JP4328468B2 - ウェーハ処理用シリコン固定具の製造方法 - Google Patents

ウェーハ処理用シリコン固定具の製造方法 Download PDF

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Publication number
JP4328468B2
JP4328468B2 JP2000612987A JP2000612987A JP4328468B2 JP 4328468 B2 JP4328468 B2 JP 4328468B2 JP 2000612987 A JP2000612987 A JP 2000612987A JP 2000612987 A JP2000612987 A JP 2000612987A JP 4328468 B2 JP4328468 B2 JP 4328468B2
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silicon
wafer
blank
base
leg
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JP2000612987A
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Japanese (ja)
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JP2002542621A5 (enExample
JP2002542621A (ja
Inventor
ゼハビ ラアナン
デイビス ロバート
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インテグレイティッド マテリアルズ インク
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Priority claimed from US09/292,491 external-priority patent/US6225594B1/en
Priority claimed from US09/292,496 external-priority patent/US6205993B1/en
Priority claimed from US09/292,495 external-priority patent/US6196211B1/en
Application filed by インテグレイティッド マテリアルズ インク filed Critical インテグレイティッド マテリアルズ インク
Publication of JP2002542621A publication Critical patent/JP2002542621A/ja
Publication of JP2002542621A5 publication Critical patent/JP2002542621A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2000612987A 1999-04-15 2000-04-06 ウェーハ処理用シリコン固定具の製造方法 Expired - Lifetime JP4328468B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US09/292,491 US6225594B1 (en) 1999-04-15 1999-04-15 Method and apparatus for securing components of wafer processing fixtures
US09/292,496 US6205993B1 (en) 1999-04-15 1999-04-15 Method and apparatus for fabricating elongate crystalline members
US09/292,491 1999-04-15
US09/292,495 1999-04-15
US09/292,496 1999-04-15
US09/292,495 US6196211B1 (en) 1999-04-15 1999-04-15 Support members for wafer processing fixtures
PCT/US2000/009362 WO2000063952A1 (en) 1999-04-15 2000-04-06 Silicon fixtures for wafer processing and method of fabrication

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009106498A Division JP2009170938A (ja) 1999-04-15 2009-04-24 ウェーハ処理用シリコン固定具およびその製造方法

Publications (3)

Publication Number Publication Date
JP2002542621A JP2002542621A (ja) 2002-12-10
JP2002542621A5 JP2002542621A5 (enExample) 2006-01-05
JP4328468B2 true JP4328468B2 (ja) 2009-09-09

Family

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Family Applications (2)

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JP2000612987A Expired - Lifetime JP4328468B2 (ja) 1999-04-15 2000-04-06 ウェーハ処理用シリコン固定具の製造方法
JP2009106498A Pending JP2009170938A (ja) 1999-04-15 2009-04-24 ウェーハ処理用シリコン固定具およびその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2009106498A Pending JP2009170938A (ja) 1999-04-15 2009-04-24 ウェーハ処理用シリコン固定具およびその製造方法

Country Status (4)

Country Link
EP (1) EP1171905A1 (enExample)
JP (2) JP4328468B2 (enExample)
TW (1) TW457618B (enExample)
WO (1) WO2000063952A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6284997B1 (en) 2000-11-08 2001-09-04 Integrated Materials, Inc. Crack free welding of silicon
US6811040B2 (en) * 2001-07-16 2004-11-02 Rohm And Haas Company Wafer holding apparatus
JP2003086525A (ja) * 2001-09-12 2003-03-20 Toshiba Ceramics Co Ltd シリコンウエハ熱処理用治具およびその製造方法
US6838114B2 (en) 2002-05-24 2005-01-04 Micron Technology, Inc. Methods for controlling gas pulsing in processes for depositing materials onto micro-device workpieces
US6955725B2 (en) 2002-08-15 2005-10-18 Micron Technology, Inc. Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces
US7335396B2 (en) 2003-04-24 2008-02-26 Micron Technology, Inc. Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers
US7235138B2 (en) 2003-08-21 2007-06-26 Micron Technology, Inc. Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces
US7344755B2 (en) 2003-08-21 2008-03-18 Micron Technology, Inc. Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers
US7422635B2 (en) 2003-08-28 2008-09-09 Micron Technology, Inc. Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces
US7056806B2 (en) 2003-09-17 2006-06-06 Micron Technology, Inc. Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces
US7282239B2 (en) 2003-09-18 2007-10-16 Micron Technology, Inc. Systems and methods for depositing material onto microfeature workpieces in reaction chambers
US7323231B2 (en) 2003-10-09 2008-01-29 Micron Technology, Inc. Apparatus and methods for plasma vapor deposition processes
US7581511B2 (en) 2003-10-10 2009-09-01 Micron Technology, Inc. Apparatus and methods for manufacturing microfeatures on workpieces using plasma vapor processes
US7258892B2 (en) 2003-12-10 2007-08-21 Micron Technology, Inc. Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition
US7906393B2 (en) 2004-01-28 2011-03-15 Micron Technology, Inc. Methods for forming small-scale capacitor structures
US7584942B2 (en) 2004-03-31 2009-09-08 Micron Technology, Inc. Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers
US8133554B2 (en) 2004-05-06 2012-03-13 Micron Technology, Inc. Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces
US7972703B2 (en) * 2005-03-03 2011-07-05 Ferrotec (Usa) Corporation Baffle wafers and randomly oriented polycrystalline silicon used therefor
JP2006286874A (ja) * 2005-03-31 2006-10-19 Komatsu Electronic Metals Co Ltd ウェーハ熱処理用治具及び熱処理後のウェーハ
JP5519389B2 (ja) * 2010-04-23 2014-06-11 株式会社ブリヂストン 支持ピン
KR101035552B1 (ko) * 2011-03-24 2011-05-23 (주)상아프론테크 솔라웨이퍼 카세트
US10770285B2 (en) 2013-03-28 2020-09-08 Mitsubishi Materials Corporation Silicon member and method of producing the same

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6228437U (enExample) * 1985-08-01 1987-02-20
JPH0761849B2 (ja) * 1987-12-09 1995-07-05 株式会社トクヤマ 構造体
US4914269A (en) * 1989-07-24 1990-04-03 Micron Technology, Inc. Method of sealing a ceramic lid on a ceramic semiconductor package with a high-power laser
JPH046826A (ja) * 1990-04-24 1992-01-10 Tokyo Electron Ltd 熱処理装置
JP2566340B2 (ja) * 1990-11-19 1996-12-25 東芝セラミックス株式会社 シリコン製ウエハ支持ボートの製造方法
JPH04300262A (ja) * 1991-03-28 1992-10-23 Shin Etsu Chem Co Ltd 炭化珪素質治具
JPH06151571A (ja) * 1992-11-06 1994-05-31 Toshiba Ceramics Co Ltd 単結晶シリコン製ウェーハボート
JPH06163676A (ja) * 1992-11-20 1994-06-10 Toshiba Ceramics Co Ltd ウエハボート
US5492229A (en) * 1992-11-27 1996-02-20 Toshiba Ceramics Co., Ltd. Vertical boat and a method for making the same
JP3245246B2 (ja) * 1993-01-27 2002-01-07 東京エレクトロン株式会社 熱処理装置
JP3117573B2 (ja) * 1993-04-02 2000-12-18 東芝セラミックス株式会社 窒化ケイ素繊維強化シリコン材及びその製造方法
JPH08107079A (ja) * 1994-09-30 1996-04-23 Toshiba Ceramics Co Ltd 縦型ウェ−ハボ−ト及び縦型熱処理炉
JP3773973B2 (ja) * 1995-12-25 2006-05-10 株式会社トクヤマ シリコン成形体用前駆体
JPH09213645A (ja) * 1996-01-29 1997-08-15 Sumitomo Sitix Corp ウェーハ支持装置及びその製造方法
TW325588B (en) * 1996-02-28 1998-01-21 Asahi Glass Co Ltd Vertical wafer boat
JP3479201B2 (ja) * 1997-03-28 2003-12-15 東芝セラミックス株式会社 組立式ウエハ用ボート及びその取付治具
JPH10284427A (ja) * 1997-04-03 1998-10-23 Mitsubishi Materials Corp シリコンウエハ支持装置
JP3507975B2 (ja) * 1997-04-15 2004-03-15 東芝セラミックス株式会社 縦型ウエハボート
JP3568017B2 (ja) * 1997-06-25 2004-09-22 東芝セラミックス株式会社 ウエハボート
US6171400B1 (en) * 1998-10-02 2001-01-09 Union Oil Company Of California Vertical semiconductor wafer carrier

Also Published As

Publication number Publication date
WO2000063952A1 (en) 2000-10-26
EP1171905A1 (en) 2002-01-16
TW457618B (en) 2001-10-01
JP2009170938A (ja) 2009-07-30
JP2002542621A (ja) 2002-12-10

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