device) may be formed on the surface of a thin plate.

In order to solve such a problem, a method of replacing the atmosphere in the FOUP, which is the clean container 12, with an inert gas in a 300 mm semiconductor wafer is used. In this case, an intake valve and an exhaust valve are provided on the bottom surface of the FOUP, and an intake port and an exhaust port are also provided at a position corresponding to the FOUP on the load port. (Patent Document 1)
A technique for filling the entire mini-environment chamber with an inert gas has also been proposed (Patent Document 2). In wafer processing, the atmosphere in the processing chamber may be replaced with an inert gas atmosphere such as nitrogen in order to control the humidity and oxygen concentration in the processing chamber or prevent organic contamination. Patent Document 2 proposes a method of filling the atmosphere in the mini-environment apparatus with an inert gas in order to shorten the time for replacing the atmosphere in the processing apparatus and to prevent organic contamination in the mini-environment apparatus. ing. In this mini-environment apparatus, a cleaning means for supplying an inert gas is provided in the upper part. The inert gas is recovered from an exhaust duct provided on the side wall in the mini-environment device without being exhausted, and is taken into the cleaning means again through the circulation path.
JP-A-11-63604 JP 2002-43391 A

  However, the above prior art has the following problems. That is, in the method of replacing the atmosphere from the bottom surface of the FOUP on the load port with an inert gas, all the semiconductor wafers that have undergone the process processing in the processing chamber are returned to the FOUP, and the FOUP door is closed by the load port, and then the inertness is achieved. Replacement with gas was performed. Therefore, for example, when nitrogen is used as the inert gas and the oxygen concentration in the FOUP is 10 ppm or less, it takes about 8 to 10 minutes. That is, since the load port is occupied until the replacement with the nitrogen gas in the FOUP is completed, there is a problem that the productivity is extremely lowered.

  Further, in the method of filling and circulating the entire mini-environment chamber with an inert gas, there is a problem that it takes a considerable time to completely replace all the gas in the FOUP container.

  In addition, the transporter discharges impurities and foreign matters such as foreign particles and trace amounts of organic gas from the moving parts, and impurities that cannot be filtered by the filter accumulate in the mini-environment chamber, adversely affecting the semiconductor wafer. . Furthermore, the impurities and foreign matters generated from these transport machines soar into the mini-environment chamber due to intake and exhaust from the bottom and bottom of the fuselage when the arms and the fuselage of the transport machine move up and down.

  In order to suppress this in the exhaust system, it is necessary to strengthen the downflow from the fan filter unit, which causes an increase in device price and operating cost.

  On the other hand, in the case of the circulation system, since the airflow in the circulation system flows linearly from the cleaning device (fan filter unit) to the exhaust port, the airflow entering the opening (cassette) provided in the housing side portion is hardly generated. There is a problem that dust stays in the clean container.

  The present invention has been made to solve the above-described problems, and prevents impurities gas from coming into contact with a thin plate-like member such as a semiconductor wafer in a clean container and a mini-environment apparatus, thereby providing a product of the thin plate-like member. One object of the present invention is to provide a pollution-preventing mini-environment device, a thin plate manufacturing system, and a cleaning container atmosphere replacement method that can prevent a decrease in yield.

  Further, the present invention provides a mini-environment device capable of suppressing the generation of dust when a wafer is taken out from a clean container and transferred under a highly clean region, and a thin plate manufacturing system including the same. One of its purposes is to provide it.

  Furthermore, the present invention provides a mini-environment device, a thin plate manufacturing system, and a cleaning container atmosphere replacement method for guiding a clean airflow circulating in the mini-environment device from an opening of the mini-environment device into the clean container. This is one of its purposes.

  In addition, the present invention provides a mini-environment device and a thin plate that prevent the exhaust from flowing back by disturbing the gas flow in the mini-environment even if a clean air flow is induced in the clean container, It is an object of the present invention to provide a state manufacturing system and a cleaning container atmosphere replacement method.

  It is another object of the present invention to provide a mini-environment device that can guide a clean airflow to a clean container without hindering the operation of the transport device.

The mini-environment device according to the first embodiment of the present invention includes a load port for placing a clean container for storing a thin plate-like object in an airtight manner, opening and closing or attaching / detaching a lid of the clean container, and a transfer arm The apparatus is equipped with a transfer machine that takes out a thin plate from a clean container and transfers it to a processing chamber for processing the thin plate, and a cleaning means that removes dust in the gas when the gas is allowed to pass through. A mini-environment device that maintains a state, wherein the harmless or low harm gas recovery port of the circulation path has a plurality of through holes provided below the transfer arm of the transfer machine. and the partition plate, provided between the second partition plate impervious to the harmless or low harmful gas provided at intervals of 150mm~250mm lower than the first partition plate, the mini-environment apparatus Harmless or low harm gas is Hama recovered and characterized in that it comprises a circulation means having a circulation path for circulating the cleaning means.

  The thin plate-like material transport machine used in the present invention is a known SCARA robot, multi-axis multi-joint robot, other industrial robots, or XY-axis transport machine.

Moreover, by having a considerable space from the first partition plate to the second partition plate, the air flow in the mini-environment chamber can be effectively made into a laminar flow by the first partition plate.

  The mini-environment device according to another embodiment of the present invention further includes a harmless or low harm gas supply device, an oxygen concentration meter that measures the oxygen concentration inside, and concentration information output from the oxygen concentration meter. And a control means for controlling the supply amount of harmless or low harm gas based on the above. In addition, a mini-environment device according to another embodiment of the present invention includes a hygrometer that measures internal humidity, and a control that controls the supply amount of harmless or low harm gas based on humidity information output from the hygrometer. It is characterized by comprising means.

  The mini-environment device according to another embodiment of the present invention further includes a rectifying member that guides harmless or low harm gas circulating inside to the inside of the clean container in front of the opening to the clean container. It is characterized by that. The shape of the current plate is not particularly limited, but is designed so as to induce a downdraft from the fan filter toward the opened clean container.

  In addition, the mini-environment device according to another embodiment of the present invention is any one selected from the group consisting of inert gas, dry air, low oxygen air, and dry low oxygen air, wherein the harmless or low harm gas is used. It is characterized by that. Here, the inert gas refers to a gas such as nitrogen, argon, neon, or xenon.

  Further, a mini-environment device according to another embodiment of the present invention includes a load port on which a clean container for storing a thin plate-like object is stored in an airtight manner, and a lid of the clean container can be opened / closed or attached / detached. An arm is provided, and a thin plate-like object is taken out of the cleaning container by the transfer arm, and transferred to a processing chamber for processing the thin plate-like object, and a gas fed into the inside is allowed to pass therethrough to remove dust in the gas. And a cleaning device for maintaining the inside in a clean environment and preventing contamination of the thin plate-like object, the clean gas supplied to the front surface of the opening of the cleaning container through the cleaning device A rectifying member is provided to guide the liquid from the opening of the clean container into the clean container. The shape of the current plate is not particularly limited, but is designed so as to induce a downdraft from the fan filter toward the opened clean container.

  Further, in the mini-environment device according to another embodiment of the present invention, the rectifying member includes an oblique guide member that guides the clean gas into the clean container by blocking the flow of the clean gas at a predetermined angle. And By blocking the descending airflow diagonally, the clean gas is guided along the wall surface of the guide member and is guided into the clean container. Therefore, the descending airflow is naturally guided to the clean container.

  A mini-environment device according to another embodiment of the present invention is characterized in that diagonal guide members are arranged in a plurality of stages in the vertical direction on the rectifying member. A thin plate-like object is accommodated in the clean container, and serves as a resistance to gas inflow. Therefore, it is desirable to provide a plurality of oblique guide members.

  Further, in the mini-environment device according to another embodiment of the present invention, the rectifying member is provided with two upper and lower guide members, and the lower oblique guide member is provided with the vertical width of the opening (the vertical length of the opening). ) Of 15/26 to 21/26, and the upper rectifying member is installed at a height within the range of 22/26 to 25/26. Since the optimal installation position (height) of the guide member differs depending on the length of the opening in the vertical direction, in the above aspect, the appropriate installation position (height) of the guide member is set to the length of the opening in the vertical direction. Is expressed as a ratio when “1” is set. Therefore, even when the number of accommodating stages is smaller or larger than this, the installation height of the guide member is determined by the above ratio. Further, in the mini-environment device according to another embodiment of the present invention, the rectifying member includes a V-shaped guide member having a depressed center that collects the descending clean gas in the center and guides the clean gas into the clean container. Features. Since the V-shaped guide member concentrates and guides the airflow in the central depression, it penetrates into the normal container more strongly.

  A mini-environment device according to another embodiment of the present invention is characterized in that the V-shaped guide member is inclined at a predetermined angle toward the clean container. By inclining toward the clean container, the concentrated descending airflow can be more effectively guided into the clean container.

  In the mini-environment device according to another embodiment of the present invention, the V-shaped guide member is disposed at a position of 17/26 to 22/26 from the bottom of the opening. Features.

  In addition, the mini-environment device according to another embodiment of the present invention is further characterized by including a drive unit that moves the rectifying member from a predetermined position of the opening.

  A mini-environment device according to another embodiment of the present invention is characterized in that the driving means moves the rectifying member downward.

  In addition, a mini-environment device according to another embodiment of the present invention covers the drive means with a cover in order to maintain a clean environment in the mini-environment device, and incorporates clean gas supplied by the cleaning means into the cover. The clean gas taken in and the dust generated from the driving means are discharged to the outside or a circulation path. Even when the gas discharged from the cover is discharged to the circulation path, the dust in the discharged gas can be removed almost completely (the dust collection rate is 99.999% or more) by the filter. Since inert gas such as nitrogen is expensive, it is desirable to circulate as much as possible rather than exhausting it to the outside.

  In addition, the mini-environment device according to another embodiment of the present invention further collects the clean gas supplied from the cleaning means, sends it to the cleaning means, and supplies the recovered clean gas again through the cleaning means. A circulation means for circulating a clean gas is provided.

  Moreover, the mini-environment device according to another embodiment of the present invention further includes a first partition plate having a plurality of through holes provided with a clean gas recovery port below the transfer arm of the transfer machine, It is characterized in that it is provided between the second partition plate which is provided below the first partition plate and does not pass harmless or low harm gas.

  A mini-environment device according to another embodiment of the present invention is characterized in that the first partition plate and the second partition plate are provided with an interval of 150 mm to 250 mm.

  A thin plate manufacturing system according to an embodiment of the present invention includes the mini-environment device according to any one of the above. The manufacturing system includes a processing chamber including all processing steps such as cleaning, drying, heating, cooling, resist coating, development, gas reaction, reaction in liquid, plasma, sputtering, etc., and an apparatus for carrying a thin plate into and out of them. Refers to the combined equipment.

The atmosphere replacement method of cleaning container according to an embodiment of the present invention, infeed clean gas mini-environment within the device from the opening of the clean container placed on the load port, the mini-environment apparatus The flow of the clean gas is guided into the clean container by obstructing the downward flow of the clean gas obliquely toward the opening of the clean container, and the atmosphere in the clean container is replaced with the clean gas. Features.

  According to the present invention, the inside of the mini-environment device can be efficiently maintained in a high cleanliness state. Further, according to the embodiment of the present invention, the above-mentioned problem is achieved by providing a circulating means for recovering harmless or low-damage gas, purifying it by a cleaning means, and supplying it again. According to another embodiment of the present invention, the first partition plate is provided below the arm of the transport machine in the mini-environment device, so that the circulating gas can be efficiently flowed without hindering the operation of the transport machine. Laminar flow is possible.

  In another embodiment, the body of the transport machine is covered with a cover, and when the body expands and contracts foreign matter and impurities generated inside the transport machine, the machine body is discharged downward from the machine base below the gas circulation path. There is no accumulation in the environment device. Therefore, the circulation amount of harmless or low harm gas in the mini-environment device can be kept low, the replenishment amount of harmless or low harm gas to be supplemented can be reduced, and the operation cost can be reduced. Further, when the inside of the clean container is replaced with a harmless or low harm gas, it is not necessary to replace the entire clean container with a harmless or low harm gas environment, and the apparatus structure can be simplified. Furthermore, in another embodiment of the present invention, by providing a gas rectifying member that guides the laminar flow in the mini-environment device from the opening of the clean container to the inside, the atmosphere in the clean container can be efficiently reduced in a short time. It is possible to exchange.

  Embodiments of the present invention will be described below with reference to FIGS. FIG. 2 is a perspective view showing a mini-environment device 21 according to an embodiment of the present invention with a part cut away. FIG. 3 is a perspective view showing an appearance of the thin plate manufacturing system 20 including the mini-environment device 21 shown in FIG. As shown in FIG. 3, the thin plate manufacturing system 20 of the present invention includes a mini-environment device 21 and a processing chamber 16.

  As shown in FIG. 2, the mini-environment device 21 includes a sealed mini-environment chamber 21-1, a fan filter unit 15 (cleaner) including a blower composed of a sirocco fan, a ULPA filter, and a clean gas blower at the upper part. And a load port 13 (FIG. 3). The mini-environment chamber 21-1 has a load port 13 on which the FOUP 12, which is a clean container, is placed as a part of the wall, and a wall 17 on the opposite side includes an openable / closable valve body 17 that serves as an inlet of the processing chamber 16. All other walls are sealed and airtight. The valve body represents a door, a valve, or a door that is not trapped by a shape such as a rectangle or a circle, and may be any one that can be opened and closed when a thin plate-like object is carried into and out of the processing chamber.

  Inside the mini-environment chamber 21-1, a transfer device 14 for transferring a semiconductor wafer, a first partition plate 22 provided below a transfer arm of the transfer device 14 and having a plurality of openings, and transfer A second partition plate 23 that is provided above the floor on which the machine base is installed and does not allow gas to pass therethrough is provided. The first partition plate 22 has a large number of through holes arranged regularly, and the flow in the clean space between the outlet of the fan filter unit 15 and the first partition plate 22 is made into a laminar flow. Has an effect.

  A space formed between the first partition plate 22 and the second partition plate 23 is connected to the air inlet 27 of the fan filter unit 15 through the circulation path 24. The fan filter unit 15 is provided with a supply port for supplying an inert gas such as nitrogen or argon, air from which oxygen has been partially removed, air to which nitrogen has been added, or a harmless or low harm gas subjected to a drying process. The supply amount can be adjusted by a control mechanism (not shown).

  The mini-environment device 21 includes an internal environment measuring device 25 such as a hygrometer including an oxygen concentration meter or a dew point meter for measuring the environment inside the mini-environment device 21. The internal environment measuring device 25 always detects the oxygen concentration or humidity inside the mini-environment device 21 and increases the supply amount of harmless or low harm gas when the environment deteriorates from a predetermined value set in advance. In the case where an environmental condition that is better than a predetermined value set in advance is maintained, the supply amount of harmless or low harm gas is reduced. Therefore, since the amount of expensive harmless or low harm gas used is not increased more than necessary, the running cost can be reduced.

  FIG. 4 is a partially cutaway perspective view showing a mini-environment device 31 according to another embodiment of the present invention. The mini-environment device 31 of FIG. 4 is provided with a rectifying member 32 for guiding harmless or low harm gas into the FOUP 12 in front of the opening of the clean container FOUP (clean container) 12. The flow regulating member 32 is fixed to the wall of the mini-environment chamber. This rectifying member 32 can promote replacement of the atmosphere inside the FOUP 12. The rectifying member will be described in more detail later.

  The processing of the thin plate according to the present invention is performed as follows. That is, the FOUP 12 containing the semiconductor wafer is placed on the load port 13 and opened by the load port 13 by an operator or an automatic transfer machine such as OHT (Over Head Transfer). The semiconductor wafer accommodated in the FOUP 12 is carried into the processing chamber 16 after the valve body 17 shown in FIG. Note that, before the semiconductor wafer is carried into the processing chamber 16, a notch aligner for aligning the orientation of the wafer (not shown) may be provided.

  When the semiconductor wafer is loaded into the processing chamber 16, the valve body 17 is closed and the processing of the semiconductor wafer is started. When the processing is completed, the valve body 17 is opened, and the semiconductor wafer is returned to the FOUP by the transfer device 14. The FOUP is closed by a load port 13 and collected by an operator or an automatic transporter such as OHT. In order to maintain the internal environment of the mini-environment device 11, it is desirable to minimize the time during which the valve element 17 is open.

  When the semiconductor wafer is transferred to the FOUP or the processing chamber 16, the transfer machine 14 can perform an expansion / contraction operation up and down according to the height of the transfer destination. The dust generated by the up and down movement is such that the opening of the body cover of the transporter is below the second partition plate 23, and the gap between the body part of the transporter 14 and the second partition plate 23 is very small. Therefore, the dust generated from the conveyor 14 does not rise into the mini-environment device 21.

  Further, the inside of the FOUP is filled with harmless or low harm gas. However, when the semiconductor wafer that has been processed is returned to the FOUP, harmful gas may be generated from the semiconductor wafer immediately after the processing. . This harmful gas is known to adversely affect the semiconductor wafer before processing. The rectifying member 32 disposed on the front surface of the opening of the FOUP 12 can efficiently introduce harmless or low harm gas in the mini-environment chamber into the FOUP 12.

  In this way, by introducing harmless or low harm gas into the FOUP 12, the atmosphere in the FOUP 12 is quickly discharged out of the FOUP 12 together with the harmful gas released from the processed semiconductor wafer. Therefore, it is possible to suppress a reduction in wafer processing yield due to harmful gas released from the wafer. Also, before the lid of the FOUP 12 is closed, the inside of the FOUP is replaced with harmless or low-hazardous gas, so that the replacement time can be greatly shortened compared to the method in which replacement is performed from the bottom side of the FOUP 12 through the purge port. I can do it.

  In the above description, the fan filter unit may be provided with a chemical filter made of particulate or fibrous activated carbon or the like for removing contaminants such as acids, alkalis and organic substances accumulated in the circulating gas. . Moreover, you may provide the dehumidification material for removing the water | moisture content of the circulating gas. In the above embodiment, the thin plate-like object is a semiconductor wafer having a diameter of 300 mm. However, a semiconductor wafer having a diameter other than 300 mm, a liquid crystal display substrate, a reticle, and disks may be used.

  FIG. 5 is a perspective view of a mini-environment device 41 according to another embodiment of the present invention. The mini-environment device 41 includes different types of transfer machines 42. The transfer device 42 is fixed so as not to pass gas between the second partition plate 23 and the transfer device 42. The neck part with the arm body on the upper side can rotate and move in the height direction, and it has a sealing function to prevent the gas containing dust generated inside the transporter from flowing into the mini-environment device. It is prepared.

(Regarding rectifying member)
Next, the flow straightening member for replacing the atmosphere in the FOUP (clean container) at high speed will be described in more detail. As described above, in order to prevent contamination of the thin plate in the FOUP (clean container), it is desirable to replace the gas in the clean container with a clean gas. On the other hand, in order to speed up the manufacture of the semiconductor device, it is desirable to replace the gas in the clean container with the gas in the mini-environment device as soon as possible.

  As described above, in order to replace the inside of the clean container with clean air, simply open the cover of the clean container and open the door of the opening of the mini-environment device. It does not flow into it and cannot be replaced efficiently. Therefore, in the present invention, a rectifying member that guides clean air descending from above the environment chamber into the clean container is provided. In order to achieve the purpose of quickly replacing the atmosphere in the clean container with clean gas, a flow regulating member is provided in front of the opening of the FOUP 12 in this way, and flows downward from the upper direction of the mini-environment chamber. Inducing the atmosphere (clean gas) into the FOUP is effective in either the exhaust system or the circulation system.

(Embodiment using rectifying member)
FIG. 6 shows a thin plate manufacturing system 50 having a mini-environment device 51 according to another embodiment of the present invention. The mini-environment device 51 includes a mini-environment chamber 51-1 and a rectifying member 52 in which a low clean area and a high clean area are separated by a casing. A cleaning means 15 for cleaning the outside air is provided inside the housing, and the air pressure inside the mini-environment chamber 51-1 is made higher than the outside to prevent the inflow of dust and clean air from the top to the bottom. The dust generated inside the mini-environment device 51 is discharged to the outside.

  The wafer is stored in the cleaning container 12 and transported. At that time, by closing the lid of the clean container (FOUP), the wafer is cut off from the outside air to prevent contamination. The clean container 12 may be transported by using an automatic transport system such as floor traveling AGV or ceiling traveling OHT, or manually. Thus, the cleaning container 12 containing the wafer is moved between various processing apparatuses according to the manufacturing process, and is positioned and placed on the stage of the load port 13. As a means for positioning, for example, a standard kinematic coupling is provided on the stage. Next, the stage is moved toward the door, and the door of the load port and the lid of the cleaning container are integrated. The stage can be provided with moving means for allowing movement in a horizontal plane.

  Thereafter, the lid of the clean container is opened by slightly moving relative to the clean container in the direction of opening the cover of the clean container while the door and the cover are fixed integrally. In other words, the clean container may be moved backward by the stage moving means while the door is stationary, or may be configured to be horizontally moved or swinged into the housing by the door moving means while the clean container is stationary.

  The integrated lid and door are moved downward by the door lifting / lowering means 54 provided at the lower part of the door, and stored in a cover that covers the four sides of the lifting / lowering means. The wafer is taken out from the clean container 12 with the lid opened, and is transferred to the processing device 16 and processed. As the means for moving, a known method such as a transporter such as a SCARA robot is used.

  In the mini-environment device 51 according to the present embodiment, the clean airflow is supplied downward from above. On the other hand, the clean container 12 is placed on a load port 13 at a recessed position. Therefore, it is necessary to guide the clean air flow in the mini-environment chamber 51-1 into the clean container 12 from the opening of the clean container. The rectifying member 52 according to the second embodiment of the present invention has an inclined plate 53 that is inclined obliquely for guiding the airflow to the clean container 12. In order to guide the clean air flow in the mini-environment chamber 51-1 to the clean container 12, it is desirable to arrange the inclined plate 53 in the vicinity of the opening. Thereby, clean gas can be sent in the whole area | region in the clean container 12, and the residence of the atmosphere in a clean container can be prevented.

  However, if the rectifying member 52 is disposed in front of the opening, the operation of the transfer machine 14 for taking out the wafer from the clean container 12 is hindered. Therefore, it is desirable to configure the rectifying member 52 so that it can be moved up and down by the driving means 53 in the lower part. Alternatively, although not shown in the figure, it may be configured to swing so as to avoid the movement line of the transfer arm of the transfer machine 14. In the case where the ascending / descending operation can be performed, it is desirable that the rectifying member 52 moved downward is housed in a cover covered on all sides, as in the case of housing the door described above.

(Exhaust fan)
Here, in order to obtain higher cleanliness, the exhaust port may be provided with any one of the door lifting / lowering means 54, the driving means 55 of the rectifying member 52, or the conveyor 14 which is a dust generation source. . Since the atmospheric pressure in the mini-environment chamber 51-1 is maintained at a high level by the cleaning means, an internal atmosphere flows toward the exhaust port. Therefore, the internal atmosphere is discharged to the outside together with the dust. Further, by providing a fan at the exhaust port, dust can be forcibly exhausted through a cover covering the elevating means 54 and the like.

  Thus, by providing the exhaust fan at the lower part of the cover of the elevating means 54 and the driving means 55, it is possible to collect and discharge dust generated due to the volatilization of organic substances for mechanical wear and lubrication. Further, when the fan is provided in this way, the exhaust from the clean container can be recovered.

  7A and 7B show an embodiment in which an exhaust fan is provided below the boundary door of the mini-environment chamber 51-1. In the drawing, 80 is a first embodiment of the boundary door, and 90 is a lid of the cleaning container. A gas suction port 81 is provided above the boundary door 80, and an exhaust fan 83 is provided below the support column. The atmosphere or clean gas sucked from the gas inlet 81 passes through the cavity 82 inside the support column and is discharged by the exhaust fan 83. Since the boundary door 80 and the lid 90 are provided in the lower part near the clean container 12, the atmosphere near the lower part of the clean container is sucked from the suction port 83. Therefore, it has the effect of promoting the replacement of the atmosphere of the clean container. FIG. 7B is a perspective view showing the boundary door 85 according to the second embodiment. In the second embodiment, a plurality of suction ports 86 are provided, and the gas sucked from each suction port 86 is discharged from a discharge port having a discharge fan (not shown) through an exhaust hole 87 and an exhaust pipe 88. The

  8 and 9 are perspective views of the mini-environment device showing the movement of the transporter 14 according to the embodiment shown in FIG. The arrows shown in FIG. 8 indicate directions in which the transporter 14 can operate. As shown in FIG. 8, the transport machine 14 can move up and down, and the transport arm 14-1 and the joint arm 14-2 can rotate 360 degrees in the horizontal direction. Accordingly, the wafer can be lifted and transferred to a desired position by the transfer arm 14-1. FIG. 9 shows the position of the arm of the transfer machine 14 when the wafer is taken out from the cleaning container 12. The transfer arm 14-1 of the transfer machine 14 takes out the wafer from the clean container 12 through the opening of the rectifying member 52.

(Embodiment of rectifying member)
FIGS. 10A and 10B show a rectifying member according to another embodiment of the present invention. The rectifying member 60 according to the second embodiment shown in FIG. 10A is different from the rectifying member 52 of the second embodiment shown in FIG. 9 only in the lifting column 64 except for the other parts. is there. The rectifying member 60 according to the third embodiment guides clean gas from the oblique guide member 61 through the horizontal guide plate 62 into the clean container 12 (like the oblique guide plate 61 and the horizontal guide plate 62) A member that is guided in the oblique direction and guided into the clean container is referred to as an “inclined guiding member.” The oblique guiding member may be configured only by the oblique guiding plate 61). The rectifying member 62 has an opening frame portion 63 for allowing the transport arm 14-1 of the transport machine 14 to pass therethrough. Under the opening frame portion 63, a diagonal guide plate 61, a horizontal guide plate 62, and a support column 64 that supports the opening frame portion 63 are provided. As indicated by arrows in the figure, the descending clean atmosphere is guided in the horizontal direction and guided into the clean container 12.

  The column 64 is driven up and down by a driving device (not shown), and the rectifying member 60 is moved up and down. By lowering the rectifying member 60, the transfer arm 14-1 can pass over the rectifying member 60 and take out or store the wafer stored in the upper part of the cleaning container 12. The wafer stored in the center of the cleaning container 12 is taken out or returned when the transfer arm 14-1 passes through the opening 65 of the opening frame 63.

  FIG. 10B shows a rectifying member 70 according to the third embodiment. The rectifying member 70 according to the third embodiment includes a first guide plate 71, a V-shaped second guide plate 72, and an opening frame portion 73 provided vertically (first guide plate). A member that guides the airflow to the clean container while guiding and guiding the airflow obliquely and in the middle direction, such as 71 and the second guide plate 72, is referred to as a “V-shaped guide member”. The air flow of the descending clean gas is collected in an oblique direction and in the middle by the V-shaped second guide plate 72 and guided into the clean container 12 as indicated by an arrow. The first guide plate 71 can be provided obliquely at a predetermined angle in the same manner as the oblique guide plate 61 of the second rectifying member 60. Thereby, more descending airflow can be induced in the clean container 12.

  FIGS. 11A and 11B show the flow of the clean atmosphere guided into the clean container by the guide plate. FIG. 11A shows a clean atmosphere guided by the oblique guide plate 61 by arrows. As indicated by the arrows, the clean atmosphere descending from above is guided toward the clean container 12 by the oblique guide plate 61 and then partially guided to the inside and the rest flows downward.

  A V-shaped guide plate 81 shown in FIG. 11B is inclined toward the clean container 12. Thereby, as shown by the arrows in the figure, the descending clean atmosphere is collected in the center along the V-shaped guide plate 81 and then guided toward the clean container 12. Therefore, the flow of the clean atmosphere becomes stronger and is guided toward the inside of the clean container 12.

  Since the shape of the wafer in the clean container is a disk, the wafer is placed so as to protrude forward (on the side of the transfer machine) on a plane. For this reason, the airflow flowing from the center in the width direction of the clean container reaches the interior of the container. Therefore, the V-shaped rectifying plate is more effective than the case where the flat rectifying plate is used to flow the airflow into the wafer cleaning container. On the other hand, a flat plate-like rectifying plate is sufficient for the inflow of clean gas into a clean container that accommodates a rectangular substrate or the like.

(Other embodiments)
6 to 9, the embodiment has been described in which the rectifying plate is provided in the exhaust type mini-environment device, but the rectifying plate can also be provided in the circulation type mini-environment device. The side view of the state which can see the inside of the thin plate-shaped object manufacturing system 100 provided with the circulation type mini-environment apparatus 91 which provided the baffle plate in FIG. 12 is shown. 6 differs from the manufacturing system of FIG. 6 in that a first partition plate 92 having a large number of through holes for generating a laminar flow, a second cut-out plate 93 that does not allow gas to pass through, and an internal gas circulation path 24 are provided. It is in the point to prepare. Thereby, the flow of the clean gas in the mini-environment chamber 91-1 can be made laminar, and the rectifying plate 52 can replace the atmosphere of the clean container 12 with the clean gas at high speed.

(Induction member shape and arrangement)
Next, the relationship between the shape and arrangement of the guide member of the rectifying member will be described. The applicant of the present invention has determined whether or not the provision of the baffle member is effective in quickly replacing the atmosphere of the clean container 12 and, if effective, the guidance for efficiently guiding the clean atmosphere into the clean container. In order to search for the shape and arrangement of members, various experiments and analysis by simulation based on the experimental results were performed.

  FIG. 13 to FIG. 15 show the shapes of various induction members used for experiments and simulations. Each guide member shown in FIGS. 13 to 15 will be described according to each experiment or simulation in which the guide member is used.

(About the opening air volume analysis results)
First, with reference to FIG. 16 to FIG. 19, the wind speed measurement result at the clean container opening (inlet) will be described using an actual measurement value and an analysis result by simulation. For the following simulation analysis, version 2.1.10 of the product name “Airpak”, which is software manufactured by FLUENT, which is commercially available as airflow analysis software, was used.

  First, simulation analysis results will be described with reference to FIGS. 16 to 18, (a) shows an analysis model, and (b) shows that the FFU air volume of the clean gas blown downward from the cleaning means provided on the ceiling of the mini-environment device is 0.3 m. The analysis result of the air volume at the opening of the clean container in the case of / sec is shown, and FIG. 5C shows the same analysis result when the FFU air volume is set to 0.5 m / sec.

  FIG. 16 is a diagram illustrating an analysis model when the guide member is not used and an air volume analysis result of the opening. In the analysis model with the air volume of 0.3 m / sec shown in FIG. 16B, the gas hardly flows into the clean container, and in the case of the analysis model with the air volume of 0.5 m / sec in FIG. It can be seen that only a small amount of gas flows into the upper portion of the opening.

  FIG. 17 is a diagram illustrating an analysis result when two oblique guide members 110 and 111 are used. FIG. 17A shows an analysis model, and FIG. 17B shows an air flow analysis result of the opening. The guide member used for this analysis uses the guide member having the shape shown in FIGS. 13A, 13B, and 13C as the upper guide member 110, and the lower guide member 111 in FIG. The guiding members shown in d), (e), and (f) are used. (A) and (d), (b) and (e), (c), and (f) of FIG. 13 respectively show a front view, a left side view, and a perspective view of each guide member.

  The upper oblique guide member 110 was disposed at the height of the 25th wafer storage position, and the lower oblique guide member 111 was analyzed at the 17th height. As can be seen from the analysis result shown in FIG. 17 (b), when the oblique guide member is used, gas flows into the upper and middle stages of the opening of the clean container even in the analysis model with the air volume of 0.3 m / sec. It can be confirmed that it flows out from the lower side. In the analysis model with the air volume of 0.5 m / sec in FIG. 17C, it can be seen that the gas is flowing into the clean container with a considerably strong air volume.

  FIG. 18 is a diagram showing an analysis result when a V-shaped guide member is used. FIG. 18A shows an analysis model using one V-shaped guide member 120. As the V-shaped guide member 120, the guide member having the shape shown in FIGS. 15D, 15E, and 15F was used, and the case where the guide member 120 was placed at the height of the 25th wafer storage position was analyzed. . FIGS. 18B and 18C are diagrams showing the analysis results when the air volume of the FFU is 0.3 m / sec and when the air volume is 0.5 m / sec, respectively. As can be seen from the analysis result in FIG. 18B, only one V-shaped guide member 120 is used, and the gas flows into the clean container even when the air volume is 0.3 m / sec. Can be confirmed. It can be seen that a larger amount of air flows effectively in the analysis model with the air volume of 0.5 m / sec shown in FIG.

  Actual measurement was performed using an apparatus similar to the analysis model used in the above analysis (FIGS. 16A to 18A). As shown in FIG. 19A, the actual measurement positions are nine positions 95 obtained by dividing the opening (inlet part) of the clean container into three vertically and horizontally.

  The graph of FIG.19 (b) shows the air volume analysis result of the above opening part, and the measured value of nine measurement positions 95 in the opening part of a clean container. As can be seen from this graph, the measured value and the analysis result show an almost regular correlation, and the analyzed value appears as a proportional relationship of about 70% of the measured value. It is understood that is possible.

(Airflow observation experiment and analysis results)
Next, the relationship between the distance between the first partition plate and the second partition plate and the change in the gas flow in the mini-environment chamber, and the effect of guiding the gas into the clean container by the oblique guide member and the V-shaped guide member Will be described based on the results of the airflow observation experiment and the airflow analysis simulation.

  FIG. 20A is a diagram schematically showing the apparatus used for the experiment and the apparatus model used for the analysis, and FIG. 20B shows the observation point positions a to i inside the clean container for the experiment and analysis. It is a side view of a cleaning container. In the figure, reference numeral 130 denotes a guide member, 131 denotes an exhaust fan provided near the clean container, 132 denotes a first partition plate, and 133 denotes a second partition plate. The first partition plate 132 has an opening ratio of 20%, the FFU air volume of the cleaning means exhausts at a wind speed of 0.5 m / sec, and the ducts at both ends exhaust at a wind speed of 5.1 m / sec (FFU supply amount and exhaust flow rate). Are the same).

(Regarding the analysis of the spacing between partition plates)
FIG. 21A shows the air flow analysis result of the mini-environment device when the interval between the first partition plate 132 and the second partition plate 133 is 100 mm, and FIG. 21B shows the interval at 200 mm. The results of gas flow analysis are shown. In the figure (b), it can be seen that the gas flow is smoother and a wider interval is desirable. As a result of various analyses, the interval between the first partition plate 132 and the second partition plate is desirably 150 mm or more, and depending on the FFU supply amount and the wind speed, the range of 150 mm to 250 mm is effective. In particular, it was found that about 200 mm was most effective.

(About airflow observation experiment results)
Next, using the apparatus of FIG. 20 (a), the wind speed of the FFU air volume is 0.5 m / sec, the aperture ratio of the first partition plate is 20%, and when there is no guide plate, guide plates are provided in the upper and lower two stages. In the case where a single V-shaped guide plate is provided, an observation experiment was performed by changing the wafer storage state. As for the rectifying plate, the diagonal rectifying plate uses the shape shown in FIGS. 15 (a), (b), and (c) in both upper and lower stages, and the V-shaped rectifying plate is shown in FIGS. The shape shown in f) was used. The upper oblique guide member is placed at the height of the 25th wafer storage position, the lower oblique guide member is placed at the 17th step height, and the V-shaped guide member is at the 17th step height. installed. The observation experiment was conducted for each of the cases where 0, 15 and 25 wafers were stored in the clean container.

  FIG. 28 is a table showing the results of the observation experiment. “A” to “i” in the table indicate the positions of the matrix obtained by equally dividing the inside of the cleaning device shown in FIG. The substitution state at each position is indicated by ○ △ ×. ○ is sufficiently substituted, Δ is almost substituted, and x is not substituted.

  As a result of the observation experiment, in the case where zero wafers were housed in the clean container, the gas in the clean container tended to rise from the top to the bottom and did not flow easily to the upper stage. Nevertheless, it can be seen that the V-shaped guide member is relatively effective. Even when 25 wafers are accommodated, the gas tends to hardly flow as a whole, but it has been found that the effect of the V-shaped induction member is also excellent here. In the case of 15 bottom-packed cases, the gas soars in the upper space and tends to hardly flow in the lower stage, and it is understood that no gas flows in the regions b, c, h, i even if the V-shaped guide member is used. It was. With 15 tops, the wafer serves as a guiding member and easily flows to the upper stage. It can be seen that the V-shaped guide member is particularly effective.

(Results of airflow analysis based on simulation)
Next, the analysis result by simulation will be described. FIG. 22 shows the analysis result of the gas flow when no wafer is stored in the clean container 12 that can store 25 wafers. (A) shows the analysis result when neither the induction member nor the exhaust fan is provided, and (b) shows the analysis result when the exhaust fan 131 and the two V-shaped induction members 135 and 136 are used. FIG. As the two V-shaped guide members 135 and 136, guide members having the shapes shown in FIGS. 14A, 14B, and 14C are used in the upper stage, and FIGS. 13D and 13E are used in the lower stage. And it analyzed as what uses the induction | guidance | derivation member of the shape shown to (f). The upper V-shaped guide member 135 is arranged at the height of the 25th wafer storage position, and the lower guide member 136 is installed at the height of the 17th stage. As can be seen from FIG. 5A, it can be seen that in the absence of the guide member and the exhaust fan, almost no gas flows into the clean container 12. On the other hand, when the guide members 135 and 135 are provided, a large amount of gas flows in, indicating that the guide member is effective.

  FIG. 23 is a diagram illustrating an analysis result of the effect due to the presence or absence of an exhaust fan. The model of the analysis device is shown in FIG. In this analysis, five wafers are accommodated in the clean container 12 at equal intervals, and the analysis is performed using a model using the oblique guide member 130. FIGS. 13A, 13B, and 13C are used as the oblique guide member 130, and the analysis result is based on a model in which the lowest part of the guide member is the height of the 25th stage of the wafer. . As can be seen from the analysis results shown in FIGS. 23A and 23B, it can be seen that the amount of inflow is larger when the exhaust fan 131 is used. In addition, the flow of fluid becomes faster.

  In FIG. 24, the effect of the oblique guide member 134 is analyzed in a state in which 15 wafers are accommodated by dividing 10 wafers on the top and 5 on the bottom. FIG. 24A shows an analysis result when the wafer is arranged at the 17th stage position. The oblique guide member 134 is analyzed using the shape shown in FIGS. 13D, 13E, and 13F. FIG. 24B shows an analysis result when the same oblique guide member 134 as that in FIG. 24A has the same height but is brought closer to the clean container 12. In FIG. 24C, in addition to the state of FIG. 24A, an oblique guide member 130 having the shape shown in FIGS. 17A, 17B, and 17C is installed at the height of the 25th stage. The analysis results are shown. As can be seen from a comparison between FIGS. 24A and 24B, it can be seen that it is better to bring the oblique guide member 134 closer. Further, from FIG. 24C, it can be seen that the addition of the oblique guide member 130 can guide the descending airflow into the clean container 12 more effectively.

  FIG. 25 is a diagram illustrating a result of analysis using a model in which V-shaped guide members 135 and 136 are installed in two stages when fifteen wafers are divided and stored together. FIG. 20D shows a model of the analysis apparatus. As the two V-shaped guide members 135 and 136, V-shaped guide members having the shapes shown in FIGS. 14A, 14B, and 14C are used in the upper stage, and FIG. The analysis was performed using the V-shaped guide member having the shape shown in (e) and (f). The upper guide member 135 is disposed at the height of the 25th wafer storage position, and the lower guide member 136 is disposed at the 17th height. In the case of using two V-shaped guide members 135 and 136, the gas can be effectively guided into the clean container in either case of FIGS. 25 (a) and 25 (b).

  FIG. 26 shows the analysis results of the oblique guide member 134 and the V-shaped guide members 135 and 136 installed in two stages when 15 wafers are bottomed. Compared with the case where the oblique guide member 134 shown in FIG. 1A is used, it can be seen that the gas flows evenly into each wafer when the V-shaped guide member shown in FIG.

FIG. 27 is a diagram showing an analysis result of the influence due to the difference in the exhaust amount of the exhaust fan when 25 wafers are stored in the clean container 12. FIG. 27A shows an analysis result when the exhaust amount of the exhaust fan is 0.1 m / min, and FIG. 27B shows an analysis result when the exhaust amount is 0.4 m ³ / min. From the figure, the exhaust amount of 0.1 m / min is slightly more inflow into the clean container.

  FIG. 29 shows a table summarizing the simulation analysis results. The notations in the table are the same as in FIG. 28, and a to i indicate the positions of the matrix obtained by equally dividing the inside of the cleaning apparatus shown in FIG. X. ○ is sufficiently substituted, Δ is almost substituted, and x is not substituted.

  In the simulation, analysis is performed for 0, 25, and 15 wafers stored in the clean container. In the case of storing 15 sheets, the simulation is divided into the case where 15 sheets are packed in the lower side, 15 sheets are stored in the upper side, 10 sheets are stored in the upper side, and 5 sheets are stored in the lower side. did. Further, the effectiveness of the exhaust fan is analyzed in a case where five wafers are equally divided and stored in a clean container and an oblique guide member is used. In addition, in the case where 25 wafers are stored, the influence of the exhaust amount of the exhaust fan is also analyzed.

  These simulation results are almost similar to the experimental results, indicating that the simulation analysis is reliable. In the case of 0 sheets and 25 sheets, both indicate that it is better that the flow into the clean container (FOUP) should be less, and the bottom 15 sheets soars gas in the upper space as in the observation experiment, It indicates that it is difficult to flow, and the top 15 sheets are easy to flow to the upper stage. It can also be seen that the number of rectifying plates is better, and it is better to install them near the FOUP. Furthermore, analysis by simulation shows that it is better to provide an exhaust fan, but it is better not to have a large amount of exhaust.

  The present inventors further perform analysis through experiments and simulations, and that the rectifying member including the guiding member is more effective in replacing the atmosphere of the clean container, and that the V-shaped guiding member is more than the oblique guiding member. I was convinced that it was effective. Further, it has been found that it is desirable to install two oblique guide members since the effect is small with one sheet. Further, in the case of a V-shaped guide member, the position of the guide member is effectively 17/26 to 22/26 from the bottom of the opening, particularly in the case of a 25-sheet container. It is most effective to install at the height of the 20th wafer. Further, in the case of the oblique guide member, the upper guide member is disposed at a position 22/26 to 25/26 from the bottom of the opening height, and the lower guide member is 15/26 to 21/26 from the bottom. It was proved effective to install in the position. In particular, in the case of 25 wafers, it has been found that it is most efficient to place the upper guide member at the 25th stage position and the lower guide member at the 17th stage from the bottom.

  An atmosphere can be introduced under almost all circumstances when a V-shaped guide member is used. However, even if the V-shaped guide member is used, the replacement of the locations of the regions b, c, h, i is insufficient when 15 sheets are stored on the lower side. Therefore, in the case of 15 sheets, it is desirable to pack the upper side of the clean container.

Further, it was found that the wider the distance between the first partition plate and the second partition plate, the more effective, and the range of 150 mm to 250 mm is desirable, and particularly around 200 mm is most effective. Moreover, although an exhaust fan may be provided, the result that it is not good that there is too much displacement is obtained. The exhaust amount of the exhaust fan is preferably between 0.05 and 0.15, particularly about 0.1 m ³ / min.

  Furthermore, in the various induction members shown in FIGS. 13 to 15, since it is necessary to specify the shape as an experiment and analysis model, the numerical value of the size combination angle and the installation angle of each induction member is specified. The length, size (size), aspect ratio, and angle of each part can be freely changed according to various conditions such as the size of the mini-environment device and the FFU air volume. For example, the crossing angle of two oblique guide plates shown as an angle of 150 ° in FIGS. 13B and 13E and as an angle of 137 ° in FIG. It is desirable to adjust between 180 °.

  Further, the lower plate and the installation angle (angle with respect to the horizon) can be freely adjusted, and it is particularly preferable to adjust between 0 and 60 °. Furthermore, the angle of the intersection of the two plates constituting the V-shape of the V-shaped guide member can be freely adjusted. In particular, it is desirable that the inner angles of the two plates constituting the V-shape intersect each other within a range of 90 ° to 170 °. Moreover, the attachment angle with respect to the horizontal line of the V-shaped guide member shown as an angle of 30 ° in FIGS. 15B and 15E can also be freely adjusted, and is particularly preferably adjusted in the range of 0 ° to 60 °. .

It is a side view which shows the conventional thin plate-shaped object manufacturing system. It is a partially cutaway perspective view showing an embodiment of the mini-environment device of the present invention. It is a perspective view which shows one Example of the thin plate-shaped object manufacturing system of this invention. It is a partially cutaway perspective view showing an embodiment of the mini-environment device of the present invention. FIG. 4 is a partially cutaway perspective view showing a mini-environment device according to the present invention having a conveyor having a different shape. It is a side view which shows the thin plate-shaped object manufacturing system using the mini environment apparatus which has a baffle member concerning one Embodiment of this invention. It is a perspective view which shows the Example which provided the exhaust fan in the lower part of the boundary part door of a mini environment chamber. It is a perspective view of the mini-environment apparatus which shows a motion of the conveying machine 14 concerning the embodiment shown in FIG. It is a perspective view of the mini-environment apparatus which shows a motion of the arm of the conveying machine which takes out a thin plate-shaped member from a cleaning apparatus with the conveying arm of a conveying machine. It is a perspective view which shows the baffle member concerning other embodiment of this invention. It is a figure which shows the flow of the clean atmosphere induced | guided | derived in a clean container by a guide member. It is a side view which shows the state which can see the inside of the thin plate-shaped object manufacturing system concerning other embodiment of this invention. It is a figure which shows the shape of the diagonal guide member used for simulation. (A) and (d) are front views, (b) and (e) are left side views, and (c) and (f) are perspective views. It is a figure which shows the shape of the V-shaped induction | guidance | derivation member used for simulation. (A) and (d) are front views, (b) and (e) are left side views, and (c) and (f) are perspective views. It is a figure which shows the shape of the diagonal guide member and V-shaped guide member which were used for experiment. (A) and (d) are front views, (b) and (e) are left side views, and (c) and (f) are perspective views. It is a figure which shows the analysis model and observation result of the wind speed in a clean container opening part. It is a figure which shows the analysis model and observation result of the wind speed in a clean container opening part. It is a figure which shows the analysis model and observation result of the wind speed in a clean container opening part. (A) It is a figure which shows nine observation areas which divided the opening part of the clean container into 3 in length and breadth, (b) is a graph which shows an analysis result and measurement apparatus. FIG. 20 (a) is a diagram schematically showing the apparatus used for the experiment and the apparatus model used for the analysis, and FIG. 20 (b) is a view of the clean container showing the observation point position of the experiment and analysis in the clean container. It is a side view, (c) And (d) is a perspective view which shows the model of an analyzer. It is a figure which shows the analysis result which simulated the space | interval of a partition plate. It is a figure which shows the analysis result in case the wafer is not accommodated. It is a figure which shows the analysis result by the presence or absence of an exhaust fan. It is a figure which shows the analysis result based on the difference of the guidance member at the time of accommodating 15 pieces of wafers. It is a figure which shows the analysis result of the difference in the case where 15 wafers are separately stored and the case where they are stored top-packed. It is a figure which shows the analysis result based on the difference of the guidance member in the case of accommodating 15 wafers bottom stock. It is a figure which shows the result of having analyzed the influence by the difference in the exhaust air volume of an exhaust fan. It is a graph which shows the result of an observation experiment. It is a graph which shows the analysis result based on simulation.

Explanation of symbols

10, 20, 50, 100 Thin plate manufacturing system 11, 21, 31, 41, 51, 91 Mini-environment device 11-1, 21-1, 51-1, 91-1 Mini-environment chamber 12 FOUP 13 Road Ports 14, 42 Transporter 15 Cleaning means (fan filter unit)
16 Processing chamber 17 Valve body 22, 92, 131 First partition plate
23, 93, 132 Second partition plate 24 Circulation path 32 Gas introduction rectification member 25 Internal environment measuring device 26 Clean gas (no harm or low harm gas) supply mechanism 27 Inlet 32, 52, 60, 70 Rectification member 53, 80, 110, 111, 130, 134 Diagonal guide member (guide plate)
54 Door lifting / lowering means 55 Current regulating member driving means 80 Door 90 Cleaning member lid 81, 120, 135, 136 V-shaped guide member (guide plate)

Claims (20)

A clean container for storing a thin plate in an airtight manner is placed, and the thin plate is removed from the clean container by a load port for opening / closing or attaching / detaching the lid of the clean container and a transfer arm. A mini-environment device that includes a transporter that transfers to a processing chamber for processing an object, and a cleaning unit that removes dust in the gas when the gas passes through, and maintains the interior in a clean environment.
A first partition plate having a plurality of through holes provided below the transport arm of the transport machine, and a lower part than the first partition plate, the harmless or low harm gas recovery port of the circulation path Provided between the second partition plate that does not pass the harmless or low harm gas provided at intervals of 150 mm to 250 mm,
A mini-environment apparatus comprising: a circulation means having a circulation path for collecting harmless or low-damage gas filled in the mini-environment apparatus and circulating it to the cleaning means. The harmless or low harm gas supply device, an oxygen concentration meter for measuring the internal oxygen concentration, and a control means for controlling the supply amount of the harmless or low harm gas based on the concentration information output from the oxygen concentration meter The mini-environment device according to claim 1 , comprising: A hygrometer for measuring the humidity inside, according to claim 1 or claim, wherein based on the humidity information output from the hygrometer that and control means for controlling the supply amount of the harmless or low harmful gas Item 3. The mini-environment device according to Item 2 . The rectifying member for guiding the harmless or low harmful gas circulating inside the interior of the clean container, in any one of claims 1 3, characterized in that provided on the front surface of the opening to the clean container The mini-environment device described. The harmless or low harmful gas, inert gas, dry air, low-oxygen air, wherein the drying is any one selected from the group consisting of low-oxygen air, any one of claims 1 4 The mini-environment device described in 1. A clean container for storing a thin plate in an airtight manner is placed, and a load port that can open and close or detach the lid of the clean container and a transfer arm are provided, and the transfer plate has the thin plate shape from the clean container. It is equipped with a transporter that takes out an object and transfers it to a processing chamber for processing the thin plate-like object, and a cleaning means that removes dust in the gas by passing the gas fed into the interior, and maintains the interior in a clean environment. A mini-environment device for preventing contamination of the thin plate,
A mini-environment device characterized in that a rectifying member for guiding clean gas supplied through the cleaning means from the opening of the cleaning container to the inside of the cleaning container is provided in front of the opening of the cleaning container. . The mini-environment device according to claim 6 , wherein the rectifying member includes an oblique guide member that guides the clean gas into the clean container by blocking the flow of the clean gas at a predetermined angle.   The mini-environment device according to claim 7, wherein the rectifying member includes the oblique guide members arranged in a plurality of stages in the vertical direction. The flow straightening member includes two upper and lower guide members, and the lower oblique guide member has a height within a range of 15/26 to 21/26 of the vertical width of the opening (length in the vertical direction of the opening). The mini-environment device according to claim 8 , wherein the upper rectifying member is installed at a height within a range of 22/26 to 25/26. The mini-environment device according to claim 6 , wherein the rectifying member includes a V-shaped guide member having a depressed center that collects the clean gas descending in the center and guides the clean gas into the clean container. The mini-environment device according to claim 10 , wherein the V-shaped guide member is inclined at a predetermined angle toward the clean container. The mini-environment according to claim 10 or 11 , wherein the V-shaped guide member is arranged at a position of 17/26 to 22/26 from the bottom of the opening. apparatus. The mini-environment device according to any one of claims 6 to 12 , further comprising a driving unit that moves the rectifying member from a predetermined position of the opening. The mini-environment device according to claim 13 , wherein the driving means moves the rectifying member downward. In order to maintain a clean environment in the mini-environment device, the driving means is covered with a cover, and clean gas supplied by the cleaning means is taken into the cover, and the introduced clean gas and dust generated from the driving means are externally provided. The mini-environment device according to claim 13 or 14 , wherein the mini-environment device is discharged to a circulation path. And a circulation means for circulating the clean gas by collecting the clean gas supplied from the cleaning means, sending it to the clean means, and supplying the recovered clean gas again through the clean means. The mini-environment device according to any one of claims 6 to 15 . A first partition plate having a plurality of through-holes provided below the transport arm of the transport machine, and the harmless or non-hazardous disposed below the first partition plate. The mini-environment device according to claim 16 , wherein the mini-environment device is provided between the second partition plate that does not allow passage of a low harmful gas. The mini-environment device according to claim 17 , wherein the first partition plate and the second partition plate are provided with an interval of 150 mm to 250 mm. A thin plate manufacturing system comprising the mini-environment device according to any one of claims 1 to 18 . The clean gas in the mini-environment device is sent from the opening of the clean container placed on the load port, and the downward flow of the clean gas in the mini-environment device is inclined toward the opening of the clean container. An atmosphere replacement method for a clean container in which the flow of the clean gas is guided into the clean container by blocking the air , and the atmosphere in the clean container is replaced with a clean gas.

Images