TW534855B - Polishing material for dry blast processing - Google Patents

Polishing material for dry blast processing Download PDF

Info

Publication number
TW534855B
TW534855B TW090129787A TW90129787A TW534855B TW 534855 B TW534855 B TW 534855B TW 090129787 A TW090129787 A TW 090129787A TW 90129787 A TW90129787 A TW 90129787A TW 534855 B TW534855 B TW 534855B
Authority
TW
Taiwan
Prior art keywords
honing material
honing
particle diameter
average particle
inorganic particles
Prior art date
Application number
TW090129787A
Other languages
Chinese (zh)
Inventor
Takanobu Sakai
Katsuhiko Matsuo
Original Assignee
Maruo Calcium
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maruo Calcium filed Critical Maruo Calcium
Application granted granted Critical
Publication of TW534855B publication Critical patent/TW534855B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/04Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C11/00Selection of abrasive materials or additives for abrasive blasts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

To provide a polishing material which can effectively prevent troubles caused by water such as the coagulation or agglomeration of the polishing material, or the adhesion of the polishing material to an article to be polished, and can achieve high polishing efficiency and high processing accuracy. The polishing material is characterized by treating the surfaces of spherical inorganic particles with a water repellency-imparting substance.

Description

534855 A7 _B7_________ 五、發明說明(/ ) [發明之詳細說明] [發明所屬之技術領域] 本發明係關於一'種在乾式之精密噴砂加工所使用之採 球狀無機粒子的硏磨材,更詳細地說係關於一種不僅可有 效防止因水分所致之硏磨材的凝集、固結以及附著於被硏 磨物等之問題,且在硏磨效率與加工精度優異之硏磨材。 [習知技術] 噴砂加工係對被加工物之表面高速噴射磨削材粒子來 將被加工物表面磨削或將附著於表面之污染物加以去除, 於被加工物表面施加衝擊力來改良其表面特性的廣爲使用 之工業做法。近年來,此種做法已逐漸被使用在以往未曾 想到之數十//m微細程度之加工上。 例如,在形成電漿顯示面板(以下稱爲PDP)之隔壁的 方法中噴砂法亦屬有效的做法而被採用,部分以邁入實用 階段。於設有電極之玻璃基板上形成具有噴砂性之厚度 1mm以下的低熔點玻璃層,將該低熔點玻璃層以形成寬度 50〜1000 // m之微細的槽的方式磨削到玻璃基板或玻璃基板 上之電極的深度。此時,槽寬係對遮蔽膠帶之表面側噴射 硏磨材進行噴砂加工來磨削低熔點玻璃層、形成隔壁。此 隔膜在後續之製程受到燒成成爲無機質之玻璃隔壁。於此 隔壁之間的空間係設置螢光體等成爲PDP。 又,對於將複數之太陽電池元件做電氣串聯之太陽電 池的製造中,做爲各太陽電池元件之分離·集積之方法, 係嘗試對於以既定圖案形成有開口部之透明導電膜、光電 3 ^氏張尺度適闬由國國家標準(CNS)A4規格(210 x 297公釐) (請先閱讀背面之注意事項再填寫本頁)534855 A7 _B7_________ V. Description of the invention (/) [Detailed description of the invention] [Technical field to which the invention belongs] The present invention relates to a kind of honing material of spherical inorganic particles used in dry precision blast processing, and more In detail, it relates to a honing material which can not only effectively prevent the problem of agglomeration, consolidation, and adhesion of the honing material due to moisture, etc., but also has excellent honing efficiency and processing accuracy. [Known technology] Sand blasting is to blast the surface of the workpiece at high speed to grind the particles of the workpiece or to remove the pollutants attached to the surface, and apply an impact force to the surface of the workpiece to improve it. Widely used industrial practice for surface properties. In recent years, this method has been gradually used for processing at a fineness of several dozens / m that was not previously thought. For example, in the method of forming a partition wall of a plasma display panel (hereinafter referred to as a PDP), a sandblasting method is also an effective method and is adopted, in part to enter a practical stage. A low-melting glass layer having a thickness of 1 mm or less is formed on a glass substrate provided with an electrode, and the low-melting glass layer is ground to a glass substrate or glass so as to form a fine groove having a width of 50 to 1000 // m. The depth of the electrodes on the substrate. At this time, the groove width is made by sandblasting a honing material sprayed on the surface side of the masking tape to grind a low-melting glass layer to form a partition wall. The separator is fired into an inorganic glass partition in the subsequent process. The space between the partitions is provided with a phosphor or the like to form a PDP. In the manufacture of solar cells in which a plurality of solar cell elements are electrically connected in series, as a method of separating and integrating each solar cell element, an attempt is made to provide a transparent conductive film and a photovoltaic element with openings formed in a predetermined pattern. The Zhang scale is suitable for the national standard (CNS) A4 specification (210 x 297 mm) (Please read the precautions on the back before filling this page)

< T /¾. Γν n 1= - - n —1- 11 III I I 1 i I j 1- 1 I In n- I 534855 A7 ___B7______ 五、發明說明(1 ) 轉換層、內部電極等各種之導電膜上以氣流方式噴附做爲 硏磨材之微粒子粉體,將露出於開口部之導體膜加以刻劃 之噴砂法。同樣地,噴砂法也被嘗試在高密度組裝之多層 配線板之通孔加工、半導體電路元件之氧化被膜去除等之 用以獲得電氣連接之微細的磨削上。 在上述之PDP背面基板之隔壁形成或太陽電池等之電 極或半導體的氧化皮膜之去除上所使用之噴砂法,所噴射 之硏磨材會隨同磨削屑(磨削下之糊材或皮膜形成物)自磨 削部分排除,經由篩網等之分離製程來回收,於儲藏槽等 進行一次儲藏,然後再次使用於噴砂加工中。 做爲硏磨材粒子,依據目的已被提出各種組成之玻璃 珠、鋁氧粉、剛玉、陶瓷珠、不鏽鋼、銅等,現在仍使用 著。該等之粒子形狀以球形或接近球形者爲佳。 使用球形或接近球形之粒子做爲硏磨材的優點在於, 於硏磨材之製造過程中可輕易地去除粗大粒子,又於噴砂 加工中不會附著到被加工物上,流動性佳,且硏磨材之磨 損少。 惟,若在噴砂法中使用平均粒徑爲數十"m〜數//m之 無機硏磨材,例如即使硏磨材粒子之形狀極爲接近正球狀 ,仍會發生流動性變差、或裝置一度停止後想要再啓動時 自供給槽到噴嘴之硏磨材的運送迴路途中變得完全無法流 動的情況。於此種情況下,對堵塞之部分施加衝擊,雖硏 磨材有時會開始流動,但多數的情形則是必須將裝置加以 分解來排除掉裝置內所有的硏磨材之後加入部分新的硏磨 __ί_ — 本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) τ < l.i I .:i all 111 In 11 III 111 ·-· »1— 0 111 111 1 n n I I f —1 -I— i m It) —i ill- I · f請先閱讀背面之注音‘)事項再填寫本頁) 534855 A7 _______B7_______ 五、發明說明($ ) 材或全部改爲新的硏磨材,然後再啓動,所以成爲作業性 、生產性上顯著的障礙。尤其是對於具備複數之噴嘴(硏磨 材噴射部分)、組裝有硏磨材回收裝置的大型噴砂裝置而言 ,在硏磨材的更換上會耗費相當大的時間與人力。 上述情況的發生原因推測係即使施以靜電去除之對策 的裝置中也會發生硏磨材的堵塞,於是在噴砂加工中、或 是加工停止中微量水分發生經時性集中,結果硏磨材粒子 之各個接觸部或部分之微細的磨削屑與硏磨材粒子之間出 現液體交聯所致之故。 亦即,噴砂機器所進行之噴砂加工中,硏磨材自噴嘴 以高壓、高速噴射出來,在噴嘴前端部會因爲噴射而出現 低溫部分,此溫度差會導致噴嘴前端部出現水滴。而後, 當噴砂機器停止後,此機器內之水分時常會造成硏磨材之 凝集的情況。又,尤其在大型之噴砂裝置中,因在機器內 存在著硏磨材的凝集、固化,爲了將噴嘴前端部與機器內 之硏磨材再啓動則不得不暫時將硏磨材排出於系統外。此 種作業不僅造成生產效率之降低,當機器位於無塵室內的 情況此作業變得非常困難。又,也有文獻指出在噴砂機器 之噴嘴前端部所發生之水分會呈現硏磨材之黏合劑的作用 ,而發生在被磨削物表面附著硏磨材之例子。 另一方面,如PDP之隔壁形成般之槽深較槽寬.爲大之 磨削,由於硏磨材粒子爲球形或接近球形之形狀,當磨削 到達一定程度而控掘出槽,則硏磨材粒子在被硏磨物之槽 底部會彈回而衝擊到槽壁面,所以有難以讓隔壁(或是槽) 5 本纸張尺度適用中國S家標準(CNTS)A4規格(210 X 297公釐) ~ (請先閱讀背面之注意事項再填寫本頁) ·取--------訂—— -線一 534855 A7 ____B7_____ 五、發明說明(☆) ,之形狀維持一定(側蝕會變大)的問題。此問題雖可減弱硏 磨材之噴射壓力來獲得相當程度之改善,但相對地則需犧 牲掉硏磨速度。 再者,有關於硏磨材粒子之大小,由於硏磨材粒子愈 大則質量愈大,所以磨削速度相對地較大,但由於硏磨材 粒子之曲率變大所以難以進行微細的加工等,是以現狀上 係進行定性之選定。惟,原本硏磨材應該對應於被加工物 之形狀而成爲加工精度高且加工速度快之粒度構成。 如上所述,噴砂法所進行之微細加工,關於作業效率 之重要的要因之硏磨材的流動性、尤其是再啓動時之流動 性的確保,影響到加工精度與作業效率兩者的側蝕之解決 ,以及高精度之作業效率良好的硏磨材係必須的。 [發明所欲解決之課題] 本發明係鑒於上述實情,其課題在於提供一種硏磨材 ,可解決上述問題,尤其是在乾式方面可適用於PDP之隔 壁形成加工以及太陽電池之刻劃線的磨削等半導體之氧化. 被膜的去除等,在不損及被加工物底部表面之性質的前提 下進行高效率、高精度之磨削,且防止因水分所造成之硏 磨材粒子之凝集,例如噴砂機器停止至少一晝夜的時間後 仍可再啓動。 [用以解決課題之手段] 本發明者經努力硏究的結果,發現以賦予撥水性之物 質對球狀無機粒子進行表面處理,可提供一種可防止硏磨 材粒子之水分引起液體交聯現象所造成之凝集,例如噴砂 ___ 6_____ 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) 變 . 534855 — A7 -_____ Β7____ 五、發明說明($ ) 機器停止至少一晝夜後仍可再啓動之硏磨材,再者,相對 於硏磨材粒子添加直徑爲其粒子徑之十分之一的微粒子可 謀求流動性的改善,藉由控制磨削最小槽寬m)、硏磨材 之形狀、最大粒子徑、平均粒子徑等,可獲致在超精密加 工中所必須之可使用在半導體領域等的硏磨材,從而完成 了本發明。 亦即,本發明之內容係關於一種乾式噴砂加工用硏磨 材,其特徵在於,係以賦予撥水性之物質對球狀無機粒子 進行表面處理所得(申請專利範圍第1項)。 又,於本發明中,磨削一詞除了磨削以外尙包含其他 之磨除而使用。 做爲較佳之態樣,係在申請專利範圍第1項之硏磨材 中,將平均粒子徑爲球狀無機粒子之平均粒子徑之十分之 一以下的流動性改良劑對球狀無機粒子添加〇·01〜5重量%( 申請專利範圍第2項)。 做爲較佳之態樣,係在申請專利範圍第1或2項之硏 磨材中,讓球狀無機粒子滿足下述式(1)〜(3)(申旨靑專1利範圍 第3項)。 10^ 0.8C (1) 0.02C^B^0.5C (2) 50^C^ 1000 (3) 其中, A :硏磨材之最大粒子徑(//m) B :硏磨材之平均粒子徑(μπα) 7 ______ 本纸張尺度適用由國國家標準(CNS)A4規格(210 X 297公釐) (請先閒讀背面之注¾事項再填寫本頁) ----- 訂---------線一 534855 A7 ------ B7__ 五、發明說明(6 ) C :磨削或磨除之最小槽寬(//m) 做爲較佳之態樣,係在申請專利範圍第1〜3項任一項 之硏磨材中,使用於半導體之氧化被膜之去除上(申請專利 範圍第4項)。 做爲較佳之態樣’係在申請專利範圍第1〜3項任一項 之硏磨材中,使用於對PDP之背面基板上之肋材的形成上 (申請專利範圍第5項)。 做爲較佳之態樣,係在申請專利範圍第i〜3項任一項 之硏磨材中,使用於太陽電池元件之串聯用刻劃線的形成 上(申請專利範圍第6項)。 [發明之實施形態] 以下,詳細說明本發明。 本發明係關於一種在乾式噴砂加工用硏磨材,其特徵 在於,係以賦予撥水性之物質對球狀無機粒子進行表面處 理,耢此,可有效地防止因水分引起粒子間液體交聯現象 所造成之硏磨材的凝集、固結以及硏磨材附著於被加工物 ,可大幅提昇磨削效率與磨削精度。 做爲本發明所使用之球狀無機粒子,可舉出例如玻璃 珠、鋁氧粉、剛玉、陶瓷珠、不鏽鋼、銅等之球狀無機粒 子粉體。於本發明中,所謂的球狀係如下述式(4)所定義般 ’宇曰粒子投影面積相封於外接圓之面積率較佳在50%以上 、更佳在80%以下的情況。 8 本紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公釐) ---------------------訂--------- (請先閱讀背面之注意事項再填寫本頁) 534855 A7 _B7 ___ 五、發明說明(7 ) 粒子之投影面積 相對於外接圓之面積率(%户-X100 (4) 粒子投影面積之外接圓的面積 做爲本發明所使用之賦予撥水性的物質,只要係能賦 予撥水性之物質則無特別限定皆可使用。以具體的例子而 言,可舉出油烯酸、月桂酸、肉豆蔻酸、肉豆蔻酸異三癸 酯、棕櫚酸、辣木子油酸、硬脂酸、異硬脂酸等之脂肪酸 ;前述脂肪酸之醯胺與雙醯胺;硬脂醇等之高級醇或分支 高級醇;一元醇之高級脂肪酸酯、多元醇之高級脂肪酸酯 、褐煤蠟形式之非常長鏈的酯或其部分水解物等之脂肪酸 酯系潤滑劑;硬脂酸鋇、硬脂酸鈣、硬脂酸鋁、硬脂酸鋅 、硬脂酸鎂或其複合物等之金屬肥皂系潤滑劑;C16以上之 液體石蠟、微晶蠟、天然石蠟、合成石鱲、聚烯烴蠟以及 該等之部分氧化物、氟化物、氯化物等之脂肪族烴系潤滑 劑;矽油、大豆油、椰子油、棕櫚核油、亞麻仁油、菜籽 油、棉實油、桐油、篦麻子油、牛脂、三十碳院、含水羊 毛脂、硬化油等之油劑;HLB在9以下之界面活性劑之例 如N—醯基氨基酸鹽、烷基醚羧酸鹽、醯化肽等之羧酸鹽 :烷基磺酸鹽、烷基苯以及烷基萘磺酸鹽、磺化琥珀酸鹽 、α —烯烴磺酸鹽、N—醯基磺酸鹽等之磺酸鹽;硫酸化 油、院基硫酸鹽、院基酸硫酸鹽、院基稀丙基酸硫酸鹽、 烷基醯胺硫酸鹽等之硫酸酯鹽;烷基磷酸鹽、烷基醚磷酸 鹽、烷基烯丙基醚磷酸鹽等之磷酸酯鹽等之陰離子界面活 性劑;脂肪族氨鹽、脂肪族4級銨鹽、苄烷銨鹽、氯化苯 9 衣紙張尺度適用☆國國家標準(CNS)A4規格(210 X 297公度1 (請先閱讀背面之注意事項再填寫本頁) ·<________丁 _____^ 彳· /¾ - 534855 A7 _ B7______ 五、發明說明(8 ). 鎗、毗啶鎗鹽、咪唑啉嗡鹽等之陽離子界面活性劑;羧基 甜菜鹼型、氨基羧酸鹽、咪唑啉鎗甜菜鹼、卵磷脂等之兩 性界面活性劑;聚環氧乙烯烷醚、聚環氧乙烯2級醇醚、 聚環氧乙烯烷基苯醚、聚氧化乙烯巢醇醚、聚氧化乙烯含 水羊毛脂衍生物、烷基酚嗎啉縮合物之氧化乙烯衍生物、 聚氧化乙烯聚氧化丙烯嵌段聚合物、聚氧化乙烯聚氧化丙 烯烷醚、聚氧化乙烯甘油脂肪酸酯、聚氧化乙烯篦麻子油 以及硬化篦麻子油、聚氧化乙烯山梨糖醇酐脂肪酸酯、聚 氧化乙烯山梨糖醇脂肪酸酯、聚乙二醇脂肪酸酯、脂肪酸 單甘油酯、聚甘油脂肪酸酯、山梨糖醇脂肪酸酯、脂肪酸 烷醇醯胺、聚氧化乙烯脂肪酸酯醯胺、聚氧化乙烯烷基胺 、烷基胺氧化物等之非離子界面活性劑;氟系界面活性劑 ;聚氧化乙烯烯丙基環氧丙基壬基苯醚等之反應系界面活 性劑;r 一氯代丙基三甲氧基矽烷、乙烯基三乙氧基矽烷 、乙烯基三甲氧基矽烷、乙烯基三(沒一甲氧基乙氧基)矽 烷、r 一甲基丙烯醯基丙基三甲氧基矽烷、/3 —(3,4一環 氧基環己基)乙基三甲氧基矽烷、r 一環氧丙氧基丙基三甲 氧基矽烷、τ一锍基丙基三甲氧基矽烷、τ一氨基丙基三 乙氧基矽烷、n—/5 —(氨乙基)一 r 一氨基丙基三甲氧基砍 烷、r 一腺基丙基三乙氧基矽烷等之矽烷偶合劑;異丙基 三異硬脂醯基鈦酸酯、異丙基三一正十二基苯磺醯基鈦酸 酯、異丙基三(二辛基焦磷酸酯)鈦酸酯、四異丙基雙(二一 十三烷基磷酸酯)鈦酸酯、四(2,2—二烯丙基羥基甲基一 1一 丁基)雙(二一十三烷基)磷酸酯鈦酸酯、雙(二辛基焦磷酸酯 10 ^紙^尺度適用由國國家標準(CNS)A4規格(210 X 297公爱Ί ~一 (請先閒讀背面之注意事項再填寫本頁) f 訂.丨 線爲 534855 A7 _Β7 ·__ 五、發明說明(7 ) )乙烯鈦酸酯、異丙基三(N-氨基乙基)鈦酸酯等之鈦偶合 劑’該等可單獨使用亦可至少2種組合使用。其中又以廉 價之硬脂酸爲佳。 賦予撥水性之物質的表面處理量相對於球狀無機粒子 以0.01〜5重量%之範圍爲佳,尤以〇.1〜4重量%爲更佳。 若賦予撥水性之物質的表面處理量未滿〇.〇1重量%,表面 處理之效果並不充分,另一方面即使超過5重量%也無法 提昇表面處理效果,不僅不符經濟效益、甚至相反地有時 會損及被硏磨物之物性。 本發明之硏磨材,對於上述表面處理粒子添加混合平 均粒子徑爲球狀無機粒子之平均粒子徑之十分之一以下的 流動性改良劑,藉此,可進一步提昇在噴砂機器內之流動 性與噴砂加工時之硏磨材之分散性,並進一步降低噴砂加 工結束後殘留於被加工物之情形。具體說明流動性改良劑 ,可舉出滑石、無水矽酸、膨潤土、高嶺土、氧化鎂、碳 酸鎂、矽酸鎂、氧化鋅、氫氧化鎂、矽膠、矽藻土、硬脂 酸鎂、熱解二氧化矽粉、矽鎂石、二氧化矽、玉米澱粉、 澱粉、矽酸鈣等之超微粉末,該等可單獨使用或至少2種 組合使用。其中,就可獲得優異改善效果的觀點來看’以 無水矽酸與矽膠爲佳。流動性改良劑之添加量相對於硏磨 材之球狀無機粒子以〇.〇1〜5重量%之範圍爲佳,尤以 0.1〜4重量%爲更佳。當流動性改良劑之添加量未滿〇·〇1 重量%則添加效果並不充分,另一方面若超過5重量%則反 而會損及添加效果。 11 __ ^氏張尺度適闬々國國家標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) # 訂---------線 534855 A7 —-—__B7_______ 五、發明說明(,。) 又’添加混合流動性改良劑之際,亦可將對球狀無機 粒子做表面處理之賦予撥水性的物質當作黏合劑來利用, 透過該黏合劑讓流動性改良劑附著於球狀無機粒子表面。 此時’流動性改良劑扮演著緩衝材之角色,藉由抑制磨削 時硏磨材之反作用力,可防止於PDP隔壁形成中之側蝕, 或提昇太陽電池製造中之刻劃精度,此爲所能獲得之效果 。再者,可進一步提昇在噴砂機器內之流動性、噴砂加工 時之硏磨材的分散性,進而具有降低噴砂加工結束後硏磨 材殘留於被加工物的效果。 又,在進行噴砂加工的情況下,相對於該等硏磨材之 粒子徑,對應於磨削最小槽寬(磨除的情況係最小磨除槽寬 )C(//m)存在著較佳最大粒子徑,本發明之硏磨材,在構成 硏磨材之球狀無機粒子的最大粒子徑A(//m)與磨削最小槽 寬C(/zm)的關係上,係以滿足下述式(1)、較佳係滿足下述 式(5)、最佳係滿足下述式(6)的方式來選擇球狀無機粒子。 10^ A^0.8C (1) 11^ A^0.7C (5) 12^ A^0.6C (6) 亦即,若球狀無機粒子中之最大粒子徑超過〇.8C:則出 現較磨削之槽寬爲大之粒子的機率會變高,在經某種程度 磨削過之槽中會夾著大的硏磨材粒子’結果會妨㈤到夾者 粒子之部分的下部之磨削,有時會發生隔壁之破損,有引 起加工精度與生產效率降低之傾向。又,若球狀無機粒子 之最大粒子徑較10 爲小,則球狀無機粒子之平均粒子 12_______ (請先閱讀背面之注意事項再填寫本頁) f 訂---------線一 本紙張尺度適闬中國國家標準(CNS)A4規格(210 X 297公濩) 534855 A7 ___B7______ 五、發明說明(H ) 徑也變得極端地小,各個硏磨材粒子之磨削能力會降低, 有無法得到磨削效率良好之硏磨材的傾向。亦即,藉由上 述之構成,可防止隔壁之破損,顯著提昇隔壁之精度。 又,球狀無機粒子之平均粒子徑對於噴砂加工時之加 工速度以及硏磨材之分散性具有影響力。考慮該等特性, 本發明之球狀無機粒子的平均粒子徑B(/z m)與最小磨削槽 寬C(/zm)的關係上’係以滿足下述式(2)、較佳係滿足下述 式(7)、最佳係滿足下述式(8)的方式來選擇。 0.02C^B^0.5C (2) 〇.〇4C^B^0.4C (7) 0.05C^B^0.3C (8) 亦即,使用PDP之噴砂法之隔壁形成、太陽電池之刻 劃線般之精密的噴砂磨削加工中,對應於磨削最小槽寬C ,係存在著較佳之平均粒子徑。當平均粒子徑超過0.5C之 時,每一個硏磨材粒子之質量會增加,粒子於1次衝突中 之磨削力也會增加,其結果對被加工物底部之玻璃等所構 成之基板上所設之電極以及基板表面造成損傷之危險性也 有增大之傾向。又,當平均粒子徑較0.02C爲小,每一個 硏磨材粒子之質量也變小,有於粒子之1次衝突中磨削力 也隨之減少的傾向。其結果,在PDP的情況,雖可避免對 被加工物底部之玻璃等所構成之基板上所設之電極以及基 板表面造成損傷之危險性,但有時硏磨效率會顯著地降低 。亦即,藉由上述之構成,即使最小加工槽寬變小,仍可 保持硏磨效率。又,在太陽電池之刻劃加工的方面也具有 13 本纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) , ____ Γ ___,0^ ' 唁· (請先閱讀背面之注意事項再填寫本頁) 534855 A7 ____ B7________ 五、發明說明((二) 同樣的情形。 又,球狀無機粒子之最大粒子徑與平均粒子徑係與以 賦予撥水性之物質進行表面處理過之球狀無機粒子、亦即 硏磨材粒子之最大粒子徑以及平均粒子徑幾乎無差異而實 質相同。 使用噴砂法之PDP的隔壁形成以及太陽電池之刻劃線 之磨削加工中最小加工槽寬C通常係主要在SiKlOOO/zm 之範圍受到噴砂加工,本發明亦以此範圍爲佳。 如上所述,以賦予撥水性之物質進行表面處理之表面 處理粒子、或進一步對該表面處理球狀無機粒子添加流動 性改良劑所成之硏磨材,乃至於已控制了對於磨削最小槽 寬之最大粒子徑、平均粒子徑等所成之本發明之硏磨材, 可適切地使用於半導體領域之氧化被膜之去除等。例如, 爲了 TFT面板之高精細化、高開口率化而要求進一步之微 細加工,於是乃從以往以濕式所進行之硏磨方法演變到乾 式;而本發明之硏磨材正對於此乾式硏磨方法可有效地被 使用,尤其在金屬或氧化膜等之需要高能量的硏磨方面效 率高且精度佳。 又,上述本發明之硏磨材,可做爲效率與精度佳之 PDP背面基板之隔壁形成用硏磨材來使用。於pdp之隔壁 形成過程中,藉由噴砂法來形成隔壁,於玻璃基板上設置 具有噴砂性之肋材層,藉具有耐噴砂性之樹脂層來施行圖 案化,自上方進行噴砂加工以形成隔壁。 再者’上述本發明之硏磨材,可適用做爲效率與精度 ____ 14 t、纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公爱) ' ^ (請先閱讀背面之注音〕事項再填寫本頁) f 訂---------線一 534855 A7 ___ B7__ 五、發明說明(〇 ) 佳之太陽電池刻劃加工用硏磨材。 如以上所述,本發明之硏磨材,由於被賦予撥水性之 物質所表面處理過,所以可有效地防止因水分引起之硏磨 材的凝集、固結以及硏磨材附著於被加工物等之問題,在 例如PDP面板之隔壁形成製程、太陽電池之刻劃加工之際 ,可對應於所需之磨削最小槽寬,藉由控制最大粒子徑、 平均粒子徑,來做爲磨削效率與加工精度高之硏磨材而使 用。 又,本發明之硏磨材,不僅因爲經由賦予撥水性之物 質所表面處理過而可得到防止液交聯所致之球狀無機粒子 凝集的效果,且可得到防止金屬硏磨劑等磨入被加工物之 效果。例如,於PDP面板背面基板之之製程中使用不鏽鋼 粉之情況下,會出現被硏磨物之白色的低熔點鉛玻璃等所 構成之隔壁因金屬硏磨劑之磨入而變色、導致PDP之亮度 降低的問題,惟本發明可防止此種問題。再者,可得到將 利用磁力之低熔點玻璃與不鏽鋼等之金屬硏磨材之分離效 率加以提高之效果。藉此,被硏磨物之低熔點玻璃的再生 利用成爲可能,可謀求PDP製造成本之降低。 [實施例] 以下,舉出實施例與比較例更具體地說明本發明,惟 本發明之範圍並不因該等例子而受限。 又,做爲被硏磨物,係依照下述之隔壁形成方法,使 用實驗用之PDP背面面板,將硏磨材之噴射壓力、每單位 時間之噴射重量調節成爲一定來進行隔壁形成試驗,對被 _ 15 ί、纸張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) T nt ----J m 1¾ m —-1 i 1 -VI m m ·_ϋ · n I-—· I n l 11 i"-I !1 1 i 11· n I n 1 (請先閱讀背面之注意事項再填寫本頁) 534855 A7 ______ B7______ 五、發明說明(以) 加工物底部之玻璃基盤之表面性質以及隔壁形狀進行觀察 0 隔壁形成方法: (A) 實驗用PDP背面面板之製造 於鹼石灰玻璃基板上形成電極(電極表面係由氧化鎂層 所保護),於其上塗佈低熔點玻璃糊、乾燥後,以表面具有 耐噴砂性之光罩材形成磨削槽寬(一定,亦即隔壁間隔一定 )爲100//m之隔壁圖案。 (B) 噴砂加工 使用上述所製造之實驗用PDP背面面板,進行下述之 實施例、比較例之各種硏磨材的磨削實驗。加工條件係如 下述般設定,測定各種硏磨材之隔壁形成時間,觀察隔壁 形狀與硏磨精度。 噴射噴嘴口徑:l〇nm 硏磨材噴射壓力:3.0kg/cm2(290kPa) 硏磨材噴射量:l〇〇g/min 到面板之距離:10cm 做爲被硏磨物係使用PDP試驗用之背面基盤,將噴砂 機器之噴砂壓力、硏磨劑之每單位時間的噴射重厘^周卽成 一定,進行隔壁形成試驗,觀察被加工物底部之玻璃基盤 的表面性質與隔壁形狀來評價加工精度。又,對於再啓動 性之可否也做了評價。表1係顯示球狀硏磨材之組成與評 價結果。 又,表1中之硏磨材粒子之特性的測定方法以及評價 16__ 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) (請先閒讀背面之注意事項再填寫本頁) --------ITi 534855 A7 ___________B7____ 五、發明說明() 係以下述方法來進行。 構成硏磨材之無機粒子粉體的最大粒子徑、平均粒子 徑係使用日機裝股份有限公司微特拉克FRA來測定。 做爲硏磨效率之評價,係量測同噴射壓力之各硏磨材 之切削速度(秒)。 表示球形之指數係對電子顯微鏡照片所拍攝之粒子隨 機選取20點求出測定値的平均値。 加工精度係使用電子顯微鏡來目視觀察硏磨後之PDP 背面面板之槽底部的刮傷、槽及其側蝕之表面性質,以下 述基準來評價。 良好:無刮傷,槽之加工形狀均一且無側蝕。 些許不良:有些微刮傷以及/或是槽之加工形狀略爲不 均一、有出現若干側蝕之傾向。 不良:有許多刮傷以及/或是槽之加工形狀不均一、發 生側蝕情況。 不能:無法藉由加工形成隔壁。 實施例1 使用平均粒子徑26//m、最大粒子徑53/zm之玻璃珠 ,對該玻璃珠重量份(solid content)添加可賦予撥水性 之物質之硬脂酸(TST:米永油脂股份有限公司製造)丨重量 % ’進一步對該玻璃珠100重量份添加做爲流動性改良劑 之平均粒子徑爲〇 · 〇 3 // m的白炭黑(思塔席魯s :神島化學 股份有限公司製造)〇.5重量%,以予謝爾混合器來加熱混 合得到硏磨材。 _ 17 卞、紙張尺度適用中國國家標準(CNS)A4規格(210 x 297公釐) 一 —- (請先閱讀背面之注意事項再填寫本頁) i 訂---------線 534855 A7 B7 五、發明說明(A ) 使用此硏磨材進行噴砂加工來形成PDP隔壁,結果可 在不致損傷隔壁的前提下進行高精度之加工。又,即使讓 噴砂機器停止放置一天後再發動噴砂機器’在噴嘴處也無 阻塞而可再啓動。 實施例2 使用平均粒子徑30// m、最大粒子徑53 V m之玻璃珠 ,對該玻璃珠1〇〇重量份添加可賦予撥水性之物質之硬脂 酸(TST :米永油脂股份有限公司製造)0.5重量%,進一步 對該玻璃珠1〇〇重量份添加做爲流動性改良劑之平均粒子 徑爲0.03/zm的白炭黑(思塔席魯S :神島化學股份有限公 司製造)1重量%,以亨謝爾混合器來加熱混合得到硏磨材 使用此硏磨材進行噴砂加工來形成PDP隔壁,結果可 在不致損傷隔壁的前提下進行高精度之加工。又,即使讓 噴砂機器停止放置一天後再發動噴砂機器,在噴嘴處也無 阻塞而可再啓動。 實施例3 使用平均粒子徑20 /z m、最大粒子徑44 // m之銘氧粉 ’對該銘氧粉100重量份添加可賦予撥水性之物質之硬脂 酸(TST :米永油脂股份有限公司製造)2重量%,以亨謝爾 混合器來加熱混合得到硏磨材。 使用此硏磨材進行噴砂加工來形成PDP隔壁,結果可 在不致損傷隔壁的前提下進行高精度之加工。又,即使讓 噴砂機器停止放置一天後再發動噴砂機器,在噴嘴處也無 18 ------------*-------訂·--------- (請先閒讀背面之注意事項再填寫本頁) 十’成乐尺度適用 中國國家標準(CNS)A4規格(210 X 297公釐) 534855 A7 ------ B7___ 五、發明說明() 阻塞而可再啓動。 實施例4 使用平均粒子徑15 // m、最大粒子徑37 // m之金鋼砂 ,對該金鋼砂100重量份添加可賦予撥水性之物質之硬脂 酸(TST :米永油脂股份有限公司製造)3重量%,進一步對 該金鋼砂100重量份添加做爲流動性改良劑之平均粒子徑 爲0.03//m的白炭黑(思塔席魯S :神島化學股份有限公司 製造)0·3重量%,以亨謝爾混合器來加熱混合得到硏磨材 〇 使用此硏磨材進行噴砂加工來形成PDP隔壁,結果可 在不致損傷隔壁且無側蝕的前提下進行高精度之加工。又 ,即使讓噴砂機器停止放置一天後再發動噴砂機器,在噴 嘴處也無阻塞而可再啓動。 實施例5 使用平均粒子徑35//m、最大粒子徑74//m之玻璃珠 ,對該玻璃珠1〇〇重量份添加可賦予撥水性之物質之硬脂 酸(TST :米永油脂股份有限公司製造)〇.1重量%,進一步 對該玻璃珠100重量份添加做爲流動性改良劑之平均粒子 徑爲0.03/zm的白炭黑(思塔席魯S :神島化學股份有限公 司製造)〇·3重量%,以亨謝爾混合器來加熱混合得到硏磨 材。 使用此硏磨材進行噴砂加工來形成PDP隔壁,結果可 在不致損傷隔壁且無側蝕的前提下進行高精度之加工。又 ,即使讓噴砂機器停止放置一天後再發動噴砂機器,在噴 19 國國家標準(CNS)A4規格(ilO X 297公釐) ^ i - - - - i II— -1— i I— i j 1 m 1.1 · 1--- 1 m an if Hi 1—n III 1 n —i n 111 I (請先.Mtf背面之注意事項再填寫本頁) 534855 A? -----__ 五、發明說明(J ) 嘴處也無阻塞而可再啓動。 實施例6 使用調整爲平均粒子徑l〇"m、最大粒子徑74"m之 玻璃珠。對該玻璃珠1〇〇亀量份添加可賦予撥水性之物質 之硬脂酸(TST :米永油脂聆份有限公司製造)3重量%,進 一步對該玻璃珠1〇〇重量份添加做爲流動性改良劑之平均 粒子徑爲0_03//m的白炭顧(思塔席魯s :神島化學股份有 限公司製造)2重量% ’以亨謝爾混合器來加熱混合得到硏 磨材。 使用此硏磨材進行噴砂加工來形成PDP隔壁,結果可 在不致損傷隔壁且無側蝕的前提下進行高精度之加工。又 ,即使讓噴砂機器停止放置一天後再發動噴砂機器,在噴 嘴處也無阻塞而可再啓動。 實施例7 使用調整爲平均粒子徑20// m、最大粒子徑52// m之 不鏽鋼粉。對該不鏽鋼粉100重量份添加可賦予撥水性之 物質之硬脂酸(TST :米永油脂股份有限公司製造)〇.4重量 %,以亨謝爾混合器來加熱混合得到硏磨材。 使用此硏磨材進行噴砂加工來形成PDP隔壁,結果可 在不致損傷隔壁也沒有側蝕的前提下進行高精度之加工。 又,也無金屬硏磨材所特有之對隔壁之磨入現象,可提升 利用磁力之低熔點玻璃與不鏽鋼等之金屬硏磨材之分離效 率,此爲效果所在。再者,即使讓噴砂機器停止放置一天 後再發動噴砂機器,在噴嘴處也無阻塞而可平順地再啓動 20 _____ 本纸張尺度適罔中國國家標準(CNS)A4規格(210 X 297公釐) - -----------費-------—訂·-------線· (請先閒讀背面之注意事項再填寫本頁) 534855 A7 ________B7 ^'—- 一 ~ " 五、發明說明((?) 實施例8 將緻密質地之石灰石加以培燒、熟化、碳酸化,製造 出最大粒子徑75/zm、平均粒子徑2//m之晶鬚(whisker) 狀碳酸鈣,對該晶鬚狀碳酸鈣粒子粉體1Q0重量份添加硬 脂酸(TST :米永油脂股份有限公司製造)1.3重量份,進一 步對晶鬚狀碳酸鈣粒子粉體重量份添加做爲流動性改 良劑之平均粒子徑〇.〇5/zm之熱解二氧化矽(雷歐羅席魯 CP-102 :德山曹達股份有限公司製造)2重量%,以亨謝爾 混合器來加熱混合得到硏磨材。 使用此硏磨材進行噴砂加工來形成PDP隔壁之時發現 到側蝕之傾向,隔壁之部分損傷,隔壁之精度略爲不良。 停止噴砂放置一天後要再啓動時略有困難。 比較例1 使用平均粒子徑60μιη、最大粒子徑74/zm之玻璃珠 。對該玻璃珠1〇〇重量份添加做爲流動性改良劑之平均粒 子徑爲〇.〇3//m的白炭黑(思塔席魯s :神島化學股份有限 公司製造)〇.3重量%,以亨謝爾混合器來加熱混合得到硏 磨材。 使用此硏磨材進行噴砂加工來形成PDP隔壁時發現隔 壁會崩潰。又,停止噴砂機器放置一天後要再啓動時,於 噴砂機器內以及噴嘴附近會發生硏磨材之凝集,無法進行 再啓動。 比較例2 _____21 "^紙張尺度消用☆國S家標準(CNS)A4—規格(21Q x 297公愛) " (請先閱讀背面之注意事項再填寫本頁) 訂_ ---線- 534855 A7 _____B7______ 五、發明說明(7-) 使用調整爲平均粒子徑l〇/im、最大粒子徑l〇5/zm 之玻璃珠。對該玻璃珠100重量份添加做爲流動性改良劑 之平均粒子徑爲〇.〇3//m的白炭黑(思塔席魯S :神島化學 股份有限公司製造)2重量%,以亨謝爾混合器來加熱混合 得到硏磨材。 使用此硏磨材進行噴砂加工來形成PDP隔壁時發現於 隔壁之一部分會發生崩潰。又,停止噴砂機器放置一天後 要再啓動時,於噴砂機器內以及噴嘴附近會發生硏磨材之 凝集,無法進行再啓動。 比較例3 使用調整爲平均粒子徑20/zm、最大粒子徑62//m之 玻璃珠。對該玻璃珠1〇〇重量份添加做爲流動性改良劑之 平均粒子徑爲0.03//m的白炭黑(思塔席魯S :神島化學股 份有限公司製造)2重量%,以亨謝爾混合器來加熱混合得 到硏磨材。 使用此硏磨材進行噴砂加工來形成PDP隔壁時發現’ 雖可形成隔壁但有出現側蝕之傾向。又’停止噴砂機器放 置一天後要再啓動時,於噴砂機器內以及噴嘴附近會發生 硏磨材之凝集,無法進行再啓動。 比較例4 使用調整爲平均粒子徑15//m、最大粒子徑44Vm之 玻璃珠做爲硏磨材。 使用此硏磨材進行噴砂加工來形成PDp隔壁時發現’ 有出現嚴重側蝕之傾向,無法高精度地形成隔壁。又’停 各紙張尺度適用由國國家標準(CNS)A4規格(210 X 297公爱) ------------費----- - 訂----------線0 (請先閱讀背面之注意事項再填寫本頁) 22_____ 534855 A7 _B7 __ 五、發明說明(W ) 止噴砂機器放置一天後要再啓動時,於噴砂機器內以及噴 嘴附近會發生硏磨材之凝集,無法進行再啓動。 比較例5 使用調整爲平均粒子徑25//m、最大粒子徑150/zm 之不鏽鋼粉做爲硏磨材。 使用此硏磨材進行噴砂加工來形成PDP隔壁時發現, 有出現側蝕之傾向,隔壁之一部分受損傷,無法高精度地 形成隔壁。又,發生屬金屬硏磨材之缺點的對隔壁之磨入 現象以及附著。再者利用磁力之低熔點玻璃與不鏽鋼等之 金屬硏磨材的分離效率變差無法做低熔點玻璃之再利用。 停止噴砂機器放置一天後要再啓動時會略有困難。 T 1:3 n ----*.:—Hi «I m I— I— i It 1 n III i 1 1 1 n 1 I «I 111- - -- a m 118 ii I 口 么vy^^ (請先閒讀背面之注意事項再填寫本頁) 例 球狀無機 粒子 疏水性賦 予物質 (%) 流動性改 良劑(%) B平均粒 子徑(# m) A最大粒 子徑("m) 球形指 數(%) 再啓動性 加工精度 實施例1 玻璃珠 1 0.5 26 53 98 可 良好 實施例2 玻璃珠 0.5 1 30 53 98 可 良好 實施例3 :鋁氧粉 2 0 20 44 96 可 良好 實施例4 金鋼砂 3 0.3 15 37 97 可 良好 實施例5 玻璃珠 0.1 0.3 35 74 98 可 良好 實施例6 玻璃珠 3 2 10 74 99 可 良好 實施例7 不鏽鋼 0.4 0 20 52 58 可 良好 實施例8 碳酸鈣 1.3 2 2 75 32 略爲困難 略爲不良 比較例1 玻璃珠 0 0.3 60 74 98 無法 無法 比較例2 玻璃珠 0 2 10 105 98 無法 不良 比較例3 玻璃珠 0 2 20 62 98 無法 略爲不良 比較例4 玻璃珠 0 0 15 44 98 無法 不良 比較例5 不鏽鋼 0 0 25 150 55 略爲困難 不良 23 紙張尺度適用由國g家標準(CNS)A4規格(210 X 297公爱) 534855 A7 ___B7_______ 五、發明說明(> ) A :球狀無機粒子之最大粒子徑(/zm) (請先閒讀背面之注意事項再填寫本頁) B :球狀無機粒子之平均粒子徑(//m) C :磨削最小槽寬(//m) (註) 10^ 80 3^B^50 C=1000( // m) [發明之效果] 如上所述,本發明之硏磨材,由於由賦予撥水性之物 質所表面處理過,所以可有效防止因水分所致之硏磨材的 凝集、固結以及附著於被硏磨物等之問題,例如在PDP面 板之隔壁形成製程、太陽電池之刻劃加工等之際依據所需 之磨削最小槽寬來控制最大粒子徑、平均粒子徑,藉此, 可做爲在硏磨效率與加工精度優異之硏磨材來使用。 24 本紙張尺度適用由國國家標準(CNS)A4規格(210 X 297公釐)< T / ¾. Γν n 1 =--n —1- 11 III II 1 i I j 1- 1 I In n- I 534855 A7 ___B7______ V. Description of the invention (1) Various conductions such as conversion layers and internal electrodes The film is sprayed with fine particles as a honing material, and the conductive film exposed on the opening is scratched by a sandblasting method. Similarly, the sand blasting method has also been attempted to obtain through-grinding of high-density assembled multilayer wiring boards, through-hole processing of semiconductor circuit elements, and removal of oxide films on semiconductor circuit elements. The sandblasting method used in the formation of the partition wall of the PDP back substrate or the removal of oxide films of semiconductors or semiconductors, the honing material sprayed will be accompanied by the grinding debris (the paste or film under grinding) Material) is removed from the grinding part, recovered through a separation process such as a screen, and stored in a storage tank, etc., and then used again in the sandblasting process. As honing material particles, glass beads, alumina powder, corundum, ceramic beads, stainless steel, copper, etc. have been proposed according to the purpose, and are still used today. The shape of these particles is preferably spherical or nearly spherical. The advantage of using spherical or near-spherical particles as the honing material is that coarse particles can be easily removed during the manufacturing process of the honing material, and it will not adhere to the workpiece during sandblasting, and has good fluidity, and Honing material has less wear. However, if an inorganic honing material having an average particle size of several tens of m " m / number / m is used in the sandblasting method, for example, even if the shape of the particles of the honing material is extremely close to a spherical shape, the fluidity will be deteriorated, Or, when the device is stopped once and it is desired to be restarted, the conveying circuit of the honing material from the supply tank to the nozzle becomes completely unable to flow. In this case, if an impact is applied to the clogged part, the honing material sometimes starts to flow, but in most cases, the device must be disassembled to eliminate all honing materials in the device and then add some new concrete.磨 __ί_ — This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) τ < li I.: i all 111 In 11 III 111 ·-· »1— 0 111 111 1 nn II f —1 -I— im It) —i ill- I · f Please read the note on the back ') (Fill in this page again) 534855 A7 _______B7_______ 5. The description of invention ($) material or all of it is changed to a new honing material, and then restarted, so it becomes a significant obstacle in workability and productivity. Especially for a large-sized sand blasting device with a plurality of nozzles (honing material spraying part) and a honing material recovery device, it takes considerable time and manpower to replace the honing material. The cause of the above situation is presumed to be that the honing material is clogged even in a device that is equipped with a countermeasure against static electricity. Therefore, during the blasting process or when the processing is stopped, a small amount of moisture is concentrated over time. As a result, the honing material particles Caused by liquid cross-linking between the fine grinding chips and honing material particles in each contact or part. That is, in the sand blasting process performed by the sand blasting machine, the honing material is ejected from the nozzle at a high pressure and high speed, and a low temperature portion occurs due to the spray at the front end of the nozzle. This temperature difference causes water droplets to appear at the front end of the nozzle. Then, when the sand blasting machine is stopped, the moisture in the machine often causes the agglomeration of the honing material. In addition, especially in large-scale sandblasting equipment, because the honing material aggregates and solidifies in the machine, the honing material must be temporarily discharged outside the system in order to restart the front end of the nozzle and the honing material in the machine. . Not only does this operation reduce productivity, it becomes very difficult when the machine is in a clean room. In addition, some literatures have pointed out that the water generated at the front end of the nozzle of the sandblasting machine acts as a binder for the honing material, and the honing material adheres to the surface of the object to be ground. On the other hand, the groove depth of the PDP wall is larger than the groove width. For large grinding, since the particles of the honing material are spherical or nearly spherical, when the grinding reaches a certain degree and the groove is controlled, then 硏Abrasive particles will bounce back at the bottom of the groove of the object to be sanded and impact the wall surface of the groove, so it is difficult to make the next wall (or groove) 5 This paper size is applicable to China S Standard (CNTS) A4 (210 X 297) %) ~ (Please read the precautions on the back before filling in this page) · Take -------- Order—— -line one 534855 A7 ____B7_____ 5. Description of the invention (☆), the shape is maintained constant (side erosion Will get bigger). Although this problem can reduce the injection pressure of the honing material to achieve a considerable improvement, it is relatively necessary to sacrifice the honing speed. Furthermore, regarding the size of the honing material particles, the larger the size of the honing material particles, the greater the mass, so the grinding speed is relatively large. However, since the curvature of the honing material particles becomes larger, it is difficult to perform fine processing, etc. It is a qualitative selection based on the current situation. However, the original honing material should have a granular structure with high processing accuracy and high processing speed corresponding to the shape of the workpiece. As mentioned above, the microfabrication by the sandblasting method is an important factor for the efficiency of the honing material, especially the guarantee of the fluidity at the restart, which affects the side corrosion of both the machining accuracy and the work efficiency. It is necessary to solve honing materials with high precision and high efficiency. [Problems to be Solved by the Invention] In view of the above-mentioned facts, the present invention is to provide a honing material that can solve the above-mentioned problems, and is particularly applicable to the formation of a partition wall of a PDP and the scribe line of a solar cell in a dry manner. Oxidation of semiconductors such as grinding. Removal of coatings, etc., can perform high-efficiency and high-precision grinding without damaging the properties of the bottom surface of the workpiece, and prevent the aggregation of honing material particles caused by moisture. For example, the blasting machine can be restarted after it has been stopped for at least one day and night. [Means to solve the problem] As a result of intensive research, the present inventors have found that surface treatment of spherical inorganic particles with a substance that imparts water repellency can provide a liquid cross-linking phenomenon that can prevent the moisture of honing material particles. Agglutination caused by, for example, sandblasting ___ 6_____ This paper size applies Chinese National Standard (CNS) A4 (210 X 297 mm) (please read the precautions on the back before filling this page). 534855 — A7 -_____ Β7 ____ V. Description of the invention ($) Honing material that can be restarted after the machine has been stopped for at least one day and night. Furthermore, the addition of particles having a diameter of one-tenth of the particle diameter of the honing material can improve the fluidity. By controlling the minimum groove width m), the shape of the honing material, the maximum particle diameter, the average particle diameter, etc., it is possible to obtain the honing materials that can be used in the semiconductor field, etc., which are necessary in ultra-precision machining, and thus complete This invention. That is, the content of the present invention relates to a honing material for dry blast processing, which is characterized in that the spherical inorganic particles are surface-treated with a substance that imparts water repellency (the first scope of the patent application). In the present invention, the term "grinding" is used in addition to the term "grinding". As a preferable aspect, in the honing material of the first patent application range, the fluidity improving agent having an average particle diameter of less than one tenth of the average particle diameter of the spherical inorganic particles is applied to the spherical inorganic particles. Add 0.01% to 5% by weight (No. 2 in the scope of patent application). As a preferable aspect, the spherical inorganic particles satisfy the following formulae (1) to (3) in the honing material of the patent application scope item 1 or 2 (the third scope of the patent application scope) ). 10 ^ 0.8C (1) 0.02C ^ B ^ 0.5C (2) 50 ^ C ^ 1000 (3) Among them, A: the largest particle diameter of the honing material (// m) B: the average particle diameter of the honing material (Μπα) 7 ______ The size of this paper is applicable to the national standard (CNS) A4 (210 X 297 mm) (please read the notes on the back side and fill in this page) ----- Order --- ------ Line one 534855 A7 ------ B7__ V. Description of the invention (6) C: The minimum groove width (// m) for grinding or grinding is a better aspect, which is in the application The honing material according to any one of the scope of patents 1 to 3 is used for the removal of the oxide film of a semiconductor (the scope of the patent application is the fourth). As a preferable aspect, it is used for the formation of ribs on the back substrate of the PDP in the honing material of any of the items 1 to 3 of the scope of patent application (item 5 of the scope of patent application). As a preferred aspect, it is used for the formation of scribe lines for tandem solar cell elements in the honing material of any one of items i to 3 of the scope of patent application (item 6 of the scope of patent application). [Embodiments of the Invention] Hereinafter, the present invention will be described in detail. The present invention relates to a honing material for dry blast processing, which is characterized in that the spherical inorganic particles are surface-treated with a substance that imparts water repellency, thereby effectively preventing liquid cross-linking between particles due to moisture. The agglomeration and consolidation of the honing material and the attachment of the honing material to the workpiece can greatly improve the grinding efficiency and precision. Examples of the spherical inorganic particles used in the present invention include spherical inorganic particle powders such as glass beads, alumina powder, corundum, ceramic beads, stainless steel, and copper. In the present invention, the so-called spherical system is as defined in the following formula (4): The case where the area ratio of the projected area of the particles to the circumscribed circle is preferably 50% or more, and more preferably 80% or less. 8 This paper size applies to China National Standard (CNS) A4 (210 x 297 mm) --------------------- Order -------- -(Please read the precautions on the back before filling this page) 534855 A7 _B7 ___ V. Description of the invention (7) Area ratio of the projected area of the particle to the circumscribed circle (% household-X100 (4) The projected area outside the particle is connected to the circle The area of water-repellent material used in the present invention is not particularly limited as long as it is a material capable of imparting water-repellency. Specific examples include oleic acid, lauric acid, and nutmeg. Fatty acids such as acids, isotridecyl myristate, palmitic acid, moringa oleic acid, stearic acid, isostearic acid, etc .; the aforementioned fatty acids such as amidine and bisamidine; higher alcohols such as stearyl alcohol or branched higher Alcohols; higher fatty acid esters of monohydric alcohols, higher fatty acid esters of polyhydric alcohols, very long chain esters in the form of montan wax or fatty acid ester-based lubricants thereof; barium stearate, calcium stearate Metal soaps such as aluminum stearate, zinc stearate, magnesium stearate or their complexes; liquid stones above C16 Waxes, microcrystalline waxes, natural paraffin waxes, synthetic stone urns, polyolefin waxes, and some of the aliphatic hydrocarbon lubricants such as oxides, fluorides, chlorides, etc .; silicone oil, soybean oil, coconut oil, palm kernel oil, Linseed oil, rapeseed oil, cotton solid oil, tung oil, ramie oil, tallow, thirty carbon, water lanolin, hardening oil, etc .; HLB below 9 surfactants such as N-fluorenyl Amino acid salts, alkyl ether carboxylates, carboxylated carboxylates: alkyl sulfonates, alkyl benzenes and alkyl naphthalene sulfonates, sulfonated succinates, α-olefin sulfonates, N —Sulfonates of sulfonium sulfonates, etc .; sulfate esters of sulfated oils, garden sulfates, garden acid sulfates, garden dilute propyl acid sulfates, alkylammonium sulfates, etc; Anionic surfactants such as phosphate salts of phosphates, alkyl ether phosphates, alkyl allyl ether phosphates, etc .; aliphatic ammonia salts, aliphatic quaternary ammonium salts, benzyl ammonium salts, benzene chloride 9 Applicable paper size: ☆ National National Standard (CNS) A4 (210 X 297 mm 1) (Please read the precautions on the back first (Fill in this page again) < ________ 丁 _____ ^ 彳 · / ¾-534855 A7 _ B7______ V. Description of the Invention (8). Cationic surfactants such as gun, pyrimidine salt, and imidazoline hum salt; carboxybetaine type, aminocarboxylate Amphoteric surfactants such as acid salts, imidazolinium betaine, lecithin, etc .; polyethylene oxide alkyl ethers, polyethylene oxide secondary alcohol ethers, polyethylene oxide alkyl phenyl ethers, polyethylene oxide nest alcohol ethers, Polyoxyethylene hydrolanolin derivative, alkylphenol morpholine condensate ethylene oxide derivative, polyoxyethylene polyoxypropylene block polymer, polyoxyethylene polyoxypropylene alkyl ether, polyoxyethylene glycerol fatty acid ester, Polyoxyethylene ramie seed oil and hardened ramie seed oil, polyethylene oxide sorbitan fatty acid ester, polyethylene oxide sorbitol fatty acid ester, polyethylene glycol fatty acid ester, fatty acid monoglyceride, polyglycerin fatty acid Esters, sorbitol fatty acid esters, fatty acid alkanolamines, polyoxyethylene fatty acid esters amines, polyoxyethylene alkylamines, alkylamine oxides, and other nonionic surfactants; fluorine-based surfactants; Polyoxygen Reactive surfactants such as vinyl allyl epoxy propyl nonyl phenyl ether; r monochloropropyltrimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinyltri ( Methoxyethoxy) silane, r-methacrylmethylpropyltrimethoxysilane, / 3- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, r-epoxy Propoxypropyltrimethoxysilane, τ-amidinopropyltrimethoxysilane, τ-aminopropyltriethoxysilane, n- / 5- (aminoethyl) -r-aminopropyltrimethoxy Silane coupling agents, such as oxyalkane, r-adenoylpropyltriethoxysilane; isopropyltriisostearylfluorenyl titanate, isopropyltri-n-dodecylbenzenesulfonyl titanate , Isopropyltris (dioctyl pyrophosphate) titanate, tetraisopropylbis (213 trialkyl phosphate) titanate, tetra (2,2-diallylhydroxymethyl one) 1 monobutyl) bis (213 trialkyl) phosphate titanate, bis (dioctyl pyrophosphate) 10 ^ paper ^ standard applicable by the national standard (CNS) A4 specifications (210 X 297 public love) ~ A ( Please read the precautions on the back before filling this page) f. Order. 丨 The line is 534855 A7 _Β7 · __ V. Description of the invention (7)) Ethylene titanate, isopropyltris (N-aminoethyl) titanic acid The titanium coupling agents such as esters can be used alone or in combination of at least two kinds. Among them, cheap stearic acid is preferred. The surface treatment amount of the water-repellent substance is 0.01 to 5 with respect to the spherical inorganic particles. The range of weight% is preferred, and more preferably 0.1 to 4% by weight. If the surface treatment amount of the water-repellent substance is less than 0.01% by weight, the effect of surface treatment is insufficient, on the other hand Even if it exceeds 5% by weight, the surface treatment effect cannot be improved, and it is not only inconsistent with economic benefits, but may sometimes impair the physical properties of the object to be honed. In the honing material of the present invention, a fluidity improver having a mixed average particle diameter of less than one-tenth of the average particle diameter of spherical inorganic particles is added to the surface-treated particles, thereby further improving the flow in the sandblasting machine. And the dispersibility of the honing material during the blasting process, and further reduce the situation of remaining on the workpiece after the blasting process. Specific flow improvers include talc, anhydrous silicic acid, bentonite, kaolin, magnesium oxide, magnesium carbonate, magnesium silicate, zinc oxide, magnesium hydroxide, silica gel, diatomaceous earth, magnesium stearate, pyrolysis Ultrafine powder of silicon dioxide, brookite, silicon dioxide, corn starch, starch, calcium silicate, etc. These can be used alone or in combination of at least two kinds. Among them, from the viewpoint of obtaining an excellent improvement effect, anhydrous silicic acid and silicone are preferred. The addition amount of the flowability improver is preferably in the range of 0.01 to 5% by weight, and more preferably 0.1 to 4% by weight, relative to the spherical inorganic particles of the honing material. When the added amount of the flowability improver is less than 0.001% by weight, the addition effect is not sufficient. On the other hand, if it exceeds 5% by weight, the addition effect is impaired. 11 __ ^ Zhang's scale is suitable for the national standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling out this page) # Order --------- line 534855 A7 —-—__ B7_______ 5. Explanation of the invention (,.) When adding a fluidity improver, the water-repellent substance that is used for surface treatment of spherical inorganic particles can also be used as a binder. The binder allows the fluidity improver to adhere to the surface of the spherical inorganic particles. At this time, the 'fluidity improver plays the role of a buffer material. By suppressing the reaction force of the honing material during grinding, it can prevent side corrosion in the formation of the PDP partition wall, or improve the scoring accuracy in the manufacture of solar cells. For the effect you can get. In addition, the fluidity in the blasting machine and the dispersibility of the honing material during the blasting process can be further improved, which has the effect of reducing the honing material remaining on the workpiece after the blasting process is completed. In addition, in the case of sandblasting, the particle diameter of these honing materials corresponds to the minimum groove width for grinding (in the case of grinding, the minimum grinding groove width) C (// m). The maximum particle diameter, the honing material of the present invention, satisfies the following relationship between the maximum particle diameter A (// m) of the spherical inorganic particles constituting the honing material and the minimum groove width C (/ zm) for grinding. The spherical inorganic particles are selected in such a manner that the formula (1), preferably satisfying the following formula (5), and most preferably satisfying the following formula (6). 10 ^ A ^ 0.8C (1) 11 ^ A ^ 0.7C (5) 12 ^ A ^ 0.6C (6) That is, if the largest particle diameter of the spherical inorganic particles exceeds 0.8C: the grinding will occur The probability that the groove width is large will increase, and large honing material particles will be sandwiched in the groove that has been ground to some extent. As a result, the lower part of the sandwiched particles will be affected. In some cases, damage to the next wall may occur, which may cause a reduction in processing accuracy and production efficiency. In addition, if the maximum particle diameter of the spherical inorganic particles is smaller than 10, the average particle size of the spherical inorganic particles is 12_______ (Please read the precautions on the back before filling this page) f Order --------- line A paper is suitable for Chinese National Standard (CNS) A4 (210 X 297 cm) 534855 A7 ___B7______ 5. The description of the invention (H) diameter has also become extremely small, and the grinding capacity of each honing material particle will decrease There is a tendency that honing materials with good grinding efficiency cannot be obtained. That is, with the above-mentioned structure, the damage of the partition can be prevented, and the accuracy of the partition can be significantly improved. In addition, the average particle diameter of the spherical inorganic particles has an influence on the processing speed during sandblasting and the dispersibility of the honing material. Considering these characteristics, the relationship between the average particle diameter B (/ zm) of the spherical inorganic particles of the present invention and the minimum grinding groove width C (/ zm) is to satisfy the following formula (2), and it is preferable to satisfy The following formula (7) and the optimal system are selected so as to satisfy the following formula (8). 0.02C ^ B ^ 0.5C (2) 〇.〇4C ^ B ^ 0.4C (7) 0.05C ^ B ^ 0.3C (8) That is, the formation of the partition wall using the sandblasting method of PDP, and the engraving of solar cells In the general precise blasting grinding process, there is a better average particle diameter corresponding to the grinding minimum groove width C. When the average particle diameter exceeds 0.5C, the mass of each honing material particle will increase, and the grinding force of the particles in one collision will also increase. As a result, it will affect the substrate made of glass and the like on the bottom of the processed object. The risk of damage to the electrodes and the substrate surface also tends to increase. In addition, when the average particle diameter is smaller than 0.02C, the mass of each honing material particle also becomes small, and the grinding force tends to decrease with one collision of particles. As a result, in the case of the PDP, although the danger of damaging the electrodes provided on the substrate made of glass and the like at the bottom of the workpiece and the surface of the substrate can be avoided, the honing efficiency may be significantly reduced in some cases. That is, with the above-mentioned configuration, the honing efficiency can be maintained even if the minimum machining groove width becomes small. In addition, there are 13 paper sizes for solar cell scribe processing, which are applicable to China National Standard (CNS) A4 (210 X 297 mm), ____ Γ ___, 0 ^ '唁 · (Please read the Please fill in this page again for attention) 534855 A7 ____ B7________ V. Description of the invention ((2) The same situation. In addition, the maximum particle diameter and average particle diameter of spherical inorganic particles are the same as those treated with water-repellent substances. The maximum particle diameter and the average particle diameter of spherical inorganic particles, that is, honing material particles, are almost the same, and they are substantially the same. The minimum processing groove width in the partition wall formation of the sandblasted PDP and the solar cell engraving process C is usually subjected to sandblasting mainly in the range of SiK1000 / zm, and the present invention is also preferred in this range. As mentioned above, the surface-treated particles are surface-treated with a substance that imparts water repellency, or the surface-treated spherical inorganic The honing material formed by adding a fluidity improver to the particles has controlled the invention for the maximum particle diameter and the average particle diameter of the smallest groove width for grinding. The honing material can be suitably used for the removal of oxide films in the semiconductor field. For example, in order to achieve high definition and high aperture ratio of TFT panels, further fine processing is required. The honing method has evolved to dry type; and the honing material of the present invention can be effectively used for this dry honing method, especially in the metal or oxide film, etc., which requires high energy honing and has high efficiency and accuracy. The above-mentioned honing material of the present invention can be used as a honing material for forming a partition wall of a PDP back substrate with high efficiency and precision. During the formation of the partition wall of the PDP, the partition wall is formed by sandblasting, and the glass substrate is provided with The sandblasting rib material layer is patterned by a resin layer having sandblasting resistance, and sandblasting is performed from above to form a partition wall. Furthermore, the above-mentioned honing material of the present invention can be applied as efficiency and accuracy ____ 14 t. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 public love) '^ (Please read the note on the back) and fill in this page) f Order --------- line one 534855 A 7 ___ B7__ V. Description of the invention (〇) The honing material for scoring processing of solar cells. As mentioned above, the honing material of the present invention can be effectively prevented because it is surface-treated with a substance that imparts water repellency. Problems such as the aggregation and consolidation of the honing material due to moisture and the adhesion of the honing material to the processed object can be matched to the required grinding during the formation process of the partition wall of the PDP panel and the scoring process of the solar cell. The minimum groove width is cut, and the maximum particle diameter and average particle diameter are controlled to be used as a honing material with high grinding efficiency and processing accuracy. Moreover, the honing material of the present invention is not only due to the substance that imparts water repellency. After the surface treatment, the effect of preventing the aggregation of the spherical inorganic particles due to the liquid cross-linking can be obtained, and the effect of preventing the metal honing agent and the like from getting into the workpiece can be obtained. For example, in the case of using stainless steel powder in the process of manufacturing the back substrate of a PDP panel, a partition wall made of white low-melting lead glass, etc., which is abraded, may be discolored due to the grinding of a metal honing agent, resulting in a PDP. The problem of reduced brightness, but the present invention can prevent such problems. Furthermore, the effect of improving the separation efficiency of magnetic low-melting glass and metal honing materials such as stainless steel can be obtained. This makes it possible to recycle the low-melting glass of the object to be abraded, and to reduce the manufacturing cost of the PDP. [Examples] Hereinafter, the present invention will be described more specifically with examples and comparative examples, but the scope of the present invention is not limited by these examples. In addition, as a material to be honed, a partition formation test was performed by adjusting the spray pressure of the honing material and the spray weight per unit time using the experimental PDP back panel in accordance with the partition formation method described below. _ 15 ί, paper size applies Chinese National Standard (CNS) A4 (210 X 297 mm) T nt ---- J m 1¾ m —-1 i 1 -VI mm · _ϋ · n I-— · I nl 11 i " -I! 1 1 i 11 · n I n 1 (Please read the precautions on the back before filling in this page) 534855 A7 ______ B7______ 5. Description of the invention (in) Surface properties of the glass substrate at the bottom of the processed object Observe the shape of the partition wall. (0) The method of forming the partition wall: (A) The PDP back panel for the experiment is formed on a soda-lime glass substrate to form an electrode (the electrode surface is protected by a magnesium oxide layer), and a low-melting glass paste is coated on it. After drying, a partition pattern having a grinding groove width (constant, that is, a constant partition distance) of 100 // m is formed by using a mask material having a sandblast resistance on the surface. (B) Sandblasting Using the experimental PDP back panel manufactured as described above, grinding experiments of various honing materials of the following Examples and Comparative Examples were performed. The processing conditions were set as follows, the partition wall forming time of various honing materials was measured, and the shape of the partition wall and the honing accuracy were observed. Spray nozzle diameter: 10nm Honing material spray pressure: 3.0kg / cm2 (290kPa) Honing material spray amount: 100g / min Distance to panel: 10cm As the material to be honed, the PDP test is used. On the back substrate, the blasting pressure of the sand blasting machine and the weight of the jet of the honing agent per unit time are set to a certain value, and a partition wall formation test is performed to observe the surface properties and shape of the glass substrate at the bottom of the workpiece to evaluate the processing accuracy. In addition, the evaluation of the restartability was also performed. Table 1 shows the composition and evaluation results of the spherical honing material. In addition, the measurement method and evaluation of the characteristics of honing material particles in Table 1 16__ This paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the precautions on the back before filling out this page) ) -------- ITi 534855 A7 ___________B7____ 5. Description of the invention () is carried out by the following method. The maximum particle diameter and average particle diameter of the inorganic particle powder constituting the honing material were measured using Nikkiso Microtrac FRA. As an evaluation of honing efficiency, the cutting speed (seconds) of each honing material with the same spray pressure is measured. The index indicating the sphericity is obtained by randomly selecting 20 points for the particles taken by the electron microscope photograph to obtain an average value of the measured 値. The machining accuracy was evaluated by visually observing the surface properties of the scratches on the bottom of the grooves of the back panel of the PDP after honing, the grooves, and the side erosion thereof using an electron microscope. Good: No scratches, uniform processing shape of the grooves and no side erosion. Slightly bad: Some micro-scratches and / or grooves are slightly uneven in shape and tend to show some side erosion. Defective: There are many scratches and / or uneven machining shapes of the grooves and side erosion. No: The next wall cannot be formed by processing. Example 1 Glass beads with an average particle diameter of 26 // m and a maximum particle diameter of 53 / zm were used. Stearic acid (TST: Miyong Oil & Fat Co., Ltd. Limited) was added to the weight content of the glass beads (solid content) to impart water repellency. (Made by the company) 丨% by weight '100 parts by weight of the glass beads is further added as a flowability improver with an average particle diameter of 0.03 // m of white carbon black (Stasilu s: Shendao Chemical Co., Ltd. (Manufactured) 0.5% by weight, and heated and mixed in a Schell mixer to obtain a honing material. _ 17 卞. The paper size is applicable to China National Standard (CNS) A4 (210 x 297 mm). I --- (Please read the precautions on the back before filling this page) i Order --------- line 534855 A7 B7 V. Description of the invention (A) Use this honing material for sandblasting to form a PDP partition wall. As a result, high-precision processing can be performed without damaging the partition wall. Furthermore, even if the blasting machine is stopped for one day and then the blasting machine is started, the nozzle can be restarted without being blocked. Example 2 Glass beads having an average particle diameter of 30 // m and a maximum particle diameter of 53 V m were used, and 100 parts by weight of the glass beads was added with stearic acid (TST: Miyong Oil Co., Ltd.), which can impart water repellency. (Manufactured) 0.5% by weight, and 100 parts by weight of the glass beads was further added as a flowability improver with an average particle diameter of 0.03 / zm of white carbon black (Stasilu S: manufactured by Kojima Chemical Co., Ltd.) 1 The weight percentage is obtained by heating and mixing with a Henschel mixer to obtain a honing material. The honing material is used for sandblasting to form a PDP partition wall. As a result, high-precision processing can be performed without damaging the partition wall. In addition, even if the blasting machine is left to stand for one day before the blasting machine is started, the nozzle can be restarted without being blocked. Example 3 Using Ming oxygen powder with an average particle diameter of 20 / zm and a maximum particle diameter of 44 // m ', 100 parts by weight of Ming oxygen powder was added with stearic acid (TST: Miyong Oil Co., Ltd.) (Manufactured) 2% by weight, and heated and mixed with a Henschel mixer to obtain a honing material. This honing material is used for sandblasting to form a PDP partition wall. As a result, high-precision processing can be performed without damaging the partition wall. In addition, even if the blasting machine is stopped for one day and then the blasting machine is started, there is no 18 at the nozzle. ------------ * ------- Order · ------- -(Please read the precautions on the back before you fill out this page) Ten 'Chengle scale is applicable to Chinese National Standard (CNS) A4 (210 X 297 mm) 534855 A7 ------ B7___ 5. Description of the invention () Blocked and restartable. Example 4 Using a steel grit with an average particle diameter of 15 // m and a maximum particle diameter of 37 // m, 100 parts by weight of the steel grit was added with stearic acid (TST: Miyong Grease Co., Ltd.) (Product made by the company) 3% by weight, and 100 parts by weight of the steel grit is further added with white carbon black having an average particle diameter of 0.03 // m as a flowability improver (Stasilu S: manufactured by Kojima Chemical Co., Ltd.) 0.3% by weight, using a Henschel mixer for heating and mixing to obtain a honing material. 0 This honing material is used for sandblasting to form a PDP partition wall. As a result, high precision can be achieved without damaging the partition wall and without side erosion. machining. In addition, even if the blasting machine is stopped after being left for one day, the blasting machine can be restarted without being blocked at the nozzle. Example 5 Using glass beads having an average particle diameter of 35 // m and a maximum particle diameter of 74 // m, 100 parts by weight of the glass beads was added with stearic acid (TST: Miyong Grease Co., Ltd.) (Manufactured by the company) 0.1% by weight, and 100 parts by weight of the glass beads was further added as a flowability improver with an average particle diameter of 0.03 / zm of white carbon black (Stasilu S: manufactured by Kojima Chemical Co., Ltd.) 0.3% by weight, and heated and mixed with a Henschel mixer to obtain a honing material. This honing material is used for sandblasting to form PDP partition walls. As a result, high-precision processing can be performed without damaging the partition walls and without side erosion. In addition, even if the blasting machine is stopped for one day before the blasting machine is started, the national standard (CNS) A4 specification (ilO X 297 mm) of the 19 countries is sprayed ^ i----i II — -1 — i I — ij 1 m 1.1 · 1 --- 1 m an if Hi 1-n III 1 n —in 111 I (please fill in this page with the precautions on the back of Mtf) 534855 A? -----__ 5. Description of the invention ( J) The mouth is not blocked and can be restarted. Example 6 Glass beads adjusted to an average particle diameter of 10 " m and a maximum particle diameter of 74 " m were used. 100 parts by weight of the glass beads was added with 3% by weight of stearic acid (TST: manufactured by Meyong Fats & Oils Co., Ltd.), which is a substance capable of imparting water repellency, and 100 parts by weight of the glass beads were further added as a flow. White carbon GU (starsilo s: manufactured by Kojima Chemical Co., Ltd.) having an average particle diameter of 0_03 // m of the property improving agent 2% by weight 'Henzell mixer was used for heating and mixing to obtain a honing material. This honing material is used for sandblasting to form PDP partition walls. As a result, high-precision processing can be performed without damaging the partition walls and without side erosion. In addition, even if the blasting machine is stopped after being left for one day, the blasting machine can be restarted without being blocked at the nozzle. Example 7 A stainless steel powder adjusted to an average particle diameter of 20 // m and a maximum particle diameter of 52 // m was used. To 100 parts by weight of the stainless steel powder, 0.4% by weight of stearic acid (TST: manufactured by Miyong Oil Co., Ltd.), which is a substance capable of imparting water repellency, was added, and the mixture was heated and mixed with a Henschel mixer to obtain a honing material. This honing material is used for sandblasting to form PDP partition walls. As a result, high-precision processing can be performed without damaging the partition walls and without side erosion. In addition, there is no phenomenon of grinding into the wall next to the metal honing material, which can improve the separation efficiency of the magnetic low-melting glass and the metal honing material such as stainless steel, which is the effect. Moreover, even if the blasting machine is stopped for one day and then the blasting machine is started, the nozzle can be restarted smoothly without blocking at the nozzle. 20 _____ This paper is suitable for China National Standard (CNS) A4 (210 X 297 mm) )------------ Fees --------- Order · ------- Line · (Please read the precautions on the back before filling this page) 534855 A7 ________B7 ^ '—- 一 ~ 5. Description of the invention ((?) Example 8 The dense texture of limestone is roasted, aged, and carbonated to produce a maximum particle diameter of 75 / zm and an average particle diameter of 2 // m. Whisker-like calcium carbonate, 1.3 parts by weight of stearic acid (TST: manufactured by Miyong Oil Co., Ltd.) was added to the whisker-like calcium carbonate particle powder 1Q0 parts, and the whisker-like calcium carbonate particle powder was further added. Pyrolytic silicon dioxide (Leo Silo CP-102: manufactured by Tokuyama Soda Co., Ltd.) with an average particle diameter of 0.05 / zm as a fluidity improver is added in parts by weight to 2% by weight. This kind of honing material is used to obtain a honing material. When using this honing material to perform sandblasting to form a PDP partition wall, it was found The tendency of erosion, part of the partition wall is damaged, the accuracy of the partition wall is slightly poor. It is slightly difficult to restart after stopping sandblasting for one day. Comparative Example 1 Glass beads with an average particle diameter of 60 μm and a maximum particle diameter of 74 / zm are used. 100 parts by weight of glass beads are added as a flowability improver, and white carbon black having an average particle diameter of 0.03 // m (Stasilu s: manufactured by Kojima Chemical Co., Ltd.) 0.3% by weight, A Henschel mixer was used to heat and mix to obtain a honing material. When the honing material was used for sand blasting to form a PDP partition, it was found that the partition would collapse. In addition, when the sand blasting machine was stopped and placed for one day, it was restarted in the sand blasting machine and Condensation of honing materials will occur near the nozzle and cannot be restarted. Comparative Example 2 _____21 " ^ Paper size consumption ☆ National Standard (CNS) A4—Specification (21Q x 297 Public Love) " (Please read first Note on the back, please fill in this page again.) Order _ --- line-534855 A7 _____B7______ 5. Description of the invention (7-) Use glass beads adjusted to average particle diameter 10 / im and maximum particle diameter 105 / zm. 100 weight on the glass beads Add 2% by weight of white carbon black (Star Shilu S: manufactured by Shinshima Chemical Co., Ltd.) with an average particle diameter of 0.03 // m as a flowability improver, and heat-mix with a Henschel mixer. A honing material was obtained. When the honing material was used for sandblasting to form a PDP partition wall, it was found that a part of the partition wall would collapse. Also, when the blasting machine was stopped and left for one day, it would restart. The agglomeration of the abrasive cannot be restarted. Comparative Example 3 Glass beads adjusted to an average particle diameter of 20 / zm and a maximum particle diameter of 62 // m were used. 100 parts by weight of this glass bead was added as a fluidity improver a white carbon black having an average particle diameter of 0.03 // m (Stasilu S: manufactured by Kojima Chemical Co., Ltd.) in an amount of 2% by weight. The mixer is used to heat and mix to obtain the honing material. When this honing material was used for sandblasting to form a PDP partition wall, it was found that 'the partition wall can be formed but side corrosion tends to occur.' In addition, when the blasting machine is stopped for one day and then restarted, the honing material aggregates in the blasting machine and near the nozzle, and the restarting cannot be performed. Comparative Example 4 As the honing material, glass beads adjusted to an average particle diameter of 15 // m and a maximum particle diameter of 44 Vm were used. When using this honing material to perform a sandblasting process to form a PDp partition wall, it was found that there was a tendency of severe side erosion, and the partition wall could not be formed with high accuracy. Also 'stop each paper size applicable by the national standard (CNS) A4 specifications (210 X 297 public love) ------------ fee ------order ------- --- Line 0 (Please read the precautions on the back before filling in this page) 22_____ 534855 A7 _B7 __ V. Description of the invention (W) When the sandblasting machine is left for one day and then restarted, it will happen in the sandblasting machine and near the nozzle. The agglutination of the honing material cannot be restarted. Comparative Example 5 A stainless steel powder adjusted to an average particle diameter of 25 // m and a maximum particle diameter of 150 / zm was used as a honing material. When this honing material was used for sandblasting to form a PDP partition wall, it was found that side erosion tended to occur, and a part of the partition wall was damaged, and the partition wall could not be formed with high accuracy. In addition, the phenomenon of abrasion into the wall and adhesion due to the disadvantages of metal honing materials occurred. Furthermore, the separation efficiency of magnetic low-melting glass and metal honing materials such as stainless steel is deteriorated, and it is not possible to reuse low-melting glass. It will be slightly difficult to stop the blasting machine and leave it for a day. T 1: 3 n ---- *.: — Hi «I m I— I— i It 1 n III i 1 1 1 n 1 I« I 111---am 118 ii I 口 ^ vy ^^ ( Please read the precautions on the back before filling in this page) Example Spherical inorganic particles Hydrophobicity-imparting substance (%) Flowability improver (%) B Average particle diameter (# m) A Maximum particle diameter (" m) Spherical Index (%) Restartability Processing accuracy Example 1 Glass bead 1 0.5 26 53 98 Good example 2 Glass bead 0.5 1 30 53 98 Good example 3: Aluminum oxide powder 2 0 20 44 96 Good example 4 Grit 3 0.3 15 37 97 Good example 5 Glass beads 0.1 0.3 35 74 98 Good example 6 Glass beads 3 2 10 74 99 Good example 7 Stainless steel 0.4 0 20 52 58 Good example 8 Calcium carbonate 1.3 2 2 75 32 Slightly difficult Slightly poor Comparative example 1 Glass beads 0 0.3 60 74 98 Unable to fail Comparative example 2 Glass beads 0 2 10 105 98 Unsatisfactory comparative example 3 Glass beads 0 2 20 62 98 Unable to compare slightly Example 4 Glass beads 0 0 15 44 98 Cannot be bad Comparative example 5 Stainless steel 0 0 25 150 55 Slightly difficult and bad 23 Paper size Applicable by the national standard (CNS) A4 specification (210 X 297 public love) 534855 A7 ___B7_______ V. Description of the invention (>) A: The maximum particle diameter of spherical inorganic particles (/ zm) (Please read the Please fill in this page again for details) B: Average particle diameter of spherical inorganic particles (// m) C: Minimum groove width for grinding (// m) (Note) 10 ^ 80 3 ^ B ^ 50 C = 1000 (/ / m) [Effects of the invention] As described above, the honing material of the present invention is surface-treated with a water-repellent substance, so it can effectively prevent the honing material from aggregating, consolidating, and adhering due to moisture. For problems such as honing objects, such as the process of forming a partition wall of a PDP panel, and the scribe process of solar cells, the maximum particle diameter and average particle diameter are controlled according to the minimum groove width required for grinding. Used as a honing material with excellent honing efficiency and processing accuracy. 24 This paper size applies to the national standard (CNS) A4 specification (210 X 297 mm)

Claims (1)

534855 A8B8C8D8 六、申請專利範圍 (請先閲讀背面之注意事項再填寫本頁) 1. 一種乾式噴砂加工用硏磨材,其特徵在於,係含有 球狀無機粒子、以及相對於球狀無機粒子爲0·1 2〜5重量% 之賦予撥水性之物質。 2. 如申請專利範圍第1項之硏磨材,其中,相對於球 狀無機粒子係含有0.01〜5重量%之平均粒子徑爲球狀無機 粒子之平均粒子徑之十分之一以下的流動性改良劑。 3. 如申請專利範圍第1項之硏磨材,係讓球狀無機粒 子滿足下述式(1)〜(3): 10^ A^0.8C (1) 0.02C^B^0.5C (2) 50^C^ 1000 (3) 其中, A :硏磨材之最大粒子徑(//m) B :硏磨材之平均粒子徑(//m) C :磨削最小槽寬(// m)。 4. 申請專利範圍第1〜3項中任一項之硏磨材,係使用 於半導體之氧化被膜之去除上。 5. 如申請專利範圍第1〜3項中任一項之硏磨材,係使 用於對PDP之背面基板上之肋材的形成上。 6. 如申請專利範圍第1〜3項中任一項之硏磨材,係使 用於太陽電池兀件之串聯用刻劃線的形成上。 1 2 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐)534855 A8B8C8D8 6. Scope of patent application (please read the precautions on the back before filling this page) 1. A type of honing material for dry blast processing, which is characterized by containing spherical inorganic particles and 0.1 · 2 to 5% by weight. 2. For example, the honing material of the scope of patent application, wherein the average particle diameter of the spherical inorganic particles is 0.01 to 5% by weight, and the flow is less than one tenth of the average particle diameter of the spherical inorganic particles. Sex improver. 3. As for the honing material of the scope of patent application, the spherical inorganic particles satisfy the following formulas (1) to (3): 10 ^ A ^ 0.8C (1) 0.02C ^ B ^ 0.5C (2 ) 50 ^ C ^ 1000 (3) where: A: the largest particle diameter of the honing material (// m) B: the average particle diameter of the honing material (// m) C: the minimum groove width of the grinding (// m ). 4. The honing material of any one of the items 1 to 3 of the scope of patent application is used for the removal of oxide coatings on semiconductors. 5. The honing material according to any of claims 1 to 3 of the scope of patent application is used to form the rib material on the back substrate of the PDP. 6. The honing material according to any one of claims 1 to 3 of the scope of patent application is used for the formation of engraved lines for series connection of solar cell elements. 1 2 This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)
TW090129787A 2000-12-28 2001-12-03 Polishing material for dry blast processing TW534855B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000401101 2000-12-28
JP2001365837A JP2002256255A (en) 2000-12-28 2001-11-30 Polishing material for dry blast processing

Publications (1)

Publication Number Publication Date
TW534855B true TW534855B (en) 2003-06-01

Family

ID=26607083

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090129787A TW534855B (en) 2000-12-28 2001-12-03 Polishing material for dry blast processing

Country Status (3)

Country Link
JP (1) JP2002256255A (en)
KR (1) KR20020055439A (en)
TW (1) TW534855B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009030003A (en) * 2007-07-24 2009-02-12 Mizue Shokai:Kk Hardly-soluble granular sodium bicarbonate and its manufacturing method
CN110587491A (en) * 2019-09-28 2019-12-20 深圳市佰石特石业有限公司 Marble leather surface treatment process

Also Published As

Publication number Publication date
KR20020055439A (en) 2002-07-08
JP2002256255A (en) 2002-09-11

Similar Documents

Publication Publication Date Title
CN112041120B (en) Abrasive article comprising shaped abrasive particles having a predetermined angle of inclination
TW479285B (en) Method of modifying a wafer suited for semiconductor fabrication
TW533229B (en) Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
RU2178599C2 (en) Cerium oxide abrasive and substrate polishing technique
KR100456208B1 (en) Method of modifying an exposed surface of a semiconductor wafer
EP3049215B1 (en) Composite ceramic abrasive polishing solution
CN106103615B (en) Metal oxide-polymer composite particles for chemical-mechanical planarization
WO2015048011A1 (en) Multi-layered polishing pads
KR102378196B1 (en) Method for removing deposited material
JP2007015103A (en) Improved design polishing material
CN102356139A (en) Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same
US20170226380A1 (en) Polishing solutions and methods of using same
ZA200605221B (en) Method of abrading a workpiece
CA2902273A1 (en) A method to provide an abrasive product surface and abrasive products thereof
JP2002353175A (en) Cerium oxide abrasive and manufacturing method for substrate
JP2008260125A (en) Anti-loading process
CN104726061A (en) Abrasive, grinding member and preparation method thereof
CN110281160A (en) The surface treatment method of the workpiece made of hard brittle material
JP2021522083A (en) Finishing medium and finishing suspension
TW201305067A (en) Light scattering articles by abrasion and etch
CN102939643B (en) For composition and the method for polishing bulk silicon
TW200305638A (en) Anti-loading treatments
TW534855B (en) Polishing material for dry blast processing
TWI768329B (en) Physical dry surface treatment method of semiconductor wafer and composition for surface treatment thereof
JP2002160162A (en) Polishing material

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees