JP4326219B2 - 電気回路用の取付け部を有する電気スイッチ - Google Patents

電気回路用の取付け部を有する電気スイッチ Download PDF

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Publication number
JP4326219B2
JP4326219B2 JP2002575972A JP2002575972A JP4326219B2 JP 4326219 B2 JP4326219 B2 JP 4326219B2 JP 2002575972 A JP2002575972 A JP 2002575972A JP 2002575972 A JP2002575972 A JP 2002575972A JP 4326219 B2 JP4326219 B2 JP 4326219B2
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JP
Japan
Prior art keywords
electrical
insulating film
housing
electrical switch
metal part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002575972A
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English (en)
Japanese (ja)
Other versions
JP2004527120A5 (enExample
JP2004527120A (ja
Inventor
ペーター ブロゲハンマー
ペーター ヴァール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marquardt GmbH
Original Assignee
Marquardt GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marquardt GmbH filed Critical Marquardt GmbH
Publication of JP2004527120A publication Critical patent/JP2004527120A/ja
Publication of JP2004527120A5 publication Critical patent/JP2004527120A5/ja
Application granted granted Critical
Publication of JP4326219B2 publication Critical patent/JP4326219B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/02—Bases, casings, or covers
    • H01H9/06—Casing of switch constituted by a handle serving a purpose other than the actuation of the switch, e.g. by the handle of a vacuum cleaner
    • H01H9/061—Casing of switch constituted by a handle serving a purpose other than the actuation of the switch, e.g. by the handle of a vacuum cleaner enclosing a continuously variable impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/52—Cooling of switch parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Push-Button Switches (AREA)
  • Multi-Conductor Connections (AREA)
  • Relay Circuits (AREA)
  • Switch Cases, Indication, And Locking (AREA)
  • Electronic Switches (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2002575972A 2001-03-24 2002-03-22 電気回路用の取付け部を有する電気スイッチ Expired - Fee Related JP4326219B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10114572A DE10114572A1 (de) 2001-03-24 2001-03-24 Träger für eine elektrische Schaltung, insbesondere für einen elektrischen Schalter
PCT/DE2002/001044 WO2002078029A1 (de) 2001-03-24 2002-03-22 Träger für eine elektrische schaltung, insbesondere für einen elektrischen schalter

Publications (3)

Publication Number Publication Date
JP2004527120A JP2004527120A (ja) 2004-09-02
JP2004527120A5 JP2004527120A5 (enExample) 2008-02-07
JP4326219B2 true JP4326219B2 (ja) 2009-09-02

Family

ID=7678917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002575972A Expired - Fee Related JP4326219B2 (ja) 2001-03-24 2002-03-22 電気回路用の取付け部を有する電気スイッチ

Country Status (7)

Country Link
US (1) US7313001B2 (enExample)
EP (1) EP1374266B1 (enExample)
JP (1) JP4326219B2 (enExample)
CN (1) CN100349236C (enExample)
AT (1) ATE365371T1 (enExample)
DE (3) DE10114572A1 (enExample)
WO (1) WO2002078029A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004003048A1 (de) 2003-01-22 2004-08-05 Marquardt Gmbh Elektrisches Verbindungselement, insbesondere für Elektrowerkzeugschalter
DE102005010129A1 (de) * 2004-03-05 2005-09-15 Marquardt Gmbh Elektrische Schaltungsanordnung für ein Elektrowerkzeug
JP5248151B2 (ja) * 2008-03-12 2013-07-31 株式会社マキタ 電動工具
US20110178874A1 (en) * 2010-01-18 2011-07-21 Rabih Salem Ballout Service for Providing an Interactive, Personalized Radio Network
DE102010035169A1 (de) 2010-08-23 2012-02-23 Marquardt Verwaltungs-Gmbh Elektrischer Schalter für Elektrohandwerkzeuge
US8351221B2 (en) * 2011-01-14 2013-01-08 Rf Micro Devices, Inc. Stacked shield compartments for electronic components
DE102011004171A1 (de) * 2011-02-15 2012-08-16 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg Temperierelement und Verfahren zur Befestigung eines Elektrobauteils an dem Temperierelement
EP2525468B1 (en) 2011-05-19 2017-06-21 Black & Decker Inc. Electronic power apparatus
US10043619B2 (en) 2014-03-28 2018-08-07 Black & Decker Inc. Biasing member for a power tool forward/reverse actuator
DE102016003150A1 (de) * 2016-03-16 2017-09-21 Andreas Stihl Ag & Co. Kg Handgeführtes Arbeitsgerät mit einem Elektromotor
US10541588B2 (en) 2017-05-24 2020-01-21 Black & Decker Inc. Electronic power module for a power tool having an integrated heat sink
US10608501B2 (en) 2017-05-24 2020-03-31 Black & Decker Inc. Variable-speed input unit having segmented pads for a power tool
EP3588524B1 (en) 2018-06-28 2020-08-05 Black & Decker Inc. Electronic switch module with an integrated flyback diode
JP7564025B2 (ja) * 2021-03-12 2024-10-08 日本特殊陶業株式会社 配線基板
JP7611740B2 (ja) 2021-03-12 2025-01-10 日本特殊陶業株式会社 配線基板

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4404059A (en) * 1982-05-26 1983-09-13 Livshits Vladimir I Process for manufacturing panels to be used in microelectronic systems
US4698471A (en) * 1985-09-30 1987-10-06 Eaton Corporation Trigger operated portable electric tool switch
GB8601746D0 (en) * 1986-01-24 1986-02-26 British Telecomm Heat sink
JPS62199437A (ja) 1986-02-28 1987-09-03 昭和電工株式会社 プリント基板
DE3629976A1 (de) 1986-09-03 1988-04-07 Hueco Gmbh Fabrik Fuer Interna Spannungsregler fuer generatoren
US5055967A (en) * 1988-10-26 1991-10-08 Texas Instruments Incorporated Substrate for an electrical circuit system and a circuit system using that substrate
US5355280A (en) * 1989-09-27 1994-10-11 Robert Bosch Gmbh Connection arrangement with PC board
JPH04287396A (ja) * 1991-03-18 1992-10-12 Fujitsu Ltd 小形電子装置筐体
DE4114854A1 (de) 1991-05-07 1992-11-12 Marquardt Gmbh Schalter, insbesondere akku-schalter fuer handbetaetigte elektrowerkzeuge
US5198793A (en) * 1991-07-30 1993-03-30 Eaton Corporation Electric control apparatus comprising integral electrical conductors plated on a two-shot molded plastic insulating housing
JP2936855B2 (ja) * 1991-12-26 1999-08-23 富士電機株式会社 電力用半導体装置
JP2698278B2 (ja) 1992-01-31 1998-01-19 三洋電機株式会社 混成集積回路装置
US5198693A (en) 1992-02-05 1993-03-30 International Business Machines Corporation Aperture formation in aluminum circuit card for enhanced thermal dissipation
US5179501A (en) * 1992-02-24 1993-01-12 Motorola, Inc. Laminated electronic module assembly
JPH07123186B2 (ja) 1992-09-25 1995-12-25 松下電工株式会社 回路装置
JP2988243B2 (ja) * 1994-03-16 1999-12-13 株式会社日立製作所 パワー混成集積回路装置
US6200407B1 (en) * 1994-08-18 2001-03-13 Rockwell Technologies, Llc Method of making a multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area
US5459640A (en) * 1994-09-23 1995-10-17 Motorola, Inc. Electrical module mounting apparatus and method thereof
JPH08139423A (ja) 1994-11-09 1996-05-31 Mitsui Mining & Smelting Co Ltd 電子回路
US6355885B1 (en) * 1996-05-02 2002-03-12 William J. Rintz Sub frame assembly for light switch assembly
DE19641397A1 (de) * 1996-09-27 1998-04-02 Siemens Ag Verfahren zum Herstellen einer wärmeableitenden Leiterplatte
JP3220075B2 (ja) 1997-11-26 2001-10-22 エヌイーシーモバイリング株式会社 車載機用及び車携帯機用無線装置の互換構造
DE19900603A1 (de) 1999-01-11 2000-07-13 Bosch Gmbh Robert Elektronisches Halbleitermodul
NL1011843C2 (nl) * 1999-04-20 2000-11-06 Capax B V Verbeterde schakelaar voor elektrisch gereedschap.

Also Published As

Publication number Publication date
CN100349236C (zh) 2007-11-14
EP1374266A1 (de) 2004-01-02
DE10114572A1 (de) 2002-11-07
US7313001B2 (en) 2007-12-25
WO2002078029A1 (de) 2002-10-03
ATE365371T1 (de) 2007-07-15
DE10212449A1 (de) 2003-05-08
DE50210352D1 (de) 2007-08-02
EP1374266B1 (de) 2007-06-20
CN1498410A (zh) 2004-05-19
JP2004527120A (ja) 2004-09-02
US20040085740A1 (en) 2004-05-06

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