JP4324952B2 - Inductance element manufacturing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method of manufacturing an inductance element that can be mounted on a substrate or the like in a space-saving manner and is lightweight and easy to manufacture.
[0002]
[Prior art]
Conventionally, as a method for manufacturing this type of inductance element, a method of winding a wire such as a copper wire using a magnetic material such as ferrite as a core core is known. Such an inductance element takes time and effort to wind a wire around a core, and is difficult to reduce in size and is often heavy. Therefore, in recent years, for example, as shown in Patent Document 1, an upper wiring layer for forming a plurality of conductor patterns, an intermediate layer having a contact portion such as a through hole, and a lower wiring layer for forming a plurality of conductor patterns are sequentially formed. There is disclosed a structure in which a toroidal coil is formed in one multilayer substrate by laminating and connecting the conductor patterns of the upper wiring layer and the lower wiring layer in a spiral manner through the contact portion of the intermediate layer. Yes.
[0003]
In another patent document 2, an arrangement region of a donut-shaped core is provided on the surface of a wiring substrate, a wiring film that is a conductive pattern is formed so as to cross the arrangement region, and both ends of the wiring film protruding from the arrangement region There is disclosed a toroidal coil in which a terminal insertion hole is provided in the terminal and an upper wiring element made of a jumper wire is connected between the terminal insertion holes so as to straddle the donut-shaped core.
[0004]
[Patent Document 1]
JP 2002-289436 A (paragraph numbers [0033] to [0036], etc.)
[Patent Document 2]
JP-A-8-203762 (paragraph numbers [0012] to [0013] etc.)
[0005]
[Problems to be solved by the invention]
However, since the work of winding the wire around the circular core as described above is performed manually, it is very time-consuming and increases the manufacturing cost of the inductance element. In addition, as in Patent Document 1, when an inductance element is manufactured using a multilayer substrate, each printed wiring board must be laminated on a printed wiring board after a conductor pattern is formed, which takes time. In addition, since the printed wiring board is required to have a certain thickness, the inductance element cannot be reduced in size. Further, in the case of the toroidal inductance element, a magnetic pattern corresponding to the core is further formed on the printed wiring board. And the manufacturing process is significantly increased. Also, when a design change occurs, it must be created again from the printed wiring board, and a quick response cannot be made.
[0006]
On the other hand, as in Patent Document 2, even when an inductance element is manufactured by a combination of a printed wiring board and a jumper line, a conductor pattern is formed on the printed wiring board, and a donut-shaped core that is a magnetic material is formed. It takes time and labor to arrange the jumper wiring in a predetermined area and to use a printed wiring board, and the inductance element cannot be miniaturized. Furthermore, since the conductor pattern is provided on the printed wiring board, there arises a problem that the design must be regenerated from the board when the design is changed.
[0007]
The present invention has been made in view of the above-described problems, and its object is to easily manufacture a space-saving, small and lightweight inductance element without winding a wire or forming a conductive pattern on a printed wiring board. An object of the present invention is to provide a method for manufacturing an inductance element.
[0008]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided a method of manufacturing an inductance element comprising: a lower lead frame in which a plurality of first patterns are radially formed; and an upper lead frame in which a plurality of second patterns are radially formed. In addition, the first pattern is cut and bent in accordance with the outer shape between one end on the center side of the first pattern and the other end on the outer peripheral side of another first pattern adjacent to the first pattern. Two patterns are joined, and unnecessary portions are cut in the vicinity of the outer periphery of the other end of the lower lead frame and the upper lead frame , and a toroidal winding portion is formed by the first pattern and the second pattern. Is formed.
[0009]
The toroidal winding portion thus obtained is formed only by the first pattern and the second pattern formed on the lower lead frame and the upper lead frame , and is cut and bent according to the outer shape. The two patterns make it easy to position the core core and align the joints, and cut the unnecessary part near the outer periphery of the other end of the lower and upper lead frames. Ru can be obtained winding portion. Therefore, the productivity can be improved and the inductance element can be easily reduced in size and weight as compared with a conventional case in which a wire is wound or a conductive pattern is formed on a printed wiring board. In addition, since the existing lead frame manufacturing technology can be used to form the first pattern and the second pattern, no special capital investment is required.
[0010]
The manufacturing method of the inductance element in the second aspect, said core core is interposed between the lower lead frame and the upper lead frame is obtained by superposing this and the lower lead frame and the upper lead frame .
[0011]
In order to manufacture an inductance element including a core core, when the lower lead frame and the upper lead frame are overlapped, it is only necessary to interpose the core core between them in advance. Therefore, an inductance element having a core can be easily manufactured.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of an inductance element and a manufacturing method thereof according to the present invention will be described with reference to the accompanying drawings. FIG. 1 shows an external appearance of an inductance element in a completed state. Reference numeral 1 denotes a winding portion of the inductance element formed in a toroidal shape, which is a frame member made of a thin metal plate as shown in FIGS. 9, lead frames 6 and 7 having a predetermined pattern shape are vertically joined. Reference numeral 2 denotes a magnetic or dielectric core core such as ferrite. Reference numeral 3 denotes a lead portion which is a connecting portion of an inductance element constituted by the lower lead frame 6 or the upper lead frame 7 similarly to the winding portion 1, and is for connection with an external circuit, for example, printing It is directly soldered to a component mounting pad of a substrate (not shown) or inserted into a through hole of a printed circuit board for soldering connection. In addition, it is good also considering the coil | winding part 1 itself as a connection part, without using the lead part 3. FIG.
[0013]
2 and 3 show the frame member 9 before the winding portion 1 is formed. In this figure, a frame material 9 is composed of a strip-shaped body of a thin metal base material having excellent mechanical strength, electrical conductivity, thermal conductivity and corrosion resistance, such as Cu-based material and Fe-based material. The first lower lead frame 6 (FIG. 2) that forms the lower side of the winding part 1 and the second upper lead frame 7 that forms the upper side of the winding part 1 by processing means such as etching, laser, or the like. One or more are formed. Although the manufacturing procedure of the lead frames 6 and 7 is not described in detail here, a manufacturing technique of a lead frame incorporated in a general semiconductor package may be applied as it is.
[0014]
The first lead frame 6 is formed with a plurality of radial patterns 5 that are substantially the lower surface of the winding portion 1 around the hollow portion 4 from which the frame material 9 is cut. In each pattern 5, one end portion 5A of the pattern 5 facing the hollow portion 4 is independent, while the other end portion 5B on the outer peripheral side is connected. One end portion 5A of the pattern 5 is joined to one end portion 15A of the pattern 15 in the second lead frame 7 described later, and the other end side of the pattern 5 is adjacent to the pattern 15 connected to the one end portion 5A. The pattern 15 is joined. The joint 8 on the other end side of the pattern 5 is indicated by a broken line in FIG.
[0015]
The second lead frame 7 is also formed with a plurality of radial patterns 15 that are substantially the upper surface portion of the winding portion 1 around the hollow portion 14 from which the frame material 9 is cut. In each pattern 15, one end portion 15A of the pattern 15 facing the hollow portion 14 is independent, while the other end portion 15B on the outer peripheral side is connected. Each pattern 15 is formed so as to connect one end portion 5 </ b> A of one pattern 5 in the first lead frame 6 and a joint portion 8 of another pattern 5 adjacent to the one pattern 5. The other end side of the pattern 15 is joined to the joint portion 8 on the other end side of the pattern 5, and this joint portion 18 is indicated by a broken line in FIG. 3.
[0016]
The pair of lead portions 3 are provided by utilizing a part of the pattern 15 formed on the second lead frame 7 in this embodiment. Of course, the lead wire 3 can also be formed into a desired shape together with the other patterns 15 by the above-described processing means when the second lead frame 7 is manufactured from the frame material 9. In addition, although the width from one end part 5A of each pattern 5 to the joint part 8 and the width from one end part 15B of each pattern 15 to the joint part 18 are respectively formed, the soldering operation described later is facilitated. In addition, the width of the pattern 5 of the lower lead frame 6 is preferably made wider than the width of the pattern 15 of the upper lead frame 7.
[0017]
Next, a preferable method for manufacturing the inductance element in the present embodiment will be described with reference to FIGS. First, in the lead frame manufacturing process, the frame material 9 that is a thin metal base material is processed by pressing, etching, or laser cutting, so that the lower lead frame 6 and the upper lead frame having the desired shapes having the radial patterns 5 and 15 are formed. 7 is manufactured. A plurality of lower lead frames 6 and upper lead frames 7 are formed on the frame member 9, but may be cut individually according to the outer shape of the lead frames 6, 7, or continuous lead frames 6, 7. It may be used as it is.
[0018]
In the next end joining step, the lower lead frame 6 and the upper lead frame 7 are soldered and connected. When manufacturing the inductance element with the core core 2, first, the upper lead frame 7 is cut from the frame material 9 according to the outer shape, and the individual upper lead frames are aligned along the outer shape of the ring-shaped core core 2. 7 patterns 15 are bent. This is for facilitating the positioning of the end portions 5A, 15A and the joint portions 8, 18 together with the positioning of the core core 2. For example, as shown in FIG. 4, when the cross-sectional shape of the core core 2 is a square, each pattern 15 of the upper lead frame 7 is bent into a substantially U shape. On the other hand, if the cross-sectional shape of the core core 2 is round, each pattern 15 of the upper lead frame 7 may be bent and formed in a substantially U shape. In addition, when the core core 2 is a thin flat plate shape, this bending process may be omitted.
[0019]
Next, the core lead 2 is placed on the arrangement region between the one end portion 5A of the pattern 5 and the joint portion 8 in the lower lead frame 6, and the upper lead frame in which the portion of the pattern 15 is bent so as to wrap around the core lead 2. 7 is overlapped. Then, one end portion 5A of each pattern 5 of the lower lead frame 6 and one end portion 15A of each pattern 15 of the upper lead frame 7 corresponding thereto are connected by a conductive joining member 10 such as solder. At the same time, the joint portions 8 of the patterns 5 of the lower lead frame 6 and the joint portions 18 of the patterns 15 of the upper lead frame 7 corresponding thereto are connected by the joint member 10 (see FIG. 5). In this case, the widths of the patterns 5 and 15 are different in this embodiment, and the exposed portions 19 are formed on the upper surface of the wide pattern 5 at the one end portions 5A and 15A and the joint portions 8 and 18 of the patterns 5 and 15. Therefore, these parts can be reliably connected by the joining member 10 using the exposed portion 19. In addition, since the connection of each part here is joining of metals, it can implement by welding or caulking.
[0020]
In the final end cutting step, unnecessary lower and upper lead frames 6 and 7 are cut in the vicinity of the outer periphery of the joints 8 and 18 in order to obtain the desired winding portion 1. The lead wire 3 is also cut to a required length. In FIG. 6, the cutting portion 20 is indicated by a broken line. In FIG. 6, for convenience, the core core 2 is indicated by a one-dot chain line.
[0021]
The winding portion 1 of the inductance element obtained as described above is not obtained by winding a wire or connecting conductive patterns formed on a printed wiring board by lamination. The lead frames 6 and 7 are extremely thin as compared with the multilayer printed wiring board, and the inductance element can be reduced in size and weight.
[0022]
In the end portion joining step, the end portions 5A and 15A and the joining portions 8 and 18 of the patterns 5 and 15 are joined without interposing the core core 2 between the lead frames 6 and 7, and finally the empty portions are joined. A core inductance element may be manufactured. Also in this case, it is preferable to bend one of the lead frames 6 and 7 in order to secure a necessary air core area.
[0023]
Further, the lead frames 6 and 7 may be manufactured by previously bonding an insulating material to the back surface of the frame member 9 so that the upper and lower portions of the winding portion 1 do not directly or contact the core core 2. .
[0024]
The completed inductance element is mounted on the substrate, for example, by soldering the lead part 3 directly to a component mounting pad on the substrate or by inserting it into a through hole and soldering. Alternatively, the inductance element can be directly mounted on the lead frame and used as an inductance body.
[0025]
As described above, in the present embodiment, the lower lead frame 6 as the first thin metal member in which the plurality of patterns 5 that are the first patterns are formed radially, and the pattern 15 that is the plurality of second patterns are radially formed. The upper lead frame 7 as the formed second thin metal member is overlapped, and one end (one end portion 5A) on the center side of the pattern 5 and the other outer periphery side of another pattern 5 adjacent to the pattern 5 The ends (joined portions 8) are joined together by the patterns 15 and cut near the outside of the other ends of the patterns 5, and the toroidal winding portions 1 are formed by the patterns 5 and 15.
[0026]
The toroidal winding portion 1 obtained in this way is composed of only the patterns 5 and 15 formed on the lead frames 6 and 7 which are two thin metal members. Therefore, the productivity can be improved and the inductance element can be easily reduced in size and weight as compared with a conventional case in which a wire is wound or a conductive pattern is formed on a printed wiring board.
[0027]
In the present embodiment, the core core 2 is interposed between the lead frames 6 and 7 in the manufacturing process in which the lead frames 6 and 7 are overlapped.
[0028]
In order to manufacture the inductance element including the core core 2, it is only necessary to interpose the core core 2 between the lead frames 6 and 7 in advance. Therefore, the inductance element having the core core 2 can be easily manufactured.
[0029]
Furthermore, in this embodiment, the first thin metal member and the second thin metal member are lead frames 6 and 7, respectively. That is, to form the patterns 5 and 15, existing lead frame manufacturing techniques can be used. Therefore, there is an advantage that no special capital investment is required.
[0030]
In addition, this invention is not limited to the said Example, In the range of the summary of this invention, it can change suitably. Various inductance elements can be manufactured by changing the width and number of radiation patterns formed on a thin metal plate.
[0031]
【The invention's effect】
According to the first aspect of the present invention, a small and lightweight inductance element can be easily manufactured without winding a wire or forming a conductive pattern on a printed wiring board. Further, the first pattern and the second pattern to be the winding part can be easily manufactured by the existing lead frame technology.
[0032]
According to the second aspect of the present invention, when the lower lead frame and the upper lead frame are overlapped with each other, an inductance element having a core core can be easily manufactured simply by interposing a core core therebetween.
[Brief description of the drawings]
FIG. 1 is a perspective view of a completed state of an inductance element according to a first embodiment of the present invention.
FIG. 2 is a plan view showing a state in which the lower lead frame is formed on the frame member.
FIG. 3 is a plan view showing a state in which an upper lead frame is formed on the frame member.
FIG. 4 is a cross-sectional view of the main part before soldering connection in a state where the upper lead frame is overlaid.
FIG. 5 is a plan view of the main part immediately after the soldering connection.
FIG. 6 is a plan view immediately after the end cutting step is completed.
[Explanation of symbols]
1 Winding part 2 Core core 5 Pattern (first pattern)
6 Lower lead frame (first sheet metal member)
7 Upper lead frame (second sheet metal member)
12 Wire 15 pattern (2nd pattern)

Claims (2)

A lower lead frame in which a plurality of first patterns are formed radially and an upper lead frame in which a plurality of second patterns are formed radially are overlapped,
The second pattern obtained by cutting and bending in accordance with the outer shape between one end on the center side of the first pattern and the other end on the outer peripheral side of another first pattern adjacent to the first pattern. Each joined with
An unnecessary portion is cut in the vicinity of the outer periphery of the other end of the lower lead frame and the upper lead frame , and a toroidal winding portion is formed by the first pattern and the second pattern. A method for manufacturing an inductance element. And the core center is interposed between the upper lead frame and the lower lead frame, the manufacturing method of the inductance element according to claim 1, wherein the superimposed this and the lower lead frame and the upper lead frame.

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