JP2002542621A5 - - Google Patents
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- Publication number
- JP2002542621A5 JP2002542621A5 JP2000612987A JP2000612987A JP2002542621A5 JP 2002542621 A5 JP2002542621 A5 JP 2002542621A5 JP 2000612987 A JP2000612987 A JP 2000612987A JP 2000612987 A JP2000612987 A JP 2000612987A JP 2002542621 A5 JP2002542621 A5 JP 2002542621A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/292,495 US6196211B1 (en) | 1999-04-15 | 1999-04-15 | Support members for wafer processing fixtures |
| US09/292,491 | 1999-04-15 | ||
| US09/292,496 | 1999-04-15 | ||
| US09/292,495 | 1999-04-15 | ||
| US09/292,491 US6225594B1 (en) | 1999-04-15 | 1999-04-15 | Method and apparatus for securing components of wafer processing fixtures |
| US09/292,496 US6205993B1 (en) | 1999-04-15 | 1999-04-15 | Method and apparatus for fabricating elongate crystalline members |
| PCT/US2000/009362 WO2000063952A1 (en) | 1999-04-15 | 2000-04-06 | Silicon fixtures for wafer processing and method of fabrication |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009106498A Division JP2009170938A (ja) | 1999-04-15 | 2009-04-24 | ウェーハ処理用シリコン固定具およびその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002542621A JP2002542621A (ja) | 2002-12-10 |
| JP2002542621A5 true JP2002542621A5 (enExample) | 2006-01-05 |
| JP4328468B2 JP4328468B2 (ja) | 2009-09-09 |
Family
ID=27404131
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000612987A Expired - Lifetime JP4328468B2 (ja) | 1999-04-15 | 2000-04-06 | ウェーハ処理用シリコン固定具の製造方法 |
| JP2009106498A Pending JP2009170938A (ja) | 1999-04-15 | 2009-04-24 | ウェーハ処理用シリコン固定具およびその製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009106498A Pending JP2009170938A (ja) | 1999-04-15 | 2009-04-24 | ウェーハ処理用シリコン固定具およびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1171905A1 (enExample) |
| JP (2) | JP4328468B2 (enExample) |
| TW (1) | TW457618B (enExample) |
| WO (1) | WO2000063952A1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6284997B1 (en) * | 2000-11-08 | 2001-09-04 | Integrated Materials, Inc. | Crack free welding of silicon |
| US6811040B2 (en) * | 2001-07-16 | 2004-11-02 | Rohm And Haas Company | Wafer holding apparatus |
| JP2003086525A (ja) * | 2001-09-12 | 2003-03-20 | Toshiba Ceramics Co Ltd | シリコンウエハ熱処理用治具およびその製造方法 |
| US6838114B2 (en) | 2002-05-24 | 2005-01-04 | Micron Technology, Inc. | Methods for controlling gas pulsing in processes for depositing materials onto micro-device workpieces |
| US6955725B2 (en) | 2002-08-15 | 2005-10-18 | Micron Technology, Inc. | Reactors with isolated gas connectors and methods for depositing materials onto micro-device workpieces |
| US7335396B2 (en) | 2003-04-24 | 2008-02-26 | Micron Technology, Inc. | Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers |
| US7344755B2 (en) | 2003-08-21 | 2008-03-18 | Micron Technology, Inc. | Methods and apparatus for processing microfeature workpieces; methods for conditioning ALD reaction chambers |
| US7235138B2 (en) | 2003-08-21 | 2007-06-26 | Micron Technology, Inc. | Microfeature workpiece processing apparatus and methods for batch deposition of materials on microfeature workpieces |
| US7422635B2 (en) | 2003-08-28 | 2008-09-09 | Micron Technology, Inc. | Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpieces |
| US7056806B2 (en) | 2003-09-17 | 2006-06-06 | Micron Technology, Inc. | Microfeature workpiece processing apparatus and methods for controlling deposition of materials on microfeature workpieces |
| US7282239B2 (en) | 2003-09-18 | 2007-10-16 | Micron Technology, Inc. | Systems and methods for depositing material onto microfeature workpieces in reaction chambers |
| US7323231B2 (en) | 2003-10-09 | 2008-01-29 | Micron Technology, Inc. | Apparatus and methods for plasma vapor deposition processes |
| US7581511B2 (en) | 2003-10-10 | 2009-09-01 | Micron Technology, Inc. | Apparatus and methods for manufacturing microfeatures on workpieces using plasma vapor processes |
| US7258892B2 (en) | 2003-12-10 | 2007-08-21 | Micron Technology, Inc. | Methods and systems for controlling temperature during microfeature workpiece processing, e.g., CVD deposition |
| US7906393B2 (en) | 2004-01-28 | 2011-03-15 | Micron Technology, Inc. | Methods for forming small-scale capacitor structures |
| US7584942B2 (en) | 2004-03-31 | 2009-09-08 | Micron Technology, Inc. | Ampoules for producing a reaction gas and systems for depositing materials onto microfeature workpieces in reaction chambers |
| US8133554B2 (en) | 2004-05-06 | 2012-03-13 | Micron Technology, Inc. | Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces |
| US7972703B2 (en) * | 2005-03-03 | 2011-07-05 | Ferrotec (Usa) Corporation | Baffle wafers and randomly oriented polycrystalline silicon used therefor |
| JP2006286874A (ja) * | 2005-03-31 | 2006-10-19 | Komatsu Electronic Metals Co Ltd | ウェーハ熱処理用治具及び熱処理後のウェーハ |
| JP5519389B2 (ja) * | 2010-04-23 | 2014-06-11 | 株式会社ブリヂストン | 支持ピン |
| KR101035552B1 (ko) * | 2011-03-24 | 2011-05-23 | (주)상아프론테크 | 솔라웨이퍼 카세트 |
| EP2784422B1 (en) | 2013-03-28 | 2017-10-04 | Mitsubishi Materials Corporation | Holding plate for deposition and heat treatment and method of producing the same |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6228437U (enExample) * | 1985-08-01 | 1987-02-20 | ||
| JPH0761849B2 (ja) * | 1987-12-09 | 1995-07-05 | 株式会社トクヤマ | 構造体 |
| US4914269A (en) * | 1989-07-24 | 1990-04-03 | Micron Technology, Inc. | Method of sealing a ceramic lid on a ceramic semiconductor package with a high-power laser |
| JPH046826A (ja) * | 1990-04-24 | 1992-01-10 | Tokyo Electron Ltd | 熱処理装置 |
| JP2566340B2 (ja) * | 1990-11-19 | 1996-12-25 | 東芝セラミックス株式会社 | シリコン製ウエハ支持ボートの製造方法 |
| JPH04300262A (ja) * | 1991-03-28 | 1992-10-23 | Shin Etsu Chem Co Ltd | 炭化珪素質治具 |
| JPH06151571A (ja) * | 1992-11-06 | 1994-05-31 | Toshiba Ceramics Co Ltd | 単結晶シリコン製ウェーハボート |
| JPH06163676A (ja) * | 1992-11-20 | 1994-06-10 | Toshiba Ceramics Co Ltd | ウエハボート |
| US5492229A (en) * | 1992-11-27 | 1996-02-20 | Toshiba Ceramics Co., Ltd. | Vertical boat and a method for making the same |
| JP3245246B2 (ja) * | 1993-01-27 | 2002-01-07 | 東京エレクトロン株式会社 | 熱処理装置 |
| JP3117573B2 (ja) * | 1993-04-02 | 2000-12-18 | 東芝セラミックス株式会社 | 窒化ケイ素繊維強化シリコン材及びその製造方法 |
| JPH08107079A (ja) * | 1994-09-30 | 1996-04-23 | Toshiba Ceramics Co Ltd | 縦型ウェ−ハボ−ト及び縦型熱処理炉 |
| JP3773973B2 (ja) * | 1995-12-25 | 2006-05-10 | 株式会社トクヤマ | シリコン成形体用前駆体 |
| JPH09213645A (ja) * | 1996-01-29 | 1997-08-15 | Sumitomo Sitix Corp | ウェーハ支持装置及びその製造方法 |
| TW325588B (en) * | 1996-02-28 | 1998-01-21 | Asahi Glass Co Ltd | Vertical wafer boat |
| JP3479201B2 (ja) * | 1997-03-28 | 2003-12-15 | 東芝セラミックス株式会社 | 組立式ウエハ用ボート及びその取付治具 |
| JPH10284427A (ja) * | 1997-04-03 | 1998-10-23 | Mitsubishi Materials Corp | シリコンウエハ支持装置 |
| JP3507975B2 (ja) * | 1997-04-15 | 2004-03-15 | 東芝セラミックス株式会社 | 縦型ウエハボート |
| JP3568017B2 (ja) * | 1997-06-25 | 2004-09-22 | 東芝セラミックス株式会社 | ウエハボート |
| US6171400B1 (en) * | 1998-10-02 | 2001-01-09 | Union Oil Company Of California | Vertical semiconductor wafer carrier |
-
2000
- 2000-04-06 JP JP2000612987A patent/JP4328468B2/ja not_active Expired - Lifetime
- 2000-04-06 WO PCT/US2000/009362 patent/WO2000063952A1/en not_active Ceased
- 2000-04-06 EP EP00928143A patent/EP1171905A1/en not_active Withdrawn
- 2000-04-10 TW TW89106650A patent/TW457618B/zh not_active IP Right Cessation
-
2009
- 2009-04-24 JP JP2009106498A patent/JP2009170938A/ja active Pending