JP4696884B2 - Wire wound electronic component and method of manufacturing the same - Google Patents

Wire wound electronic component and method of manufacturing the same Download PDF

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JP4696884B2
JP4696884B2 JP2005351320A JP2005351320A JP4696884B2 JP 4696884 B2 JP4696884 B2 JP 4696884B2 JP 2005351320 A JP2005351320 A JP 2005351320A JP 2005351320 A JP2005351320 A JP 2005351320A JP 4696884 B2 JP4696884 B2 JP 4696884B2
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宗和 犬伏
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Murata Manufacturing Co Ltd
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Description

本発明は、巻線型電子部品及びその製造方法に関し、更に詳しくは、巻線型電子部品を小型化、低背化することができる巻線型電子部品及びその製造方法に関するものである。   The present invention relates to a wound electronic component and a manufacturing method thereof, and more particularly to a wound electronic component capable of reducing the size and height of a wound electronic component and a manufacturing method thereof.

従来の巻線型電子部品は、例えば図5の(a)に示すように、コア1と、コア1の巻芯部1Aに巻回されたワイヤ2と、コア1の一方(同図では上方)の鍔部1Bの端面に設けられた一対の端子電極3A、3Bと、を備え、ワイヤ2の両端部2A、2Bがそれぞれ鍔部1Bの一対の端子電極3A、3Bに電気的に接続されている。この巻線型電子部品の場合には、端子電極3が鍔部1Bの巻芯部1Aの軸芯と直交する端面に設けられているため、巻線型電子部品をマザーボード等の実装基板に実装する場合には、端子電極3A、3Bを実装面に形成された表面電極に電気的に接続する。   For example, as shown in FIG. 5A, a conventional wound electronic component includes a core 1, a wire 2 wound around a core portion 1A of the core 1, and one of the cores 1 (upper in FIG. 5). A pair of terminal electrodes 3A, 3B provided on the end face of the flange portion 1B, and both ends 2A, 2B of the wire 2 are electrically connected to the pair of terminal electrodes 3A, 3B of the flange portion 1B, respectively. Yes. In the case of this winding type electronic component, since the terminal electrode 3 is provided on the end surface orthogonal to the axis of the winding core portion 1A of the flange portion 1B, the winding type electronic component is mounted on a mounting board such as a mother board. In this case, the terminal electrodes 3A and 3B are electrically connected to the surface electrodes formed on the mounting surface.

さて、上記巻線型電子部品の製造工程にはワイヤ2の両端部2A、2Bを端子電極3A、3Bに電気的に接続する端末処理工程がある。この端末処理を行う場合には、例えば特許文献1、2において本出願人が提案しているように、端子電極3A、3Bが設けられた鍔部1Bを上向きに配置し、図5の(a)に示すようにヒータチップ等の熱圧着手段5を用いてコア11の巻芯部11Aから折り返したワイヤ2の両端部2A、2Bを矢印に示すように所定の圧力で端子電極3A、3Bにそれぞれ押圧し、ワイヤ2の両端部2A、2Bを端子電極3A、3Bにそれぞれ同時に熱圧着し、両端部2A、2Bと端子電極3A、3Bとを電気的に接続している。   Now, in the manufacturing process of the wire wound electronic component, there is a terminal processing process for electrically connecting both end portions 2A, 2B of the wire 2 to the terminal electrodes 3A, 3B. When this terminal processing is performed, for example, as proposed by the present applicants in Patent Documents 1 and 2, the flange portion 1B provided with the terminal electrodes 3A and 3B is disposed upward, and (a) of FIG. ), The two end portions 2A and 2B of the wire 2 folded from the core portion 11A of the core 11 using the thermocompression bonding means 5 such as a heater chip are applied to the terminal electrodes 3A and 3B with a predetermined pressure as indicated by arrows. The both ends 2A and 2B of the wire 2 are simultaneously thermocompression bonded to the terminal electrodes 3A and 3B, respectively, and the both ends 2A and 2B and the terminal electrodes 3A and 3B are electrically connected.

特開平02−271605JP 02-271605 特開平05−291047JP 05-291047

しかしながら、従来の巻線型電子部品は、小型化、低背化に伴ってコア1の鍔部1Bが益々薄くなり、しかもワイヤ12の両端部を図5の(b)に示すように巻芯部1Aの外側に配置しているため、特許文献1、2に記載の端末処理では熱圧着時の押圧力が同図に矢印で示すように巻芯部1Aの外側で鍔部1Bに作用し、鍔部1Bに欠損を生じ易い。欠損を防止するために押圧力を下げると両端部2A、2Bが十分に潰れず、ワイヤ2の両端部2A、2Bと端子電極3A、3Bとの接続が十分でなく、接続信頼性が低下する虞がある。また、欠損を防止するために鍔部1Bを厚くすれば、巻線型電子部品の小型化、低背化を妨げることになる。   However, in the conventional wire-wound electronic component, the flange portion 1B of the core 1 becomes thinner and thinner as the size and height are reduced, and both ends of the wire 12 are wound as shown in FIG. Since it is arranged outside 1A, in the terminal processing described in Patent Documents 1 and 2, the pressing force at the time of thermocompression acts on the flange portion 1B outside the core portion 1A as indicated by an arrow in FIG. Defects are likely to occur in the buttocks 1B. If the pressing force is lowered to prevent the chipping, the both end portions 2A and 2B are not sufficiently crushed, the connection between the both end portions 2A and 2B of the wire 2 and the terminal electrodes 3A and 3B is not sufficient, and the connection reliability is lowered. There is a fear. Further, if the flange portion 1B is made thick in order to prevent the chipping, it is difficult to reduce the size and height of the wound electronic component.

本発明は、上記課題を解決するためになされたもので、巻線型電子部品の小型化、低背化によりコアの鍔部が薄くなっても鍔部を損傷させることなくワイヤの端末処理を確実に行うことができて、信頼性及び歩留まりを高めることができる巻線型電子部品及びその製造方法を提供することを目的としている。   The present invention has been made in order to solve the above-described problems, and even if the core part of the core is thinned by downsizing and low profile of the wire wound electronic component, the wire end processing is surely performed without damaging the part of the core. It is an object of the present invention to provide a wound electronic component and a method for manufacturing the same, which can be performed in a simple manner and can improve reliability and yield.

本発明の請求項1に記載の巻線型電子部品の製造方法は、巻芯部及びその両端に形成された一対の鍔部を有するコアと、上記コアの巻芯部に巻回された絶縁被膜付きのワイヤと、上記一対の鍔部の上記巻芯部の軸芯とそれぞれ直交する端面のいずれか一方の端面に設けられた一対の端子電極と、を備え、上記巻芯部に巻回された上記ワイヤの両端部が上記一対の端子電極にそれぞれ接続された巻線型電子部品の製造方法において、上記ワイヤの両端部を、上記いずれか一方の端面において少なくとも上記巻芯部の上方で且つ上記一対の端子電極上にそれぞれ離隔して配置する工程と、上記いずれか一方の端面において上記ワイヤの両端部を押圧して上記一対の端子電極にそれぞれ接続する工程と、を備えたことを特徴とするものである。 According to a first aspect of the present invention, there is provided a wound electronic component manufacturing method comprising: a core having a core portion and a pair of flanges formed at both ends thereof; and an insulating film wound around the core portion of the core. And a pair of terminal electrodes provided on one end face of each of the end faces orthogonal to the axis of the core part of the pair of flange parts, and wound around the core part. both ends of the wire in each connected winding method for manufacturing a wound electronic part in the pair of terminal electrodes have, both ends of the wire, and at least above the said core portion in the one end face the and wherein the step of spaced respectively on a pair of terminal electrodes, a step of connecting each of the pair of terminal electrodes to press the both end portions of the wire in the one end face either further comprising a To do.

また、本発明の請求項2に記載の巻線型電子部品は、巻芯部及びその両端に形成された一対の鍔部を有するコアと、上記コアの巻芯部に巻回された絶縁被膜付きのワイヤと、上記一対の鍔部の上記巻芯部の軸芯とそれぞれ直交する端面のいずれか一方の端面に設けられた一対の端子電極と、を備え、上記巻芯部に巻回された上記ワイヤの両端部が上記一対の端子電極にそれぞれ接続された巻線型電子部品において、上記ワイヤの両端部は、上記いずれか一方の端面において少なくとも上記巻芯部の上方で且つ上記一対の端子電極にそれぞれ離隔して接続されていることを特徴とするものである。 According to a second aspect of the present invention, there is provided a wound electronic component including a core having a core part and a pair of flanges formed at both ends thereof, and an insulating film wound around the core part of the core. And a pair of terminal electrodes provided on one end face of each of the end faces orthogonal to the axis of the core part of the pair of flange parts, and wound around the core part. In the wound electronic component in which both ends of the wire are respectively connected to the pair of terminal electrodes, the both ends of the wire are at least above the core portion on the one end surface and the pair of terminal electrodes. Are connected to each other at a distance from each other.

本発明の請求項1及び請求項2に記載の発明によれば、巻線型電子部品の小型化、低背化によりコアの鍔部が薄くなっても鍔部を損傷させることなくワイヤの端末処理を確実に行うことができて、信頼性及び歩留まりを高めることができる巻線型電子部品及びその製造方法を提供することができる。   According to the first and second aspects of the present invention, the wire end processing is performed without damaging the collar part even if the core collar part becomes thin due to downsizing and low profile of the wound electronic component. Thus, it is possible to provide a wound electronic component and a method of manufacturing the same that can reliably perform the above-described process and improve the reliability and the yield.

以下、図1〜図4に示す実施形態に基づいて本発明について説明する。   Hereinafter, the present invention will be described based on the embodiment shown in FIGS.

本実施形態の巻線型電子部品10は、例えば図1に示すように、巻芯部11A及びその両端に形成された一対の鍔部11Bを有するコア11と、巻芯部11Aに巻回されたワイヤ12と、鍔部11Bの巻芯部11Aの軸芯と直交する一方(図1では上方)の端面に設けられた一対の端子電極13A、13Bと、を備えている。ワイヤ12の両端部12A、12Bは、それぞれ巻芯部11Aから上方の鍔部11B側へ折り返されて、端子電極13A、13Bに互いに平行に延ばして配置されている。   As shown in FIG. 1, for example, the wound electronic component 10 of the present embodiment is wound around a core 11 having a core 11A and a pair of flanges 11B formed at both ends thereof, and the core 11A. A wire 12 and a pair of terminal electrodes 13A and 13B provided on one end face (upward in FIG. 1) orthogonal to the axis of the winding core portion 11A of the flange portion 11B are provided. Both end portions 12A and 12B of the wire 12 are respectively folded back from the core portion 11A to the upper flange portion 11B side, and arranged so as to extend in parallel to the terminal electrodes 13A and 13B.

コア11は、例えばフェライト、アルミナ等の絶縁材料によって形成されている。コア11の鍔部11Bに形成された端子電極13A、13Bは、例えばAg、Cr−Cu合金、Cr−Ni合金等からなる下地電極と、Sn、Sn−Pb合金等からなる外部電極との二層構造として形成されている。端子電極13A、13Bの下地電極と外部電極の間にはNi、Cu等からなる中間層が介在していても良い。各端子電極13A、13Bに接続されるワイヤ12の表面にはポリウレタン等の絶縁皮膜が施され、通常コア11の巻芯部11Aの複数層に渡って巻回されている。ワイヤ12の両端部12A、12Bは、各端子電極13A、13Bにそれぞれ熱圧着されてそれぞれの外部電極に溶着されている。   The core 11 is made of an insulating material such as ferrite or alumina. The terminal electrodes 13A and 13B formed on the flange portion 11B of the core 11 are, for example, a base electrode made of Ag, Cr—Cu alloy, Cr—Ni alloy or the like and an external electrode made of Sn, Sn—Pb alloy or the like. It is formed as a layer structure. An intermediate layer made of Ni, Cu or the like may be interposed between the base electrode of the terminal electrodes 13A and 13B and the external electrode. An insulating film such as polyurethane is applied to the surface of the wire 12 connected to each of the terminal electrodes 13A and 13B, and is usually wound around a plurality of layers of the core portion 11A of the core 11. Both end portions 12A and 12B of the wire 12 are thermocompression bonded to the terminal electrodes 13A and 13B, respectively, and welded to the external electrodes.

而して、本実施形態では、図1の(a)、(b)に示すようにワイヤ12の両端部12A、12Bには熱圧着により押し潰されて幅広の平坦部12A’、12B’がコア11の巻芯部11A上の鍔部11Bに形成され、絶縁皮膜が除去されている。これらの平坦部12A’12B’は、同図の(b)に示すようにその軸芯がコア11の巻芯部11Aの上方に配置されている。平坦部12A’12B’の軸芯を巻芯部11Aの上方に配置してそれぞれの端子電極13A、13Bに熱圧着することで、熱圧着時の押圧力が巻芯部11Aの上方においてワイヤ12の両端部12A、12Bから鍔部11Bに形成された端子電極13A、13Bに作用するため、押圧力が鍔部11Bに作用せず、鍔部11Bの損傷を防止することができ、延いては圧着時の押圧力を高めることができる。押圧力を高めることによって従来よりも太いワイヤを用いても鍔部11Bを損傷することがなく、端末処理を行うことができ、巻線型電子部品10としてのインダクタンス値の設計の自由度を高めることができる。これによってワイヤ12の線径は、従来であれば120μm程度が限度であったが、本実施形態では例えば150μmのワイヤを用いることができる。   Thus, in the present embodiment, as shown in FIGS. 1A and 1B, the both end portions 12A and 12B of the wire 12 are crushed by thermocompression bonding to have wide flat portions 12A ′ and 12B ′. Formed on the flange portion 11B on the core portion 11A of the core 11, the insulating film is removed. These flat portions 12A'12B 'have their axial centers disposed above the core portion 11A of the core 11, as shown in FIG. The shaft core of the flat portion 12A′12B ′ is disposed above the core portion 11A and thermocompression bonded to the respective terminal electrodes 13A and 13B, so that the pressing force at the time of thermocompression is applied to the wire 12 above the core portion 11A. Since it acts on the terminal electrodes 13A and 13B formed on the flange portion 11B from both end portions 12A and 12B, the pressing force does not act on the flange portion 11B, and damage to the flange portion 11B can be prevented. The pressing force at the time of pressure bonding can be increased. By increasing the pressing force, even if a thicker wire is used than before, the flange portion 11B is not damaged, terminal processing can be performed, and the degree of freedom in designing the inductance value as the wound electronic component 10 is increased. Can do. As a result, the wire diameter of the wire 12 is conventionally limited to about 120 μm, but in the present embodiment, for example, a wire of 150 μm can be used.

次に、本発明の巻線型電子部品の製造方法について図2、図3をも参照しながら説明する。本発明の製造方法では、従来と同様にコア11の巻芯部11Aにワイヤ12を巻回した後、図2の(a)、(b)に示すようにその両端部12A、12Bの間隔が巻芯部11Aの幅よりも狭くなるように巻芯部11Aから鍔部11Bに形成された端子電極13A、13B側へ折り返し、同図に示すように両端部12A、12Bの軸芯をコア11の巻芯部11A上方で鍔部11Bより内側に偏倚させて配置する。この際、端子電極13A、13Bは、互いに短絡しない間隔を空けて形成されている。   Next, a method for manufacturing a wound electronic component according to the present invention will be described with reference to FIGS. In the manufacturing method of the present invention, after the wire 12 is wound around the core portion 11A of the core 11 as in the conventional case, the distance between the both end portions 12A and 12B is as shown in FIGS. 2 (a) and 2 (b). Folded from the core portion 11A to the terminal electrodes 13A and 13B formed on the flange portion 11B so as to be narrower than the width of the core portion 11A, the shaft cores of both ends 12A and 12B are connected to the core 11 as shown in FIG. The upper core portion 11A is arranged to be biased inward from the flange portion 11B. At this time, the terminal electrodes 13A and 13B are formed at intervals that do not short-circuit each other.

ワイヤ12の両端部12A、12Bが上述のように配置された状態で、図2の(a)に矢印で示すようにヒータチップ等の熱圧着手段15を用いてワイヤ12の両端部12A、12Bを加熱しながら押圧する。この時、ワイヤ12の両端部12A、12Bは、同図の(b)に一点鎖線で示す巻芯部11Aの内側で端子電極13A、13Bに線接触しているため、熱圧着手段15の押圧力は図3に矢印で示すように線接触部から巻芯部11Aにそれぞれ作用する。この押圧力で両端部12A、12Bはそれぞれ押し潰されて平坦部12A’、12B’として端子電極13A、13Bに熱圧着される。この時、押圧力は鍔部11Bには作用しないため、従来よりも大きな押圧力で両端部12A、12Bを押し潰しても、鍔部11Bを欠損させることなく、平坦部12A’、12B’を端子電極13A、13Bの外部電極に確実に接続することができる。ワイヤ12の両端部12A、12Bは、軸芯が少なくとも巻芯部11Aの両側面の延長より内側に配置された状態であれば良い。この結果、平坦部12A’、12B’の外側の辺が鍔部11B側へはみ出すことになっても良い。   With both end portions 12A and 12B of the wire 12 arranged as described above, both end portions 12A and 12B of the wire 12 are formed by using thermocompression bonding means 15 such as a heater chip as shown by arrows in FIG. Press while heating. At this time, since both end portions 12A and 12B of the wire 12 are in line contact with the terminal electrodes 13A and 13B inside the winding core portion 11A shown by a one-dot chain line in FIG. The pressure acts from the line contact portion to the core portion 11A as indicated by arrows in FIG. With this pressing force, both end portions 12A and 12B are crushed and thermocompression bonded to the terminal electrodes 13A and 13B as flat portions 12A 'and 12B'. At this time, since the pressing force does not act on the flange portion 11B, even if both end portions 12A and 12B are crushed with a larger pressing force than before, the flat portions 12A ′ and 12B ′ are not damaged without losing the flange portion 11B. The terminal electrodes 13A and 13B can be reliably connected to the external electrodes. The ends 12A and 12B of the wire 12 may be in a state in which the shaft core is disposed at least inside the extension of both side surfaces of the core portion 11A. As a result, the outer sides of the flat portions 12A ′ and 12B ′ may protrude toward the flange portion 11B.

以上説明したように本実施形態によれば、巻芯部11A及びその両端に形成された鍔部11Bを有するコア11と、コア11の巻芯部11Aに巻回された絶縁被膜付きのワイヤ12と、鍔部11Bの巻芯部11Aの軸芯と直交する端面に設けられた端子電極13A、13Bと、を備え、巻芯部11Aに巻回されたワイヤ12の両端部12A、12Bが端子電極13A、13Bにそれぞれ接続された巻線型電子部品10を製造する際に、ワイヤ12の両端部12A、12Bを巻芯部11Aの上方で且つ各端子電極13A、13B上にそれぞれ配置した後、これらの端部12A、12Bを押圧してそれぞれの端子電極13A、13Bに接続するようにしたため、熱圧着手段15の押圧力で巻芯部11A上の両端部12A、12Bを押し潰しても、両端部12A、12Bから鍔部11Bに押圧力が作用せず、鍔部11Bに欠損を生じさせることがなく、両平坦部12A’、12B’として端子電極13A、13Bに確実に接続することができる。   As described above, according to the present embodiment, the core 11 having the core portion 11A and the flange portions 11B formed at both ends thereof, and the wire 12 with the insulating coating wound around the core portion 11A of the core 11. And terminal electrodes 13A and 13B provided on end faces orthogonal to the axis of the core part 11A of the flange part 11B, and both end parts 12A and 12B of the wire 12 wound around the core part 11A are terminals. When manufacturing the wound electronic component 10 connected to the electrodes 13A and 13B, respectively, after disposing both end portions 12A and 12B of the wire 12 above the core portion 11A and on the terminal electrodes 13A and 13B, respectively. Since these end portions 12A and 12B are pressed and connected to the respective terminal electrodes 13A and 13B, even if both end portions 12A and 12B on the core portion 11A are crushed by the pressing force of the thermocompression bonding means 15, A pressing force does not act on the flange portion 11B from the end portions 12A and 12B, and no defects are generated in the flange portion 11B, and the flat electrodes 12A ′ and 12B ′ can be reliably connected to the terminal electrodes 13A and 13B. it can.

従って、本実施形態によれば、巻線型電子部品10、即ちコア11が小型化、低背化して鍔部11Bが薄くなっても、鍔部11Bに欠損を生じさせることなくワイヤ12の両端部12A、12Bをそれぞれの端子電極13A、13Bに接続して、信頼性の高い巻線型電子部品10を歩留まり良く製造することができる。また、本実施形態によれば、熱圧着手段15の押圧力を従来よりも大きくすることができるため、従来よりも太いワイヤ12を用いて端末処理することができ、巻線型電子部品10のインダクタンス値の設計上の自由度を高めることができる。   Therefore, according to the present embodiment, even if the wound electronic component 10, that is, the core 11, is reduced in size and height and the flange portion 11B is thinned, both end portions of the wire 12 are not caused without causing defects in the flange portion 11B. By connecting 12A and 12B to the respective terminal electrodes 13A and 13B, the highly reliable wound electronic component 10 can be manufactured with a high yield. Further, according to the present embodiment, since the pressing force of the thermocompression bonding means 15 can be increased as compared with the conventional case, it is possible to perform the terminal processing using the wire 12 that is thicker than the conventional one, and the inductance of the wound electronic component 10 The degree of freedom in design of the value can be increased.

上記実施形態ではワイヤ12の両端部12A、12Bがそれぞれの端子電極13A、13Bにおいて互いに平行に配置されたものついて説明したが、巻線型電子部品10が更に小型化すると、端子電極13A、13B間の間隔が狭くなり、短絡を生じる虞がある。そこで、例えば図4に示すようにL字に形成された端子電極13A’、13B’を鍔部11Bの端面で点対称になるように配置することによって、端子電極13A’、13B’間に短絡しない間隔を設けることができる。一方、ワイヤ12の始端部12Aを長く、終端部12Bを短く設定し、それぞれの折り返し部から先端に向けて徐々に近づくように両端部12A、12Bをそれぞれの端子電極13A、13B上に配置する。左側の始端部12Aは、鍔部11Bの左側側面から鍔部11Bの上面に右側の端子電極13B’に向けて傾斜するように折り返されて左側の端子電極13A’の張り出し部に重なり平坦部12A”として接続され、右側の終端部12Bは、鍔部11Bの右側側面から鍔部11Bの上面に左側の端子電極13A’に向けて傾斜するように折り返されて右側の端子電極13B’の張り出し部に重なり平坦部12B”として接続されている。このような接続構造を採用することで、両端子電極13A’、13B’間の短絡を防止することができる。端子電極の形状は、L字状に限らず互いに逆向きの台形状に形成しても良い。これらいずれの場合においてもワイヤ12の両端部12A、12Bは、コア11の巻芯部11A上に位置するように配置することは云うまでもない。本実施形態においても上記実施形態と同様の作用効果を期することができる。   In the above embodiment, the description has been given of the case where both end portions 12A and 12B of the wire 12 are arranged in parallel with each other at the respective terminal electrodes 13A and 13B. There is a possibility that a short circuit may occur due to a narrow interval. Therefore, for example, as shown in FIG. 4, terminal electrodes 13A ′ and 13B ′ formed in an L shape are arranged so as to be point-symmetrical on the end face of the flange portion 11B, thereby short-circuiting between the terminal electrodes 13A ′ and 13B ′. An interval can be provided. On the other hand, the starting end portion 12A of the wire 12 is set long and the terminal end portion 12B is set short, and both end portions 12A and 12B are arranged on the terminal electrodes 13A and 13B so as to gradually approach from the respective folded portions toward the tip end. . The left starting end portion 12A is folded back from the left side surface of the flange portion 11B to the upper surface of the flange portion 11B so as to incline toward the right terminal electrode 13B ′, and overlaps with the protruding portion of the left terminal electrode 13A ′. The right terminal portion 12B is folded from the right side surface of the flange portion 11B to the upper surface of the flange portion 11B so as to incline toward the left terminal electrode 13A ′, and the protruding portion of the right terminal electrode 13B ′ is connected. And is connected as a flat portion 12B ″. By adopting such a connection structure, it is possible to prevent a short circuit between the terminal electrodes 13A 'and 13B'. The shape of the terminal electrode is not limited to the L shape, and may be formed in a trapezoidal shape opposite to each other. In any of these cases, it is needless to say that both end portions 12A and 12B of the wire 12 are disposed on the core portion 11A of the core 11. Also in this embodiment, the same effect as the said embodiment can be expected.

尚、本発明は上記各実施形態に何等制限されるものではない。要は、巻芯部及びその両端に形成された鍔部を有するコアと、上記コアの巻芯部に巻回された絶縁被膜付きのワイヤと、上記鍔部の上記巻芯部の軸芯と直交する端面に設けられた端子電極と、を備え、上記巻芯部に巻回されたワイヤの両端部が上記端子電極にそれぞれ接続された巻線型電子部品を製造する際に、上記ワイヤの両端部を少なくとも上記巻芯部の上方で且つ上記各端子電極上にそれぞれ配置し、上記両端部を押圧して上記端子電極に接続して製造された巻線型電子部品あれば、本発明に包含される。   The present invention is not limited to the above embodiments. In short, a core having a core part and flanges formed at both ends thereof, a wire with an insulating coating wound around the core part of the core, and an axis of the core part of the core part, Terminal electrodes provided on orthogonal end faces, and both ends of the wire when the wound type electronic component in which both ends of the wire wound around the core are connected to the terminal electrodes are manufactured. If it is a wound type electronic component manufactured by connecting a portion to the terminal electrode by pressing the both end portions at least above the winding core portion and on each terminal electrode, respectively, it is included in the present invention. The

本発明は、電子機器や通信機器等に使用される巻線型電子部品を製造する際に好適に利用することができる。   INDUSTRIAL APPLICABILITY The present invention can be suitably used when manufacturing a wound electronic component used for an electronic device or a communication device.

(a)、(b)はそれぞれ本発明の巻線型電子部品の一実施形態を示す図で、(a)はその斜視図、(b)はその要部断面図である。(A), (b) is a figure which shows one Embodiment of the winding type | mold electronic component of this invention, respectively, (a) is the perspective view, (b) is the principal part sectional drawing. (a)、(b)はそれぞれ本発明の巻線型電子部品の製造方法の一実施形態でワイヤを熱圧着する工程図で、(a)は圧着直前の斜視図、(b)はその要部断面図である。(A), (b) is a process figure which thermocompression-bonds a wire by one Embodiment of the manufacturing method of the winding type | mold electronic component of this invention, respectively (a) is a perspective view just before crimping, (b) is the principal part It is sectional drawing. 図2に示す巻線型電子部品の製造方法での熱圧着手段からコアに作用する押圧力を説明すする説明図である。It is explanatory drawing explaining the pressing force which acts on a core from the thermocompression-bonding means in the manufacturing method of the winding type electronic component shown in FIG. 本発明の巻線型電子部品の他の実施形態の要部を示す平面図である。It is a top view which shows the principal part of other embodiment of the winding type | mold electronic component of this invention. (a)、(b)はそれぞれ従来の巻線型電子部品の製造方法でワイヤを熱圧着する工程図で、(a)は圧着直前の斜視図、(b)は圧着する時にワイヤへの押圧力を説明する断面図である。(A), (b) is a process drawing of thermocompression bonding of a wire by a conventional method of manufacturing a wound electronic component, (a) is a perspective view immediately before crimping, and (b) is a pressing force applied to the wire when crimping. FIG.

符号の説明Explanation of symbols

11 コア
11A 巻芯部
11B 鍔部
12 ワイヤ
12A、12B 端部
12A’、12B’、12A”12B” 平坦部
13A、、13B、13A’、13B’ 端子電極
15 熱圧着手段
11 core 11A core part 11B collar part 12 wire 12A, 12B end part 12A ', 12B', 12A "12B" flat part 13A, 13B, 13A ', 13B' terminal electrode 15 thermocompression bonding means

Claims (2)

巻芯部及びその両端に形成された一対の鍔部を有するコアと、上記コアの巻芯部に巻回された絶縁被膜付きのワイヤと、上記一対の鍔部の上記巻芯部の軸芯とそれぞれ直交する端面のいずれか一方の端面に設けられた一対の端子電極と、を備え、上記巻芯部に巻回された上記ワイヤの両端部が上記一対の端子電極にそれぞれ接続された巻線型電子部品の製造方法において、上記ワイヤの両端部を、上記いずれか一方の端面において少なくとも上記巻芯部の上方で且つ上記一対の端子電極上にそれぞれ離隔して配置する工程と、上記いずれか一方の端面において上記ワイヤの両端部を押圧して上記一対の端子電極にそれぞれ接続する工程と、を備えたことを特徴とする巻線型電子部品の製造方法。 A core having a core portion and a pair of flange portions formed at both ends thereof, a wire with an insulating film wound around the core portion of the core, and an axis of the core portion of the pair of flange portions When a pair of terminal electrodes provided on one end face either end surface orthogonal respectively, comprising a winding both ends of the wire wound on the winding core are connected respectively to the pair of terminal electrodes the method of manufacturing a wound electronic component, placing both ends of the wire, each spaced apart from at least and the pair of the terminal electrodes above the winding core portion in the one end face, the one And a step of pressing both end portions of the wire on one end face to connect to the pair of terminal electrodes, respectively . 巻芯部及びその両端に形成された一対の鍔部を有するコアと、上記コアの巻芯部に巻回された絶縁被膜付きのワイヤと、上記一対の鍔部の上記巻芯部の軸芯とそれぞれ直交する端面のいずれか一方の端面に設けられた一対の端子電極と、を備え、上記巻芯部に巻回された上記ワイヤの両端部が上記一対の端子電極にそれぞれ接続された巻線型電子部品において、上記ワイヤの両端部は、上記いずれか一方の端面において少なくとも上記巻芯部の上方で且つ上記一対の端子電極にそれぞれ離隔して接続されていることを特徴とする巻線型電子部品。 A core having a core portion and a pair of flange portions formed at both ends thereof, a wire with an insulating film wound around the core portion of the core, and an axis of the core portion of the pair of flange portions When a pair of terminal electrodes provided on one end face either end surface orthogonal respectively, comprising a winding both ends of the wire wound on the winding core are connected respectively to the pair of terminal electrodes In the linear electronic component, both ends of the wire are connected to at least one of the end faces above the core part and to the pair of terminal electrodes, respectively. parts.
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792807A (en) * 1981-06-05 1982-06-09 Tdk Corp Small-sized inductor
JPH1126254A (en) * 1997-07-01 1999-01-29 Sumida Denki Kk Chip inductor
JP2000049019A (en) * 1998-07-25 2000-02-18 Tdk Corp Coil device
JP2005210055A (en) * 2003-12-22 2005-08-04 Taiyo Yuden Co Ltd Surface mount coil part and manufacturing method of the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792807A (en) * 1981-06-05 1982-06-09 Tdk Corp Small-sized inductor
JPH1126254A (en) * 1997-07-01 1999-01-29 Sumida Denki Kk Chip inductor
JP2000049019A (en) * 1998-07-25 2000-02-18 Tdk Corp Coil device
JP2005210055A (en) * 2003-12-22 2005-08-04 Taiyo Yuden Co Ltd Surface mount coil part and manufacturing method of the same

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