JP2004200669A - Minienvironment equipment, sheet-like object manufacturing system, and method of replacing atmosphere in sanitized vessel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide minienvironment equipment, a sheet-like object manufacturing system, and a method of replacing the atmosphere of a sanitized vessel whereby it is possible to prevent impurity gas from reaching a semiconductor wafer in the sanitized vessel and the minienvironment equipment and thus to prevent a reduction in yield. <P>SOLUTION: The equipment comprises a load port 13 for loading a cleaning container 12, which hermetically stores a sheet-like object, and detachably opening/closing the lid of the container, a conveyor 14, a fan filter unit 15, and a circulation path 24 for gathering air in a minienvironment chamber 91-1 and circulating the air in the fan filter unit 15. Further, the equipment comprises a straightening member 52 for guiding internal clean air into the cleaning container 12, a first partition 92 having a number of through holes, and a second partition 93 not allowing the passage of air. Thus, the circulating air is kept clean and an internal airflow is caused to become a laminar flow. Moreover, it is also possible to replace the atmosphere in the cleaning container with clean air at a high speed. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

  The present invention is an apparatus for handling thin objects such as a semiconductor wafer, a liquid crystal panel substrate, an organic electroluminescence display substrate, an inorganic electroluminescence display substrate, a plasma display substrate, and a field emission display substrate under a harmless or low harmful gas atmosphere, The present invention relates to a manufacturing system, and a method for replacing the atmosphere of a pollution-prevention type cleaning container that stores and transports these sheet-like materials.

  In particular, the present invention includes a mini-environment device that provides a highly clean environment for taking out and processing a thin plate from a clean container used for transporting the thin plate during a manufacturing process. The present invention relates to a manufacturing system and a method for replacing an atmosphere in a clean container. The present invention can be applied to any sheet-like material that requires a high clean environment during transportation and processing. In the following, a description will be given of an electronic device member such as a silicon wafer or a liquid crystal substrate, particularly a semiconductor wafer (hereinafter, referred to as a wafer) as a thin plate, but this is merely an example and does not limit the present invention.

  In a manufacturing process of an electronic device, an electronic device manufacturing apparatus having a processing chamber for processing or surface-treating the surface of a thin plate is used. For example, in a semiconductor wafer production process, if dust or minute organic matter adheres to and contaminates a wafer, the production yield (non-defective product rate) decreases. Therefore, when transporting, processing and storing wafers, a high clean environment is required to prevent such contamination.

  Among electronic devices, processing of semiconductor wafers is particularly performed in a clean room with high cleanliness. Since there is no risk of contamination in a clean room with high cleanliness, an open cassette, which is an open storage container, has been widely used so far as a container for storing a plurality of semiconductor wafers. However, a mini-environment method has been proposed as a means for reducing the cost of maintaining a clean room with high cleanliness and making a high-performance semiconductor device at low cost. In the mini-environment method, a high-purity room called a mini-environment room is set up in a clean room with a very low degree of cleanliness, in which wafers are taken out of a clean container (in a high-purity environment) and transferred to the processing room. To process the wafer.

  Up to the mini-environment chamber, the wafer is hermetically stored in a clean container that can be hermetically sealed, and is transported and transported together with the clean container by an AGV, an OHT, or manually. In this way, the wafer is prevented from being contaminated by dust even when transported through a place with relatively low cleanliness. As an airtight cleaning container for transporting such a wafer, a SMIF (Standard Mechanical Interface) method is widely used for 200 mm semiconductor wafers, and a FOUP (Front Opening Unified Pod) method is used for 300 mm semiconductor wafers. Have been.

  The cleaning container storing the thin plate is placed on the load port, and the lid on the mini-environment room side is opened in a state where the cleaning container is shielded from the outside air. The sheet-like material in the cleaning container is taken out of the cleaning container by a transporter provided in the mini-environment chamber, and is transferred to the processing chamber. When the surface processing or surface treatment of the thin plate is performed in the processing chamber and the predetermined surface treatment is completed, the thin plate is taken out of the processing chamber by the transfer device and returned to the clean container.

  A plurality of wafers stored in the cleaning container are transferred one by one from the cleaning container into the mini-environment. In order to prevent dust floating in the atmosphere from adhering to the wafer during such transfer, dust generated due to the opening / closing operation of the cleaning container, the operation of the load port, the operation of the transfer device, and the like. In addition, dust and the like flowing from a region having a low cleanliness pose a problem.

  FIG. 1 is a view showing one example of a conventionally used thin plate manufacturing system, and is a side view showing a partially omitted inside. In the drawing, reference numeral 10 denotes the entire thin plate manufacturing system, and reference numeral 11 denotes a mini-environment device for maintaining a highly clean environment inside. The mini-environment device 11 includes a mini-environment chamber 11-1 that separates a low clean area outside and a high clean area inside by a housing. Reference numeral 12 denotes a cleaning container called a FOUP for storing a thin plate-like material. Reference numeral 13 denotes a cleaning container provided at the boundary between the mini-environment room 11-1 and the low-cleaning room. This is a load port for opening and closing. When the wafer is not moved, the opening of the load port is closed, so that dust can be prevented from flowing into the mini-environment chamber 11-1 from the low clean room.

  Reference numeral 14 denotes the transfer of a thin plate-like object such as taking out the thin plate-like object from the cleaning container 12 in the mini-environment chamber 11-1 and transporting the thin plate-like object to the processing chamber for processing, or taking out the thin plate-like material from the processing chamber and returning it to the inside of the cleaning container 12. This is a transfer machine that performs the following. Reference numeral 15 denotes a fan filter unit (cleaning means) including a fan (blower) and a filter for keeping the mini-environment chamber 11-1 clean, and constantly supplies a constant clean airflow into the mini-environment chamber 11-1. The supplied and floating dust can be blown off in a certain direction and discharged to the outside. Reference numeral 16 denotes a processing chamber for processing or treating the surface of the thin plate.

  The cleaning means for supplying a clean airflow into the mini-environment chamber 11-1 includes a blower and an ULPA filter or a chemical filter, and is installed above the mini-environment chamber 11-1. Air outside the mini-environment chamber 11-1 is taken into the blower and passes through the filter to become high-purity air. This clean airflow flows from the upper part of the mini-environment chamber 11-1 to the lower part thereof, and the dust floating in the mini-environment chamber 11-1 is discharged together with the airflow at the exhaust port at the lower part of the mini-environment chamber 11-1. It is discharged to the outside via.

  The processing of a thin plate in the thin plate manufacturing system 10 shown in FIG. 1 is performed as follows. When the cleaning container 12 containing the thin plate is placed on the load port 13, the lid is opened by the load port 13. The sheet-like material in the cleaning container 12 is transferred to the processing chamber 16 by the transfer device 14. When the processing or surface treatment of the sheet-like material is completed in the processing chamber 16, the sheet-like material is returned to the cleansing container 12 again by the carrier 14 and the lid is closed.

  When the sheet-like material after processing is stored in a clean container 12 in an air environment and hermetically stored, unnecessary and electronic storage is carried out again to the sheet-like material manufacturing system 10 during storage until the next processing is started. Reactants (especially, in the case of a semiconductor device, a natural oxide film) which are not preferable in manufacturing the device may be formed on the surface of the thin plate.

In order to solve such a problem, a method of replacing the atmosphere in the FOUP which is the cleaning container 12 with an inert gas in a 300 mm semiconductor wafer is used. This is one in which an intake valve and an exhaust valve are provided on the bottom of the FOUP, and an intake port and an exhaust port are also provided on the load port at positions corresponding to the FOUP. (Patent Document 1)
A technique for filling the entire mini-environment chamber with an inert gas has also been proposed (Patent Document 2). In processing a wafer, the atmosphere in the processing chamber may be replaced with an inert gas atmosphere such as nitrogen in order to control the humidity and oxygen concentration in the processing chamber or prevent organic contamination. Patent Document 2 proposes a method of filling the atmosphere in the mini-environment device with an inert gas in order to reduce the time for replacing the atmosphere in the processing device and to prevent organic contamination in the mini-environment device. ing. This mini-environment device is provided with a cleaning means for supplying an inert gas at the top. The inert gas is collected without being exhausted from an exhaust duct provided on a side wall in the mini-environment device, and is taken into the cleaning means again through the circulation path.
JP-A-11-63604 JP-A-2002-43391

  However, the above prior art has the following problems. That is, in the method of replacing the atmosphere from the bottom of the FOUP with an inert gas on the load port, all the semiconductor wafers that have been subjected to the process processing are returned to the FOUP in the processing chamber, the FOUP door is closed by the load port, and then the inert gas is removed. Replacement with gas was being performed. Therefore, for example, when nitrogen is used as an inert gas and the oxygen concentration in the FOUP is set to 10 ppm or less, it takes about 8 to 10 minutes. That is, the load port is occupied until the replacement with the nitrogen gas in the FOUP is completed, so that there is a problem that productivity is extremely reduced.

  Further, the method of filling and circulating the entire mini-environment chamber with an inert gas has a problem that it takes a considerable time to completely replace all the gas in the FOUP container.

  In addition, the transporter discharges impurities and foreign substances such as foreign particles and a small amount of organic gas from the movable part, and impurities that cannot be filtered by the filter accumulate in the mini-environment chamber and adversely affect the semiconductor wafer. . Further, impurities and foreign substances generated from these transporters soar into the mini-environment chamber due to intake and exhaust air from the lower and lower portions of the body when the arms and the body of the transporter move up and down.

  In order to suppress this in the exhaust system, it is necessary to enhance the downflow from the fan filter unit, which has resulted in an increase in the price of the device and the operating cost.

  On the other hand, in the case of the circulation system, the airflow in the circulation system flows linearly from the cleaning device (fan filter unit) to the exhaust port, so that an airflow that enters the opening (cassette) provided on the side of the housing is hardly generated. However, there is a problem that dust stays in the cleaning container.

  SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and in a cleaning container and a mini-environment device, a product of a thin plate member is prevented by preventing an impurity gas from coming into contact with a thin plate member such as a semiconductor wafer. It is an object of the present invention to provide a pollution-prevention type mini-environment device, a sheet-like material production system, and a method for replacing the atmosphere of a clean container, which can prevent a decrease in yield.

  Further, the present invention provides a mini-environment device capable of suppressing generation of dust when a wafer is taken out of a clean container and transferred under a highly clean area, and a thin plate manufacturing system including the same. Providing is one of its purposes.

  Further, the present invention provides a mini-environment device, a sheet-like material manufacturing system, and an atmosphere replacement method for a cleaning container, in which a clean air flow circulating in the mini-environment device is guided into the cleaning container from an opening of the mini-environment device. That is one of its purposes.

  In addition, the present invention provides a mini-environment device that disturbs the flow of gas in the mini-environment and flies up dust even if a clean air flow is induced in the cleaning container, thereby preventing exhaust gas from flowing back. It is an object of the present invention to provide a state-of-the-art material manufacturing system and a method for replacing the atmosphere of a clean container.

  Further, another object of the present invention is to provide a mini-environment device capable of guiding a clean airflow to a clean container without obstructing the operation of the transport device, and one of its objects.

  The mini-environment device according to the first embodiment of the present invention has a load port for mounting a cleaning container for storing a thin plate-like material in an airtight manner, opening and closing or removing a lid of the cleaning container, and a transfer arm. A transfer device that removes a thin plate from a cleaning container and transfers the thin plate to a processing chamber for processing the thin plate, and a cleaning unit that removes dust in the gas when the gas passes therethrough. A mini-environment device for maintaining the state of the mini-environment device, comprising a circulating means having a circulating path for collecting harmless or low harmful gas filled in the mini-environment device and circulating the gas to the cleaning means. I do. In the present invention, the circulation path may be provided anywhere. However, it is preferable that the circulation path be provided on the side of the mini-environment device so as not to hinder the carrying in and out of the thin plate.

  In addition, the mini-environment device according to another embodiment of the present invention has a harmless or low harmful gas recovery port in a circulation path, a first port having a plurality of through holes provided below a transfer arm of a transfer device. And a second partition plate provided below the first partition plate and passing no harmful or low harmful gas. The thin plate-like object transfer machine used in the present invention is a known SCARA robot, a multi-axis articulated robot, other industrial robots, and an XY-axis transfer machine.

  Further, a mini-environment device according to another embodiment of the present invention is characterized in that the first partition plate and the second partition plate are provided at an interval of 150 mm to 250 mm. As described above, by providing a considerable distance from the first partition plate to the second partition plate, the first partition plate can effectively make the airflow in the mini-environment chamber laminar.

  In addition, the mini-environment device according to another embodiment of the present invention further includes a harmless or low harmful gas supply device, an oximeter that measures the internal oxygen concentration, and concentration information output from the oximeter. And control means for controlling the supply amount of the harmless or low harmful gas based on the above. In addition, a mini-environment device according to another embodiment of the present invention includes a hygrometer that measures internal humidity, and a control that controls a supply amount of a harmless or low harmful gas based on humidity information output from the hygrometer. Means.

  In addition, the mini-environment device according to another embodiment of the present invention further includes a rectifying member that guides a harmless or low harmful gas circulating in the inside of the cleaning container, on the front surface of the opening to the cleaning container. It is characterized by the following. The shape of the current plate is not particularly limited, but is designed to induce a downward airflow from the fan filter toward the open clean container.

  In addition, the mini-environment device according to another embodiment of the present invention is one in which the harmless or low harmful gas is selected from the group consisting of an inert gas, dry air, low oxygen air, and dry low oxygen air. It is characterized by the following. Here, the inert gas refers to a gas such as nitrogen, argon, neon, or xenon.

  In addition, a mini-environment device according to another embodiment of the present invention includes a load port capable of mounting a cleaning container for storing a thin plate-like material in an airtight manner and opening / closing or removing a lid of the cleaning container; An arm is provided, and the transfer arm takes out a thin plate from the cleaning container, transfers the transfer to a processing chamber for processing the thin plate, and removes dust in the gas by passing the gas sent into the inside. A mini-environment device for maintaining the inside in a clean environment state to prevent contamination of the sheet-like material, comprising a cleaning means for removing the cleaning gas, and a cleaning gas supplied through the cleaning means to a front surface of an opening of the cleaning container. A rectifying member is provided to guide the flow through the opening of the cleansing container into the inside of the cleansing container. The shape of the current plate is not particularly limited, but is designed to induce a downward airflow from the fan filter toward the open clean container.

  Further, a mini-environment device according to another embodiment of the present invention is characterized in that the straightening member includes an oblique guiding member that guides the clean gas into the clean container by blocking the flow of the clean gas at a predetermined angle. And By obliquely blocking the descending airflow, the clean gas is guided along the wall surface of the guide member, and is guided into the clean container. Therefore, the downdraft is naturally guided to the clean container.

  Further, a mini-environment device according to another embodiment of the present invention is characterized in that diagonal guide members are arranged in a plurality of stages vertically on the rectifying member. The cleaning container accommodates a thin plate-like material, which serves as a resistance to gas inflow. Therefore, it is desirable to provide a plurality of oblique guide members.

  In addition, in the mini-environment device according to another embodiment of the present invention, the rectifying member includes two guide members vertically, and the lower diagonal guide member is connected to the vertical width of the opening (the vertical length of the opening). ) Is installed at a height within the range of 15/26 to 21/26, and the upper rectifying member is installed at a height within the range of 22/26 to 25/26. Since the optimal installation position (height) of the guide member differs depending on the vertical length of the opening, in the above-described embodiment, the appropriate installation position (height) of the guide member is determined by the vertical length of the opening. Is set to “1”. Therefore, even when the number of storage stages is smaller or larger than this, the installation height of the guide member is determined by the above ratio. In addition, the mini-environment device according to another embodiment of the present invention is configured such that the rectifying member includes a V-shaped guiding member having a hollow central portion for collecting the descending clean gas at the center and guiding the descending clean gas into the cleaning container. Features. The V-shaped guide member concentrates and guides the airflow to the central hollow portion, so that the V-shaped guide member more strongly enters the normal container.

  A mini-environment device according to another embodiment of the present invention is characterized in that the V-shaped guiding member is inclined at a predetermined angle toward the cleaning container. By inclining in the direction of the cleaning container, the concentrated downdraft can be more effectively guided into the cleaning container.

  Also, in a mini-environment device according to another embodiment of the present invention, the V-shaped guide member may be arranged at a position 17/26 to 22/26 from below the opening. Features.

  Further, the mini-environment device according to another embodiment of the present invention is further characterized by further comprising a driving unit for moving the rectifying member from a predetermined position of the opening.

  Further, a mini-environment device according to another embodiment of the present invention is characterized in that the driving means moves the rectifying member downward.

  Further, in a mini-environment device according to another embodiment of the present invention, in order to maintain a clean environment in the mini-environment device, the driving means is covered with a cover, and a clean gas supplied by the cleaning means is taken into the cover. And discharging the introduced clean gas and dust generated from the driving means to the outside or a circulation path. Even when the gas discharged from the cover is discharged to the circulation path, dust in the discharged gas can be almost completely removed by the filter (the dust collection rate is 99.999% or more). Since inert gas such as nitrogen is expensive, it is desirable to circulate as much as possible rather than exhausting it to the outside.

  In addition, the mini-environment device according to another embodiment of the present invention further collects the clean gas supplied from the cleaning unit, sends the collected clean gas to the purifying unit, and supplies the collected clean gas again through the purifying unit. And circulating means for circulating the clean gas.

  Further, the mini-environment device according to another embodiment of the present invention further includes a first partition plate having a plurality of through holes provided below the transfer arm of the transfer device with a recovery port for the clean gas, It is provided between the first partition plate and a second partition plate provided below the harmless or low harmful gas provided below the first partition plate.

  Further, a mini-environment device according to another embodiment of the present invention is characterized in that the first partition plate and the second partition plate are provided at an interval of 150 mm to 250 mm.

  According to one embodiment of the present invention, there is provided a thin plate-like object manufacturing system including the mini-environment device described above. The manufacturing system consists of a processing chamber that includes all processing steps such as cleaning, drying, heating, cooling, resist coating, developing, gas reaction, submerged reaction, plasma, sputtering, etc., and a device for loading and unloading sheet-like materials to and from them. Refers to equipment that is combined.

  Further, in the method for replacing the atmosphere of a clean container according to one embodiment of the present invention, the clean gas in the mini-environment device is sent from the opening of the clean container placed on the load port to clean the atmosphere in the clean container. It is characterized by replacement with gas.

  Further, the method for replacing the atmosphere of a clean container according to another embodiment of the present invention is characterized in that the downward flow of the clean gas in the mini-environment device is obliquely blocked toward the opening direction of the clean container, whereby the clean gas is removed. The method is characterized in that a flow is guided into a cleaning container.

  ADVANTAGE OF THE INVENTION According to this invention, it becomes possible to maintain the inside of a mini-environment apparatus in a highly clean state efficiently. Further, according to the embodiment of the present invention, the above-described object is achieved by providing a circulating means for collecting a harmless or low harmful gas, purifying the gas by a purifying means, and supplying the gas again. According to another embodiment of the present invention, by providing the first partition plate below the arm of the transporter in the mini-environment device, the circulating gas can be efficiently removed without hindering the operation of the transporter. Laminar flow is possible.

  Further, in another embodiment, the body of the transporter is covered with a cover, and when the body expands and contracts foreign substances and impurities generated inside the transporter, the foreign matter and impurities are discharged downward from a machine lower than the gas circulation path. It does not accumulate in the environment device. Therefore, the amount of harmless or low harmful gas circulating in the mini-environment device can be reduced, the amount of harmless or low harmful gas to be replenished can be reduced, and the operating cost can be reduced. Further, when replacing the inside of the cleaning container with a harmless or low harmful gas, there is no need to replace the entire cleaning container with a harmless or low harmful gas environment, and the apparatus structure can be simplified. Further, in another embodiment of the present invention, by providing a gas rectifying member for guiding the laminar flow in the mini-environment device from the opening of the cleaning container to the inside, the atmosphere in the cleaning container can be efficiently reduced in a short time. It is possible to exchange.

  An embodiment of the present invention will be described below with reference to FIGS. FIG. 2 is a perspective view showing a mini-environment device 21 according to an embodiment of the present invention, with a part cut away. FIG. 3 is a perspective view showing the appearance of a thin plate manufacturing system 20 including the mini-environment device 21 shown in FIG. As shown in FIG. 3, the thin plate manufacturing system 20 of the present invention includes a mini-environment device 21 and a processing chamber 16.

  As shown in FIG. 2, the mini-environment device 21 includes a fan filter unit 15 (cleaning unit) including a sealed mini-environment chamber 21-1, a blower including a sirocco fan, an ULPA filter, and a clean gas outlet at an upper portion thereof. And a load port 13 (FIG. 3). The mini-environment chamber 21-1 has a load port 13 on which the FOUP 12 as a cleaning container is placed as a partial wall, and the opposite wall has an openable / closable valve body 17 serving as an inlet of the processing chamber 16, All other walls are sealed and airtight. The valve body is representative of doors, valves, and doors that are not limited to shapes such as rectangles and circles, and may be any as long as they can be opened and closed when a thin plate-like object is carried into and out of the processing chamber.

  Inside the mini-environment chamber 21-1, a transfer device 14 for transferring a semiconductor wafer, a first partition plate 22 provided below a transfer arm of the transfer device 14 and having a plurality of openings, and a transfer device A second partition plate 23 is provided above the floor on which the machine base is installed and is impermeable to gas. The first partition plate 22 has a large number of through holes arranged regularly, and makes the flow in the clean space between the outlet of the fan filter unit 15 and the first partition plate 22 a laminar flow. Has an effect.

  The space defined between the first partition plate 22 and the second partition plate 23 is connected to the intake port 27 of the fan filter unit 15 through the circulation path 24. The fan filter unit 15 is provided with a supply port for supplying an inert gas such as nitrogen and argon, air from which oxygen has been partially removed, air to which nitrogen has been added, and a harmless or low harmful gas that has been subjected to a drying treatment. The supply amount can be adjusted by a control mechanism (not shown).

  In addition, the mini-environment device 21 includes an internal environment measuring device 25 such as an oxygen concentration meter or a hygrometer including a dew point meter for measuring the environment inside the mini-environment device 21. The internal environment measuring device 25 always detects the oxygen concentration or humidity inside the mini-environment device 21 and increases the supply amount of harmless or low harmful gas when the environment becomes worse than a predetermined value. In the case where an environmental condition that is excessively good than a predetermined value is maintained, the supply amount of harmless or low harmful gas is reduced. Therefore, the running cost can be reduced because the use amount of expensive harmless or low harmful gas is not increased more than necessary.

  FIG. 4 is a partially cutaway perspective view showing a mini-environment device 31 according to another embodiment of the present invention. In the mini-environment device 31 of FIG. 4, a rectifying member 32 for guiding harmless or low harmful gas into the FOUP 12 is provided in front of the opening of the cleaning container FOUP (cleaning container) 12. The rectifying member 32 is fixed to a wall of the mini-environment chamber. The rectifying member 32 can promote replacement of the atmosphere inside the FOUP 12. The rectifying member will be described later in more detail.

  The processing of the thin plate according to the present invention is performed as follows. That is, the FOUP 12 containing the semiconductor wafer is placed on the load port 13 by an operator or an automatic carrier such as an OHT (Over Head Transfer), and is opened by the load port 13. The semiconductor wafer stored in the FOUP 12 is carried into the processing chamber 16 by the carrier 14 after the valve element 17 shown in FIG. Before the semiconductor wafer is carried into the processing chamber 16, a notch aligner for aligning the orientation of the wafer (not shown) may be provided.

  When the semiconductor wafer is loaded into the processing chamber 16, the valve 17 is closed, and the processing of the semiconductor wafer is started. When the processing is completed, the valve element 17 is opened, and the semiconductor wafer is returned to the FOUP by the carrier 14. The FOUP has its door closed by the load port 13 and is collected by an operator or an automatic transporter such as an OHT. In order to maintain the internal environment of the mini-environment device 11, it is desirable that the time during which the valve element 17 is open be minimized.

  When transferring the semiconductor wafer to the FOUP or the processing chamber 16, the transfer device 14 can vertically expand and contract in accordance with the height of the transfer destination. The dust generated due to the vertical movement has a very small gap between the body of the transporter 14 and the second partition plate 23 because the opening of the fuselage cover of the transporter is below the second partition plate 23. Therefore, the dust generated from the transporter 14 does not soar into the mini-environment device 21.

  Further, the inside of the FOUP is filled with a harmless or low harmful gas. However, when the processed semiconductor wafer is returned to the FOUP, harmful gas may be generated from the semiconductor wafer immediately after the processing. . This harmful gas is known to adversely affect the semiconductor wafer before processing. The rectifying member 32 arranged in front of the opening of the FOUP 12 can efficiently introduce harmless or low harmful gas in the mini-environment chamber into the FOUP 12.

  By introducing a harmless or low harmful gas into the FOUP 12, the atmosphere in the FOUP 12 is quickly discharged out of the FOUP 12 together with the harmful gas released from the processed semiconductor wafer. Therefore, a decrease in the yield of wafer processing due to the harmful gas released from the wafer is suppressed. Further, before the lid of the FOUP 12 is closed, the inside of the FOUP is replaced with a harmless or low harmful gas. Therefore, the replacement time is greatly reduced as compared with a method of performing replacement through a purge port from the bottom side of the FOUP 12. Can be done.

  In the above description, the fan filter unit may be provided with a chemical filter made of particulate or fibrous activated carbon for removing contaminants such as acids, alkalis, and organic substances accumulated in the circulating gas. . Further, a dehumidifying material for removing the moisture of the circulating gas may be provided. Further, in the above-described embodiment, the thin plate-shaped object is a semiconductor wafer having a diameter of 300 mm, but may be a semiconductor wafer having a diameter other than 300 mm, a liquid crystal display substrate, a reticle, and disks.

  FIG. 5 is a perspective view of a mini-environment device 41 according to another embodiment of the present invention. The mini-environment device 41 includes different types of transporters 42. The transfer device 42 is fixed between the second partition plate 23 and the second partition plate 23 so as not to allow gas to pass therethrough. The neck with the upper arm can rotate and move in the height direction, and a sealing function for preventing gas containing dust inside the transfer machine from flowing into the mini-environment device is provided. It is equipped.

(About rectifying member)
Next, the rectifying member for rapidly replacing the atmosphere in the FOUP (cleaning container) will be described in more detail. As described above, it is desirable to replace the gas in the cleaning container with the cleaning gas in order to prevent contamination of the thin plate in the FOUP (cleaning container). On the other hand, in order to speed up the manufacture of semiconductor devices, it is desirable to replace the gas in the cleaning container with the gas in the mini-environment device as soon as possible.

  As described above, in order to replace the inside of the clean container with clean air, simply opening the lid of the clean container and opening the door of the opening of the mini-environment device will cause the clean air to flow only downward as a laminar flow. It does not flow inside and cannot be replaced efficiently. Therefore, in the present invention, a rectifying member for guiding the clean air descending from above the environment chamber into the clean container is provided. In addition, in order to achieve the purpose of quickly replacing the atmosphere in the cleaning container with the cleaning gas, a rectifying member is provided in front of the opening of the FOUP 12 so that the mini-environment chamber flows downward from above. Inducing the atmosphere (clean gas) into the FOUP is effective in any of the exhaust system and the circulation system.

(About the embodiment using the rectifying member)
FIG. 6 shows a thin plate manufacturing system 50 having a mini-environment device 51 according to another embodiment of the present invention. The mini-environment device 51 includes a mini-environment chamber 51-1 and a rectifying member 52 in which a low-clean area and a high-clean area are separated by a housing. The inside of the housing is provided with a cleaning means 15 for purifying the outside air. By increasing the pressure inside the mini-environment chamber 51-1 higher than the outside, the inflow of dust is prevented, and the clean air is moved from the upper part to the lower part. To discharge dust generated inside the mini-environment device 51 to the outside.

  The wafer is transported while being stored in the cleaning container 12. At this time, the wafer is shut off from the outside air by closing the lid of the cleaning container (FOUP), thereby preventing contamination. The transport of the clean container 12 may be performed by an automatic transport system such as a floor traveling AGV or an overhead traveling OHT, or may be performed manually. The cleaning container 12 containing the wafer as described above is moved between various processing apparatuses according to the manufacturing process, and is positioned and mounted on the stage of the load port 13. As a means for positioning, for example, a standard kinematic coupling is provided on the stage. Next, the stage is moved toward the door, and the door of the load port and the lid of the cleaning container are integrated. The stage can include a moving means that can move in a horizontal plane.

  Thereafter, the lid of the cleaning container is opened by slightly moving the cleaning container in a direction to open the lid of the cleaning container while the door and the lid are fixed together. That is, even if the cleaning container is retracted by the stage moving means while the door is stationary, the cleaning container may be horizontally moved or rocked by the door moving means in the stationary state.

  Further, the integrated lid and door are moved downward by a door elevating means 54 provided at the lower part of the door, and are housed in a cover which covers four sides of the elevating means. The wafer is taken out of the open cleaning container 12 and transferred to the processing device 16 for processing. As a means for moving, a known method such as a transporter such as a scalar robot is used.

  In the mini-environment device 51 according to the present embodiment, the clean airflow is supplied downward from above. On the other hand, the cleaning container 12 is placed on the load port 13 located at a depressed position. Therefore, it is necessary to guide the clean airflow in the mini-environment chamber 51-1 from the opening of the clean container into the clean container 12. The flow regulating member 52 according to the second embodiment of the present invention has an inclined plate 53 that is obliquely inclined to guide the airflow to the cleaning container 12. In order to guide the clean airflow in the mini-environment chamber 51-1 to the clean container 12, it is desirable that the inclined plate 53 be disposed near the opening. As a result, the clean gas can be sent into the entire area of the clean container 12, and the stagnation of the atmosphere in the clean container can be prevented.

  However, disposing the rectifying member 52 in front of the opening hinders the operation of the transfer device 14 that takes out the wafer from the cleaning container 12. Therefore, it is desirable that the rectifying member 52 be configured to be able to vertically move up and down by the driving means 53 below. Alternatively, although not shown, the transfer device 14 may be configured to swing so as to avoid the movement line of the transfer arm of the transfer device 14. When the lifting operation can be performed, it is preferable that the rectifying member 52 moved downward is stored in a cover that covers all sides, as in the case of storing the door described above.

(Exhaust fan)
Here, in order to obtain even higher cleanliness, the exhaust port can be provided in any of the door elevating / lowering means 54 serving as a dust generation source, the driving means 55 of the rectifying member 52, or the transporter 14. . Since the pressure in the mini-environment chamber 51-1 is kept high by the cleaning means, a flow of the internal atmosphere toward the exhaust port is generated. Therefore, the internal atmosphere is discharged to the outside together with the dust. In addition, by providing a fan at the exhaust port, dust can be forcibly exhausted through a cover that covers the elevating means 54 and the like.

  By providing the exhaust fan below the covers of the elevating means 54 and the driving means 55, dust generated by mechanical volatilization and volatilization of organic substances for lubrication can be collected and discharged. Further, when the fan is provided in this manner, the exhaust gas from the clean container can be collected.

  FIGS. 7A and 7B show an embodiment in which an exhaust fan is provided below the boundary door of the mini-environment chamber 51-1. In the drawing, reference numeral 80 denotes a first embodiment of a boundary portion door, and reference numeral 90 denotes a lid of a cleaning container. A gas inlet 81 is provided above the boundary door 80, and an exhaust fan 83 is provided below the column. The atmosphere or the clean gas sucked from the gas suction port 81 passes through the cavity 82 inside the column, and is discharged by the exhaust fan 83. Since the boundary door 80 and the lid 90 are provided in the lower part near the clean container 12, the atmosphere near the lower part of the clean container is sucked from the suction port 83. Therefore, it has the effect of promoting the replacement of the atmosphere of the cleaning container. FIG. 7B is a perspective view illustrating a boundary portion door 85 according to the second embodiment. In the second embodiment, a plurality of suction ports 86 are provided, and gas sucked from each suction port 86 is discharged from a discharge port provided with a discharge fan (not shown) through an exhaust hole 87 and an exhaust pipe 88. You.

  8 and 9 are perspective views of the mini-environment device showing the movement of the transporter 14 according to the embodiment shown in FIG. The arrows shown in FIG. 8 indicate the directions in which the transporter 14 can operate. As shown in FIG. 8, the transfer device 14 can move up and down, and the transfer arm 14-1 and the joint arm 14-2 can each be rotated 360 degrees in the horizontal direction. Therefore, the wafer can be lifted by the transfer arm 14-1 and transferred to a desired position. FIG. 9 shows the position of the arm of the transfer device 14 when the wafer is taken out from the cleaning container 12. The transfer arm 14-1 of the transfer device 14 takes out the wafer from the cleaning container 12 through the opening of the rectifying member 52.

(Embodiment of rectifying member)
FIGS. 10A and 10B show a rectifying member according to another embodiment of the present invention. The rectifying member 60 according to the second embodiment shown in FIG. 10A is the same as the rectifying member 52 of the second embodiment shown in FIG. is there. The rectifying member 60 according to the third embodiment guides clean gas from the oblique guide member 61 through the horizontal guide portion plate 62 into the cleansing container 12 (like the oblique guide plate 61 and the horizontal guide plate 62, the air flow is reduced). A member that guides the inside of the cleaning container while guiding in the oblique direction is referred to as a “diagonal guide member. In addition, the diagonal guide member may include only the diagonal guide plate 61.) The rectifying member 62 has an opening frame 63 through which the transfer arm 14-1 of the transfer device 14 passes. A diagonal guide plate 61, a horizontal guide plate 62, and a support column 64 that supports the opening frame 63 are provided below the opening frame 63. As shown by the arrows in the figure, the descending clean atmosphere is guided in the horizontal direction into the cleansing container 12.

  The support column 64 is driven up and down by a driving device (not shown), and the rectifying member 60 is raised and lowered. By lowering the rectifying member 60, the transfer arm 14-1 can pass through the rectifying member 60 and take out or store the wafer stored in the upper portion of the cleaning container 12. The wafer stored in the center of the cleaning container 12 is taken out or returned by the transfer arm 14-1 passing through the opening 65 of the opening frame 63.

  FIG. 10B shows a rectifying member 70 according to the third embodiment. The rectifying member 70 according to the third embodiment includes a vertically provided first guide plate 71, a V-shaped second guide plate 72, and an opening frame 73 (first guide plate). A member that guides the airflow obliquely and in the middle direction, such as the 71 and the second guide plate 72, and guides the airflow to the clean container is referred to as a “V-shaped guide member”. As shown by the arrow, the descending flow of the clean gas is collected obliquely and inward by the V-shaped second guide plate 72 and guided into the clean container 12. The first guide plate 71 may be provided obliquely at a predetermined angle, similarly to the oblique guide plate 61 of the second rectifying member 60. Thereby, more downdrafts can be guided into the cleaning container 12.

  FIGS. 11A and 11B show the flow of the clean atmosphere guided into the cleaning container by the guide plate. FIG. 11A shows the clean atmosphere guided by the oblique guide plate 61 by arrows. As shown by the arrows, the clean atmosphere descending from above is guided toward the clean container 12 by the oblique guide plate 61, and then partly guided inside and the rest flows downward.

  The V-shaped guide plate 81 shown in FIG. 11B is inclined toward the cleaning container 12. Thereby, as shown by the arrow in the figure, the descending clean atmosphere is collected at the center along the V-shaped guide plate 81 and then guided toward the clean container 12. Therefore, the flow of the clean atmosphere becomes stronger and is guided toward the inside of the clean container 12.

  Since the shape of the wafer in the cleaning container is a disk, the wafer is placed protruding forward (toward the transfer device) on a plane. For this reason, the airflow flowing from the center in the width direction of the clean container reaches the inside of the container. Therefore, the V-shaped current plate is more effective in flowing air into the cleaning container for wafers than when a flat current plate is used. On the other hand, a flat rectifying plate is sufficient for the flow of the clean gas into the clean container storing the square substrate or the like.

(Other embodiments)
6 to 9, the embodiment in which the current plate is provided in the exhaust type mini-environment device has been described. However, it is also possible to provide the circulation type mini environment device with the current plate. FIG. 12 shows a side view of a state in which the inside of the thin plate manufacturing system 100 including the circulation type mini-environment device 91 provided with the current plate is visible. 6 is different from the manufacturing system of FIG. 6 in that a first partition plate 92 having a large number of through holes for generating laminar flow, a second partition plate 93 that does not allow gas to pass through, and a circulation path 24 of the internal gas are provided. The point is to prepare. Thus, the flow of the clean gas in the mini-environment chamber 91-1 can be made laminar, and the rectifier plate 52 can replace the atmosphere of the clean container 12 with the clean gas at high speed.

(Shape and arrangement of guide members)
Next, the relationship between the shape and arrangement of the guide member of the rectifying member will be described. The applicant of the present invention has determined whether the provision of the rectifying member is effective in quickly replacing the atmosphere of the cleaning container 12 and, if so, guiding the cleaning atmosphere into the cleaning container efficiently. In order to search for the shape and arrangement of members, various experiments and analysis based on simulations based on the experimental results were performed.

  13 to 15 show the shapes of various guide members used in the experiment and the simulation. Each guide member shown in FIGS. 13 to 15 will be described according to each experiment or simulation in which the guide member is used.

(About the analysis result of the air volume at the opening)
First, the results of measuring the wind velocity at the opening (entrance) of the cleaning container will be described with reference to FIGS. 16 to 19, using measured values and analysis results obtained by simulation. In the following simulation analysis, version 2.1.10 of the product name “Airpak”, which is a software manufactured by FLUENT, which is commercially available as airflow analysis software, was used.

  First, the results of the simulation analysis will be described with reference to FIGS. 16A to 18, FIG. 16A shows an analysis model, and FIG. 16B shows an FFU air volume of 0.3 m of the clean gas blown downward from the cleaning means provided on the ceiling of the mini-environment device. / Sec shows the analysis result of the air volume at the opening of the cleaning container, and FIG. 9C shows the same analysis result when the FFU air volume is set to 0.5 m / sec.

  FIG. 16 is a diagram illustrating an analysis model and a flow rate analysis result of an opening when no guide member is used. In the analytical model with an air flow of 0.3 m / sec shown in FIG. 16B, gas hardly flows into the cleansing container, and in the case of the analytical model with an air flow of 0.5 m / sec shown in FIG. It can be seen that only a small amount of gas flows into the upper part of the opening.

  FIG. 17 is a diagram illustrating an analysis result when two oblique guide members 110 and 111 are used. FIG. 17A shows an analysis model, and FIG. 17B shows an analysis result of the air volume at the opening. As the guide member used in this analysis, a guide member having a shape shown in FIGS. 13A, 13B, and 13C is used as the upper guide member 110, and a guide member shown in FIG. The guide members shown in d), (e) and (f) are used. (A) and (d), (b) and (e), (c) and (f) of FIG. 13 respectively show a front view, a left side view, and a perspective view of each guide member.

  The analysis was performed assuming that the upper oblique guiding member 110 was disposed at the height of the 25th wafer storage position, and the lower oblique guiding member 111 was installed at the 17th height. As can be seen from the analysis result shown in FIG. 17 (b), when the oblique guiding member is used, gas flows into the upper and middle stages of the opening of the cleansing container even in the analysis model with a flow rate of 0.3 m / sec. It can be seen that it flows out from below. In the analysis model with an air volume of 0.5 m / sec shown in FIG. 17C, it can be seen that gas flows into the clean container at a considerably high air volume.

  FIG. 18 is a diagram showing an analysis result when a V-shaped guiding member is used. FIG. 18A shows an analysis model using one V-shaped guiding member 120. As the V-shaped guiding member, an analysis was performed on a case where a guiding member having a shape shown in FIGS. 15D, 15E, and 15F was used and arranged at the height of the 25th wafer storage position. . FIGS. 18B and 18C are diagrams showing the analysis results when the FFU air volume is 0.3 m / sec and when the air volume is 0.5 m / sec, respectively. As can be seen from the analysis result of FIG. 18B, the gas has flowed into the cleansing container even when the air flow rate is 0.3 m / sec when only one V-shaped guiding member 120 is used. Can be confirmed. In the analysis model with an air volume of 0.5 m / sec shown in FIG. 18C, it can be seen that a larger air volume is flowing effectively.

  Actual measurement was performed using the same apparatus as the analysis model (FIGS. 16A to 18A) used in the above analysis. As shown in FIG. 19A, the measured positions are nine positions 95 obtained by dividing the opening (inlet) of the cleaning container into three parts vertically and horizontally.

  The graph of FIG. 19B shows the results of the analysis of the air volume at the opening and the measured values at nine measured positions 95 at the opening of the cleansing container. As can be seen from this graph, the measured value and the analysis result show a substantially regular correlation, and the analysis value appears as a proportional relationship of about 70% of the measured value. It can be seen that is possible.

(Airflow observation experiment and analysis results)
Next, the relationship between the distance between the first partition plate and the second partition plate and the change in the flow of gas in the mini-environment chamber, and the effect of the diagonal guide member and the V-shaped guide member for guiding the gas into the clean container. Will be described based on the results of an airflow observation experiment and an airflow analysis simulation.

  FIG. 20A is a diagram schematically illustrating the device used for the experiment and the device model used for the analysis, and FIG. 20B shows the observation point positions a to i inside the clean container for the experiment and the analysis. It is a side view of a cleaning container. In the drawing, 130 indicates a guide member, 131 indicates an exhaust fan provided near the cleaning container, 132 indicates a first partition plate, and 133 indicates a second partition plate. The first partition plate 132 has an opening ratio of 20%, and the FFU air volume of the cleaning means is exhausted at a wind speed of 0.5 m / sec, and the ducts at both ends are exhausted at a wind speed of 5.1 m / sec (the FFU supply amount and the exhaust flow rate). Were the same).

(About the analysis of the spacing of the partition)
FIG. 21A shows an airflow analysis result of the mini-environment device when the distance between the first partition plate 132 and the second partition plate 133 is set to 100 mm, and FIG. The results of the gas flow analysis when performing the above are shown. It can be seen that it is preferable that the gas flow is smoother and the interval is wider in FIG. As a result of various analyses, the distance between the first partition plate 132 and the second partition plate is desirably 150 mm or more, and depends on the FFU supply amount and the wind speed, but the range of 150 mm to 250 mm is effective. , Especially around 200 mm was found to be most effective.

(About the results of airflow observation experiments)
Next, using the apparatus shown in FIG. 20 (a), the FFU air flow rate was set to 0.5 m / sec, the opening ratio of the first partition plate was set to 20%, and when there was no guide plate, guide plates were provided in two upper and lower stages. In the case where one V-shaped guide plate was provided, an observation experiment was performed while changing the storage state of the wafer. As the rectifying plate, the oblique rectifying plate has a shape shown in FIGS. 15A, 15B, and 15C in both upper and lower stages, and the V-shaped rectifying plate has the shapes shown in FIGS. The shape shown in f) was used. The upper oblique guiding member is arranged at the height of the 25th wafer storage position, the lower oblique guiding member is installed at the 17th height, and the V-shaped guiding member is at the 17th height. installed. The observation experiment was performed for each of cases where 0, 15, and 25 wafers were stored in a clean container.

  FIG. 28 is a table showing the results of the observation experiment. A to i in the table indicate the positions of the matrix obtained by equally dividing the inside of the cleaning device shown in FIG. The state of substitution at each position is indicated by ○ △ ×. ○ indicates that the substitution is sufficient, Δ indicates that the substitution is almost completed, and X indicates that the substitution is not performed.

  As a result of the observation experiment, in the case where zero wafers were stored in the clean container, the gas in the clean container was soared from the top to the bottom, and tended to hardly flow to the upper stage. Nevertheless, it can be seen that the V-shaped guide is relatively effective. Even when 25 wafers are stored, the gas tends to hardly flow as a whole, but the effect of the V-shaped guiding member was also found to be excellent here. In the case of 15 sheets in the lower stuffing, the gas soars in the upper space and tends to be hard to flow in the lower tier, and it is understood that the gas does not flow in the regions b, c, h, and i even if the V-shaped guiding member is used. Was. With the upper 15 sheets, the wafer acts as a guide member and easily flows to the upper stage. In particular, it can be seen that the V-shaped guiding member is effective.

(About airflow analysis results based on simulation)
Next, an analysis result by a simulation will be described. FIG. 22 shows an analysis result of a gas flow in a state where no wafer is stored in the cleaning container 12 capable of storing 25 wafers. (A) shows an analysis result when neither the guide member nor the exhaust fan is provided, and (b) shows an analysis result when the exhaust fan 131 and two V-shaped guide members 135 and 136 are used. FIG. As the two V-shaped guiding members 135 and 136, guiding members having the shapes shown in FIGS. 14A, 14B and 14C are used in the upper row, and FIGS. 13D and 13E are shown in the lower row. The analysis was performed assuming that the guide member having the shape shown in FIG. The upper V-shaped guiding member 135 is located at the height of the 25th wafer storage position, and the lower guiding member 136 is located at the 17th height. As can be seen from FIG. 7A, when there is no guide member and no exhaust fan, it is understood that almost no gas flows into the inside of the cleansing container 12. On the other hand, when the guide members 135 and 135 are provided, a large amount of gas flows in, which indicates that the guide members are effective.

  FIG. 23 is a diagram illustrating an analysis result of the effect depending on the presence or absence of the exhaust fan. The model of the analysis device is shown in FIG. In this analysis, five wafers are stored in the cleaning container 12 at equal intervals, and the analysis is performed using a model using the oblique guiding member 130. 13 (a), 13 (b), and 13 (c) are used as the oblique guiding member 130, and the analysis results are based on a model in which the lowest part of the guiding member is at the height of the 25th wafer. . As can be seen from the analysis results of FIGS. 23A and 23B, it is understood that the use of the exhaust fan 131 increases the inflow amount, though slightly. In addition, the flow of the fluid becomes faster.

  FIG. 24 analyzes the effect of the oblique guiding member 134 in a state in which 15 wafers are divided into ten upper and five lower wafers. FIG. 24A shows an analysis result when the wafer is arranged at the 17th stage. The diagonal guiding member 134 is analyzed using the shapes shown in FIGS. 13 (d), (e) and (f). FIG. 24B shows an analysis result when the oblique guide member 134 similar to FIG. 24A is at the same height but closer to the cleaning container 12. In FIG. 24 (c), in addition to the state of FIG. 24 (a), a diagonal guiding member 130 having the shape shown in FIGS. 17 (a), (b) and (c) is installed at the height of the 25th step. The analysis result in the case is shown. As can be seen from a comparison between FIGS. 24A and 24B, it is clear that it is better to bring the oblique guiding member 134 closer. FIG. 24C shows that the addition of the oblique guiding member 130 can more effectively guide the downdraft into the cleansing container 12.

  FIG. 25 is a diagram illustrating the results of analysis using a model in which V-shaped guide members 135 and 136 are installed in two stages, in a case where 15 wafers are stored in a divided manner and in a case where the wafers are stored collectively on the upper side. FIG. 20D shows a model of the analyzer. As the two V-shaped guiding members 135 and 136, V-shaped guiding members having the shapes shown in FIGS. 14A, 14B and 14C are used in the upper row, and the lower row in FIG. The analysis was performed assuming that a V-shaped guiding member having the shape shown in (e) and (f) was used. The upper guide member 135 is arranged at the height of the 25th wafer storage position, and the lower guide member 136 is installed at the 17th height. In the case where two V-shaped guiding members 135 and 136 are used, gas can be effectively guided into the cleansing container in both cases of FIGS. 25 (a) and 25 (b).

  FIG. 26 shows an analysis result of the oblique guide member 134 and the V-shaped guide members 135 and 136 installed in two stages when 15 wafers are packed in the lower part. It can be seen that the gas flows evenly into each wafer when the V-shaped guiding member shown in FIG. 13B is used, as compared with the case where the oblique guiding member 134 shown in FIG.

FIG. 27 is a diagram illustrating an analysis result of an influence of a difference in the displacement of the exhaust fan when 25 wafers are stored in the cleaning container 12. FIG. 27A shows the analysis result of the exhaust fan with the displacement of 0.1 m / min, and FIG. 27B shows the analysis result of the displacement of 0.4 m ³ / min. As can be seen from the figure, the amount of gas flowing into the cleansing container is larger at a displacement of 0.1 m / min, though slightly.

  FIG. 29 shows a table summarizing the results of the simulation analysis. In the table, as in the case of FIG. 28, a to i show the positions of the matrix obtained by equally dividing the inside of the cleaning device shown in FIG. Shown by x. ○ indicates that the substitution is sufficient, Δ indicates that the substitution is almost completed, and X indicates that the substitution is not performed.

  In the simulation, the number of wafers stored in the cleaning container is analyzed as 0, 25, and 15 wafers. In the case of storing 15 sheets, the simulation is divided into a case where 15 sheets are packed in the lower side, a case where 15 sheets are packed in the upper side, and a case where 10 sheets are stored in the top and 5 sheets are stored in the bottom. did. Furthermore, the effectiveness of an exhaust fan is analyzed in a case where five wafers are equally divided and stored in a cleaning container and a diagonal guiding member is used. In addition, in a case where 25 wafers are stored, the influence of the exhaust amount of the exhaust fan is also analyzed.

  These simulation results show results almost similar to the experimental results, indicating that the simulation analysis is reliable. In the case of 0 sheets and 25 sheets, it indicates that it is better that the flow into the clean container (FOUP) is small, and in the case of the bottom 15 sheets, the gas soars in the upper space as in the observation experiment, and This indicates that it is difficult to flow, and that the top 15 sheets are easy to flow to the upper stage. Also, it is understood that the larger the number of current plates, the better, and the better the position of the current plates near the FOUP. Furthermore, analysis by simulation shows that it is better to provide an exhaust fan, but it is better not to have too much exhaust.

  The present inventors further conducted analysis by experiments and simulations, and found that the rectifying member provided with the guide member is effective in replacing the atmosphere of the cleaning container, and that the V-shaped guide member is more effective than the oblique guide member. I was convinced that it was effective. In addition, it has been found that it is desirable to install two oblique guiding members because only one oblique guiding member has little effect. Furthermore, in the case of a V-shaped guide member, the position of the guide member is effective at a position of 17/26 to 22/26 from the bottom of the opening, particularly in the case of a 25-sheet container. Is most effectively installed at the height of the twentieth wafer. Further, in the case of the oblique guiding member, the upper guiding member is arranged at a position 22/26 to 25/26 from the bottom of the opening, and the lower guiding member is set to 15/26 to 21/26 from the bottom. It has been found that it is effective to install the device at the position. In particular, in the case of 25 wafers, it has been found that it is most efficient to arrange the upper guiding member at the position of the 25th stage and the lower guiding member at the 17th stage from the bottom.

  An atmosphere can be introduced under almost all circumstances when using a V-shaped guiding member. However, even when the V-shaped guiding member is used, the replacement of the locations of the regions b, c, h, and i is insufficient when 15 sheets are stored on the lower side. Therefore, in the case of 15 sheets, it is desirable to pack them on the upper side of the cleaning container.

Further, it has been found that the wider the distance between the first partition plate and the second partition plate is, the more effective it is. The range between 150 mm and 250 mm is desirable, and the most effective is about 200 mm. In addition, although an exhaust fan may be provided, it was found that it is not good that the exhaust amount is too large. The exhaust amount of the exhaust fan is desirably between 0.05 and 0.15, particularly about 0.1 m ³ / min.

  Further, in the various guide members shown in FIGS. 13 to 15, since the shape has to be specified as an experiment and an analysis model, the numerical values of the size combination angle and the installation angle of each guide member are specified. The length, size (size), aspect ratio, and angle of each part can be freely changed according to various conditions such as the size of the mini-environment device and the FFU air volume. For example, the intersection angle between two oblique guide plates shown as an angle of 150 ° in FIGS. 13B and 13E and as 137 ° in FIG. 15B can be freely adjusted, and is 90 ° to 90 °. It is desirable to adjust between 180 °.

  Also, the lower plate and the installation angle (the angle with respect to the horizontal line) can be freely adjusted, and it is particularly preferable to adjust the angle between 0 and 60 °. Further, the angle of the intersection of the two plates forming the V-shape of the V-shaped guide member can be freely adjusted. In particular, it is desirable that the inner angles of the two plates forming the V-shape cross each other within the range of 90 ° to 170 °. Also, the mounting angle of the V-shaped guide member with respect to the horizontal line, which is shown as an angle of 30 ° in FIGS. 15B and 15E, can be freely adjusted, and particularly, it is desirable to adjust the angle in the range of 0 ° to 60 °. .

It is a side view which shows the conventional thin plate-shaped object manufacturing system. 1 is a partially cutaway perspective view showing an embodiment of the mini-environment device of the present invention. It is a perspective view showing one embodiment of the sheet-like thing manufacturing system of the present invention. 1 is a partially cutaway perspective view showing an embodiment of the mini-environment device of the present invention. FIG. 4 is a partially cutaway perspective view showing the mini-environment device of the present invention provided with transporters having different shapes. FIG. 1 is a side view showing a thin plate manufacturing system using a mini-environment device having a rectifying member according to an embodiment of the present invention. It is a perspective view which shows the Example in which the exhaust fan was provided in the lower part of the boundary part door of the mini-environment room. FIG. 7 is a perspective view of the mini-environment device showing movement of the transporter 14 according to the embodiment shown in FIG. 6. It is a perspective view of the mini-environment device which shows movement of the arm of the conveyance machine which takes out the thin plate member from the cleaning device by the conveyance arm of the conveyance machine. It is a perspective view showing the rectification member concerning other embodiments of the present invention. It is a figure which shows the flow of the clean atmosphere induced | guided | derived in a clean container by a guide member. It is a side view showing the state where the inside of the sheet-like thing manufacturing system concerning other embodiments of the present invention can be seen. It is a figure showing the shape of the diagonal guidance member used for simulation. (A) and (d) are front views, (b) and (e) are left side views, and (c) and (f) are perspective views. It is a figure showing the shape of the V-shaped guidance member used for simulation. (A) and (d) are front views, (b) and (e) are left side views, and (c) and (f) are perspective views. It is a figure which shows the shape of the oblique guide member and the V-shaped guide member used for the experiment. (A) and (d) are front views, (b) and (e) are left side views, and (c) and (f) are perspective views. It is a figure which shows the analysis model of the wind speed in the opening part of a clean container, and the observation result. It is a figure which shows the analysis model of the wind speed in the opening part of a clean container, and the observation result. It is a figure which shows the analysis model of the wind speed in the opening part of a clean container, and the observation result. (A) It is a figure which shows the 9 observation area | region which divided the opening part of the cleansing container into three vertically and horizontally, and (b) is a graph which shows an analysis result and actual measurement. FIG. 20A is a diagram schematically illustrating the device used for the experiment and the device model used for the analysis, and FIG. 20B is a diagram illustrating the position of the observation point of the experiment and the analysis inside the clean container. It is a side view, (c) and (d) are perspective views which show the model of an analysis device. It is a figure showing the analysis result which simulated the interval of the partition. FIG. 9 is a diagram showing an analysis result when no wafer is stored. It is a figure showing an analysis result by existence of an exhaust fan. It is a figure showing the analysis result based on the difference of the guidance member at the time of dividing and storing 15 wafers. FIG. 10 is a diagram illustrating an analysis result of a difference between a case where 15 wafers are stored in a divided manner and a case where 15 wafers are housed in an upper position. It is a figure showing the analysis result based on the difference of the guidance member at the time of storing 15 sheets of wafers from the bottom. It is a figure showing the result of having analyzed the influence by the difference of the exhaust air volume of an exhaust fan. 4 is a chart showing the results of observation experiments. 9 is a chart showing analysis results based on simulation.

Explanation of reference numerals

10, 20, 50, 100 Thin plate manufacturing system 11, 21, 31, 41, 51, 91 Mini-environment device 11-1, 21-1, 51-1, 91-1 Mini-environment room 12 FOUP 13 Load Ports 14, 42 Carrier 15 Cleaning means (fan filter unit)
Reference Signs List 16 processing chamber 17 valve element 22, 92, 131 first partition plate
23, 93, 132 Second partition plate 24 Circulation path 32 Gas introduction rectifying member 25 Internal environment measuring instrument 26 Clean gas (harmless or low harmful gas) supply mechanism 27 Inlet 32, 52, 60, 70 Rectifying member 53, 80, 110, 111, 130, 134 Oblique guide member (guide plate)
54 Door lifting / lowering means 55 Straightening member drive means 80 Door 90 Cleaning member lid 81, 120, 135, 136 V-shaped guide member (guide plate)

Claims (23)

A cleaning container accommodating the thin plate-like material in an airtight manner is placed thereon, a load port for opening / closing or detaching a lid of the clean container, and the transfer arm takes out the thin plate-like material from the clean container by a transfer arm. A mini-environment device that includes a transfer device that is transferred to a processing chamber for processing an object, and a cleaning unit that removes dust in the gas when passing the gas, and maintains the inside in a clean environment.
A circulating means having a circulation path for collecting a harmless or low harmful gas filled in the mini-environment apparatus and circulating the gas to the cleaning means.   The recovery port of the harmless or low harmful gas of the circulation path is provided below a first partition plate having a plurality of through holes provided below the transfer arm of the transfer device, and below the first partition plate. The mini-environment device according to claim 1, wherein the mini-environment device is provided between the harmless or low harmful gas and a second partition plate provided therethrough.   The mini-environment device according to claim 2, wherein the first partition plate and the second partition plate are provided at an interval of 150 mm to 250 mm.   Further, the harmless or low harmful gas supply device, an oximeter for measuring the oxygen concentration inside, and the supply amount of the harmless or low harmful gas based on the concentration information output from the oximeter are controlled. The mini-environment device according to any one of claims 1 to 3, further comprising control means.   5. A hygrometer for measuring internal humidity, and control means for controlling a supply amount of said harmless or low harmful gas based on humidity information outputted from said hygrometer, wherein The mini-environment device according to any one of the above.   A rectifying member for guiding the harmless or low harmful gas circulating in the inside of the cleaning container is provided on a front surface of an opening to the cleaning container. The mini-environment device according to item 1.   The said harmless or low harmful gas is any one kind selected from the group consisting of inert gas, dry air, low oxygen air, and dry low oxygen air, The claim 1 characterized by the above-mentioned. A mini-environment device according to claim 1. A cleaning port for holding the thin plate-like material in an airtight manner, and a load port capable of opening and closing or detaching a lid of the cleaning container, and a transfer arm, and the transfer arm is used to remove the thin plate from the clean container. A transfer device for taking out an object and transferring it to a processing chamber for processing the thin plate-like object, and cleaning means for removing dust in the gas by passing a gas to be sent into the inside, and maintaining the inside in a clean environment state A mini-environment device for preventing contamination of the thin plate-like material.
A mini-environment device provided with a rectifying member for guiding a cleaning gas supplied through the cleaning means from the opening of the cleaning container into the interior of the cleaning container, in front of the opening of the cleaning container. .   The mini-environment device according to claim 8, wherein the straightening member includes an oblique guiding member that guides the clean gas into the clean container by blocking a flow of the clean gas at a predetermined angle.   The mini-environment device according to claim 9, wherein the rectifying member has the oblique guiding members arranged in a plurality of stages vertically.   The rectifying member includes two upper and lower guide members, and the lower skew guide member has a height in the range of 15/26 to 21/26 of the vertical width of the opening (vertical length of the opening). The mini-environment device according to claim 10, wherein the rectifying member is installed at a height within a range of 22/26 to 25/26.   9. The mini-environment device according to claim 8, wherein the rectifying member includes a V-shaped guiding member having a concave center for collecting the descending clean gas at the center and guiding the clean gas into the cleansing container. 10.   The mini-environment device according to claim 12, wherein the V-shaped guide member is inclined at a predetermined angle toward the cleaning container.   14. The mini-environment according to claim 12, wherein the V-shaped guide member is arranged at a position 17/26 to 22/26 from below the opening. apparatus.   The mini-environment device according to any one of claims 8 to 14, further comprising driving means for moving the rectifying member from a predetermined position of the opening.   The mini-environment device according to claim 15, wherein the driving unit moves the rectifying member downward.   In order to maintain a clean environment in the mini-environment device, the drive means is covered with a cover, and the clean gas supplied by the clean means is taken into the cover. The mini-environment device according to any one of claims 8 to 16, wherein the device is discharged to a circulation path.   Further, a circulating means for circulating the clean gas by collecting the clean gas supplied from the clean means, sending the clean gas to the clean means, and supplying the collected clean gas again through the clean means is provided. The mini-environment device according to any one of claims 8 to 17, characterized in that:   Further, a first partition plate having a plurality of through holes provided below the transfer arm of the transfer device with the recovery port for the clean gas, and the harmless provided below the first partition plate. 19. The mini-environment device according to claim 18, wherein the mini-environment device is provided between the second partition plate and a second partition plate that does not allow low harmful gas to pass through.   20. The mini-environment device according to claim 19, wherein the first partition plate and the second partition plate are provided at an interval of 150 mm to 250 mm.   A thin plate manufacturing system comprising the mini-environment device according to any one of claims 1 to 20.   An atmosphere replacement method for a clean container, wherein a clean gas in a mini-environment device is sent from an opening of a clean container placed on a load port, and the atmosphere in the clean container is replaced with the clean gas. The flow of the clean gas is guided into the clean container by obliquely blocking a downward flow of the clean gas in the mini-environment device toward an opening of the clean container. 24. The method for replacing an atmosphere in a clean container according to 23.

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