JP4332004B2 - ブラストマスクを用いた加工方法およびウェハ支持部材 - Google Patents
ブラストマスクを用いた加工方法およびウェハ支持部材 Download PDFInfo
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- JP4332004B2 JP4332004B2 JP2003334425A JP2003334425A JP4332004B2 JP 4332004 B2 JP4332004 B2 JP 4332004B2 JP 2003334425 A JP2003334425 A JP 2003334425A JP 2003334425 A JP2003334425 A JP 2003334425A JP 4332004 B2 JP4332004 B2 JP 4332004B2
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- 238000003672 processing method Methods 0.000 title claims description 11
- 239000000919 ceramic Substances 0.000 claims description 29
- -1 ester compound Chemical class 0.000 claims description 23
- 239000012530 fluid Substances 0.000 claims description 21
- 229920002678 cellulose Polymers 0.000 claims description 15
- 239000001913 cellulose Substances 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 12
- 230000003746 surface roughness Effects 0.000 claims description 9
- 238000007664 blowing Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 81
- 238000005422 blasting Methods 0.000 description 64
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 41
- 239000006061 abrasive grain Substances 0.000 description 40
- 230000005611 electricity Effects 0.000 description 21
- 230000003068 static effect Effects 0.000 description 20
- 238000000034 method Methods 0.000 description 13
- 239000011261 inert gas Substances 0.000 description 11
- 239000007789 gas Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 239000000523 sample Substances 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229920000896 Ethulose Polymers 0.000 description 6
- 239000001859 Ethyl hydroxyethyl cellulose Substances 0.000 description 6
- 235000019326 ethyl hydroxyethyl cellulose Nutrition 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000003754 machining Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 238000010183 spectrum analysis Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 230000003796 beauty Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 235000013372 meat Nutrition 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000000790 scattering method Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- 238000005270 abrasive blasting Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000538 analytical sample Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005421 electrostatic potential Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- UACSZOWTRIJIFU-UHFFFAOYSA-N hydroxymethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCO UACSZOWTRIJIFU-UHFFFAOYSA-N 0.000 description 1
- GJIDOLBZYSCZRX-UHFFFAOYSA-N hydroxymethyl prop-2-enoate Chemical compound OCOC(=O)C=C GJIDOLBZYSCZRX-UHFFFAOYSA-N 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- 239000001866 hydroxypropyl methyl cellulose Substances 0.000 description 1
- 229920003088 hydroxypropyl methyl cellulose Polymers 0.000 description 1
- 235000010979 hydroxypropyl methyl cellulose Nutrition 0.000 description 1
- UFVKGYZPFZQRLF-UHFFFAOYSA-N hydroxypropyl methyl cellulose Chemical compound OC1C(O)C(OC)OC(CO)C1OC1C(O)C(O)C(OC2C(C(O)C(OC3C(C(O)C(O)C(CO)O3)O)C(CO)O2)O)C(CO)O1 UFVKGYZPFZQRLF-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 210000003437 trachea Anatomy 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
なお、本発明の加工方法は、上記ブラストマスクが、シート状体の一方の主面がセルロース誘導体を含む層からなり、他方の主面がエステル化合物を含む層からなることが好ましい。
2:層
2a:主面
3:層
3a:主面
4:凹部
5、14a、34a:凹部
8、32、86:被加工物
10、81:露出部
12:ウェハ支持部材
14、34:板状セラミック体
14b、34b:絶縁層
16、36:ガス導入口
18、20、38、40:給電端子
22、42:静電吸着用電極
24、44:抵抗発熱体電極
26、46:載置面
52:ブラスト加工室
54:ノズル
56:砥粒供給管
58:送気管
60:台車
62:砥粒回収管
66:砥粒
68:サイクロン集塵機装置
70:面
72:ゴルフクラブ
74:インパクト面
76:凹凸部
80:マスク
80b:接着面
82:保護フィルム
84:支持フィルム
W:ウェハ
Claims (9)
- 圧縮空気と砥粒との混合流体を噴射するノズルと、ブラストマスクを貼り付けた被加工物とを備え、上記混合流体を上記被加工物に吹き付けてブラスト加工し、上記圧縮空気の初期圧力がその後の圧力より小さいことを特徴とする加工方法。
- 上記初期圧力がその後の圧力の20〜70%であることを特徴とする請求項1に記載の加工方法。
- 上記被加工物がウェハ支持部材であることを特徴とする請求項1または2に記載の加工方法。
- 板状セラミックス体の一方の主面にウェハを載せる載置面を、上記板状セラミックス体の内部あるいは表面に形成されている電極を備えており、シート状体の一方の主面がセルロース誘導体を含む層からなり、他方の主面がエステル化合物を含む層からなるブラストマスクを使用して上記載置面を加工したことを特徴とするウェハ支持部材。
- 板状セラミックス体の一方の主面にウェハを載せる載置面を、上記板状セラミックス体の内部あるいは表面に形成されている電極を備えており、請求項1〜3の何れかに記載の加工方法で上記載置面を加工したことを特徴とするウェハ支持部材。
- 上記電極が静電吸着用電極であることを特徴とする請求項4または5に記載のウェハ支持部材。
- 上記電極が抵抗発熱体電極であることを特徴とする請求項4または5に記載のウェハ支持部材。
- 板状セラミックス体の一方の主面にウェハを載せる載置面を、上記板状セラミックス体の内部あるいは表面に形成されている電極を備えており、上記載置面に凹部が形成されており、該凹部の底面の表面粗さRmaxが5.5μm以下であることを特徴とするウェハ支持部材。
- 上記ブラストマスクは、シート状体の一方の主面がセルロース誘導体を含む層からなり、他方の主面がエステル化合物を含む層からなることを特徴とする請求項1に記載の加工方法。
Priority Applications (1)
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JP2003334425A JP4332004B2 (ja) | 2003-09-25 | 2003-09-25 | ブラストマスクを用いた加工方法およびウェハ支持部材 |
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---|---|---|---|
JP2003334425A JP4332004B2 (ja) | 2003-09-25 | 2003-09-25 | ブラストマスクを用いた加工方法およびウェハ支持部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005096040A JP2005096040A (ja) | 2005-04-14 |
JP4332004B2 true JP4332004B2 (ja) | 2009-09-16 |
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JP2003334425A Expired - Fee Related JP4332004B2 (ja) | 2003-09-25 | 2003-09-25 | ブラストマスクを用いた加工方法およびウェハ支持部材 |
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JP (1) | JP4332004B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2012103128A (ja) * | 2010-11-10 | 2012-05-31 | Fujitsu Ltd | コンタクトプローブ用プランジャの製造方法及びコンタクトプローブ用プランジャ |
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