JP6521104B2 - Inductor component and method of manufacturing the same - Google Patents

Description

  The present invention relates to an inductor component including a resin layer and an inductor electrode and a method of manufacturing the same.

Conventionally, as shown in FIG. 19, an inductor component 100 is known in which a coil 102 is provided on a core substrate 101 formed of a printed circuit board or a prepreg (see, for example, Patent Document 1).
In this case, the annular magnetic material layer 103 is disposed inside the core substrate 101, and the coil 102 is spirally wound around the magnetic material layer 103. The coil 102 is arranged along the outer periphery of the magnetic layer 103 so as to form a plurality of pairs with the plurality of inner interlayer connecting conductors 102 a arranged along the inner periphery of the magnetic layer 103 and the interlayer connecting conductors 102 a. A plurality of outer interlayer connection conductors 102b, a plurality of upper wiring patterns 102c connecting upper ends of predetermined inner interlayer connection conductors 102a and outer interlayer connection conductors 102b, and predetermined inner interlayer connection conductors 102a and outer layers It is comprised by the several lower side wiring pattern 102d which connects the lower ends of the connection conductor 102b. Here, each of the interlayer connection conductors 102 a and 102 b is formed of a through hole conductor in which a conductor film is formed on the inner surface of the through hole penetrating the core substrate 101. Further, each of the wiring patterns 102c and 102d is formed in a print pattern using a conductive paste.

JP-A-2000-40620 (see paragraph 0018, FIG. 1, etc.)

  With the recent miniaturization and high performance of electronic devices, miniaturization of mounted inductor parts is required. One way to improve the characteristics of the inductor component is to lower the resistance value of the inductor electrode (in the inductor component 100 described above, the coil 102). In the conventional inductor component 100, each of the interlayer connection conductors 102a and 102b constituting the coil 102 is formed of a through hole conductor in which a conductor film is formed on the inner surface of the through hole. Since the interlayer connection conductors 102a and 102b are connected to the wiring patterns 102c and 102d by solder or the like, the value of the connection resistance becomes high. Here, when the conductive paste is filled in the through holes to form via conductors, the value of connection resistance can be lowered, but generally, the conductive paste is formed by mixing a metal filler with an organic solvent or the like, High resistance compared to pure metal. In addition, since each of the wiring patterns 102c and 102d is formed by conductive paste or plating and has a resistance value higher than that of a pure metal, it is difficult to reduce the resistance value of the entire inductor electrode.

  The present invention has been made in view of the above problems, and an object of the present invention is to improve the characteristics of an inductor component by reducing the resistance value of the entire inductor electrode in the inductor component including a resin layer and the inductor electrode. I assume.

In order to achieve the above object, the inductor component of the present invention includes a resin layer having a main surface, and an inductor electrode, and the inductor electrode is a first metal plate disposed inside the resin layer; And a second metal plate having a portion overlapping the first metal plate when viewed in a direction perpendicular to the main surface of the resin layer, wherein the first metal plate and the second metal plate overlap A portion having a first connection portion formed by a part of one of the two metal plates and connected to the other metal plate, the first connection portion being a portion of the one metal plate It is characterized in der Rukoto those bent concave cross-sectional shape toward the said portion to said other metal plate. According to this configuration, since the inductor electrode is formed of a metal plate having a resistance value lower than that of the conductive paste or plating, it is possible to reduce the resistance of the entire inductor electrode. (For example, inductance value) can be improved. Further, since the connection portion formed of a part of the metal plate can be used as the vertical wiring of the inductor, it is possible to form a three-dimensional inductor with an inexpensive configuration. Also, in order to reduce the resistance of the inductor electrode, it is conceivable to form the inductor electrode using a metal plate for wiring and a metal pin, but in this case, the impedance mismatch between the metal plate and the metal pin Causes a problem of signal loss. However, according to the configuration described above, since the inductor electrode is formed only of the metal plate, impedance mismatch can be suppressed. In addition, a specific configuration of the first connection site can be provided.

Further, another inductor component of the present invention includes a resin layer having a main surface, and an inductor electrode, wherein the inductor electrode is a first metal plate disposed inside the resin layer, and the resin layer And a second metal plate having a portion overlapping with the first metal plate when viewed in a direction perpendicular to the main surface, the two overlapping portions in the overlapping portion of the first metal plate and the second metal plate It has a first connection site formed by a portion of one of the metal plates and connected to the other metal plate, the first connection site being the portion of the one metal plate It is characterized in der Rukoto those thicker toward the other metal plate. According to this configuration, since the inductor electrode is formed of a metal plate having a resistance value lower than that of the conductive paste or plating, it is possible to reduce the resistance of the entire inductor electrode. (For example, inductance value) can be improved. Further, since the connection portion formed of a part of the metal plate can be used as the vertical wiring of the inductor, it is possible to form a three-dimensional inductor with an inexpensive configuration. Also, in order to reduce the resistance of the inductor electrode, it is conceivable to form the inductor electrode using a metal plate for wiring and a metal pin, but in this case, the impedance mismatch between the metal plate and the metal pin Causes a problem of signal loss. However, according to the configuration described above, since the inductor electrode is formed only of the metal plate, impedance mismatch can be suppressed. In addition, a specific configuration of the first connection site can be provided.

Further, another inductor component of the present invention includes a resin layer having a main surface, and an inductor electrode, wherein the inductor electrode is a first metal plate disposed inside the resin layer, and the resin layer And a second metal plate having a portion overlapping with the first metal plate when viewed in a direction perpendicular to the main surface, the two overlapping portions in the overlapping portion of the first metal plate and the second metal plate It has a first connection site formed by a portion of one of the metal plates and connected to the other metal plate, the first connection site being recessed from the portion of the one metal plate It is characterized in der Rukoto those. According to this configuration, since the inductor electrode is formed of a metal plate having a resistance value lower than that of the conductive paste or plating, it is possible to reduce the resistance of the entire inductor electrode. (For example, inductance value) can be improved. Further, since the connection portion formed of a part of the metal plate can be used as the vertical wiring of the inductor, it is possible to form a three-dimensional inductor with an inexpensive configuration. Also, in order to reduce the resistance of the inductor electrode, it is conceivable to form the inductor electrode using a metal plate for wiring and a metal pin, but in this case, the impedance mismatch between the metal plate and the metal pin Causes a problem of signal loss. However, according to the configuration described above, since the inductor electrode is formed only of the metal plate, impedance mismatch can be suppressed. In addition, a specific configuration of the first connection site can be provided.

  Further, the semiconductor device further includes a wiring substrate whose one main surface is in contact with the main surface of the resin layer, and a component which is mounted on the one main surface of the wiring substrate and sealed in the resin layer. The wiring is disposed inside the resin layer, one end is connected to one of the first metal plate and the second metal plate, and the other end is exposed to the main surface of the resin layer to form the wiring. It may further have a metal pin connected to the substrate.

  According to this configuration, for example, when the external electrode is formed on the back surface opposite to the main surface of the wiring substrate and the inductor component is mounted on the mother substrate, the component can be disposed near the mother substrate, so the component generates heat The heat dissipation of the case can be improved. Further, by arranging a component between the main surface of the wiring board and the inductor electrode, the inductor component can be miniaturized.

Furthermore, the inductor electrodes are arranged in substantially the same position as the first metal plate in a direction perpendicular to the main surface of the resin layer has a portion overlapping with the second metal plate at different points from that of the overlapping portion further comprising a third metal plate, it said in the overlapping portion of the second metal plate and the third metal plate, and is formed by a portion of one metal plate of the second metal plate and the third metal plate The inductor electrode may form a coil having a winding axis in a direction substantially parallel to the main surface of the resin layer by having a second connection portion in contact with the other metal plate.

  According to this configuration, it is possible to form a three-dimensional coil extending in both the main surface direction and the thickness direction of the resin layer. In addition, parts can be disposed between the main surface of the wiring board and the inductor electrode, and miniaturization of the inductor parts can be easily realized.

The first at least one of the metal plate and the second metal plate, when viewed from a direction perpendicular to the front SL main surface of the resin layer, so that a portion of the edge has reached the periphery of the resin layer It may be formed in

  According to this configuration, since the metal part of the inductor component is increased, the heat dissipation of the inductor component can be improved. Further, when a part of the edge of the second metal plate reaches the peripheral edge of the resin layer, the corresponding portion of the second metal plate is exposed from the resin layer, so the heat accumulated in the resin layer is dissipated. It will be easier.

  In addition, a coil core may be provided between the first connection portion and the second connection portion and between the first metal plate and the second metal plate. According to this configuration, the inductance value of the inductor electrode can be effectively increased.

Further, the coil core, the when seen in the direction perpendicular to the previous SL main surface of the resin layer, an annular portion and a rod-like portion provided with an inner region so that half of the annular portion is synthesized And the rod-like portion is disposed between the first connection portion and the second connection portion, and the axial direction of the rod-like portion is substantially the same as the winding axis of the coil. It may be arranged to be in parallel directions.

  According to this configuration, the coil core is disposed in the path of the magnetic flux lines generated when the inductor electrode (coil) is energized, so that the characteristics (for example, the inductance value) of the inductor electrode can be improved.

  Further, in the method of manufacturing an inductor component according to the present invention, a first structure in which a connection portion is formed on one surface of the first metal plate by processing the first metal plate in a state of being supported by a flat frame. And connecting one surface of the second metal plate supported by the flat frame to the tip of the connection portion, and forming a metal pin on the surface of the first metal plate facing the second metal plate. A step of forming a second structure in which an inductor electrode having the first metal plate, the second metal plate, and the metal pin is formed by connecting one end, and a component is mounted on one main surface A third structure in which a component is disposed between the one main surface of the wiring board and the second metal plate by connecting the other end of the metal pin to the one main surface of the wiring board Forming the third structure and sealing the third structure with a resin Forming a fourth structure having the third structure and the resin layer, removing the flat frame of the first metal plate and the flat frame of the second metal plate. And processing the fourth structure.

  According to this configuration, it is possible to manufacture an inductor electrode having a resistance value lower than that of an inductor electrode formed by conductive paste or plating. Moreover, since it is not necessary to form a via in the resin layer, the manufacturing cost can be reduced. Further, since both the first metal plate and the second metal plate are supported by the flat frame, it is necessary to use the main surface of the resin layer for the formation like the wiring pattern formed by the conventional conductive paste. Absent. Therefore, since the third structure can be formed before the formation of the resin layer, the manufacturing cost of the inductor component can be reduced. Further, since the plating process and the printing process are not required to form the inductor electrode as in the prior art, the manufacturing cost of the inductor component can be further reduced and the manufacturing time can be reduced. Also, by processing the fourth structure so as to remove the flat frame of the first metal plate and the flat frame of the second metal plate, when viewed from the direction perpendicular to the main surface of the resin layer Since the edges of the first and second metal plates are formed to reach the periphery of the resin layer, an inductor component with excellent heat dissipation can be manufactured.

Further, the inductor component of the present invention includes a wiring substrate, a component mounted on one main surface of the wiring substrate, a resin layer which is laminated on the one main surface of the wiring substrate and covers the component, the resin And a coil core having a portion overlapping with the component when viewed from a direction perpendicular to the one main surface of the wiring substrate, and an inductor electrode for winding the coil core, the inductor electrode Has a first metal plate and a second metal plate disposed on the resin layer such that at least a portion thereof overlaps with the coil core when viewed in a direction perpendicular to the one main surface of the wiring substrate The first metal plate has a first bent portion which is partially bent toward the other main surface of the wiring substrate and disposed inside the resin layer, and the second metal plate is Another part is the other of the wiring board It has a second bent portion bent toward the main surface and disposed inside the resin layer, and the tip portion of the first bent portion and the tip portion of the second bent portion are electrically connected. the the distal portion and the tip portion of the second bend of the first bent portion, is characterized that it is connected through the wiring electrodes provided on the wiring board. According to this configuration, the inductor electrodes (coils) can be easily formed by electrically connecting the metal plates. Also, since the coil diameter can be increased, the inductor characteristics are improved. Furthermore, since it is possible to expose the tip portions of both the bent portions on the other main surface side of the mounting substrate, the heat dissipation characteristics of the coil can be improved by bonding the exposed tip portions to the mother substrate. Further , the inductor electrode can be easily formed by both the metal plates and the wiring electrode provided on the wiring substrate.

  The wiring electrode is provided inside the wiring substrate, and a tip end portion of the first bent portion and one end of the wiring electrode are connected by a first via conductor, and a tip portion of the second bent portion The other end of the wiring electrode may be connected by the second via conductor. According to this configuration, the inductor electrode can be easily formed by electrically connecting the two metal plates and the wiring board provided inside the wiring board through the vias.

Further, the inductor component of the present invention includes a wiring substrate, a component mounted on one main surface of the wiring substrate, a resin layer which is laminated on the one main surface of the wiring substrate and covers the component, the resin And a coil core having a portion overlapping with the component when viewed from a direction perpendicular to the one main surface of the wiring substrate, and an inductor electrode for winding the coil core, the inductor electrode Has a first metal plate and a second metal plate disposed on the resin layer such that at least a portion thereof overlaps with the coil core when viewed in a direction perpendicular to the one main surface of the wiring substrate The first metal plate has a first bent portion which is partially bent toward the other main surface of the wiring substrate and disposed inside the resin layer, and the second metal plate is Another part is the other of the wiring board It has a second bent portion bent toward the main surface and disposed inside the resin layer, and the tip portion of the first bent portion and the tip portion of the second bent portion are electrically connected. , a tip portion of the tip portion of the first bent portion and the second bend is characterized that it is connected directly. According to this configuration, the inductor electrodes (coils) can be easily formed by electrically connecting the metal plates. Also, since the coil diameter can be increased, the inductor characteristics are improved. Furthermore, since it is possible to expose the tip portions of both the bent portions on the other main surface side of the mounting substrate, the heat dissipation characteristics of the coil can be improved by bonding the exposed tip portions to the mother substrate. Moreover, it is possible to form an inductor electrode only with a metal plate.

  According to the present invention, since the inductor electrode is formed of a metal plate having a resistance value lower than that of the conductive paste or plating, the resistance value of the entire inductor electrode can be lowered. Thereby, the characteristic (for example, inductance value) of the inductor component can be improved.

It is a figure which shows the inductor component concerning 1st Embodiment of this invention. It is a top view of the wiring board of the state supported by the frame. It is a figure for demonstrating the manufacturing method of the inductor component of FIG. It is a figure which shows the modification of the wiring board of FIG. It is a figure which shows the inductor component concerning 2nd Embodiment of this invention. It is a top view of the wiring board of the state supported by the frame. It is a figure for demonstrating the manufacturing method of the inductor component of FIG. It is a figure which shows the modification of the wiring board of FIG. It is a figure which shows the inductor component concerning 3rd Embodiment of this invention. It is a figure which shows the modification of the wiring board of FIG. It is a figure which shows the inductor component concerning 4th Embodiment of this invention. It is a figure which shows the inductor component concerning 5th Embodiment of this invention. It is a figure which shows the inductor component concerning 6th Embodiment of this invention. It is a figure of the wiring board of the state supported by the frame. It is a figure for demonstrating the manufacturing method of the inductor component of FIG. It is a figure which shows the modification of the bending part of FIG. It is a figure which shows the inductor component concerning 7th Embodiment of this invention. It is a figure which shows the inductor component concerning 8th Embodiment of this invention. It is a perspective view of the conventional inductor component.

First Embodiment
An inductor component according to a first embodiment of the present invention will be described with reference to FIG. FIG. 1A is a view when the inductor component is viewed in a direction parallel to the main surface of the wiring substrate, and a part of the resin layer is not shown so that the internal structure can be seen. FIG. 1B is a plan view of the inductor component showing the wiring structure of the inductor electrode.

(Configuration of inductor component)
The inductor component 1 a of this embodiment includes the wiring substrate 2, the resin layer 3 stacked on the upper surface 2 a of the wiring substrate 2, a plurality of components 4 mounted on the upper surface 2 a of the wiring substrate 2, and the inside of the resin layer 3. The coil core 5 and the inductor electrode 6 are disposed, and mounted on, for example, a mother substrate of an electronic device such as a portable terminal device.

  The wiring substrate 2 is, for example, a glass epoxy resin substrate or a ceramic substrate, and via conductors and various wiring electrodes are formed inside. Further, on the upper surface 2a, connection electrodes (not shown) for connecting to the respective components 4 and metal pins 9a and 9b described later are formed. The wiring board 2 may have either a single layer structure or a multilayer structure.

  The component 4 is configured of, for example, a semiconductor element formed of Si or the like, a chip capacitor, a chip inductor, a chip resistor, or the like.

  The resin layer 3 is provided such that the wiring boards 8a to 8c described later are disposed inside, and the lower surface 3a (corresponding to "the main surface of the resin layer" in the present invention) abuts on the upper surface 2a of the wiring substrate 2. Be Further, the resin layer 3 and the wiring board 2 of this embodiment are formed in a horizontally long rectangular shape when viewed from a direction perpendicular to the lower surface 3 a of the resin layer 3 (hereinafter sometimes referred to as a plan view). (See Figure 1 (b)). In addition, the resin layer 3 can be formed with various materials generally used as sealing resin, such as an epoxy resin, for example.

  The coil core 5 is formed of a magnetic material adopted as a general coil core such as Ni—Zn ferrite. Further, as shown in FIG. 1B, the coil core 5 of this embodiment has, in a plan view, an annular portion 5a, and a rod-like portion 5b provided so as to equally divide the inner region of the annular portion 5a. Have. In the case where the coil core has low insulating properties such as Mn—Zn ferrite, the upper and lower surfaces of the coil core may be covered with the insulating film 10.

  The inductor electrode 6 has two upper wiring boards 8a and 8b, one lower wiring board 8c, and two metal pins 9a and 9b serving as input / output terminals. The upper wiring boards 8a and 8b and the lower wiring board 8c are connected via connection portions 7a and 7b formed by a part of each, and a coil wound around the rod-like portion 5b of the coil core 5 is formed There is. At this time, connection portions 7a and 7b are formed on upper wiring boards 8a and 8b by bending one end 80a or 80b (see FIG. 2A) toward lower wiring board 8c. The lower surfaces 70a and 70b of the connection portions 7a and 7b are joined to the lower wiring board 8c by, for example, solder, whereby the upper wiring board 8a and the lower wiring board 8c, and the upper wiring board 8b and the lower wiring board 8c. The side wiring boards 8c are electrically connected to each other. That is, both connection parts 7a, 7b are formed by bending the dotted line part (refer FIG. 2 (a)) of one edge part 80a, 80b of both upper side wiring boards 8a, 8b. The upper end surface of each of the two metal pins 9a and 9b is connected to the upper wiring boards 8a and 8b, and the lower end surface (corresponding to "the other end of the metal pin" in the present invention) is the lower surface of the resin layer 3. The lower end surfaces of both metal pins 9a and 9b are connected to the wiring board 2 while being exposed from 3a. In addition, one of the two metal pins 9 a and 9 b is the outer region of the annular portion 5 a of the coil core 5 and is disposed near one short side of the resin layer 3, and the other is the outer region of the annular portion 5 a of the coil core 5 , And is disposed in the vicinity of the other short side of the resin layer 3. The two metal pins 9a and 9b can be formed, for example, by shearing a wire made of a metal such as Cu, Al, Ag or the like.

  As shown in FIG. 1B and FIG. 2, both upper side wiring boards 8 a and 8 b are each formed in a linear shape substantially parallel to the longitudinal direction of the horizontally long rectangular resin layer 3. The right end portion 81 a of the upper wiring board 8 a is formed to reach the peripheral edge 30 b (one short side of the rectangular shape in plan view) of the resin layer 3. The left end portion 81 b of the upper wiring board 8 b is formed to reach the peripheral edge 30 a (the other short side of the horizontally long rectangular shape in plan view) of the resin layer 3. Both end portions 81 a and 81 b are exposed to the side surface of the resin layer 3. The left end 80a of the upper wiring board 8a and the right end 80b of the upper wiring board 8b are bent in the direction of the dotted line in FIG. 2A in the direction of the lower wiring board 8c. It is formed. At this time, when viewed from a direction parallel to the lower surface 3a of the resin layer 3 (in other words, at least one of the cross sections perpendicular to the lower wiring board 8c), the connection portions 7a and 7b are L-shaped. The lower surfaces 70a and 70b are in contact with the lower wiring board 8c. The lower end portions of the connection portions 7a and 7b are bent to bring the lower surfaces 70a and 70b into contact with the lower wiring board 8c, whereby the connection portions and the lower wiring board 8c can be reliably contacted. However, the lower surfaces 70a and 70b may not necessarily be provided, and the connection portions 7a and 7b are formed in a linear shape (I shape) when viewed from the direction parallel to the lower surface 3a of the resin layer 3 May be Further, at the end portions 80a and 80b of the upper wiring boards 8a and 8b, the support portions 82a having a narrower line width than the central portions of the upper wiring boards 8a and 8b toward the peripheral edges 30a and 30b of the resin layer 3, 82b is formed extending. The support portions 82 a and 82 b are integrally formed with the upper wiring boards 8 a and 8 b, respectively, and exposed to the side surface of the resin layer 3.

  The lower wiring board 8c is disposed so as to have a portion overlapping the upper wiring boards 8a and 8b inside the resin layer 3 when viewed in a direction perpendicular to the lower surface 3a of the resin layer 3. The lower wiring board 8c is formed in a line substantially parallel to the longitudinal direction of the horizontally long rectangular resin layer 3 as shown in FIG. 1 (b), and is connected to the lower surfaces of the connection portions 7a and 7b. The lower wiring board 8c is provided, at both ends thereof, support parts 82c similar to the support parts 82a and 82b of the upper wiring boards 8a and 8b. Each of the support portions 82 c is formed to reach the peripheral edges 30 a and 30 b of the resin layer 3, and the support portions 82 c are exposed on the side surface of the resin layer 3. The support 82c is formed to have a smaller line width than the central portion of the lower wiring board 8c, similarly to the supports 82a and 82b of the upper wiring boards 8a and 8b.

  Further, as described above, the lower end surfaces of the two metal pins 9 a and 9 b are connected to connection electrodes (not shown) on the upper surface 2 a of the wiring substrate 2. With such a connection configuration, an inductor electrode 6 is formed which is wound around the rod-like portion 5b of the coil core 5 with both metal pins 9a and 9b as input / output terminals. In this case, the axial direction (longitudinal direction) of the rod-like portion 5 b is substantially parallel to the winding axis of the inductor electrode 6. Here, the two upper wiring boards 8a and 8b correspond to the "first metal plate" and the "third metal plate" in the present invention, and the one lower wiring board 8c is the "second metal plate in the present invention". Equivalent to

  By the way, when the coil pattern is planarly formed on the upper surface 2 a of the wiring substrate 2, the winding axis of the coil is in the direction perpendicular to the upper surface 2 a of the wiring substrate 2. On the other hand, in the case of this embodiment, the winding axis of the coil (inductor electrode 6) is in a direction parallel to the upper surface 2a of the wiring board 2 by three-dimensionally forming the wiring structure of the inductor electrode 6. With this structure, the magnetic flux lines are not blocked by the electrodes of the mounted parts and the like, and the inductor characteristics are improved.

  As shown in FIG. 1A, an insulating film 10 formed of an insulating material such as epoxy resin, polyimide, or silicon resin may be disposed between the coil core 5 and each of the wiring boards 8a to 8c. In this way, the insulation between the coil core 5 and the inductor electrode 6 can be ensured, so that the characteristics of the inductor electrode 6 can be stabilized.

(Method of manufacturing inductor parts)
Next, a method of manufacturing the inductor component 1a will be described with reference to FIG. 2 and FIG. 2 is a plan view of the wiring boards 8a to 8c in a state of being supported by a frame, and FIG. 3 is a view for explaining a method of manufacturing the inductor component 1a.

  First, each wiring board 8a-8c is prepared. For example, the two upper wiring boards 8a and 8b can be formed by etching one metal plate made of Cu or the like. At this time, after removing the area of the frame 11a and both upper side wiring boards 8a and 8b, they are removed by etching, and the end portions 81a and 81b of both upper side wiring boards 8a and 8b are supported by the frame 11a. The end portions 80a and 80b of the plates 8a and 8b form a first etching plate 12a supported by the frame 11a via the support portions 82a and 82b. Further, in the end portions 80a and 80b of the upper side wiring boards 8a and 8b, notches are formed for later bending. Similarly, the lower wiring board 8c forms the second etching plate 12b in a state in which the lower wiring board 8c and the support portion 82c are supported by the frame 11b. In addition, formation of each wiring boards 8a-8c can use not only etching but various methods, such as punching process, for example.

  Next, as shown in FIG. 3A, the end portions 80a and 80b of the upper side wiring boards 8a and 8b of the first etching plate 12a are bent to form connection portions 7a and 7b. For forming the connection portions 7a and 7b, for example, both upper side wiring boards 8a and 8b are fixed with a jig or the like, and a mold material is disposed at a predetermined position of the end portions 80a and 80b of both upper side wiring boards 8a and 8b. There is a method of bending the end portions 80a and 80b into a predetermined shape by applying. FIG. 3A corresponds to the “first structure” in the present invention.

  Next, as shown in FIG. 3B, the coil core 5 having the insulating film 10 disposed on the upper surface and the lower surface is disposed in the first structure. At this time, the rod-like portion 5b of the coil core 5 is disposed between the connection portions 7a and 7b.

  Next, as shown in FIG. 3C, the lower surfaces 70a and 70b of the connection portions 7a and 7b are joined to one surface of the lower wiring board 8c of the second etching plate 12b. The second etching plate and the lower surfaces 70a and 70b can be joined, for example, by solder. Moreover, it is also possible to join using joining materials other than solder, and an ultrasonic wave. The surfaces of the etching plates 12a and 12b may be subjected to surface treatment with Ni / Au plating, Zn, Cr or the like in order to facilitate bonding.

Next, as shown in FIG. 3D, upper end surfaces (corresponding to “one end of the metal pin” of the present invention) of both metal pins 9a and 9b are placed on the first etching plate 12a (upper wiring boards 8a and 8b). By bonding, the inductor electrode 6 is formed (FIG. 3D corresponds to the “second structure” in the present invention). The connection can also use a bonding material such as solder bonding, ultrasonic bonding, and a conductive adhesive.

  Next, as shown in FIG. 3 (e), after mounting each component 4 on the upper surface 2a of the wiring substrate 2 using a well-known surface mounting technique, the lower end surfaces of both metal pins 9a and 9b are formed on the upper surface 2a. It connects (FIG. 3 (e) is corresponded to the "3rd structure" of this invention). In this case, each component 4 is disposed between the second etching plate 12 b and the upper surface 2 a of the wiring substrate 2.

Next, as shown in FIG. 3 (f), the wiring substrate 2 and the inductor electrode 6 mounted on each part 4 is coated with an epoxy resin, that form a resin layer 3 (Fig. 3 (f) is the invention Equivalent to the “fourth structure” of For example, a mold method or a dispense method can be used to form the resin layer 3.

  Next, as shown in FIG. 3 (g), removing the frame 11a (see FIG. 2 (a)) of the first etching plate 12a and the frame 11b (see FIG. 2 (b)) of the second etching plate 12b. Thus, the inductor component 1a is completed. For example, dicing or laser processing can be used to remove the frames 11a and 11b.

  Therefore, according to the above-described embodiment, since the inductor electrode 6 is formed by the wiring boards 8a to 8c and the metal pins 9a and 9b each having a resistance value lower than that of the conductive paste or plating, the entire inductor electrode 6 is Therefore, the characteristics (for example, the inductance value) of the inductor component 1a can be improved.

  For example, it is also conceivable to form the inductor electrode 6 using a metal pin in a direction perpendicular to the main surface of the resin layer 3 and a metal plate in a direction parallel to the main surface. In this case, since the metal pin has a low resistance value, the resistance value of the entire inductor electrode 6 can be reduced, but the difference in the resistance value between the metal pin and the metal plate causes an impedance mismatch. According to the embodiment described above, since all the portions except the input / output terminals formed by the metal pins 9a and 9b are formed by the wiring boards 8a to 8c, the case of using the metal pins for the connection portions 7a and 7b and In comparison, impedance mismatch can be suppressed.

  In addition, by adjusting the length of both metal pins 9a and 9b and forming a space under the lower wiring board 8c, for example, the area on the upper surface side of the resin layer 3 is used for the formation area of the inductor electrode 6 It is possible to improve the degree of freedom in designing the inside of the resin layer 3, such as setting the region on the lower surface side of the resin layer 3 as a component placement region. Further, by arranging each component 4 between the upper surface 2a of the wiring board 2 and the lower wiring board 8c, the inductor component 1a can be miniaturized. Further, for example, when the coil is formed only by the wiring electrode formed on the upper surface 2 a of the wiring substrate 2, it is difficult to reduce the area of the upper surface 2 a of the wiring substrate 2. By forming the wiring structure, the area of the upper surface 2 a of the wiring substrate 2 can be easily reduced. Further, in this case, since the wiring substrate 2 having the heat dissipation characteristics superior to that of the resin layer 3 is disposed between the components 4 and the mother substrate, the inductor component 1a having the excellent heat dissipation characteristics can be provided.

  Further, since each of the wiring boards 8a to 8c is formed such that both ends thereof reach the peripheral edge of the resin layer 3, each of the wiring boards 8a to 8c is formed only in a portion necessary to form the inductor electrode 6. As compared with the case where it is formed, the metal portion in the inductor component 1a can be increased, whereby the heat dissipation of the inductor component 1a can be improved.

  In addition, since the potential difference between the two metal pins 9a and 9b forming the input / output terminal of the inductor electrode 6 is large, the characteristic deterioration of the inductor electrode 6 due to the stray capacitance may be concerned. In this case, since both metal pins 9a and 9b are disposed apart, it is possible to suppress stray capacitance. Because of the pin shape, it is also possible to reduce the facing area between the pins, and it is possible to further suppress stray capacitance.

  Further, in this embodiment, the coil core 5 includes the annular portion 5a and the rod portion 5b, and the inductor electrode 6 is spirally wound along the length direction of the rod portion 5b. In this way, the coil core 5 is disposed in the magnetic flux path through which the magnetic flux generated when the inductor electrode 6 is energized passes, so the inductance value of the inductor electrode 6 can be efficiently increased.

When the inductor component 1a of this embodiment is to be manufactured using a pattern formed of conductive paste or plating instead of the wiring boards 8a to 8c, the components 4 are mounted on the upper surface 2a of the wiring board 2 Thereafter, each component 4 is sealed with a first resin layer, and a portion corresponding to the lower wiring board 8c is formed on the surface of the first resin layer by conductive paste or plating. Thereafter, coil cores, metal pins and the like are disposed on the surface of the first resin layer, and these are sealed with the second resin layer, and then portions corresponding to the upper wiring boards 8a and 8b are formed on the surface of the second resin layer. It will be done. In this case, the portions corresponding to the resin layer and the wiring board need to be formed in two separate steps. On the other hand, according to this embodiment, since the inductor component 1a can be manufactured using the two etching plates 12a and 12b and the both metal pins 9a and 9b, the number of resin layers 3 can be reduced to one. The manufacturing cost of the inductor component 1a can be reduced. Further, since the printing process and the plating process for forming the conventional wiring portion become unnecessary, the manufacturing cost of the inductor component 1a can be further reduced.

(Modification of wiring board)
In the embodiment described above, the portion of the lower wiring board 8c which forms the support portion 82c is thinner than the portion which forms the inductor electrode 6, but as shown in FIG. 4A, the lower wiring board The supporting portion 82c of 8c may have the same width as the central portion of the lower wiring board 8c. Further, as shown in FIG. 4B, the upper wiring boards 8a and 8b may have two supporting portions 82a, 83a, 82b and 83b, respectively. Further, as shown in FIG. 4C, the support portion 82c of the lower wiring board 8c is formed to have the same width as the central portion of the lower wiring board 8c, and the support portions 82a and 82b of the upper wiring boards 8a and 8b. May have the same width as the central portion of the upper wiring boards 8a and 8b. In the case of the above-mentioned modification, since the metal part in inductor component 1a can be increased, the heat dissipation of inductor component 1a can be improved. Furthermore, in the present embodiment, an example in which the bent portion is provided on the upper wiring board is shown, but in the present invention, the bent portion may be provided on the lower wiring board.

Second Embodiment
An inductor component according to a second embodiment of the present invention will be described with reference to FIG. FIG. 5A is a view when the inductor component is viewed in a direction parallel to the main surface of the wiring substrate, and a portion of the resin layer is omitted so that the internal structure can be seen. FIG. 5B is a plan view of the inductor component showing the wiring structure of the inductor electrode.

  The inductor component 1b of this embodiment differs from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that the connection portions 7a and 7b have a concave cross-sectional shape as shown in FIG. It is bending. The other configuration is the same as that of the inductor component 1 a of the first embodiment, and thus the description will be omitted by giving the same reference numerals.

  In this case, as shown in FIG. 5A, the connection portions 7a and 7b formed on the upper wiring boards 8a and 8b have a concave sectional shape when viewed from the plane parallel to the main surface of the resin layer 3 (Bent in a direction perpendicular to the lower surface 3a of the resin layer 3 and sectioned in the length direction of the upper wiring boards 8a and 8b) and formed so that the lower surfaces 70a and 70b of the connection portions 7a and 7b are on the lower side. By contacting the wiring board 8c, each of the upper wiring boards 8a and 8b and the lower wiring board 8c are electrically connected. Further, as shown in FIG. 5B, the supporting portions 82a and 82b of the upper wiring boards 8a and 8b are formed to reach the peripheral edges 30a and 30b of the resin layer 3, respectively, and the widths of the supporting portions 82a and 82b Is formed to have the same width as the central portion of the upper wiring boards 8a and 8b. The support portion 82c of the lower wiring board 8c is also formed to have the same width as the central portion of the lower wiring board 8c.

(Method of manufacturing inductor parts)
Next, a method of manufacturing the inductor component 1 b will be described with reference to FIGS. 6 and 7. 6 is a plan view of the wiring boards 8a to 8c in a state of being supported by a frame, and FIG. 7 is a view for explaining a method of manufacturing the inductor component 1b.

  First, as shown in FIG. 6, the wiring boards 8a to 8c are prepared. Each of the wiring boards 8a to 8c can be formed, for example, by etching one metal plate formed of Cu or the like on the two upper wiring boards 8a and 8b. At this time, after the areas of the frame 11a and the upper side wiring boards 8a and 8b are left, they are removed by etching to form a first etching plate 12a. Similarly, the lower wiring board 8c forms a second etching plate 12b in which both ends of the lower wiring board 8c are supported by the frame 11b. At this time, the first etching plate 12a may be formed to be larger than the second etching plate in consideration of the bent portion in order to perform bending processing to form the connection portions 7a and 7b later.

  Next, as shown in FIG. 7A, predetermined positions of the upper side wiring boards 8a and 8b of the first etching plate 12a and arbitrary places of the frame portion are bent to form connection portions 7a and 7b. . The connection portions 7a and 7b can be formed, for example, by pressing or the like in which a mold is pressed against a predetermined position of the both upper side wiring boards 8a and 8b and bent. FIG. 7A corresponds to the “first structure” in the present invention.

  Next, as shown in FIG. 7B, the coil core 5 having the insulating film 10 disposed on the upper surface and the lower surface is disposed in the first structure. At this time, the rod-like portion 5b of the coil core 5 is positioned between the connection portions 7a and 7b.

  Next, as shown in FIG. 7C, the lower surfaces 70a and 70b of the connection portions 7a and 7b are joined to one surface of the lower wiring board 8c of the second etching plate 12b. The second etching plate 12b and the lower surfaces 70a and 70b can be joined by solder. Moreover, it is also possible to join using joining materials other than solder, and an ultrasonic wave. The surfaces of the etching plates 12a and 12b may be subjected to surface treatment with Ni / Au plating, Zn, Cr or the like in order to facilitate bonding.

Next, as shown in FIG. 7 (d), upper end surfaces of both metal pins 9 a and 9 b (corresponding to “one end of metal pin of the present invention”) so as to be located in the outer region of the annular portion 5 a of the coil core 5 Is bonded to the first etching plate 12a (upper wiring boards 8a and 8b) to form an inductor electrode 6 (FIG. 3D corresponds to the "second structure" of the present invention). The connection can also use a bonding material such as solder bonding, ultrasonic bonding, and a conductive adhesive.

  Next, as shown in FIG. 7 (e), after mounting each component 4 on the upper surface 2a of the wiring substrate 2 using a well-known surface mounting technology, the lower end surfaces of both metal pins 9a and 9b are formed on the upper surface 2a. Connection is made (FIG. 7 (e) corresponds to the "third structure" of the present invention). In this case, each component 4 is disposed between the second etching plate 12 b and the upper surface 2 a of the wiring substrate 2.

Next, as shown in FIG. 7 (f), the wiring substrate 2 and the inductor electrode 6 mounted on each part 4 is coated with an epoxy resin, that form a resin layer 3 (Fig. 7 (f) is the invention Equivalent to the “fourth structure” of For example, a mold method or a dispense method can be used to form the resin layer 3.

  Next, as shown in FIG. 7 (g), removing the frame 11a (see FIG. 6 (a)) of the first etching plate 12a and the frame 11b (see FIG. 6 (b)) of the second etching plate 12b. Thus, the inductor component 1b is completed. For example, dicing or laser processing can be used to remove the frames 11a and 11b.

  According to the above-described embodiment, the same effect as that of the first embodiment can be obtained.

(Modification of wiring board)
As shown in FIG. 8, the support parts 82a and 82b of the upper wiring boards 8a and 8b and the support part 82c of the lower wiring board 8c have a smaller line width than the central parts (inductor electrode forming parts) of the wiring boards 8a to 8c. It may be formed.

Third Embodiment
An inductor component according to a third embodiment of the present invention will be described with reference to FIG. FIG. 9 is a plan view of the inductor component 1c showing the wiring structure of the inductor electrode.

  The inductor component 1c of this embodiment is different from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that the shape of the connection portions 7a and 7b is recessed as shown in FIG. It is. The other configuration is the same as that of the inductor component 1 a of the first embodiment, and thus the description will be omitted by giving the same reference numerals.

  In this case, as shown in FIG. 9, the connection portions 7a and 7b formed on the upper wiring boards 8a and 8b are both recessed in the direction of the lower wiring board 8c. At this time, the cross-sectional shape as viewed in a direction parallel to the lower surface 3 a of the resin layer 3 is the same as that shown in FIG. Then, when the lower surfaces (not shown) of the connection portions 7a and 7b contact the lower wiring board 8c, the upper wiring boards 8a and 8b are electrically connected to the lower wiring board 8c. The connection portions 7a and 7b can be formed, for example, by pressing a member having a conical convex portion against a predetermined position of the upper wiring boards 8a and 8b. A hole may penetrate through the lower surface of the connection portions 7a and 7b.

  Therefore, according to the above-mentioned embodiment, the same effect as that of the first embodiment can be obtained.

(Modification of wiring board)
As shown in FIG. 10, the support portions 82a to 82c of the wiring boards 8a to 8c may be formed to have the same width as the central portions of the wiring boards 8a to 8c. In this case, since the metal part in the inductor component 1c can be increased, the heat dissipation of the inductor component 1c can be improved.

Fourth Embodiment
An inductor component according to a third embodiment of the present invention will be described with reference to FIG. FIG. 11A is a view when the inductor component is viewed in a direction parallel to the main surface of the wiring substrate, and a portion of the resin layer is omitted so that the internal structure can be seen. FIG. 11B is a plan view of the inductor component showing the wiring structure of the inductor electrode.

  The inductor component 1d of this embodiment is different from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that the connection portions 7a and 7b are the wiring boards 8a and 8b as shown in FIG. It is formed by thickening a part. The other configuration is the same as that of the inductor component 1 a of the first embodiment, and thus the description will be omitted by giving the same reference numerals.

  In this case, as shown in FIG. 11A, connection portions 7a and 7b formed thicker than the periphery are formed at predetermined positions of the upper wiring boards 8a and 8b. The connection portions 7a and 7b can be formed by thinning the surrounding metal plate by etching. When the lower surfaces 70a and 70b of the connection portions 7a and 7b are in contact with the lower wiring board 8c, the upper wiring boards 8a and 8b are electrically connected to the lower wiring board 8c. Further, as shown in FIG. 11B, the support portions 82a to 82c of the wiring boards 8a to 8c are formed to reach the peripheral edges 30a and 30b of the resin layer 3, respectively.

  Therefore, according to the above-mentioned embodiment, the same effect as that of the first embodiment can be obtained.

Fifth Embodiment
An inductor component according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 12A is a view when the inductor component is viewed in a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen. FIG. 12B is a plan view of the inductor component showing the wiring structure of the inductor electrode.

  The inductor component 1e of this embodiment differs from the inductor component 1a of the first embodiment described with reference to FIG. 1 in the arrangement of the wiring boards 8d to 8f and the metal pins 9a, as shown in FIG. The arrangement of 9b is different. The other configuration is the same as that of the inductor component 1 a of the first embodiment, and thus the description will be omitted by giving the same reference numerals.

  In this case, the inductor electrode 6 is formed of one upper wiring board 8d and two lower wiring boards 8e and 8f, and the one upper wiring board 8d is the lower side of the first embodiment. It is formed in the same shape as the wiring board 8c (see FIG. 1B), and the two lower wiring boards 8e and 8f have the same shape as the upper wiring boards 8a and 8b in the first embodiment (FIG. 1B) Reference). The two metal pins 9a and 9b constituting the input / output terminal of the inductor electrode 6 connect the upper wiring boards 8a and 8b to the wiring board 2 in the first embodiment, but in this embodiment, It is formed shorter than that of the first embodiment, and the lower wiring boards 8e and 8f and the wiring board 2 are connected.

  According to this configuration, since the inductor electrode 6 is formed by the metal pins 9a and 9b and the wiring boards 8d and 8f each having a resistance value lower than that of the conductive paste or plating, the resistance of the entire inductor electrode 6 can be reduced. Thus, the characteristics (for example, the inductance value) of the inductor component 1e can be improved. Furthermore, the distance between the mother substrate and the coil portion can be shortened, and the resistance can be reduced.

Sixth Embodiment
An inductor component according to a sixth embodiment of the present invention will be described with reference to FIG. FIG. 13A is a view when the inductor component is viewed in a direction parallel to the main surface of the wiring substrate, and a part of the resin layer is not shown so that the internal structure can be seen. 13 (b) is a bottom view of the inductor component as viewed from the lower surface side, and FIG. 13 (c) is a plan view of the inductor component as viewed from the top surface.

  The inductor component 1f of this embodiment differs from the inductor component 1a of the first embodiment described with reference to FIG. 1 in the wiring board 8g, which is a first and second metal plate, as shown in FIG. The inductor electrode 6 is composed of 8 h and the wiring electrode 13 provided on the wiring substrate 2. The other configuration is the same as that of the inductor component 1 a of the first embodiment, and thus the description will be omitted by giving the same reference numerals.

  In the inductor component 1 f, the wiring electrode 13 is provided on the lower surface 2 b of the wiring substrate 2. Further, the inductor electrode 6 has two wiring boards 8g and 8h, and a first bending portion 7c and a second bending portion 7d formed by parts of the wiring boards 8g and 8h are the wiring board 2 By contacting the wiring electrode 13 provided on the lower surface 2 b, a coil wound around the rod-like portion 5 b of the coil core 5 is formed. When viewed from a direction parallel to the upper surface 2a of the wiring board 2, both bent portions 7c and 7d have L-shaped end portions 80g and 80h (see FIG. 14A) of the wiring boards 8g and 8h. The respective tip portions 70c and 70d of the two bent portions 7c and 7d are bent and formed, and the lower surface 2b of the wiring board 2 is electrically connected to the wiring electrode 13. At this time, as shown in FIG. 13B, on the surface including the lower surface 2b of the wiring substrate 2 of the inductor component 1f, the tip portions 70c and 70d of the bent portions 7c and 7d are in contact with the wiring electrode 13 An inductor electrode is formed. Further, as shown in FIG. 13C, supporting portions 82g, 84g, 82h, 84h each having a line width smaller than that of the central portion of each of the wiring boards 8g, 8h are integrally formed. Exposed to the side.

(Method of manufacturing inductor parts)
Next, a method of manufacturing the inductor component 1 f will be described with reference to FIGS. 14 and 15. 14 (a) and 14 (b) are plan views of the wiring boards 8g and 8h in a state of being supported by a frame, and FIG. 14 (c) is a cross section of the wiring boards 8g and 8h in a state of being supported by a frame FIG. 15 is a view for explaining a method of manufacturing the inductor component 1 f.

  First, as shown in FIG. 14A, the wiring boards 8g and 8h are prepared. The wiring boards 8g and 8h can be formed by etching one metal plate made of Cu or the like. At this time, the frame 11a, the wiring boards 8g and 8h, and the supports 82g, 84g, 82h and 84h are removed by etching, and both the boards 8g and 8h are supported by the supports 82g, 84g, 82h and 84h, respectively. To form an etched plate 12c. Further, in the end portions 80g and 80h of both the wiring boards 8g and 8h, notches for later bending are formed (dotted line portion in FIG. 14A). The formation of the wiring boards 8g and 8h is not limited to etching, and various methods such as punching may be used, for example.

  Next, as shown in FIGS. 14B and 14C, the end portions 80g and 80h of the wiring boards 8g and 8h of the etching plate 12c are bent to form both bent portions 7c and 7d. Do. For the formation of both bent portions 7c and 7d, for example, the wiring boards 8g and 8h are fixed with a jig or the like, and a mold material is disposed at predetermined positions of the end portions 80g and 80h of both wiring boards 8g and 8h, respectively. There is a method of bending the end portions 80g and 80h into a predetermined shape by applying.

  Next, as shown in FIGS. 15 (a) and 15 (b), the coil core 5 having the insulating film 10 on the upper and lower surfaces is disposed on the etching plate 12c in which both the bent portions 7c and 7d are formed. At this time, the rod-shaped portion 5b of the coil core is disposed between the bent portions 7c and 7d. Next, as shown in FIGS. 15C and 15D, an etching plate 12c on which the coil core 5 is disposed, and a wiring board 2 on which the component 4 is mounted on the upper surface 2a and the wiring electrode 13 is provided on the lower surface 2b. And join. The etching plate 12c and the wiring substrate 2 can be joined by solder. At this time, tip portions 70c and 70d of both bent portions 7c and 7d are in contact with wiring electrode 13, and both bent portions 7c and 7d are electrically connected via wiring electrode 13, so that inductor electrode 6 is Form. The surface of the etching plate 12c may be subjected to surface treatment with Ni / Au plating, Zn, Cr or the like in order to facilitate bonding.

  Thereafter, as shown in FIG. 15E, the wiring substrate 2 and the inductor electrode 6 are coated with a resin such as epoxy resin to form a resin layer 3. For example, a mold method or a dispense method can be used to form the resin layer 3. Thereafter, the frame 11a of the etching plate is removed, and dicer cutting or the like is performed as necessary to complete the inductor component 1f.

  Therefore, according to the above-described embodiment, the inductor electrode 6 can be easily formed only by the wiring boards 8 g and 8 h and the wiring electrode 13. Further, since the inductor electrode 6 having a large coil diameter can be formed, the characteristics (for example, the inductance value) of the inductor component 1 f can be improved. In addition, since the tip portions 70c and 70d of the both bent portions 7c and 7d and the wiring electrode 13 are exposed, the heat dissipation characteristics can be improved by bonding to the mother substrate.

(Modified example of bending part)
In the above-described embodiment, both of the bent portions 7c and 7d are formed in an L shape when viewed from the direction parallel to the top surface 2a of the wiring substrate 2 with the respective tip portions 70c and 70d further bent. The inductor electrode 6 is formed by bringing the end portions 70c and 70d into contact with the lower surface 2b of the wiring board 2, but as shown in FIG. 16A, both the bent portions 7c and 7d are the upper surface of the wiring board 2 When viewed in a direction parallel to 2a, it may be formed in a linear shape (I-shaped). In this case, both the bent portions 7 c and 7 d pass through the inside of the wiring board 2 and contact the wiring electrode 13, whereby the inductor electrode 6 is formed. In this case, since the mounting area of the wiring board 2 can be made larger than in the case of the above-described embodiment, it is possible to mount more components. Note that, as shown in FIG. 16B, the wiring electrode 13 may be provided inside the wiring substrate 2.

Seventh Embodiment
An inductor component according to a seventh embodiment of the present invention will be described with reference to FIG. FIG. 17 is a view when the inductor component is viewed in a direction parallel to the main surface of the wiring substrate, and a part of the resin layer is not shown so that the internal structure can be seen.

  The inductor component 1g of this embodiment differs from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that both the wiring boards 8g and 8h and the wiring substrate 2 are provided as shown in FIG. The wiring electrode 13 and the via conductors 14a and 14b constitute an inductor electrode. The other configuration is the same as that of the inductor component 1 a of the first embodiment, and thus the description will be omitted by giving the same reference numerals.

  In this case, the inductor electrode 6 is formed by electrically connecting the two wiring boards 8g and 8h and the wiring electrode 13 provided inside the wiring board 2 via the via conductors 14a and 14b. That is, on the upper surface 2a of the wiring substrate 2, the tip portion 70c of the first bent portion 7c and one end of the wiring electrode 13 are connected by the via conductor 14a (corresponding to the "first via conductor" of the present invention) By connecting the tip portion 70d of the portion 7d and the other end of the wiring electrode 13 by the via conductor 14b (corresponding to the "second via conductor" of the present invention), both the wiring boards 8g and 8h and the wiring electrode 13 are electrically connected. Are connected to form an inductor electrode 6.

  According to this configuration, the inductor electrode 6 can be easily formed by electrically connecting the two wiring boards 8g and 8h and the wiring electrode 13 via the via conductors 14a and 14b. At this time, since the inductor electrode 6 having a large coil diameter can be formed, the characteristics (for example, the inductance value) of the inductor component 1g can be improved.

Eighth Embodiment
An inductor component according to an eighth embodiment of the present invention will be described with reference to FIG. FIG. 18A is a view when the inductor component is viewed in a direction parallel to the main surface of the wiring substrate, and a portion of the resin layer is omitted so that the internal structure can be seen. FIG. 18B is a plan view of the lower surface of the inductor component.

  The inductor component 1h of this embodiment is different from the inductor component 1a of the first embodiment described with reference to FIG. 1 in both wiring boards 8g and 8h and a part of each as shown in FIG. The inductor electrode is formed only by the both bent portions 7c and 7d. The other configuration is the same as that of the inductor component 1 a of the first embodiment, and thus the description will be omitted by giving the same reference numerals.

  In this case, the inductor electrode 6 is bent in an L shape when both of the bent portions 7c and 7d are seen from a direction parallel to the top surface 2a of the wiring board 2 when a part of each of the wiring boards 8g and 8h is viewed. The inductor electrode 6 is formed by being formed and brought into contact and electrically connected in a state where the respective tip portions 70c, 70d of both the bent portions 7c, 7d are butted to each other.

  According to this configuration, the inductor electrode 6 can be formed only by both the wiring boards 8g and 8h.

  The present invention is not limited to the above-described embodiments, and various modifications can be made other than those described above without departing from the scope of the invention. For example, although the case where the inductor electrode 6 forms a coil has been described in each of the above-described embodiments, it may be used as an inductor element. Moreover, the structure without the coil core 5 may be sufficient.

  Further, the number of turns of the inductor electrode 6 can be changed as appropriate. In this case, the number of metal pins and wiring boards may be changed according to the number of turns.

  In addition to the above-described shapes, the shapes of the connection portions 7a and 7b may be, for example, a shape such as a cut and raised rib or an annular rib.

  The present invention can be widely applied to various inductor components in which an inductor electrode includes a resin layer and an inductor electrode.

1a to 1g Inductor parts 2 Wiring board 3 Resin layer 4 Parts 5 Coil core 5a Annular part 5b Rod portion 6 Inductor parts 7a, 7b Connection part (first connection part, second connection part)
7c, 7d bend (first bend, second bend)
8a, 8b Upper wiring board (first metal plate, third metal plate)
8c Lower wiring board (second metal plate)
8g, 8h Wiring board (1st metal plate, 2nd metal plate)
9a, 9b Metal pin 13 Wiring electrode 14a, 14b Via conductor (first via conductor, second via conductor)

Claims (12)

A resin layer having a main surface,
With an inductor electrode,
The inductor electrode is
A first metal plate disposed inside the resin layer;
And a second metal plate having a portion overlapping the first metal plate when viewed in a direction perpendicular to the main surface of the resin layer,
In the overlapping portion of the first metal plate and the second metal plate, the first connection portion is formed by a part of one of the two metal plates and connected to the other metal plate. ,
The first connection site, features and be Louis inductor component that toward the portion of the one metal plate to the other metal plate is obtained by bending in a concave cross-sectional shape. A resin layer having a main surface,
With an inductor electrode,
The inductor electrode is
A first metal plate disposed inside the resin layer;
And a second metal plate having a portion overlapping the first metal plate when viewed in a direction perpendicular to the main surface of the resin layer,
In the overlapping portion of the first metal plate and the second metal plate, the first connection portion is formed by a part of one of the two metal plates and connected to the other metal plate. ,
The first connection site, features and be Louis inductor component that the portion of the one metal plate is obtained by thicker toward the other metal plate. A resin layer having a main surface,
With an inductor electrode,
The inductor electrode is
A first metal plate disposed inside the resin layer;
And a second metal plate having a portion overlapping the first metal plate when viewed in a direction perpendicular to the main surface of the resin layer,
In the overlapping portion of the first metal plate and the second metal plate, the first connection portion is formed by a part of one of the two metal plates and connected to the other metal plate. ,
The first connection site, features and be Louis inductor component that the portion of the one metal plate is obtained by recessed. A wiring substrate whose one main surface is in contact with the main surface of the resin layer;
A component mounted on the one main surface of the wiring substrate and sealed in the resin layer;
The inductor electrode is
The wiring board is disposed inside the resin layer, one end is connected to one of the first metal plate and the second metal plate, and the other end is exposed to the main surface of the resin layer to form the wiring board The inductor component according to any one of claims 1 to 3 , further comprising a metal pin connected to the. The inductor electrode is
The third metal plate is disposed at substantially the same position as the first metal plate in a direction perpendicular to the main surface of the resin layer, and further includes a third metal plate having a portion different from the overlapping portion and overlapping the second metal plate. And
In the overlapping portion of the second metal plate and the third metal plate, a portion formed by a part of one of the second metal plate and the third metal plate is in contact with the other metal plate. 5. The coil according to any one of claims 1 to 4 , characterized in that the inductor electrode forms a coil having a winding axis in a direction substantially parallel to the main surface of the resin layer by having two connection portions. Inductor parts. At least one of the first metal plate and the second metal plate is formed such that part of an edge thereof reaches the periphery of the resin layer when viewed in a direction perpendicular to the main surface of the resin layer The inductor component according to any one of claims 1 to 5 , characterized in that: Be between the second connecting portion and the first connecting portion, claim 5 or claim and having a coil core which is disposed between the first metal plate and the second metal plate The inductor component according to claim 6 , which is subordinate to 5 . In the coil core, when viewed in a direction perpendicular to the main surface of the resin layer, an annular portion and a rod-like portion provided to bisect the inner region of the annular portion are combined. Have a shape
The rod-shaped portion is disposed between the first connection portion and the second connection portion, and is disposed such that an axial direction of the rod-shaped portion is substantially parallel to the winding axis of the coil. The inductor component according to claim 7 , characterized in that: Forming a first structure having a connection portion formed on one surface of the first metal plate by processing the first metal plate supported by the flat frame;
By connecting one surface of the second metal plate supported by the flat frame to the tip of the connection portion, and connecting one end of the metal pin to the surface of the first metal plate facing the second metal plate Forming a second structure in which an inductor electrode having the first metal plate, the second metal plate, and the metal pin is formed;
By connecting the other end of the metal pin to the one main surface of the wiring substrate on which the component is mounted on the one main surface, the component is between the one main surface of the wiring substrate and the second metal plate. Forming a third structure to be arranged;
Forming a fourth structure having the third structure and a resin layer by sealing the third structure with a resin;
Processing the fourth structure so as to remove the flat frame of the first metal plate and the flat frame of the second metal plate. A wiring board,
A component mounted on one main surface of the wiring substrate;
A resin layer that is laminated on the one main surface of the wiring substrate and covers the component;
A coil core disposed inside the resin layer and having a portion overlapping the component when viewed in a direction perpendicular to the one main surface of the wiring substrate;
And an inductor electrode for winding the coil core,
The first metal plate and the second metal plate disposed on the resin layer such that at least a part of each of the inductor electrodes overlaps the coil core when viewed from a direction perpendicular to the one main surface of the wiring substrate. Have
The first metal plate has a first bent portion which is partially bent toward the other main surface of the wiring substrate and disposed inside the resin layer, and the second metal plate is one of the first bent portions. Has a second bent portion bent toward the other main surface of the wiring substrate and disposed inside the resin layer, and the tip portion of the first bent portion and the tip portion of the second bent portion are Electrically connected,
Wherein a distal end portion and said distal portion of the second bend of the first bent portion, wherein the to Louis inductor components that are connected through the wiring electrodes provided on the wiring board. The wiring electrode is provided inside the wiring substrate,
The tip end portion of the first bent portion and one end of the wiring electrode are connected by a first via conductor,
The inductor component according to claim 10 , wherein a tip end portion of the second bent portion and the other end of the wiring electrode are connected by a second via conductor. A wiring board,
A component mounted on one main surface of the wiring substrate;
A resin layer that is laminated on the one main surface of the wiring substrate and covers the component;
A coil core disposed inside the resin layer and having a portion overlapping the component when viewed in a direction perpendicular to the one main surface of the wiring substrate;
And an inductor electrode for winding the coil core,
The first metal plate and the second metal plate disposed on the resin layer such that at least a part of each of the inductor electrodes overlaps the coil core when viewed from a direction perpendicular to the one main surface of the wiring substrate. Have
The first metal plate has a first bent portion which is partially bent toward the other main surface of the wiring substrate and disposed inside the resin layer, and the second metal plate is one of the first bent portions. Has a second bent portion bent toward the other main surface of the wiring substrate and disposed inside the resin layer, and the tip portion of the first bent portion and the tip portion of the second bent portion are Electrically connected,
Features and to Louis inductor component that a tip portion of the second bend and the distal end portion of the first bending portion are directly connected.

Images