WO2017131011A1 - Inductor component and manufacturing method therefor - Google Patents

Inductor component and manufacturing method therefor Download PDF

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Publication number
WO2017131011A1
WO2017131011A1 PCT/JP2017/002476 JP2017002476W WO2017131011A1 WO 2017131011 A1 WO2017131011 A1 WO 2017131011A1 JP 2017002476 W JP2017002476 W JP 2017002476W WO 2017131011 A1 WO2017131011 A1 WO 2017131011A1
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WO
WIPO (PCT)
Prior art keywords
metal plate
inductor
resin layer
wiring board
main surface
Prior art date
Application number
PCT/JP2017/002476
Other languages
French (fr)
Japanese (ja)
Inventor
喜人 大坪
寛幸 大田
酒井 範夫
西出 充良
番場 真一郎
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2017564298A priority Critical patent/JP6521104B2/en
Publication of WO2017131011A1 publication Critical patent/WO2017131011A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/04Fixed inductances of the signal type  with magnetic core
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/06Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10Connecting leads to windings

Definitions

  • the present invention relates to an inductor component including a resin layer and an inductor electrode and a manufacturing method thereof.
  • an inductor component 100 in which a coil 102 is provided on a core substrate 101 formed of a printed board or a prepreg is known (see, for example, Patent Document 1).
  • an annular magnetic layer 103 is disposed inside the core substrate 101, and the coil 102 is spirally wound around the magnetic layer 103.
  • the coil 102 is arranged along the outer periphery of the magnetic layer 103 so as to form a plurality of inner interlayer connection conductors 102a arranged along the inner periphery of the magnetic layer 103 and a plurality of pairs with these interlayer connection conductors 102a.
  • each of the interlayer connection conductors 102 a and 102 b is formed of a through-hole conductor in which a conductor film is formed on the inner surface of a through hole that penetrates the core substrate 101. Further, each of the wiring patterns 102c and 102d is formed as a printed pattern using a conductive paste.
  • each of the interlayer connection conductors 102a and 102b constituting the coil 102 is formed of a through-hole conductor in which a conductor film is formed on the inner surface of the through hole. Since these interlayer connection conductors 102a and 102b are connected to the respective wiring patterns 102c and 102d by solder or the like, the value of the connection resistance becomes high.
  • each wiring pattern 102c, 102d is formed by conductive paste or plating, and has a higher resistance value than that of pure metal, so it is difficult to reduce the resistance value of the entire inductor electrode.
  • the present invention has been made in view of the above-described problems, and an object of the present invention is to improve the characteristics of an inductor component by lowering the resistance value of the entire inductor electrode in an inductor component including a resin layer and an inductor electrode.
  • an inductor component of the present invention includes a resin layer having a main surface and an inductor electrode, and the inductor electrode includes a first metal plate disposed inside the resin layer, A second metal plate having a portion overlapping with the first metal plate when viewed from a direction perpendicular to the main surface of the resin layer, and overlapping the first metal plate and the second metal plate.
  • the portion is characterized in that it has a first connection part formed by a part of one of the two metal plates and connected to the other metal plate.
  • the inductor electrode is formed of a metal plate having a resistance value lower than that of the conductive paste or plating, the resistance of the entire inductor electrode can be reduced. (For example, the inductance value) can be improved. Further, since the connection portion formed by a part of the metal plate can be used as the vertical wiring of the inductor, it is possible to form a three-dimensional inductor with an inexpensive configuration. In order to reduce the resistance of the inductor electrode, a method of forming the inductor electrode using a metal plate for wiring and a metal pin is also conceivable, but in this case, impedance mismatch between the metal plate and the metal pin is considered. Therefore, there is a problem that signal loss occurs. However, according to the above-described configuration, since the inductor electrode is configured only by the metal plate, impedance mismatch can be suppressed.
  • the first connection portion may be formed by bending an end portion of the one metal plate into an L shape when viewed from a direction parallel to the main surface of the resin layer. In this case, a specific configuration of the first connection site can be provided.
  • the first connection part may be formed by bending the part of the one metal plate with a concave cross-sectional shape toward the other metal plate. In this case, a specific configuration of the first connection site can be provided.
  • the first connection part may be a part in which the one metal plate is thickened toward the other metal plate. In this case, a specific configuration of the first connection site can be provided.
  • first connection portion may be a recess of the part of the one metal plate.
  • a specific configuration of the first connection site can be provided.
  • the circuit board further includes a wiring board whose one main surface is in contact with the main surface of the resin layer, and a component mounted on the one main surface of the wiring board and sealed by the resin layer, , Disposed inside the resin layer, having one end connected to one of the first metal plate and the second metal plate, and the other end exposed to the main surface of the resin layer. You may have further the metal pin connected to a board
  • the component when an external electrode is formed on the back surface opposite to the main surface of the wiring board and the inductor component is mounted on the mother substrate, the component can be placed near the mother substrate, so the component generates heat. The heat dissipation in the case can be improved. Further, by disposing the component between the main surface of the wiring board and the inductor electrode, it is possible to reduce the size of the inductor component.
  • the inductor electrode is disposed at substantially the same position as the first metal plate in a direction perpendicular to the main surface of the resin layer, and has a portion overlapping the second metal plate at a location different from the overlapping portion.
  • the inductor electrode may form a coil having a winding axis in a direction substantially parallel to the main surface of the resin layer.
  • a three-dimensional coil extending in both the main surface direction and the thickness direction of the resin layer can be formed. Also, a component can be disposed between the main surface of the wiring board and the inductor electrode, and the inductor component can be easily downsized.
  • At least one of the first metal plate and the second metal plate is such that a part of the edge reaches the periphery of the resin layer when viewed from a direction perpendicular to the one main surface of the resin layer. It may be formed.
  • the metal part of the inductor component increases, the heat dissipation of the inductor component can be improved.
  • the portion of the second metal plate is exposed from the resin layer, so that heat accumulated in the resin layer is dissipated. It becomes easy.
  • a coil core disposed between the first connection part and the second connection part and between the first metal plate and the second metal plate may be provided. According to this configuration, the inductance value of the inductor electrode can be effectively increased.
  • the coil core is composed of an annular portion and a rod-like portion provided so as to bisect the inner region of the annular portion when viewed from a direction perpendicular to the one main surface of the resin layer.
  • the rod-shaped portion is disposed between the first connection portion and the second connection portion, and the axial direction of the rod-shaped portion is substantially the same as the winding axis of the coil. You may arrange
  • the characteristics of the inductor electrode (for example, the inductance value) can be improved.
  • the method for manufacturing an inductor component according to the present invention includes a first structure in which a connection portion is formed on one surface of the first metal plate by processing the first metal plate supported by the flat frame. And connecting one surface of the second metal plate supported by the flat frame to the tip of the connecting portion, and a metal pin on the surface of the first metal plate facing the second metal plate.
  • a step of forming a second structure in which an inductor electrode having the first metal plate, the second metal plate and the metal pin is formed, and a component is mounted on one main surface By connecting the other end of the metal pin to the one main surface of the wiring board, a third structure in which components are arranged between the one main surface of the wiring board and the second metal plate Forming and sealing the third structure with a resin
  • the step of forming the fourth structure having the third structure and the resin layer, the flat plate frame of the first metal plate, and the flat plate frame of the second metal plate are removed. And a step of processing the fourth structure.
  • an inductor electrode having a resistance value lower than that of an inductor electrode formed by conductive paste or plating can be manufactured. Moreover, since it is not necessary to form a via in the resin layer, the manufacturing cost can be reduced. In addition, since both the first metal plate and the second metal plate are supported by the flat frame, it is necessary to use the main surface of the resin layer for the formation thereof, like a wiring pattern formed by a conventional conductive paste. Absent. Therefore, since the third structure can be formed before the resin layer is formed, the manufacturing cost of the inductor component can be reduced. In addition, since the plating or printing process is not required to form the inductor electrode as in the prior art, the manufacturing cost of the inductor component can be further reduced and the manufacturing time can be reduced.
  • the inductor component according to the present invention includes a wiring board, a component mounted on one main surface of the wiring substrate, a resin layer laminated on the one main surface of the wiring substrate, and covering the component, and the resin A coil core disposed inside a layer and having a portion overlapping with the component when viewed from a direction perpendicular to the one main surface of the wiring board; and an inductor electrode around which the coil core is wound, the inductor electrode Has a first metal plate and a second metal plate arranged in the resin layer so that at least a part thereof overlaps the coil core when viewed from a direction perpendicular to the one main surface of the wiring board.
  • the first metal plate has a first bent portion that is partly bent toward the other main surface of the wiring board and disposed inside the resin layer, and the second metal plate is Part of the wiring board A second bent portion that is bent toward the main surface and disposed inside the resin layer, and a tip portion of the first bent portion and a tip portion of the second bent portion are electrically connected; Also good.
  • the inductor electrode (coil) can be easily formed by electrically connecting the metal plates. Moreover, since the coil diameter can be increased, the inductor characteristics are improved. Furthermore, since the tip portions of both bent portions can be exposed to the other main surface side of the mounting substrate, the heat dissipation characteristics of the coil can be improved by joining the exposed tip portions to the mother substrate.
  • the tip portion of the first bent portion and the tip portion of the second bent portion may be connected via a wiring electrode provided on the wiring board. According to this configuration, the inductor electrode can be easily formed by using both the metal plates and the wiring electrodes provided on the wiring board.
  • the wiring electrode is provided inside the wiring board, the tip portion of the first bent portion and one end of the wiring electrode are connected by a first via conductor, and the tip portion of the second bent portion and the tip The other end of the wiring electrode may be connected by a second via conductor.
  • the inductor electrode can be easily formed by electrically connecting both the metal plates and the wiring board provided inside the wiring board through the vias.
  • the tip portion of the first bent portion and the tip portion of the second bent portion may be directly connected. According to this structure, it is possible to form an inductor electrode only with a metal plate.
  • the inductor electrode is formed of a metal plate having a resistance value lower than that of the conductive paste or plating, the resistance value of the entire inductor electrode can be lowered. Thereby, the characteristic (for example, inductance value) of an inductor component can be improved.
  • FIG. 1A is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen.
  • FIG. 1B is a plan view of the inductor component showing the wiring structure of the inductor electrode.
  • the inductor component 1a of this embodiment includes a wiring substrate 2, a resin layer 3 laminated on the upper surface 2a of the wiring substrate 2, a plurality of components 4 mounted on the upper surface 2a of the wiring substrate 2, and the interior of the resin layer 3.
  • the coil core 5 and the inductor electrode 6 are mounted on a mother board of an electronic device such as a portable terminal device.
  • the wiring substrate 2 is, for example, a glass epoxy resin substrate or a ceramic substrate, and via conductors and various wiring electrodes are formed therein. Further, on the upper surface 2a, connection electrodes (not shown) for connecting to each component 4 and metal pins 9a and 9b described later are formed.
  • the wiring board 2 may have either a single layer structure or a multilayer structure.
  • the component 4 is composed of, for example, a semiconductor element formed of Si or the like, a chip capacitor, a chip inductor, a chip resistor, or the like.
  • the resin layer 3 is provided so that wiring boards 8a to 8c, which will be described later, are disposed therein, and the lower surface 3a (corresponding to “the main surface of the resin layer” of the present invention) is in contact with the upper surface 2a of the wiring substrate 2. It is done.
  • the resin layer 3 and the wiring board 2 of this embodiment are formed in a horizontally long rectangular shape when viewed from a direction perpendicular to the lower surface 3a of the resin layer 3 (hereinafter sometimes referred to as a plan view). (See FIG. 1B).
  • the resin layer 3 can be formed of various materials generally used as a sealing resin such as an epoxy resin.
  • the coil core 5 is made of a magnetic material that is employed as a general coil core such as Ni-Zn ferrite.
  • the coil core 5 of this embodiment includes an annular portion 5a and a rod-like portion 5b provided so as to divide the inner region of the annular portion 5a into two equal parts in a plan view.
  • the upper and lower surfaces of the coil core may be covered with the insulating film 10.
  • the inductor electrode 6 has two upper wiring boards 8a and 8b, one lower wiring board 8c, and two metal pins 9a and 9b forming input / output terminals.
  • the upper wiring boards 8a and 8b and the lower wiring board 8c are connected via the connection portions 7a and 7b formed by each part, and a coil is formed that winds around the rod-shaped portion 5b of the coil core 5. Yes.
  • connection portions 7a and 7b formed by bending one end portions 80a and 80b (see FIG. 2A) toward the lower wiring board 8c are formed.
  • connection parts 7a, 7b and the lower wiring board 8c are joined by, for example, solder, so that the upper wiring board 8a, the lower wiring board 8c, and the upper wiring board 8b
  • the side wiring boards 8c are electrically connected to each other. That is, both connection parts 7a and 7b are formed by bending the dotted line portions (see FIG. 2A) of one end portions 80a and 80b of the upper wiring boards 8a and 8b. Further, the upper ends of the two metal pins 9 a and 9 b are both connected to the upper wiring boards 8 a and 8 b, and the lower end surface (corresponding to “the other end of the metal pin” of the present invention) is the lower surface of the resin layer 3.
  • both metal pins 9 a and 9 b are connected to the wiring board 2.
  • One of the metal pins 9 a and 9 b is an outer region of the annular portion 5 a of the coil core 5 and is disposed in the vicinity of one short side of the resin layer 3, and the other is an outer region of the annular portion 5 a of the coil core 5. In this case, the resin layer 3 is disposed in the vicinity of the other short side.
  • Both metal pins 9a and 9b can be formed by, for example, shearing a wire made of a metal such as Cu, Al, or Ag.
  • Both upper side wiring boards 8a and 8b are formed in a line shape substantially parallel to the longitudinal direction of the horizontally long resin layer 3 as shown in FIG. 1 (b) and FIG.
  • the right end 81a of the upper wiring board 8a is formed so as to reach the peripheral edge 30b (one short side of the horizontally long rectangular shape in plan view) of the resin layer 3.
  • the left end 81b of the upper wiring board 8b is formed so as to reach the peripheral edge 30a of the resin layer 3 (the other short side of the horizontally long rectangular shape in plan view). Both end portions 81 a and 81 b are exposed on the side surface of the resin layer 3.
  • connection parts 7a and 7b are L-shaped when viewed from a direction parallel to the lower surface 3a of the resin layer 3 (in other words, in at least one of the cross sections perpendicular to the lower wiring board 8c).
  • the lower surfaces 70a and 70b are in contact with the lower wiring board 8c. Since the lower end portions of the connection parts 7a and 7b are bent and the lower surfaces 70a and 70b are in contact with the lower wiring board 8c, the connection parts and the lower wiring board 8c can be reliably brought into contact with each other.
  • the lower surfaces 70a and 70b are not necessarily provided, and the connection portions 7a and 7b are formed in a straight line shape (I shape) when viewed from a direction parallel to the lower surface 3a of the resin layer 3. May be.
  • the end portions 80a and 80b of the upper wiring boards 8a and 8b are respectively provided with support portions 82a having a narrower line width than the central portions of the upper wiring boards 8a and 8b toward the peripheral edges 30a and 30b of the resin layer 3, respectively.
  • 82b is extended and formed.
  • the support portions 82 a and 82 b are formed integrally with the upper wiring boards 8 a and 8 b, respectively, and are exposed on the side surfaces of the resin layer 3.
  • the lower wiring board 8c is disposed inside the resin layer 3 so as to have portions overlapping with the upper wiring boards 8a and 8b when viewed from a direction perpendicular to the lower surface 3a of the resin layer 3. As shown in FIG. 1B, the lower wiring board 8c is formed in a line shape substantially parallel to the longitudinal direction of the horizontally-long rectangular resin layer 3, and is connected to the lower surfaces of the connection portions 7a and 7b. Further, the lower wiring board 8c is formed at both ends thereof with support portions 82c similar to the support portions 82a and 82b of the upper wiring boards 8a and 8b.
  • Each of the support portions 82 c is formed so as to reach the peripheral edges 30 a and 30 b of the resin layer 3, and the support portions 82 c are exposed on the side surfaces of the resin layer 3. Further, like the support portions 82a and 82b of the upper wiring boards 8a and 8b, the support portion 82c has a line width narrower than that of the central portion of the lower wiring board 8c.
  • the lower end surfaces of the two metal pins 9a and 9b are connected to connection electrodes (not shown) on the upper surface 2a of the wiring board 2.
  • connection electrodes (not shown) on the upper surface 2a of the wiring board 2.
  • the inductor electrode 6 that is wound around the rod-shaped portion 5b of the coil core 5 is formed using both the metal pins 9a and 9b as input / output terminals.
  • the axial direction (length direction) of the rod-like portion 5 b is substantially parallel to the winding axis of the inductor electrode 6.
  • the two upper wiring boards 8a and 8b correspond to the “first metal plate” and the “third metal board” of the present invention, and the one lower wiring board 8c of the present invention “the second metal plate”. Is equivalent to.
  • the winding axis of the coil is in a direction perpendicular to the upper surface 2a of the wiring board 2.
  • the winding structure of the coil (inductor electrode 6) is parallel to the upper surface 2a of the wiring board 2 by making the wiring structure of the inductor electrode 6 three-dimensional. With this structure, the magnetic flux lines are not blocked by the electrodes of the mounted components, and the inductor characteristics are improved.
  • an insulating film 10 made of an insulating material such as epoxy resin, polyimide, or silicon resin may be disposed between the coil core 5 and the wiring boards 8a to 8c. In this way, since the insulation between the coil core 5 and the inductor electrode 6 can be ensured, the characteristics of the inductor electrode 6 can be stabilized.
  • FIGS. 2 is a plan view of the wiring boards 8a to 8c supported by the frame
  • FIG. 3 is a diagram for explaining a method of manufacturing the inductor component 1a.
  • each wiring board 8a to 8c is prepared.
  • the two upper wiring boards 8a and 8b can be formed by etching one metal plate made of Cu or the like.
  • the regions of the frame 11a and the upper wiring boards 8a and 8b are left and removed by etching, and the ends 81a and 81b of the upper wiring boards 8a and 8b are supported by the frame 11a.
  • a first etching plate 12a is formed in which the end portions 80a and 80b of the plates 8a and 8b are supported by the frame 11a via the support portions 82a and 82b.
  • cuts are formed in the end portions 80a and 80b of the upper wiring boards 8a and 8b in order to be bent later.
  • the lower wiring board 8c forms the second etching plate 12b in a state where the lower wiring board 8c and the support portion 82c are supported by the frame 11b.
  • the formation of the wiring boards 8a to 8c is not limited to etching, and various methods such as punching can be used.
  • connection portions 7a and 7b are bent to form connection portions 7a and 7b.
  • both the upper wiring boards 8a and 8b are fixed with a jig or the like, and a mold material is arranged at a predetermined position of each end 80a and 80b of the both upper wiring boards 8a and 8b.
  • FIG. 3A corresponds to the “first structure” of the present invention.
  • the coil core 5 in which the insulating film 10 is disposed on the upper surface and the lower surface is disposed on the first structure.
  • the rod-shaped part 5b of the coil core 5 is disposed between the connection parts 7a and 7b.
  • the lower surfaces 70a and 70b of the connection portions 7a and 7b are joined to one surface of the lower wiring board 8c of the second etching plate 12b.
  • the second etching plate and the lower surfaces 70a and 70b can be joined by, for example, solder. It is also possible to bond using a bonding material other than solder or ultrasonic waves.
  • the surfaces of the etching plates 12a and 12b may be subjected to surface treatment with Ni / Au plating, Zn, Cr, or the like in order to facilitate bonding.
  • the upper end surfaces of the metal pins 9a and 9b are formed on the first etching plate 12a (upper wiring boards 8a and 8b).
  • the inductor electrode 6 is formed (FIG. 3D corresponds to the “second structure” of the present invention).
  • a bonding material such as solder bonding, ultrasonic bonding, and conductive adhesive can be used.
  • each component 4 is mounted on the upper surface 2a of the wiring board 2 using a known surface mounting technique, the lower end surfaces of both metal pins 9a and 9b are mounted on the upper surface 2a.
  • the connection is made (FIG. 3E corresponds to the “third structure” of the present invention).
  • each component 4 is arranged between the second etching plate 12 b and the upper surface 2 a of the wiring board 2.
  • FIG. 3F corresponds to the “fourth structure” of the present invention.
  • a mold method or a dispense method can be used for the formation of the resin layer 3.
  • the frame 11a of the first etching plate 12a (see FIG. 2A) and the frame 11b of the second etching plate 12b (see FIG. 2B) are removed.
  • the inductor component 1a is completed.
  • dicing or laser processing can be used to remove the frames 11a and 11b.
  • the inductor electrode 6 is formed by the wiring boards 8a to 8c and the metal pins 9a and 9b each having a resistance value lower than that of the conductive paste or plating.
  • the resistance (inductance value, for example) of the inductor component 1a can be improved.
  • the inductor electrode 6 using a metal pin in a direction perpendicular to the main surface of the resin layer 3 and a metal plate in a direction parallel to the main surface.
  • the resistance value of the metal pin is low, the resistance value of the inductor electrode 6 as a whole can be lowered.
  • impedance mismatch occurs due to the difference in resistance value between the metal pin and the metal plate.
  • all parts except the input / output terminals formed by the metal pins 9a and 9b are formed by the wiring boards 8a to 8c, so that the metal pins are used for the connection portions 7a and 7b. In comparison, impedance mismatch can be suppressed.
  • the inductor component 1a can be reduced in size.
  • the inductor electrode 6 is formed in a three-dimensional manner.
  • the area of the upper surface 2a of the wiring board 2 can be easily reduced.
  • the inductor component 1a having an excellent heat dissipation characteristic can be provided.
  • each wiring board 8a to 8c is formed so that both ends thereof reach the periphery of the resin layer 3, each wiring board 8a to 8c is formed only at a portion necessary for forming the inductor electrode 6. Compared with the case where it forms, the metal part in the inductor component 1a can be increased, and thereby the heat dissipation of the inductor component 1a can be improved.
  • the coil core 5 has an annular portion 5a and a rod-shaped portion 5b, and the inductor electrode 6 is spirally wound along the length direction of the rod-shaped portion 5b. If it does in this way, since the coil core 5 will be arrange
  • each component 4 is mounted on the upper surface 2a of the wiring board 2. Then, each component 4 is sealed with the first resin layer, and a portion corresponding to the city-side wiring board 8c is formed on the surface of the first resin layer with a conductive paste or plating. Thereafter, a coil core, a metal pin, and the like are disposed on the surface of the first resin layer, and after sealing them with the second resin layer, portions corresponding to the upper wiring boards 8a and 8b are formed on the surface of the second resin layer. Will do.
  • the inductor component 1a is manufactured using the two etching plates 12a and 12b and both the metal pins 9a and 9b, the formation of the resin layer 3 can be reduced to one time. The manufacturing cost of the inductor component 1a can be reduced. Further, since the conventional printing process and plating process for forming the wiring portion are not required, the manufacturing cost of the inductor component 1a can be further reduced.
  • the portion of the lower wiring board 8c where the support portion 82c is formed is thinner than the portion where the inductor electrode 6 is formed.
  • the support portion 82c of 8c may have the same width as the central portion of the lower wiring board 8c.
  • the upper side wiring boards 8a and 8b may have two support parts 82a, 83a, 82b, and 83b, respectively.
  • the support portion 82c of the lower wiring board 8c is formed to have the same width as the central portion of the lower wiring board 8c, and the support portions 82a and 82b of the upper wiring boards 8a and 8b.
  • the metal part in the inductor component 1a can be increased, so that the heat dissipation of the inductor component 1a can be improved. Furthermore, in this embodiment, although the example which provided the bending part in the upper side wiring board was shown, you may provide a bending part in a lower side wiring board in this invention.
  • FIG. 5A is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen.
  • FIG. 5B is a plan view of the inductor component showing the wiring structure of the inductor electrode.
  • the connecting portions 7a and 7b have a concave cross-sectional shape as shown in FIG. It is bent. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.
  • connection sites 7a and 7b formed on the upper wiring boards 8a and 8b have a concave cross-sectional shape when viewed from a plane parallel to the main surface of the resin layer 3. (The direction perpendicular to the lower surface 3a of the resin layer 3 and the cross-section in the length direction of the upper wiring boards 8a and 8b) is bent and the lower surfaces 70a and 70b of the connection parts 7a and 7b are on the lower side.
  • Each of the upper wiring boards 8a and 8b and the lower wiring board 8c are electrically connected by being in contact with the wiring board 8c. Further, as shown in FIG.
  • the support portions 82a and 82b of the upper wiring boards 8a and 8b are formed so as to reach the peripheral edges 30a and 30b of the resin layer 3, respectively, and the width of the support portions 82a and 82b. Is formed with the same width as the central portion of the upper wiring boards 8a, 8b.
  • the support portion 82c of the lower wiring board 8c is also formed with the same width as the central portion of the lower wiring board 8c.
  • FIGS. 6 is a plan view of the wiring boards 8a to 8c supported by the frame
  • FIG. 7 is a diagram for explaining a method of manufacturing the inductor component 1b.
  • wiring boards 8a to 8c are prepared.
  • Each of the wiring boards 8a to 8c can be formed, for example, by etching a single metal plate made of Cu or the like, and the two upper wiring boards 8a and 8b.
  • the regions of the frame 11a and the upper wiring boards 8a and 8b are left and removed by etching to form the first etching plate 12a.
  • the lower wiring board 8c forms the second etching plate 12b in a state where both ends of the lower wiring board 8c are supported by the frame 11b.
  • the first etching plate 12a is bent to form the connection portions 7a and 7b later, the first etching plate 12a is preferably formed larger than the second etching plate in consideration of the bent portion.
  • connection portions 7a and 7b are applied to predetermined positions of the upper wiring boards 8a and 8b of the first etching plate 12a and arbitrary portions of the frame portion to form connection portions 7a and 7b.
  • the connection parts 7a and 7b can be formed by, for example, pressing or bending the molds at predetermined positions on the upper wiring boards 8a and 8b.
  • FIG. 7A corresponds to the “first structure” of the present invention.
  • the coil core 5 in which the insulating film 10 is disposed on the upper surface and the lower surface is disposed on the first structure.
  • the rod-shaped part 5b of the coil core 5 is located between the connection parts 7a and 7b.
  • the lower surfaces 70a and 70b of the connection portions 7a and 7b are joined to one surface of the lower wiring board 8c of the second etching plate 12b.
  • the second etching plate 12b and the lower surfaces 70a and 70b can be joined by solder. It is also possible to bond using a bonding material other than solder or ultrasonic waves.
  • the surfaces of the etching plates 12a and 12b may be subjected to surface treatment with Ni / Au plating, Zn, Cr, or the like in order to facilitate bonding.
  • both metal pins 9a and 9b corresponding to "one end of metal pin” of the present invention
  • a bonding material such as solder bonding, ultrasonic bonding, and conductive adhesive can be used.
  • each component 4 is arranged between the second etching plate 12 b and the upper surface 2 a of the wiring board 2.
  • FIG. 7F corresponds to the “fourth structure” of the present invention.
  • a mold method or a dispense method can be used for the formation of the resin layer 3.
  • the frame 11a of the first etching plate 12a (see FIG. 6A) and the frame 11b of the second etching plate 12b (see FIG. 6B) are removed.
  • the inductor component 1b is completed.
  • dicing or laser processing can be used to remove the frames 11a and 11b.
  • the support portions 82a and 82b of the upper wiring boards 8a and 8b and the support portion 82c of the lower wiring board 8c are narrower than the center portion (inductor electrode forming portion) of the wiring boards 8a to 8c. It may be formed.
  • FIG. 9 is a plan view of the inductor component 1c showing the wiring structure of the inductor electrode.
  • connection parts 7a and 7b are recessed as shown in FIG. That is. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.
  • connection portions 7a and 7b formed on the upper wiring boards 8a and 8b are both recessed in the direction of the lower wiring board 8c.
  • the cross-sectional shape when viewed from a direction parallel to the lower surface 3a of the resin layer 3 is the same as that shown in FIG.
  • the lower surfaces (not shown) of the connection parts 7a and 7b are in contact with the lower wiring board 8c, so that the upper wiring boards 8a and 8b are electrically connected to the lower wiring board 8c.
  • the connection parts 7a and 7b can be formed, for example, by pressing a member having a mortar-shaped convex portion against a predetermined position of the upper wiring boards 8a and 8b.
  • the hole may penetrate in the lower surface of the connection parts 7a and 7b.
  • the support portions 82a to 82c of the wiring boards 8a to 8c may be formed to have the same width as the central portion of the wiring boards 8a to 8c. In this case, since the metal part in the inductor component 1c can be increased, the heat dissipation of the inductor component 1c can be improved.
  • FIG. 11A is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen.
  • FIG. 11B is a plan view of the inductor component showing the wiring structure of the inductor electrode.
  • the inductor component 1d of this embodiment differs from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that the connection parts 7a and 7b are connected to the wiring boards 8a and 8b as shown in FIG. It is formed by thickening a part. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.
  • connection portions 7a and 7b formed thicker than the surroundings are formed at predetermined positions of the upper wiring boards 8a and 8b.
  • the connection parts 7a and 7b can be formed by thinning the surrounding metal plate by etching. Since the lower surfaces 70a and 70b of the connection portions 7a and 7b are in contact with the lower wiring board 8c, the upper wiring boards 8a and 8b and the lower wiring board 8c are electrically connected. Further, as shown in FIG. 11B, the support portions 82a to 82c of the wiring boards 8a to 8c are formed so as to reach the peripheral edges 30a and 30b of the resin layer 3, respectively.
  • FIG. 12A is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen.
  • FIG. 12B is a plan view of the inductor component showing the wiring structure of the inductor electrode.
  • the inductor component 1e of this embodiment differs from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that the arrangement of the wiring boards 8d to 8f and the metal pins 9a, The arrangement of 9b is different. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.
  • the inductor electrode 6 is formed by one upper wiring board 8d and two lower wiring boards 8e and 8f, and the one upper wiring board 8d is the lower side of the first embodiment.
  • the two lower wiring boards 8e and 8f have the same shape as the upper wiring boards 8a and 8b in the first embodiment (see FIG. 1B). See).
  • the two metal pins 9a and 9b constituting the input / output terminals of the inductor electrode 6 connect the upper wiring boards 8a and 8b and the wiring board 2 in the first embodiment, but in this embodiment, The wiring board 2 is connected to the lower wiring boards 8e and 8f which are shorter than those of the first embodiment.
  • the inductor electrode 6 is formed of the metal pins 9a and 9b and the wiring boards 8d and 8f, both of which have a resistance value lower than that of the conductive paste or plating, the resistance of the entire inductor electrode 6 can be reduced. As a result, the characteristics (for example, inductance value) of the inductor component 1e can be improved. Furthermore, the distance between the mother substrate and the coil portion can be shortened, and the resistance can be reduced.
  • FIG. 13A is a view of the inductor component as viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen.
  • FIG. 13B is a bottom view of the inductor component viewed from the lower surface side
  • FIG. 13C is a plan view of the inductor component viewed from the upper surface side.
  • the inductor component 1f of this embodiment differs from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that a wiring board 8g that is a first and second metal plate, as shown in FIG. 8h and the wiring electrode 13 provided on the wiring board 2 constitute the inductor electrode 6. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.
  • the inductor component 1 f is provided with a wiring electrode 13 on the lower surface 2 b of the wiring board 2.
  • the inductor electrode 6 includes two wiring boards 8g and 8h, and the first bent portion 7c and the second bent portion 7d formed by a part of each of the wiring boards 8g and 8h are provided on the wiring board 2.
  • a coil is formed that winds around the rod-shaped portion 5b of the coil core 5.
  • the two bent portions 7c and 7d have L-shaped ends 80g and 80h (see FIG. 14A) of the wiring boards 8g and 8h when viewed from a direction parallel to the upper surface 2a of the wiring board 2.
  • both wiring boards 8g and 8h are integrally formed with support portions 82g, 84g, 82h and 84h whose line widths are narrower than the center portions of the respective wiring boards 8g and 8h. It is exposed on the side.
  • FIGS. 14A and 14B are plan views of the wiring boards 8g and 8h supported by the frame
  • FIG. 14C is a cross section of the wiring boards 8g and 8h supported by the frame.
  • FIGS. 15A and 15B are diagrams for explaining a method of manufacturing the inductor component 1f.
  • wiring boards 8g and 8h are prepared.
  • the wiring boards 8g and 8h can be formed by etching one metal plate made of Cu or the like.
  • the frame 11a, the wiring boards 8g and 8h and the support portions 82g, 84g, 82h and 84h are removed by etching, and both the wiring boards 8g and 8h are supported by the support portions 82g, 84g, 82h and 84h, respectively.
  • the etched plate 12c is formed. Further, notches for later bending are formed in the respective end portions 80g and 80h of both wiring boards 8g and 8h (dotted line portions in FIG. 14A).
  • the formation of the wiring boards 8g and 8h is not limited to etching, and various methods such as punching can be used.
  • the end portions 80g and 80h of the wiring boards 8g and 8h of the etching plate 12c are bent to form both bent portions 7c and 7d.
  • the wiring boards 8g and 8h are fixed with a jig or the like, and a mold material is arranged at a predetermined position of each end portion 80g and 80h of the both wiring boards 8g and 8h.
  • the coil core 5 having the insulating film 10 disposed on the upper surface and the lower surface is disposed on the etching plate 12c formed with both bent portions 7c and 7d.
  • the rod-shaped portion 5b of the coil core is disposed between the two bent portions 7c and 7d.
  • an etching plate 12c on which the coil core 5 is arranged, and a wiring board 2 in which the component 4 is mounted on the upper surface 2a and the wiring electrode 13 is provided on the lower surface 2b. And join.
  • the etching plate 12c and the wiring board 2 can be joined by solder.
  • the tip portions 70c and 70d of both bent portions 7c and 7d are in contact with the wiring electrode 13, and both the bent portions 7c and 7d are electrically connected via the wiring electrode 13, so that the inductor electrode 6 is Form.
  • the surface of the etching plate 12c may be subjected to surface treatment by Ni / Au plating, Zn, Cr or the like in order to facilitate bonding.
  • the wiring board 2 and the inductor electrode 6 are covered with a resin such as an epoxy resin to form the resin layer 3.
  • a resin such as an epoxy resin
  • a mold method or a dispense method can be used for the formation of the resin layer 3.
  • the frame 11a of the etching plate is removed, and dicer cutting or the like is performed as necessary to complete the inductor component 1f.
  • the inductor electrode 6 can be easily formed only by the wiring boards 8g and 8h and the wiring electrode 13.
  • the characteristics (for example, inductance value) of the inductor component 1f can be improved.
  • the front end portions 70c and 70d of both the bent portions 7c and 7d and the wiring electrode 13 are exposed, the heat dissipation characteristics can be improved by bonding to the mother substrate.
  • both the bent portions 7c and 7d are formed in an L shape when viewed from a direction parallel to the upper surface 2a of the wiring board 2 by further bending the respective tip portions 70c and 70d.
  • the inductor electrode 6 is formed by the tip portions 70c and 70d coming into contact with the lower surface 2b of the wiring board 2, but both bent portions 7c and 7d are formed on the upper surface of the wiring board 2 as shown in FIG. When viewed from a direction parallel to 2a, it may be linear (I-shaped).
  • both the bent portions 7c and 7d pass through the inside of the wiring board 2 and come into contact with the wiring electrode 13, whereby the inductor electrode 6 is formed.
  • the wiring electrode 13 may be provided inside the wiring board 2 as shown in FIG.
  • FIG. 17 is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen.
  • the inductor component 1g of this embodiment differs from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that both wiring boards 8g and 8h and the wiring board 2 are provided as shown in FIG.
  • the wiring electrode 13 and the via conductors 14a and 14b constitute an inductor electrode. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.
  • the inductor electrode 6 is formed by electrically connecting both the wiring boards 8g and 8h and the wiring electrode 13 provided inside the wiring board 2 via the via conductors 14a and 14b. That is, on the upper surface 2 a of the wiring board 2, the tip end portion 70 c of the first bent portion 7 c and one end of the wiring electrode 13 are connected by the via conductor 14 a (corresponding to the “first via conductor” of the present invention), and the second bent portion The front end portion 70d of the portion 7d and the other end of the wiring electrode 13 are connected by a via conductor 14b (corresponding to the “second via conductor” of the present invention), so that both the wiring boards 8g and 8h and the wiring electrode 13 are electrically connected. Are connected to each other to form the inductor electrode 6.
  • the inductor electrode 6 can be easily formed by electrically connecting the wiring boards 8g and 8h and the wiring electrode 13 via the via conductors 14a and 14b. At this time, since the inductor electrode 6 having a large coil diameter can be formed, the characteristics (for example, inductance value) of the inductor component 1g can be improved.
  • FIG. 18A is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen.
  • FIG. 18B is a plan view of the lower surface of the inductor component.
  • the inductor component 1h of this embodiment is different from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that both wiring boards 8g and 8h are part of each, as shown in FIG. That is, the inductor electrode is formed only by the two bent portions 7c and 7d. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.
  • the inductor electrode 6 is bent in an L shape when both bent portions 7c and 7d are viewed from a direction parallel to the upper surface 2a of the wiring board 2 when a part of each of the wiring boards 8g and 8h is viewed.
  • the inductor electrode 6 is formed by being formed and contacted and electrically connected in a state where the tip portions 70c and 70d of the bent portions 7c and 7d face each other.
  • the inductor electrode 6 can be formed only by the both wiring boards 8g and 8h.
  • the present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention.
  • the case where the inductor electrode 6 forms a coil has been described, but it may be used as long as it is used as an inductor element.
  • the structure without the coil core 5 may be sufficient.
  • the number of turns of the inductor electrode 6 can be changed as appropriate.
  • the number of metal pins and wiring boards may be changed according to the number of turns.
  • connection portions 7a and 7b may be, for example, a shape such as a cut-and-raised rib or an annular rib other than the above-described shape.
  • the present invention can be widely applied to various inductor components in which the inductor electrode includes a resin layer and an inductor electrode.

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Abstract

The present invention improves the characteristics of an inductor component by lowering the resistance of an inductor electrode. An inductor component 1a comprises a resin layer 3 and an inductor electrode 6, wherein the inductor electrode 6 has upper side wiring boards 8a, 8b that have connection sites 7a, 7b, a lower side wiring board that is in contact with the upper side wiring boards 8a, 8b via the respective connection sites 7a, 7b, and metal pins 9a, 9b. The connection sites 7a, 7b are formed by bending one end section 80a, 80b of each of the upper side wiring boards 8a, 8b. Because, in this case, the inductor electrode 6 is formed from the wiring boards 8a-8c and the metal pins 9a, 9b, all of which have lower resistance values than conductive paste or plating, the resistance of the entire inductor electrode 6 can be lowered, thereby improving the characteristics of the inductor component 1a.

Description

インダクタ部品およびその製造方法Inductor component and manufacturing method thereof
 本発明は、樹脂層およびインダクタ電極を備えるインダクタ部品およびその製造方法に関する。 The present invention relates to an inductor component including a resin layer and an inductor electrode and a manufacturing method thereof.
 従来、図19に示すように、プリント基板やプリプレグで形成されたコア基板101にコイル102が設けられたインダクタ部品100が知られている(例えば特許文献1参照)。
この場合、コア基板101の内部に環状の磁性体層103が配置され、コイル102が磁性体層103の周囲を螺旋状に巻回している。コイル102は、磁性体層103の内周に沿って配列された複数の内側層間接続導体102aと、これらの層間接続導体102aと複数の対を成すように磁性体層103の外周に沿って配列された複数の外側層間接続導体102bと、それぞれ所定の内側層間接続導体102aと外側層間接続導体102bの上端同士を接続する複数の上側配線パターン102cと、それぞれ所定の内側層間接続導体102aと外側層間接続導体102bの下端同士を接続する複数の下側配線パターン102dとで構成される。ここで、各層間接続導体102a、102bは、いずれもコア基板101を貫通する貫通孔の内面に導体膜が形成されてなるスルーホール導体で形成される。また、各配線パターン102c、102dは、いずれも導電性ペーストを用いた印刷パターンで形成される。
Conventionally, as shown in FIG. 19, an inductor component 100 in which a coil 102 is provided on a core substrate 101 formed of a printed board or a prepreg is known (see, for example, Patent Document 1).
In this case, an annular magnetic layer 103 is disposed inside the core substrate 101, and the coil 102 is spirally wound around the magnetic layer 103. The coil 102 is arranged along the outer periphery of the magnetic layer 103 so as to form a plurality of inner interlayer connection conductors 102a arranged along the inner periphery of the magnetic layer 103 and a plurality of pairs with these interlayer connection conductors 102a. A plurality of outer interlayer connection conductors 102b, a plurality of upper wiring patterns 102c connecting the upper ends of predetermined inner interlayer connection conductors 102a and outer interlayer connection conductors 102b, respectively, and a predetermined inner interlayer connection conductor 102a and an outer interlayer, respectively. A plurality of lower wiring patterns 102d connecting the lower ends of the connection conductors 102b. Here, each of the interlayer connection conductors 102 a and 102 b is formed of a through-hole conductor in which a conductor film is formed on the inner surface of a through hole that penetrates the core substrate 101. Further, each of the wiring patterns 102c and 102d is formed as a printed pattern using a conductive paste.
特開2000-40620号公報(段落0018、図1など参照)Japanese Unexamined Patent Publication No. 2000-40620 (see paragraph 0018, FIG. 1, etc.)
 近年の電子機器の小型・高機能化に伴って、搭載されるインダクタ部品の小型化が要求されている。インダクタ部品の特性向上を図るための一つの方策は、インダクタ電極(上述のインダクタ部品100ではコイル102)の抵抗値を下げることである。従来のインダクタ部品100では、コイル102を構成する各層間接続導体102a、102bは、いずれも貫通孔の内面に導体膜が形成されたスルーホール導体で形成されている。これらの層間接続導体102a、102bは各配線パターン102c、102dと半田などで接続されるため、接続抵抗の値が高くなってしまう。ここで、貫通孔に導電性ペーストを充填してビア導体化すれば、接続抵抗の値を下げることができるが、一般的に導電性ペーストは有機溶剤等に金属フィラを混合して形成され、純粋な金属と比べて抵抗値が高い。また、各配線パターン102c、102dは導電性ペーストやめっきにより形成されており、純粋な金属と比べて抵抗値が高いため、インダクタ電極全体の抵抗値を下げることは困難である。 With the recent downsizing and higher functionality of electronic devices, it is required to reduce the size of inductor components. One measure for improving the characteristics of the inductor component is to reduce the resistance value of the inductor electrode (the coil 102 in the above-described inductor component 100). In the conventional inductor component 100, each of the interlayer connection conductors 102a and 102b constituting the coil 102 is formed of a through-hole conductor in which a conductor film is formed on the inner surface of the through hole. Since these interlayer connection conductors 102a and 102b are connected to the respective wiring patterns 102c and 102d by solder or the like, the value of the connection resistance becomes high. Here, if the through-hole is filled with a conductive paste to make a via conductor, the value of connection resistance can be lowered, but generally the conductive paste is formed by mixing a metal filler in an organic solvent or the like, High resistance compared to pure metal. Further, each wiring pattern 102c, 102d is formed by conductive paste or plating, and has a higher resistance value than that of pure metal, so it is difficult to reduce the resistance value of the entire inductor electrode.
 本発明は、上記した課題に鑑みてなされたものであり、樹脂層とインダクタ電極とを備えるインダクタ部品において、インダクタ電極全体の抵抗値を下げることにより、インダクタ部品の特性の向上を図ることを目的とする。 The present invention has been made in view of the above-described problems, and an object of the present invention is to improve the characteristics of an inductor component by lowering the resistance value of the entire inductor electrode in an inductor component including a resin layer and an inductor electrode. And
 上記した目的を達成するために、本発明のインダクタ部品は、主面を有する樹脂層と、インダクタ電極とを備え、前記インダクタ電極は、前記樹脂層の内部に配置された第1金属板と、前記樹脂層の前記主面に垂直な方向から見たときに、前記第1金属板と重なる部分を有する第2金属板とを有し、前記第1金属板および前記第2金属板の前記重なる部分において、前記両金属板のうち一方の金属板の一部により形成されて、他方の金属板に接続される第1接続部位を有することを特徴としている。 In order to achieve the above-described object, an inductor component of the present invention includes a resin layer having a main surface and an inductor electrode, and the inductor electrode includes a first metal plate disposed inside the resin layer, A second metal plate having a portion overlapping with the first metal plate when viewed from a direction perpendicular to the main surface of the resin layer, and overlapping the first metal plate and the second metal plate. The portion is characterized in that it has a first connection part formed by a part of one of the two metal plates and connected to the other metal plate.
 この構成によると、インダクタ電極が、導電性ペーストやめっきと比べて抵抗値が低い金属板により形成されているため、インダクタ電極全体の低抵抗化を図ることができ、これにより、インダクタ部品の特性(例えば、インダクタンス値)を向上することができる。また、金属板の一部で形成された接続部を、インダクタの垂直配線として利用することができるため、安価な構成で立体的なインダクタを形成することが可能である。また、インダクタ電極の低抵抗化を図るために、インダクタ電極を配線用の金属板と金属ピンを用いて形成する方法も考えられるが、この場合、金属板と金属ピンとの間のインピーダンスの不整合により、信号ロスが発生するという問題がある。しかしながら、上記した構成によると、インダクタ電極を金属板のみで構成しているため、インピーダンスの不整合を抑制することができる。 According to this configuration, since the inductor electrode is formed of a metal plate having a resistance value lower than that of the conductive paste or plating, the resistance of the entire inductor electrode can be reduced. (For example, the inductance value) can be improved. Further, since the connection portion formed by a part of the metal plate can be used as the vertical wiring of the inductor, it is possible to form a three-dimensional inductor with an inexpensive configuration. In order to reduce the resistance of the inductor electrode, a method of forming the inductor electrode using a metal plate for wiring and a metal pin is also conceivable, but in this case, impedance mismatch between the metal plate and the metal pin is considered. Therefore, there is a problem that signal loss occurs. However, according to the above-described configuration, since the inductor electrode is configured only by the metal plate, impedance mismatch can be suppressed.
 また、前記第1接続部位は、前記樹脂層の前記主面と平行な方向から見たときに、前記一方の金属板の端部をL字状に屈曲したものであってもよい。この場合、第1接続部位の具体的な構成を提供することができる。 Further, the first connection portion may be formed by bending an end portion of the one metal plate into an L shape when viewed from a direction parallel to the main surface of the resin layer. In this case, a specific configuration of the first connection site can be provided.
 また、前記第1接続部位は、前記一方の金属板の前記一部を前記他方の金属板に向かって凹状の断面形状で屈曲したものであってもよい。この場合、第1接続部位の具体的な構成を提供することができる。 In addition, the first connection part may be formed by bending the part of the one metal plate with a concave cross-sectional shape toward the other metal plate. In this case, a specific configuration of the first connection site can be provided.
 また、前記第1接続部位は、前記一方の金属板の前記一部を前記他方の金属板に向かって厚くしたものであってもよい。この場合、第1接続部位の具体的な構成を提供することができる。 Further, the first connection part may be a part in which the one metal plate is thickened toward the other metal plate. In this case, a specific configuration of the first connection site can be provided.
 また、前記第1接続部位は、前記一方の金属板の前記一部を凹陥したものであってもよい。この場合、第1接続部位の具体的な構成を提供することができる。 Further, the first connection portion may be a recess of the part of the one metal plate. In this case, a specific configuration of the first connection site can be provided.
 また、一方主面が前記樹脂層の前記主面に当接する配線基板と、前記配線基板の前記一方主面に実装されて前記樹脂層に封止される部品とをさらに備え、前記インダクタ電極は、前記樹脂層の内部に配設され、一端が前記第1金属板および前記第2金属板のうち一方の金属板に接続され、他端が前記樹脂層の前記主面に露出して前記配線基板に接続される金属ピンをさらに有していてもよい。 The circuit board further includes a wiring board whose one main surface is in contact with the main surface of the resin layer, and a component mounted on the one main surface of the wiring board and sealed by the resin layer, , Disposed inside the resin layer, having one end connected to one of the first metal plate and the second metal plate, and the other end exposed to the main surface of the resin layer. You may have further the metal pin connected to a board | substrate.
 この構成によると、例えば、配線基板の前記主面と反対側の裏面に外部電極を形成し、インダクタ部品をマザー基板に実装した場合、部品をマザー基板の近くに配置できるため、部品から発熱した場合の放熱性を向上することができる。また、配線基板の前記主面とインダクタ電極との間に部品を配置することで、インダクタ部品の小型化を図ることができる。 According to this configuration, for example, when an external electrode is formed on the back surface opposite to the main surface of the wiring board and the inductor component is mounted on the mother substrate, the component can be placed near the mother substrate, so the component generates heat. The heat dissipation in the case can be improved. Further, by disposing the component between the main surface of the wiring board and the inductor electrode, it is possible to reduce the size of the inductor component.
 また、前記インダクタ電極は、前記樹脂層の主面に垂直な方向で前記第1金属板と略同じ位置に配置され、前記重なる部分とは異なる箇所で前記第2金属板と重なる部分を有する第3金属板をさらに有し、前記第2金属板および前記第3金属板の前記重なる部分において、前記第2金属板および第3金属板のうち一方の金属板の一部により形成されて、他方の金属板に接触する第2接続部位を有することにより、前記インダクタ電極が、前記樹脂層の前記主面と略平行な方向に巻回軸を有するコイルを成すようにしてもよい。 In addition, the inductor electrode is disposed at substantially the same position as the first metal plate in a direction perpendicular to the main surface of the resin layer, and has a portion overlapping the second metal plate at a location different from the overlapping portion. 3 metal plates, wherein the second metal plate and the overlapping portion of the third metal plate are formed by a part of one metal plate of the second metal plate and the third metal plate, and the other The inductor electrode may form a coil having a winding axis in a direction substantially parallel to the main surface of the resin layer.
 この構成によると、樹脂層の主面方向と厚み方向との両方に渡る立体的なコイルを形成することができる。また、配線基板の前記主面とインダクタ電極との間に部品を配置することもでき、インダクタ部品の小型化を容易に実現することができる。 According to this configuration, a three-dimensional coil extending in both the main surface direction and the thickness direction of the resin layer can be formed. Also, a component can be disposed between the main surface of the wiring board and the inductor electrode, and the inductor component can be easily downsized.
 また、前記第1金属板および前記第2金属板の少なくとも一方は、前記樹脂層の前記一方主面に垂直な方向から見たときに、端縁の一部が前記樹脂層の周縁に達するように形成されていてもよい。 Further, at least one of the first metal plate and the second metal plate is such that a part of the edge reaches the periphery of the resin layer when viewed from a direction perpendicular to the one main surface of the resin layer. It may be formed.
 この構成によると、インダクタ部品の金属部分が増えるため、インダクタ部品の放熱性を向上することができる。また、第2金属板の端縁の一部が樹脂層の周縁に達する場合は、第2金属板の当該部分が樹脂層から露出した状態となるため、樹脂層内に溜まった熱が放熱され易くなる。 According to this configuration, since the metal part of the inductor component increases, the heat dissipation of the inductor component can be improved. In addition, when a part of the edge of the second metal plate reaches the periphery of the resin layer, the portion of the second metal plate is exposed from the resin layer, so that heat accumulated in the resin layer is dissipated. It becomes easy.
 また、前記第1接続部位と前記第2接続部位との間であって、前記第1金属板と前記第2金属板との間に配置されたコイルコアを有していてもよい。この構成によると、インダクタ電極のインダクタンス値を効果的に増やすことができる。 Further, a coil core disposed between the first connection part and the second connection part and between the first metal plate and the second metal plate may be provided. According to this configuration, the inductance value of the inductor electrode can be effectively increased.
 また、前記コイルコアは、前記樹脂層の前記一方主面に対して垂直な方向から見たときに、環状部と、前記環状部の内側領域を2分するように設けられた棒状部とが合成されたような形状を有し、前記棒状部は、前記第1接続部位と前記第2接続部位との間に配置されるとともに、前記棒状部の軸方向が前記コイルの前記巻回軸と略平行な方向となるように配置されてもよい。 The coil core is composed of an annular portion and a rod-like portion provided so as to bisect the inner region of the annular portion when viewed from a direction perpendicular to the one main surface of the resin layer. The rod-shaped portion is disposed between the first connection portion and the second connection portion, and the axial direction of the rod-shaped portion is substantially the same as the winding axis of the coil. You may arrange | position so that it may become a parallel direction.
 この構成によると、インダクタ電極(コイル)の通電時に発生する磁束線の通り道にコイルコアが配置されるため、インダクタ電極の特性(例えば、インダクタンス値)の向上を図ることができる。 According to this configuration, since the coil core is disposed along the path of the magnetic flux lines generated when the inductor electrode (coil) is energized, the characteristics of the inductor electrode (for example, the inductance value) can be improved.
 また、本発明のインダクタ部品の製造方法は、平板枠に支持された状態の第1金属板を加工することにより、前記第1金属板の一方面に接続部位が形成されてなる第1構造体を形成する工程と、平板枠に支持された状態の第2金属板の一方面を前記接続部位の先端に接続し、前記第1金属板の前記第2金属板との対向面に金属ピンの一端を接続することにより、前記第1金属板、前記第2金属板および前記金属ピンを有するインダクタ電極が形成されてなる第2構造体を形成する工程と、一方主面に部品が実装された配線基板の当該一方主面に、前記金属ピンの他端を接続させることにより、前記配線基板の前記一方主面と前記第2金属板との間に部品が配置されてなる第3構造体を形成する工程と、前記第3構造体を樹脂で封止することにより、前記第3構造体と樹脂層とを有する第4構造体を形成する工程と、前記第1金属板の前記平板枠と、前記第2金属板の前記平板枠とを除去するように前記第4構造体を加工する工程とを備えることを特徴としている。 In addition, the method for manufacturing an inductor component according to the present invention includes a first structure in which a connection portion is formed on one surface of the first metal plate by processing the first metal plate supported by the flat frame. And connecting one surface of the second metal plate supported by the flat frame to the tip of the connecting portion, and a metal pin on the surface of the first metal plate facing the second metal plate. By connecting one end, a step of forming a second structure in which an inductor electrode having the first metal plate, the second metal plate and the metal pin is formed, and a component is mounted on one main surface By connecting the other end of the metal pin to the one main surface of the wiring board, a third structure in which components are arranged between the one main surface of the wiring board and the second metal plate Forming and sealing the third structure with a resin The step of forming the fourth structure having the third structure and the resin layer, the flat plate frame of the first metal plate, and the flat plate frame of the second metal plate are removed. And a step of processing the fourth structure.
 この構成によると、導電性ペーストやめっきで形成されたインダクタ電極よりも抵抗値の低いインダクタ電極を製造することができる。また、樹脂層にビアを形成する必要がないため、製造コストを削減することができる。また、第1金属板および第2金属板は、いずれも平板枠に支持されるため、従来の導電性ペーストにより形成する配線パターンのように、その形成に樹脂層の主面を利用する必要がない。そのため、樹脂層の形成前に、第3構造体まで形成することができるため、インダクタ部品の製造コストの削減を図ることができる。また、インダクタ電極を形成するのに、従来のようにめっきや印刷工程が必要ないため、インダクタ部品の製造コストのさらなる削減と、製造時間の削減を図ることができる。また、第1金属板の平板枠と、第2金属板の平板枠とを除去するように第4構造体を加工することで、樹脂層の主面に対して垂直な方向から見たときに、第1および第2金属板の端縁が樹脂層の周縁に達するように形成されるため、放熱性の優れたインダクタ部品を製造することができる。 According to this configuration, an inductor electrode having a resistance value lower than that of an inductor electrode formed by conductive paste or plating can be manufactured. Moreover, since it is not necessary to form a via in the resin layer, the manufacturing cost can be reduced. In addition, since both the first metal plate and the second metal plate are supported by the flat frame, it is necessary to use the main surface of the resin layer for the formation thereof, like a wiring pattern formed by a conventional conductive paste. Absent. Therefore, since the third structure can be formed before the resin layer is formed, the manufacturing cost of the inductor component can be reduced. In addition, since the plating or printing process is not required to form the inductor electrode as in the prior art, the manufacturing cost of the inductor component can be further reduced and the manufacturing time can be reduced. Further, by processing the fourth structure so as to remove the flat frame of the first metal plate and the flat frame of the second metal plate, when viewed from a direction perpendicular to the main surface of the resin layer Since the end edges of the first and second metal plates reach the periphery of the resin layer, an inductor component with excellent heat dissipation can be manufactured.
 また、本発明のインダクタ部品は、配線基板と、記配線基板の一方主面に実装された部品と、前記配線基板の前記一方主面に積層され、前記部品を被覆する樹脂層と、前記樹脂層の内部に配置され、前記配線基板の前記一方主面に垂直な方向から見たときに、前記部品と重なる部分を有するコイルコアと、前記コイルコアを巻回するインダクタ電極とを備え、前記インダクタ電極は、前記配線基板の前記一方主面に垂直な方向から見たときに、それぞれ少なくとも一部が前記コイルコアと重なるように前記樹脂層に配置された第1金属板および第2金属板を有し、前記第1金属板は、その一部が前記配線基板の他方主面に向かって屈曲され前記樹脂層の内部に配設された第1屈曲部を有し、前記第2金属板は、その一部が前記配線基板の他方主面に向かって屈曲され前記樹脂層の内部に配設された第2屈曲部を有し、前記第1屈曲部の先端部分と前記第2屈曲部の先端部分が電気的に接続されていてもよい。 The inductor component according to the present invention includes a wiring board, a component mounted on one main surface of the wiring substrate, a resin layer laminated on the one main surface of the wiring substrate, and covering the component, and the resin A coil core disposed inside a layer and having a portion overlapping with the component when viewed from a direction perpendicular to the one main surface of the wiring board; and an inductor electrode around which the coil core is wound, the inductor electrode Has a first metal plate and a second metal plate arranged in the resin layer so that at least a part thereof overlaps the coil core when viewed from a direction perpendicular to the one main surface of the wiring board. The first metal plate has a first bent portion that is partly bent toward the other main surface of the wiring board and disposed inside the resin layer, and the second metal plate is Part of the wiring board A second bent portion that is bent toward the main surface and disposed inside the resin layer, and a tip portion of the first bent portion and a tip portion of the second bent portion are electrically connected; Also good.
 この構成によると、金属板どうしを電気的に接続することによりインダクタ電極(コイル)を容易に形成することができる。また、コイル径を大きくすることができるため、インダクタ特性が向上する。さらに、両屈曲部の先端部分を実装基板の他方主面側に露出することが可能であるため、露出した先端部分をマザー基板と接合させることにより、コイルの放熱特性を向上させることができる。 According to this configuration, the inductor electrode (coil) can be easily formed by electrically connecting the metal plates. Moreover, since the coil diameter can be increased, the inductor characteristics are improved. Furthermore, since the tip portions of both bent portions can be exposed to the other main surface side of the mounting substrate, the heat dissipation characteristics of the coil can be improved by joining the exposed tip portions to the mother substrate.
 また、前記第1屈曲部の先端部分と前記第2屈曲部の先端部分とは、前記配線基板に設けられた配線電極を介して接続されていてもよい。この構成によると、両金属板と配線基板に設けられた配線電極とでインダクタ電極を容易に形成することができる。 Further, the tip portion of the first bent portion and the tip portion of the second bent portion may be connected via a wiring electrode provided on the wiring board. According to this configuration, the inductor electrode can be easily formed by using both the metal plates and the wiring electrodes provided on the wiring board.
 また、前記配線電極は、前記配線基板の内部に設けられ、前記第1屈曲部の先端部分と当該配線電極の一端とが第1ビア導体により接続され、前記第2屈曲部の先端部分と当該配線電極の他端とが第2ビア導体により接続されていてもよい。この構成によると、両金属板と配線基板の内部に設けられた配線基板とをビアを介して電気的に接続することでインダクタ電極を容易に形成することができる。 The wiring electrode is provided inside the wiring board, the tip portion of the first bent portion and one end of the wiring electrode are connected by a first via conductor, and the tip portion of the second bent portion and the tip The other end of the wiring electrode may be connected by a second via conductor. According to this configuration, the inductor electrode can be easily formed by electrically connecting both the metal plates and the wiring board provided inside the wiring board through the vias.
 また、前記第1屈曲部の先端部分と前記第2屈曲部の先端部分とが直接接続されていてもよい。この構成によると、金属板のみでインダクタ電極を形成することが可能である。 Further, the tip portion of the first bent portion and the tip portion of the second bent portion may be directly connected. According to this structure, it is possible to form an inductor electrode only with a metal plate.
 本発明によれば、インダクタ電極が導電性ペーストやめっきと比べて抵抗値が低い金属板により形成されているため、インダクタ電極全体の抵抗値を下げることができる。これにより、インダクタ部品の特性(例えば、インダクタンス値)を向上することができる。 According to the present invention, since the inductor electrode is formed of a metal plate having a resistance value lower than that of the conductive paste or plating, the resistance value of the entire inductor electrode can be lowered. Thereby, the characteristic (for example, inductance value) of an inductor component can be improved.
本発明の第1実施形態にかかるインダクタ部品を示す図である。It is a figure which shows the inductor components concerning 1st Embodiment of this invention. 枠で支持された状態の配線板の平面図である。It is a top view of the wiring board in the state supported by the frame. 図1のインダクタ部品の製造方法を説明するための図である。It is a figure for demonstrating the manufacturing method of the inductor components of FIG. 図1の配線板の変形例を示す図である。It is a figure which shows the modification of the wiring board of FIG. 本発明の第2実施形態にかかるインダクタ部品を示す図である。It is a figure which shows the inductor components concerning 2nd Embodiment of this invention. 枠で支持された状態の配線板の平面図である。It is a top view of the wiring board in the state supported by the frame. 図5のインダクタ部品の製造方法を説明するための図である。It is a figure for demonstrating the manufacturing method of the inductor components of FIG. 図5の配線板の変形例を示す図である。It is a figure which shows the modification of the wiring board of FIG. 本発明の第3実施形態にかかるインダクタ部品を示す図である。It is a figure which shows the inductor components concerning 3rd Embodiment of this invention. 図9の配線板の変形例を示す図である。It is a figure which shows the modification of the wiring board of FIG. 本発明の第4実施形態にかかるインダクタ部品を示す図である。It is a figure which shows the inductor components concerning 4th Embodiment of this invention. 本発明の第5実施形態にかかるインダクタ部品を示す図である。It is a figure which shows the inductor components concerning 5th Embodiment of this invention. 本発明の第6実施形態にかかるインダクタ部品を示す図である。It is a figure which shows the inductor components concerning 6th Embodiment of this invention. 枠で支持された状態の配線板の図である。It is a figure of the wiring board of the state supported by the frame. 図13のインダクタ部品の製造方法を説明するための図である。It is a figure for demonstrating the manufacturing method of the inductor components of FIG. 図13の屈曲部の変形例を示す図である。It is a figure which shows the modification of the bending part of FIG. 本発明の第7実施形態にかかるインダクタ部品を示す図である。It is a figure which shows the inductor components concerning 7th Embodiment of this invention. 本発明の第8実施形態にかかるインダクタ部品を示す図である。It is a figure which shows the inductor components concerning 8th Embodiment of this invention. 従来のインダクタ部品の斜視図である。It is a perspective view of the conventional inductor component.
 <第1実施形態>
 本発明の第1実施形態にかかるインダクタ部品について図1を参照して説明する。なお、図1(a)はインダクタ部品を配線基板の主面と平行な方向から見たときの図であって、内部構造が分かるように樹脂層の一部を図示省略している。また、図1(b)はインダクタ電極の配線構造を示すインダクタ部品の平面図である。
<First Embodiment>
An inductor component according to a first embodiment of the present invention will be described with reference to FIG. FIG. 1A is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen. FIG. 1B is a plan view of the inductor component showing the wiring structure of the inductor electrode.
 (インダクタ部品の構成)
 この実施形態のインダクタ部品1aは、配線基板2と、配線基板2の上面2aに積層された樹脂層3と、配線基板2の上面2aに実装された複数の部品4と、樹脂層3の内部に配置されたコイルコア5と、インダクタ電極6とを備え、例えば、携帯端末装置等の電子機器のマザー基板に実装されるものである。
(Configuration of inductor parts)
The inductor component 1a of this embodiment includes a wiring substrate 2, a resin layer 3 laminated on the upper surface 2a of the wiring substrate 2, a plurality of components 4 mounted on the upper surface 2a of the wiring substrate 2, and the interior of the resin layer 3. The coil core 5 and the inductor electrode 6 are mounted on a mother board of an electronic device such as a portable terminal device.
 配線基板2は、例えば、ガラスエポキシ樹脂基板やセラミック基板であり、内部にビア導体や各種の配線電極が形成される。また、上面2aには、各部品4や後述する金属ピン9a、9bと接続するための接続電極(図示省略)が形成される。なお、配線基板2は単層構造および多層構造のいずれであってもよい。 The wiring substrate 2 is, for example, a glass epoxy resin substrate or a ceramic substrate, and via conductors and various wiring electrodes are formed therein. Further, on the upper surface 2a, connection electrodes (not shown) for connecting to each component 4 and metal pins 9a and 9b described later are formed. The wiring board 2 may have either a single layer structure or a multilayer structure.
 部品4は、例えば、Si等で形成された半導体素子や、チップコンデンサ、チップインダクタ、チップ抵抗などで構成される。 The component 4 is composed of, for example, a semiconductor element formed of Si or the like, a chip capacitor, a chip inductor, a chip resistor, or the like.
 樹脂層3は、内部に後述する配線板8a~8cが配置されるとともに、下面3a(本発明の「樹脂層の主面」に相当)が、配線基板2の上面2aに当接するように設けられる。また、この実施形態の樹脂層3および配線基板2は、樹脂層3の下面3aに対して垂直な方向から見たときに(以下、平面視という場合もある)、横長矩形状に形成されている(図1(b)参照)。なお、樹脂層3は、例えば、エポキシ樹脂などの一般的に封止樹脂として使用される種々の材料で形成することができる。 The resin layer 3 is provided so that wiring boards 8a to 8c, which will be described later, are disposed therein, and the lower surface 3a (corresponding to “the main surface of the resin layer” of the present invention) is in contact with the upper surface 2a of the wiring substrate 2. It is done. In addition, the resin layer 3 and the wiring board 2 of this embodiment are formed in a horizontally long rectangular shape when viewed from a direction perpendicular to the lower surface 3a of the resin layer 3 (hereinafter sometimes referred to as a plan view). (See FIG. 1B). The resin layer 3 can be formed of various materials generally used as a sealing resin such as an epoxy resin.
 コイルコア5は、Ni-Znフェライト等の一般的なコイルコアとして採用される磁性材料で形成されている。また、この実施形態のコイルコア5は、図1(b)に示すように、平面視において、環状部5aと、該環状部5aの内側領域を2等分するように設けられた棒状部5bとを有する。コイルコアがMn-Znフェライトのように絶縁性が低い場合は、コイルコアの上面と下面に絶縁膜10を被覆しておいてもよい。 The coil core 5 is made of a magnetic material that is employed as a general coil core such as Ni-Zn ferrite. In addition, as shown in FIG. 1B, the coil core 5 of this embodiment includes an annular portion 5a and a rod-like portion 5b provided so as to divide the inner region of the annular portion 5a into two equal parts in a plan view. Have When the coil core is low in insulation like Mn—Zn ferrite, the upper and lower surfaces of the coil core may be covered with the insulating film 10.
 インダクタ電極6は、2枚の上側配線板8a、8bと1枚の下側配線板8cと、入出力端子をなす2本の金属ピン9a、9bとを有し、上側配線板8a、8bのそれぞれの一部により形成された接続部位7a、7bを介して上側配線板8a、8bと下側配線板8cが接続されて、コイルコア5の棒状部5bの周囲を巻回するコイルが形成されている。このとき、上側配線板8a、8bには、その一方の端部80a、80b(図2(a)参照)が下側配線板8cの方向に向かって屈曲されて成る接続部位7a、7bが形成され、該接続部位7a、7bの下面70a、70bと下側配線板8cとが、例えば半田で接合されることにより、上側配線板8aと下側配線板8c、および、上側配線板8bと下側配線板8cがそれぞれ電気的に接続している。すなわち、両接続部位7a、7bは、両上側配線板8a、8bの一方の端部80a、80bの点線部分(図2(a)参照)を屈曲させることで形成される。また、2本の金属ピン9a、9bは、いずれも上端面が、上側配線板8a、8bに接続され、下端面(本発明の「金属ピンの他端」に相当)は樹脂層3の下面3aから露出し、両金属ピン9a、9bの下端面が配線基板2に接続される。また、両金属ピン9a、9bのうち、一方がコイルコア5の環状部5aの外側領域であって、樹脂層3の一方の短辺近傍に配置され、他方がコイルコア5の環状部5aの外側領域であって、樹脂層3の他方の短辺近傍に配置される。なお、両金属ピン9a、9bは、例えば、Cu、Al、Agなどの金属からなる線材をせん断加工するなどして形成することができる。 The inductor electrode 6 has two upper wiring boards 8a and 8b, one lower wiring board 8c, and two metal pins 9a and 9b forming input / output terminals. The upper wiring boards 8a and 8b and the lower wiring board 8c are connected via the connection portions 7a and 7b formed by each part, and a coil is formed that winds around the rod-shaped portion 5b of the coil core 5. Yes. At this time, on the upper wiring boards 8a and 8b, connection portions 7a and 7b formed by bending one end portions 80a and 80b (see FIG. 2A) toward the lower wiring board 8c are formed. The lower surfaces 70a, 70b of the connection parts 7a, 7b and the lower wiring board 8c are joined by, for example, solder, so that the upper wiring board 8a, the lower wiring board 8c, and the upper wiring board 8b The side wiring boards 8c are electrically connected to each other. That is, both connection parts 7a and 7b are formed by bending the dotted line portions (see FIG. 2A) of one end portions 80a and 80b of the upper wiring boards 8a and 8b. Further, the upper ends of the two metal pins 9 a and 9 b are both connected to the upper wiring boards 8 a and 8 b, and the lower end surface (corresponding to “the other end of the metal pin” of the present invention) is the lower surface of the resin layer 3. The lower end surfaces of both metal pins 9 a and 9 b are connected to the wiring board 2. One of the metal pins 9 a and 9 b is an outer region of the annular portion 5 a of the coil core 5 and is disposed in the vicinity of one short side of the resin layer 3, and the other is an outer region of the annular portion 5 a of the coil core 5. In this case, the resin layer 3 is disposed in the vicinity of the other short side. Both metal pins 9a and 9b can be formed by, for example, shearing a wire made of a metal such as Cu, Al, or Ag.
 両上側配線板8a、8bは、図1(b)および図2に示すように、いずれも横長矩形の樹脂層3の長手方向と略平行な線状に形成されている。上側配線板8aの右端部81aは、樹脂層3の周縁30b(平面視横長矩形状の一方の短辺)に達するように形成される。上側配線板8bの左端部81bは、樹脂層3の周縁30a(平面視横長矩形状の他方の短辺)に達するように形成される。両端部81a、81bは樹脂層3の側面に露出している。また、上側配線板8aの左端部80aおよび上側配線板8bの右端部80bは、図2(a)の点線部が下側配線板8cの方向に向かって屈曲されて、接続部位7a、7bが形成される。このとき、接続部位7a、7bは、樹脂層3の下面3aに平行な方向から見たときに(言い換えれば、下側配線板8cに垂直な断面のうちの少なくともいずれか断面において)、L字状になるように形成され、下面70a、70bが、下側配線板8cと接している。接続部位7a、7bの下端部が折り曲げられて下面70a、70bが下側配線板8cと接触することにより、接続部位と下側配線板8cとを確実に接触させることができる。ただし、下面70a、70bは必ずしも設けられていなくてもよく、接続部位7a、7bは、樹脂層3の下面3aに平行な方向から見たときに、直線状(I字状)に形成されていてもよい。また、上側配線板8a、8bのそれぞれの端部80a、80bには、樹脂層3の周縁30a、30bに向かって、それぞれ上側配線板8a、8bの中央部分より線幅が細い支持部82a、82bが延出形成されている。支持部82a、82bは、それぞれ上側配線板8a、8bと一体的に形成され、樹脂層3の側面に露出している。 Both upper side wiring boards 8a and 8b are formed in a line shape substantially parallel to the longitudinal direction of the horizontally long resin layer 3 as shown in FIG. 1 (b) and FIG. The right end 81a of the upper wiring board 8a is formed so as to reach the peripheral edge 30b (one short side of the horizontally long rectangular shape in plan view) of the resin layer 3. The left end 81b of the upper wiring board 8b is formed so as to reach the peripheral edge 30a of the resin layer 3 (the other short side of the horizontally long rectangular shape in plan view). Both end portions 81 a and 81 b are exposed on the side surface of the resin layer 3. Further, the left end portion 80a of the upper wiring board 8a and the right end portion 80b of the upper wiring board 8b are bent toward the lower wiring board 8c in the dotted line portion of FIG. It is formed. At this time, the connection parts 7a and 7b are L-shaped when viewed from a direction parallel to the lower surface 3a of the resin layer 3 (in other words, in at least one of the cross sections perpendicular to the lower wiring board 8c). The lower surfaces 70a and 70b are in contact with the lower wiring board 8c. Since the lower end portions of the connection parts 7a and 7b are bent and the lower surfaces 70a and 70b are in contact with the lower wiring board 8c, the connection parts and the lower wiring board 8c can be reliably brought into contact with each other. However, the lower surfaces 70a and 70b are not necessarily provided, and the connection portions 7a and 7b are formed in a straight line shape (I shape) when viewed from a direction parallel to the lower surface 3a of the resin layer 3. May be. Further, the end portions 80a and 80b of the upper wiring boards 8a and 8b are respectively provided with support portions 82a having a narrower line width than the central portions of the upper wiring boards 8a and 8b toward the peripheral edges 30a and 30b of the resin layer 3, respectively. 82b is extended and formed. The support portions 82 a and 82 b are formed integrally with the upper wiring boards 8 a and 8 b, respectively, and are exposed on the side surfaces of the resin layer 3.
 下側配線板8cは、樹脂層3の下面3aに垂直な方向から見たときに、樹脂層3の内部に、上側配線板8a、8bのそれぞれと重なる部分を有するように配置される。下側配線板8cは、図1(b)に示すように、横長矩形の樹脂層3の長手方向と略平行な線状に形成され、接続部位7a、7bの下面と接続される。また、下側配線板8cは、その両端に、上側配線板8a、8bの支持部82a、82bと同様の支持部82cが形成される。支持部82cのそれぞれは樹脂層3の周縁30a、30bに達するように形成されており、支持部82cが樹脂層3の側面に露出している。また、支持部82cは、上側配線板8a、8bの支持部82a、82bと同様に、下側配線板8cの中央部分よりも線幅が細く形成されている。 The lower wiring board 8c is disposed inside the resin layer 3 so as to have portions overlapping with the upper wiring boards 8a and 8b when viewed from a direction perpendicular to the lower surface 3a of the resin layer 3. As shown in FIG. 1B, the lower wiring board 8c is formed in a line shape substantially parallel to the longitudinal direction of the horizontally-long rectangular resin layer 3, and is connected to the lower surfaces of the connection portions 7a and 7b. Further, the lower wiring board 8c is formed at both ends thereof with support portions 82c similar to the support portions 82a and 82b of the upper wiring boards 8a and 8b. Each of the support portions 82 c is formed so as to reach the peripheral edges 30 a and 30 b of the resin layer 3, and the support portions 82 c are exposed on the side surfaces of the resin layer 3. Further, like the support portions 82a and 82b of the upper wiring boards 8a and 8b, the support portion 82c has a line width narrower than that of the central portion of the lower wiring board 8c.
 また、上記したように2本の金属ピン9a、9bの下端面が配線基板2の上面2aの接続電極(図示省略)に接続される。このような接続構成により、両金属ピン9a、9bを入出力端子として、コイルコア5の棒状部5bの周囲を巻回するインダクタ電極6が形成されている。この場合、棒状部5bの軸方向(長さ方向)がインダクタ電極6の巻回軸と略平行になる。ここで、2枚の上側配線板8a、8bが本発明の「第1金属板」および「第3金属板」に相当し、1枚の下側配線板8cが本発明の「第2金属板」に相当する。 Also, as described above, the lower end surfaces of the two metal pins 9a and 9b are connected to connection electrodes (not shown) on the upper surface 2a of the wiring board 2. With such a connection configuration, the inductor electrode 6 that is wound around the rod-shaped portion 5b of the coil core 5 is formed using both the metal pins 9a and 9b as input / output terminals. In this case, the axial direction (length direction) of the rod-like portion 5 b is substantially parallel to the winding axis of the inductor electrode 6. Here, the two upper wiring boards 8a and 8b correspond to the “first metal plate” and the “third metal board” of the present invention, and the one lower wiring board 8c of the present invention “the second metal plate”. Is equivalent to.
 ところで、配線基板2の上面2aに平面的にコイルパターンを形成した場合は、コイルの巻回軸が配線基板2の上面2aと垂直な方向になる。これに対して、この実施形態の場合は、インダクタ電極6の配線構造を立体的にすることで、コイル(インダクタ電極6)の巻回軸が配線基板2の上面2aと平行な方向になる。この構造によって磁束線が実装部品の電極などによって遮られず、インダクタ特性が向上する。 By the way, when a coil pattern is formed in a plane on the upper surface 2a of the wiring board 2, the winding axis of the coil is in a direction perpendicular to the upper surface 2a of the wiring board 2. On the other hand, in the case of this embodiment, the winding structure of the coil (inductor electrode 6) is parallel to the upper surface 2a of the wiring board 2 by making the wiring structure of the inductor electrode 6 three-dimensional. With this structure, the magnetic flux lines are not blocked by the electrodes of the mounted components, and the inductor characteristics are improved.
 なお、図1(a)に示すように、コイルコア5と各配線板8a~8cの間に、エポキシ樹脂、ポリイミド、シリコン樹脂などの絶縁材料で形成された絶縁膜10を配置してもよい。このようにすると、コイルコア5とインダクタ電極6の間の絶縁性が担保できるため、インダクタ電極6の特性の安定化を図ることができる。 As shown in FIG. 1A, an insulating film 10 made of an insulating material such as epoxy resin, polyimide, or silicon resin may be disposed between the coil core 5 and the wiring boards 8a to 8c. In this way, since the insulation between the coil core 5 and the inductor electrode 6 can be ensured, the characteristics of the inductor electrode 6 can be stabilized.
 (インダクタ部品の製造方法)
 次に、図2および図3を参照してインダクタ部品1aの製造方法について説明する。なお、図2は枠で支持された状態の配線板8a~8cの平面図、図3はインダクタ部品1aの製造方法を説明するための図である。
(Manufacturing method of inductor parts)
Next, a method for manufacturing the inductor component 1a will be described with reference to FIGS. 2 is a plan view of the wiring boards 8a to 8c supported by the frame, and FIG. 3 is a diagram for explaining a method of manufacturing the inductor component 1a.
 まず、各配線板8a~8cを準備する。例えば、2枚の上側配線板8a、8bは、Cuなどで形成された1枚の金属板をエッチングすることにより形成することができる。このとき、枠11aと両上側配線板8a、8bの領域を残して後はエッチングで除去し、両上側配線板8a、8bのそれぞれの端部81a、81bが枠11aで支持され、両上側配線板8a、8bのそれぞれの端部80a、80bが支持部82a、82bを介して枠11aで支持された第1エッチングプレート12aを形成する。また、両上側配線板8a、8bのそれぞれの端部80a、80bには、後で折り曲げ加工をするために切れ込みを形成する。下側配線板8cも同様に、下側配線板8cと支持部82cが枠11bで支持された状態の第2エッチングプレート12bを形成する。なお、各配線板8a~8cの形成は、エッチングに限らず、例えば、パンチング加工など、種々の方法を用いることができる。 First, each wiring board 8a to 8c is prepared. For example, the two upper wiring boards 8a and 8b can be formed by etching one metal plate made of Cu or the like. At this time, the regions of the frame 11a and the upper wiring boards 8a and 8b are left and removed by etching, and the ends 81a and 81b of the upper wiring boards 8a and 8b are supported by the frame 11a. A first etching plate 12a is formed in which the end portions 80a and 80b of the plates 8a and 8b are supported by the frame 11a via the support portions 82a and 82b. In addition, cuts are formed in the end portions 80a and 80b of the upper wiring boards 8a and 8b in order to be bent later. Similarly, the lower wiring board 8c forms the second etching plate 12b in a state where the lower wiring board 8c and the support portion 82c are supported by the frame 11b. The formation of the wiring boards 8a to 8c is not limited to etching, and various methods such as punching can be used.
 次に、図3(a)に示すように、第1エッチングプレート12aの両上側配線板8a、8bのそれぞれの端部80a、80bに折り曲げ加工を施し、接続部位7a、7bを形成する。接続部位7a、7bの形成には、例えば、両上側配線板8a、8bを冶具等で固定し、両上側配線板8a、8bそれぞれの端部80a、80bの所定位置に型材を配置して圧力をかけることで、端部80a、80bを所定の形状に屈曲させる方法がある。なお、図3(a)が本発明の「第1構造体」に相当する。 Next, as shown in FIG. 3A, the end portions 80a and 80b of the upper wiring boards 8a and 8b of the first etching plate 12a are bent to form connection portions 7a and 7b. For forming the connection parts 7a and 7b, for example, both the upper wiring boards 8a and 8b are fixed with a jig or the like, and a mold material is arranged at a predetermined position of each end 80a and 80b of the both upper wiring boards 8a and 8b. There is a method of bending the end portions 80a and 80b into a predetermined shape by applying. FIG. 3A corresponds to the “first structure” of the present invention.
 次に、図3(b)に示すように、第1構造体に、上面および下面に絶縁膜10が配置されたコイルコア5を配置する。このとき、コイルコア5の棒状部5bを接続部位7a、7bの間に配置する。 Next, as shown in FIG. 3B, the coil core 5 in which the insulating film 10 is disposed on the upper surface and the lower surface is disposed on the first structure. At this time, the rod-shaped part 5b of the coil core 5 is disposed between the connection parts 7a and 7b.
 次に、図3(c)に示すように、第2エッチングプレート12bの下側配線板8cの一方面に接続部位7a、7bそれぞれの下面70a、70bを接合する。第2エッチングプレートと下面70a、70bとは、例えば、半田により接合することができる。また、半田以外の接合材や、超音波を用いて接合することも可能である。なお、エッチングプレート12a、12bの表面は、接合しやすくするために、Ni/AuめっきやZn、Cr等により表面処理が施されていてもよい。 Next, as shown in FIG. 3C, the lower surfaces 70a and 70b of the connection portions 7a and 7b are joined to one surface of the lower wiring board 8c of the second etching plate 12b. The second etching plate and the lower surfaces 70a and 70b can be joined by, for example, solder. It is also possible to bond using a bonding material other than solder or ultrasonic waves. The surfaces of the etching plates 12a and 12b may be subjected to surface treatment with Ni / Au plating, Zn, Cr, or the like in order to facilitate bonding.
次に、図3(d)に示すように、両金属ピン9a、9bの上端面(本発明の「金属ピンの一端」に相当)を第1エッチングプレート12a(上側配線板8a、8b)に接合することにより、インダクタ電極6を形成する(図3(d)が本発明の「第2構造体」に相当)。当該接続も半田接合、超音波接合および導電性接着材等の接合材を用いることができる。 Next, as shown in FIG. 3D, the upper end surfaces of the metal pins 9a and 9b (corresponding to “one end of the metal pins” of the present invention) are formed on the first etching plate 12a ( upper wiring boards 8a and 8b). By joining, the inductor electrode 6 is formed (FIG. 3D corresponds to the “second structure” of the present invention). For this connection, a bonding material such as solder bonding, ultrasonic bonding, and conductive adhesive can be used.
 次に、図3(e)に示すように、配線基板2の上面2aに周知の表面実装技術を用いて各部品4を実装したあと、当該上面2aに両金属ピン9a、9bの下端面を接続する(図3(e)が本発明の「第3構造体」に相当)。この場合、第2エッチングプレート12bと配線基板2の上面2aの間に各部品4が配置された構造になる。 Next, as shown in FIG. 3E, after each component 4 is mounted on the upper surface 2a of the wiring board 2 using a known surface mounting technique, the lower end surfaces of both metal pins 9a and 9b are mounted on the upper surface 2a. The connection is made (FIG. 3E corresponds to the “third structure” of the present invention). In this case, each component 4 is arranged between the second etching plate 12 b and the upper surface 2 a of the wiring board 2.
 次に、図3(f)に示すように、各部品4の実装された配線基板2とインダクタ電極6をエポキシ樹脂で被覆し、樹脂層3を形成する。(図3(f)が本発明の「第4構造体」に相当)。樹脂層3の形成には、例えば、モールド方式やディスペンス方式を使用することができる。 Next, as shown in FIG. 3F, the wiring board 2 on which each component 4 is mounted and the inductor electrode 6 are covered with an epoxy resin to form the resin layer 3. (FIG. 3F corresponds to the “fourth structure” of the present invention). For the formation of the resin layer 3, for example, a mold method or a dispense method can be used.
 次に、図3(g)に示すように、第1エッチングプレート12aの枠11a(図2(a)参照)および第2エッチングプレート12bの枠11b(図2(b)参照)を除去することにより、インダクタ部品1aが完成する。枠11a、11bの除去には、例えばダイシングやレーザ加工を用いることができる。 Next, as shown in FIG. 3G, the frame 11a of the first etching plate 12a (see FIG. 2A) and the frame 11b of the second etching plate 12b (see FIG. 2B) are removed. Thus, the inductor component 1a is completed. For example, dicing or laser processing can be used to remove the frames 11a and 11b.
 したがって、上記した実施形態によれば、インダクタ電極6が、いずれも導電性ペーストやめっきよりも抵抗値が低い配線板8a~8cと金属ピン9a、9bとで形成されるため、インダクタ電極6全体の低抵抗化を図ることができ、これにより、インダクタ部品1aの特性(例えば、インダクタンス値)を向上することができる。 Therefore, according to the above-described embodiment, the inductor electrode 6 is formed by the wiring boards 8a to 8c and the metal pins 9a and 9b each having a resistance value lower than that of the conductive paste or plating. The resistance (inductance value, for example) of the inductor component 1a can be improved.
 また、例えば、樹脂層3の主面と垂直な方向に金属ピン、主面と平行な方向に金属板を使用してインダクタ電極6を形成することも考えられる。この場合、金属ピンは抵抗値が低いため、インダクタ電極6全体の抵抗値を下げることが可能であるが、金属ピンと金属板との抵抗値の違いにより、インピーダンスの不整合が発生してしまう。上記した実施形態によれば、金属ピン9a、9bで形成された入出力端子を除く部分はすべて配線板8a~8cで形成されているため、接続部位7a、7bに金属ピンを使用する場合と比べてインピーダンスの不整合を抑制することができる。 Further, for example, it is conceivable to form the inductor electrode 6 using a metal pin in a direction perpendicular to the main surface of the resin layer 3 and a metal plate in a direction parallel to the main surface. In this case, since the resistance value of the metal pin is low, the resistance value of the inductor electrode 6 as a whole can be lowered. However, impedance mismatch occurs due to the difference in resistance value between the metal pin and the metal plate. According to the above-described embodiment, all parts except the input / output terminals formed by the metal pins 9a and 9b are formed by the wiring boards 8a to 8c, so that the metal pins are used for the connection portions 7a and 7b. In comparison, impedance mismatch can be suppressed.
 また、両金属ピン9a、9bの長さを調整し、下側配線板8cの下部に空間を形成することで、例えば、樹脂層3の上面側の領域にインダクタ電極6の形成領域に使用し、樹脂層3の下面側の領域を部品配置領域にするなど、樹脂層3内部の設計自由度の向上を図ることができる。また、配線基板2の上面2aと下側配線板8cの間に各部品4を配置することで、インダクタ部品1aの小型化を図ることができる。また、例えば、配線基板2の上面2aに形成された配線電極のみでコイルを形成した場合は、配線基板2の上面2aの面積を小さくするのが困難であるが、インダクタ電極6を立体的な配線構造で形成することで、配線基板2の上面2aの面積を容易に小さくすることができる。また、この場合、各部品4とマザー基板との間に、放熱特性が樹脂層3よりも優れた配線基板2を配置するため、放熱特性の優れたインダクタ部品1aを提供することができる。 Further, by adjusting the lengths of both metal pins 9a and 9b and forming a space below the lower wiring board 8c, for example, it is used as a region where the inductor electrode 6 is formed in the region on the upper surface side of the resin layer 3. Further, the degree of freedom in design inside the resin layer 3 can be improved, for example, the region on the lower surface side of the resin layer 3 can be a component placement region. Further, by disposing each component 4 between the upper surface 2a of the wiring board 2 and the lower wiring board 8c, the inductor component 1a can be reduced in size. For example, when the coil is formed only with the wiring electrode formed on the upper surface 2a of the wiring board 2, it is difficult to reduce the area of the upper surface 2a of the wiring board 2, but the inductor electrode 6 is formed in a three-dimensional manner. By forming the wiring structure, the area of the upper surface 2a of the wiring board 2 can be easily reduced. In this case, since the wiring board 2 having a heat dissipation characteristic superior to that of the resin layer 3 is disposed between each component 4 and the mother board, the inductor component 1a having an excellent heat dissipation characteristic can be provided.
 また、各配線板8a~8cは、いずれも両端それぞれが樹脂層3の周縁に達するように形成されているため、インダクタ電極6を形成するのに必要な部分のみで各配線板8a~8cが形成される場合と比較して、インダクタ部品1a内の金属部分を増やすことができ、これにより、インダクタ部品1aの放熱性を向上することができる。 In addition, since each of the wiring boards 8a to 8c is formed so that both ends thereof reach the periphery of the resin layer 3, each wiring board 8a to 8c is formed only at a portion necessary for forming the inductor electrode 6. Compared with the case where it forms, the metal part in the inductor component 1a can be increased, and thereby the heat dissipation of the inductor component 1a can be improved.
 また、それぞれインダクタ電極6の入力/出力端子を形成する両金属ピン9a、9bの間は、電位差が大きくなるため、浮遊容量に起因するインダクタ電極6の特性劣化が懸念されるが、この実施形態では、両金属ピン9a、9bが離れて配置されるため、浮遊容量を抑制することができる。ピン形状であるからピン間の対向面積を減らすことも可能であり、更に浮遊容量を抑制することができる。 In addition, since the potential difference between the metal pins 9a and 9b forming the input / output terminals of the inductor electrode 6 increases, there is a concern about deterioration of the characteristics of the inductor electrode 6 due to stray capacitance. Then, since both the metal pins 9a and 9b are arranged apart from each other, stray capacitance can be suppressed. Because of the pin shape, the facing area between the pins can be reduced, and stray capacitance can be further suppressed.
 また、この実施形態では、コイルコア5が環状部5aと棒状部5bとを有し、インダクタ電極6が、棒状部5bの長さ方向に沿って螺旋状に巻回する。このようにすると、インダクタ電極6の通電時に発生する磁束が通る磁束路にコイルコア5は配置されることになるため、インダクタ電極6のインダクタンス値を効率的に増やすことができる。 In this embodiment, the coil core 5 has an annular portion 5a and a rod-shaped portion 5b, and the inductor electrode 6 is spirally wound along the length direction of the rod-shaped portion 5b. If it does in this way, since the coil core 5 will be arrange | positioned in the magnetic flux path through which the magnetic flux generated at the time of electricity supply of the inductor electrode 6 passes, the inductance value of the inductor electrode 6 can be increased efficiently.
 ところで、各配線板8a~8cの代わりに導電性ペーストやめっきで形成されたパターンを用いてこの実施形態のインダクタ部品1aを製造しようとすると、各部品4を配線基板2の上面2aに実装したあと、第1樹脂層で各部品4を封止し、第1樹脂層の表面に市側配線板8cに相当する部分を導電性ペーストやめっきで形成する。その後、第1樹脂層の表面にコイルコアや金属ピンなどを配置して、第2樹脂層でこれらを封止した後、第2樹脂層の表面に上側配線板8a、8bに相当する部分を形成することになる。この場合、樹脂層と配線板に相当する部分をそれぞれ2回に分けて形成する必要がある。一方、この実施形態によると、2枚のエッチングプレート12a、12bと両金属ピン9a、9bを用いてインダクタ部品1aを製造することで、樹脂層3の形成を1回に減らすことができるため、インダクタ部品1aの製造コストの削減を図ることができる。また、従来の配線部形成の為の印刷工程やめっき工程が不要となるため、インダクタ部品1aの製造コストのさらなる削減を図ることができる。 By the way, when trying to manufacture the inductor component 1a of this embodiment using a pattern formed by conductive paste or plating instead of the wiring boards 8a to 8c, each component 4 is mounted on the upper surface 2a of the wiring board 2. Then, each component 4 is sealed with the first resin layer, and a portion corresponding to the city-side wiring board 8c is formed on the surface of the first resin layer with a conductive paste or plating. Thereafter, a coil core, a metal pin, and the like are disposed on the surface of the first resin layer, and after sealing them with the second resin layer, portions corresponding to the upper wiring boards 8a and 8b are formed on the surface of the second resin layer. Will do. In this case, it is necessary to form portions corresponding to the resin layer and the wiring board in two portions. On the other hand, according to this embodiment, since the inductor component 1a is manufactured using the two etching plates 12a and 12b and both the metal pins 9a and 9b, the formation of the resin layer 3 can be reduced to one time. The manufacturing cost of the inductor component 1a can be reduced. Further, since the conventional printing process and plating process for forming the wiring portion are not required, the manufacturing cost of the inductor component 1a can be further reduced.
 (配線板の変形例)
 上記した実施形態では、下側配線板8cのうち支持部82cを形成する部分がインダクタ電極6を形成する部分よりも細くなっているが、図4(a)に示すように、下側配線板8cの支持部82cは、下側配線板8cの中央部分と同じ幅であってもよい。また、図4(b)に示すように、上側配線板8a、8bはそれぞれ、2本の支持部82a、83a、82b、83bを有していてもよい。また、図4(c)に示すように、下側配線板8cの支持部82cは、下側配線板8cの中央部分と同じ幅に形成され、上側配線板8a、8bの支持部82a、82bは、上側配線板8a、8bの中央部分と同じ幅となっていてもよい。上記した変形例の場合、インダクタ部品1a内の金属部分を増やすことができるため、インダクタ部品1aの放熱性を向上することができる。更に、本実施形態では、折り曲げ部を上側配線板に設けている例を示したが、本発明においては、折り曲げ部を下側配線板に設けてもよい。
(Modification of wiring board)
In the embodiment described above, the portion of the lower wiring board 8c where the support portion 82c is formed is thinner than the portion where the inductor electrode 6 is formed. However, as shown in FIG. The support portion 82c of 8c may have the same width as the central portion of the lower wiring board 8c. Moreover, as shown in FIG.4 (b), the upper side wiring boards 8a and 8b may have two support parts 82a, 83a, 82b, and 83b, respectively. As shown in FIG. 4C, the support portion 82c of the lower wiring board 8c is formed to have the same width as the central portion of the lower wiring board 8c, and the support portions 82a and 82b of the upper wiring boards 8a and 8b. May have the same width as the central portion of the upper wiring boards 8a, 8b. In the case of the above-described modification, the metal part in the inductor component 1a can be increased, so that the heat dissipation of the inductor component 1a can be improved. Furthermore, in this embodiment, although the example which provided the bending part in the upper side wiring board was shown, you may provide a bending part in a lower side wiring board in this invention.
 <第2実施形態>
 本発明の第2実施形態にかかるインダクタ部品について、図5を参照して説明する。なお、図5(a)はインダクタ部品を配線基板の主面と平行な方向から見たときの図であって、内部構造が分かるように樹脂層の一部を図示省略している。また、図5(b)はインダクタ電極の配線構造を示すインダクタ部品の平面図である。
Second Embodiment
An inductor component according to a second embodiment of the present invention will be described with reference to FIG. FIG. 5A is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen. FIG. 5B is a plan view of the inductor component showing the wiring structure of the inductor electrode.
 この実施形態のインダクタ部品1bが、図1を参照して説明した第1実施形態のインダクタ部品1aと異なるところは、図5に示すように、接続部位7a、7bの形状が凹状の断面形状で屈曲していることである。その他の構成は、第1実施形態のインダクタ部品1aと同じであるため、同一符号を付すことにより説明を省略する。 The difference between the inductor component 1b of this embodiment and the inductor component 1a of the first embodiment described with reference to FIG. 1 is that the connecting portions 7a and 7b have a concave cross-sectional shape as shown in FIG. It is bent. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.
 この場合、図5(a)に示すように、上側配線板8a、8bに形成された接続部位7a、7bは、樹脂層3の主面に平行な面から見たときに、凹状の断面形状(樹脂層3の下面3aと垂直な方向であって、上側配線板8a、8bの長さ方向の断面)で屈曲して形成されており、接続部位7a、7bの下面70a、70bが下側配線板8cに接することで、上側配線板8a、8bのそれぞれと下側配線板8cとが電気的に接続している。また、図5(b)に示すように、上側配線板8a、8bの支持部82a、82bは樹脂層3の周縁30a、30bにそれぞれ達するように形成されており、支持部82a、82bの幅は、上側配線板8a、8bの中央部分と同じ幅で形成されている。下側配線板8cの支持部82cもまた、下側配線板8cの中央部分と同じ幅で形成されている。 In this case, as shown in FIG. 5 (a), the connection sites 7a and 7b formed on the upper wiring boards 8a and 8b have a concave cross-sectional shape when viewed from a plane parallel to the main surface of the resin layer 3. (The direction perpendicular to the lower surface 3a of the resin layer 3 and the cross-section in the length direction of the upper wiring boards 8a and 8b) is bent and the lower surfaces 70a and 70b of the connection parts 7a and 7b are on the lower side. Each of the upper wiring boards 8a and 8b and the lower wiring board 8c are electrically connected by being in contact with the wiring board 8c. Further, as shown in FIG. 5B, the support portions 82a and 82b of the upper wiring boards 8a and 8b are formed so as to reach the peripheral edges 30a and 30b of the resin layer 3, respectively, and the width of the support portions 82a and 82b. Is formed with the same width as the central portion of the upper wiring boards 8a, 8b. The support portion 82c of the lower wiring board 8c is also formed with the same width as the central portion of the lower wiring board 8c.
 (インダクタ部品の製造方法)
 次に、図6および図7を参照してインダクタ部品1bの製造方法について説明する。なお、図6は枠で支持された状態の配線板8a~8cの平面図、図7はインダクタ部品1bの製造方法を説明するための図である。
(Manufacturing method of inductor parts)
Next, a method for manufacturing the inductor component 1b will be described with reference to FIGS. 6 is a plan view of the wiring boards 8a to 8c supported by the frame, and FIG. 7 is a diagram for explaining a method of manufacturing the inductor component 1b.
 まず、図6に示すように、各配線板8a~8cを準備する。各配線板8a~8cは、例えば、2枚の上側配線板8a、8bは、Cuなどで形成された1枚の金属板をエッチングすることにより形成することができる。このとき、枠11aと両上側配線板8a、8bの領域を残して後はエッチングで除去し、第1エッチングプレート12aを形成する。下側配線板8cも同様に、下側配線板8cの両端が枠11bで支持された状態の第2エッチングプレート12bを形成する。この時、第1エッチングプレート12aは、後に接続部位7a、7bを形成するために折り曲げ加工を施すため、折り曲げ部分を考慮して第2エッチングプレートよりも大きく形成しておくとよい。 First, as shown in FIG. 6, wiring boards 8a to 8c are prepared. Each of the wiring boards 8a to 8c can be formed, for example, by etching a single metal plate made of Cu or the like, and the two upper wiring boards 8a and 8b. At this time, the regions of the frame 11a and the upper wiring boards 8a and 8b are left and removed by etching to form the first etching plate 12a. Similarly, the lower wiring board 8c forms the second etching plate 12b in a state where both ends of the lower wiring board 8c are supported by the frame 11b. At this time, since the first etching plate 12a is bent to form the connection portions 7a and 7b later, the first etching plate 12a is preferably formed larger than the second etching plate in consideration of the bent portion.
 次に、図7(a)に示すように、第1エッチングプレート12aの両上側配線板8a、8bの所定位置及び枠部の任意の箇所に曲げ加工を施し、接続部位7a、7bを形成する。接続部位7a、7bは、例えば、両上側配線板8a、8bの所定位置に金型を押し付けて屈曲させるプレス加工等により形成することができる。なお、図7(a)が本発明の「第1構造体」に相当する。 Next, as shown in FIG. 7A, bending portions are applied to predetermined positions of the upper wiring boards 8a and 8b of the first etching plate 12a and arbitrary portions of the frame portion to form connection portions 7a and 7b. . The connection parts 7a and 7b can be formed by, for example, pressing or bending the molds at predetermined positions on the upper wiring boards 8a and 8b. FIG. 7A corresponds to the “first structure” of the present invention.
 次に、図7(b)に示すように、第1構造体に上面および下面に絶縁膜10が配置されたコイルコア5を配置する。このとき、コイルコア5の棒状部5bを接続部位7a、7bの間に位置する。 Next, as shown in FIG. 7B, the coil core 5 in which the insulating film 10 is disposed on the upper surface and the lower surface is disposed on the first structure. At this time, the rod-shaped part 5b of the coil core 5 is located between the connection parts 7a and 7b.
 次に、図7(c)に示すように、第2エッチングプレート12bの下側配線板8cの一方面に接続部位7a、7bそれぞれの下面70a、70bを接合する。第2エッチングプレート12bと下面70a、70bとは、半田により接合することができる。また、半田以外の接合材や、超音波を用いて接合することも可能である。なお、エッチングプレート12a、12bの表面は、接合しやすくするために、Ni/AuめっきやZn、Cr等により表面処理が施されていてもよい。 Next, as shown in FIG. 7C, the lower surfaces 70a and 70b of the connection portions 7a and 7b are joined to one surface of the lower wiring board 8c of the second etching plate 12b. The second etching plate 12b and the lower surfaces 70a and 70b can be joined by solder. It is also possible to bond using a bonding material other than solder or ultrasonic waves. The surfaces of the etching plates 12a and 12b may be subjected to surface treatment with Ni / Au plating, Zn, Cr, or the like in order to facilitate bonding.
次に、図7(d)に示すように、コイルコア5の環状部5aの外側領域に位置するように、両金属ピン9a、9bの上端面(本発明の「金属ピンの一端」に相当)を第1エッチングプレート12a(上側配線板8a、8b)に接合することにより、インダクタ電極6を形成する(図3(d)が本発明の「第2構造体」に相当)。当該接続も半田接合、超音波接合および導電性接着材等の接合材を用いることができる。 Next, as shown in FIG. 7 (d), upper end surfaces of both metal pins 9a and 9b (corresponding to "one end of metal pin" of the present invention) so as to be located in the outer region of the annular portion 5a of the coil core 5. Is joined to the first etching plate 12a ( upper wiring boards 8a and 8b) to form the inductor electrode 6 (FIG. 3D corresponds to the “second structure” of the present invention). For this connection, a bonding material such as solder bonding, ultrasonic bonding, and conductive adhesive can be used.
 次に、図7(e)に示すように、配線基板2の上面2aに周知の表面実装技術を用いて各部品4を実装したあと、当該上面2aに両金属ピン9a、9bの下端面を接続する(図7(e)が本発明の「第3構造体」に相当)。この場合、第2エッチングプレート12bと配線基板2の上面2aの間に各部品4が配置された構造になる。 Next, as shown in FIG. 7E, after mounting each component 4 on the upper surface 2a of the wiring board 2 using a known surface mounting technique, the lower end surfaces of both metal pins 9a and 9b are mounted on the upper surface 2a. The connection is made (FIG. 7E corresponds to the “third structure” of the present invention). In this case, each component 4 is arranged between the second etching plate 12 b and the upper surface 2 a of the wiring board 2.
 次に、図7(f)に示すように、各部品4の実装された配線基板2とインダクタ電極6をエポキシ樹脂で被覆し、樹脂層3を形成する。(図7(f)が本発明の「第4構造体」に相当)。樹脂層3の形成には、例えば、モールド方式やディスペンス方式を使用することができる。 Next, as shown in FIG. 7F, the wiring board 2 on which each component 4 is mounted and the inductor electrode 6 are covered with an epoxy resin to form the resin layer 3. (FIG. 7F corresponds to the “fourth structure” of the present invention). For the formation of the resin layer 3, for example, a mold method or a dispense method can be used.
 次に、図7(g)に示すように、第1エッチングプレート12aの枠11a(図6(a)参照)および第2エッチングプレート12bの枠11b(図6(b)参照)を除去することにより、インダクタ部品1bが完成する。枠11a、11bの除去には、例えばダイシングやレーザ加工を用いることができる。 Next, as shown in FIG. 7G, the frame 11a of the first etching plate 12a (see FIG. 6A) and the frame 11b of the second etching plate 12b (see FIG. 6B) are removed. Thus, the inductor component 1b is completed. For example, dicing or laser processing can be used to remove the frames 11a and 11b.
 上記した実施形態によれば、第1実施形態と同様の効果を得ることができる。 According to the above-described embodiment, the same effect as that of the first embodiment can be obtained.
 (配線板の変形例)
 図8に示すように、上側配線板8a、8bの支持部82a、82bおよび下側配線板8cの支持部82cが、配線板8a~8cの中央部分(インダクタ電極形成部分)より線幅が細く形成されていてもよい。
(Modification of wiring board)
As shown in FIG. 8, the support portions 82a and 82b of the upper wiring boards 8a and 8b and the support portion 82c of the lower wiring board 8c are narrower than the center portion (inductor electrode forming portion) of the wiring boards 8a to 8c. It may be formed.
 <第3実施形態>
 本発明の第3実施形態にかかるインダクタ部品について、図9を参照して説明する。なお、図9は、インダクタ電極の配線構造を示すインダクタ部品1cの平面図である。
<Third Embodiment>
An inductor component according to a third embodiment of the present invention will be described with reference to FIG. FIG. 9 is a plan view of the inductor component 1c showing the wiring structure of the inductor electrode.
 この実施形態のインダクタ部品1cが、図1を参照して説明した第1実施形態のインダクタ部品1aと異なるところは、図9に示すように、接続部位7a、7bの形状が凹陥したものであることである。その他の構成は、第1実施形態のインダクタ部品1aと同じであるため、同一符号を付すことにより説明を省略する。 The difference between the inductor component 1c of this embodiment and the inductor component 1a of the first embodiment described with reference to FIG. 1 is that the shape of the connection parts 7a and 7b is recessed as shown in FIG. That is. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.
 この場合、図9に示すように、上側配線板8a、8bに形成された接続部位7a、7bは、いずれも、下側配線板8cの方向に凹陥して形成される。この時、樹脂層3の下面3aと平行な方向から見たときの断面形状は、図5(a)と同様になる。そして、接続部位7a、7bの下面(図示省略)が下側配線板8cに接することで、上側配線板8a、8bのそれぞれと下側配線板8cとが電気的に接続している。接続部位7a、7bは、例えば、すり鉢状の凸部を有する部材を、上側配線板8a、8bの所定位置に押し付けて形成することができる。なお、接続部位7a、7bの下面には、穴が貫通していてもよい。 In this case, as shown in FIG. 9, the connection portions 7a and 7b formed on the upper wiring boards 8a and 8b are both recessed in the direction of the lower wiring board 8c. At this time, the cross-sectional shape when viewed from a direction parallel to the lower surface 3a of the resin layer 3 is the same as that shown in FIG. The lower surfaces (not shown) of the connection parts 7a and 7b are in contact with the lower wiring board 8c, so that the upper wiring boards 8a and 8b are electrically connected to the lower wiring board 8c. The connection parts 7a and 7b can be formed, for example, by pressing a member having a mortar-shaped convex portion against a predetermined position of the upper wiring boards 8a and 8b. In addition, the hole may penetrate in the lower surface of the connection parts 7a and 7b.
 したがって、上記した実施形態によれば、第1実施形態と同様の効果を得ることができる。 Therefore, according to the above-described embodiment, the same effect as that of the first embodiment can be obtained.
 (配線板の変形例)
 図10に示すように、配線板8a~8cの支持部82a~82cを、配線板8a~8cの中心部分と同じ幅に形成してもよい。この場合、インダクタ部品1c内の金属部分を増やすことができるため、インダクタ部品1cの放熱性を向上することができる。
(Modification of wiring board)
As shown in FIG. 10, the support portions 82a to 82c of the wiring boards 8a to 8c may be formed to have the same width as the central portion of the wiring boards 8a to 8c. In this case, since the metal part in the inductor component 1c can be increased, the heat dissipation of the inductor component 1c can be improved.
 <第4実施形態>
 本発明の第3実施形態にかかるインダクタ部品について、図11を参照して説明する。なお、図11(a)は、インダクタ部品を配線基板の主面と平行な方向から見たときの図であって、内部構造がわかるように樹脂層の一部を図示省略している。また、図11(b)は、インダクタ電極の配線構造を示すインダクタ部品の平面図である。
<Fourth embodiment>
An inductor component according to a third embodiment of the present invention will be described with reference to FIG. FIG. 11A is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen. FIG. 11B is a plan view of the inductor component showing the wiring structure of the inductor electrode.
 この実施形態のインダクタ部品1dが、図1を参照して説明した第1実施形態のインダクタ部品1aと異なるところは、図11に示すように、接続部位7a、7bが、配線板8a、8bの一部を厚くすることにより形成されていることである。その他の構成は、第1実施形態のインダクタ部品1aと同じであるため、同一符号を付すことにより説明を省略する。 The inductor component 1d of this embodiment differs from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that the connection parts 7a and 7b are connected to the wiring boards 8a and 8b as shown in FIG. It is formed by thickening a part. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.
 この場合、図11(a)に示すように、上側配線板8a、8bの所定位置に、周囲より厚く形成された接続部位7a、7bが形成されている。接続部位7a、7bは、周囲の金属板をエッチングで薄くすることにより形成することができる。接続部位7a、7bの下面70a、70bが下側配線板8cに接することで、上側配線板8a、8bのそれぞれと下側配線板8cとが電気的に接続している。また、図11(b)に示すように、配線板8a~8cの支持部82a~82cは、樹脂層3の周縁30a、30bにそれぞれ達するように形成されている。 In this case, as shown in FIG. 11A, connection portions 7a and 7b formed thicker than the surroundings are formed at predetermined positions of the upper wiring boards 8a and 8b. The connection parts 7a and 7b can be formed by thinning the surrounding metal plate by etching. Since the lower surfaces 70a and 70b of the connection portions 7a and 7b are in contact with the lower wiring board 8c, the upper wiring boards 8a and 8b and the lower wiring board 8c are electrically connected. Further, as shown in FIG. 11B, the support portions 82a to 82c of the wiring boards 8a to 8c are formed so as to reach the peripheral edges 30a and 30b of the resin layer 3, respectively.
 したがって、上記した実施形態によれば、第1実施形態と同様の効果を得ることができる。 Therefore, according to the above-described embodiment, the same effect as that of the first embodiment can be obtained.
 <第5実施形態>
 本発明の第5実施形態にかかるインダクタ部品について、図12を参照して説明する。なお、図12(a)はインダクタ部品を配線基板の主面と平行な方向から見たときの図であって、内部構造がわかるように樹脂層の一部を図示省略している。また、図12(b)はインダクタ電極の配線構造を示すインダクタ部品の平面図である。
<Fifth Embodiment>
An inductor component according to a fifth embodiment of the present invention will be described with reference to FIG. FIG. 12A is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen. FIG. 12B is a plan view of the inductor component showing the wiring structure of the inductor electrode.
 この実施形態のインダクタ部品1eが、図1を参照して説明した第1実施形態のインダクタ部品1aと異なるところは、図12に示すように、配線板8d~8fの配置と、金属ピン9a、9bの配置が異なることである。その他の構成は、第1実施形態のインダクタ部品1aと同じであるため、同一符号を付すことにより説明を省略する。 The inductor component 1e of this embodiment differs from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that the arrangement of the wiring boards 8d to 8f and the metal pins 9a, The arrangement of 9b is different. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.
 この場合、インダクタ電極6は、1枚の上側配線板8dと、2枚の下側配線板8e、8fとで形成されており、1枚の上側配線板8dが、第1実施形態の下側配線板8cと同じ形状(図1(b)参照)で形成され、2枚の下側配線板8e、8fが、第1実施形態の上側配線板8a、8bと同じ形状(図1(b)参照)で形成される。インダクタ電極6の入力/出力端子を構成する2本の金属ピン9a、9bは、第1実施形態では、上側配線板8a、8bと配線基板2とを接続していたが、この実施形態では、第1実施形態のものよりも短く形成されて下側配線板8e、8fと配線基板2とを接続する。 In this case, the inductor electrode 6 is formed by one upper wiring board 8d and two lower wiring boards 8e and 8f, and the one upper wiring board 8d is the lower side of the first embodiment. Formed in the same shape as the wiring board 8c (see FIG. 1B), the two lower wiring boards 8e and 8f have the same shape as the upper wiring boards 8a and 8b in the first embodiment (see FIG. 1B). See). The two metal pins 9a and 9b constituting the input / output terminals of the inductor electrode 6 connect the upper wiring boards 8a and 8b and the wiring board 2 in the first embodiment, but in this embodiment, The wiring board 2 is connected to the lower wiring boards 8e and 8f which are shorter than those of the first embodiment.
 この構成によると、インダクタ電極6が、いずれも導電性ペーストやめっきよりも抵抗値が低い金属ピン9a、9bおよび配線板8d、8fとで形成されるため、インダクタ電極6全体の低抵抗化を図ることができ、これにより、インダクタ部品1eの特性(例えば、インダクタンス値)を向上することができる。更に、マザー基板とコイル部の距離を短くでき、低抵抗化が可能となる。 According to this configuration, since the inductor electrode 6 is formed of the metal pins 9a and 9b and the wiring boards 8d and 8f, both of which have a resistance value lower than that of the conductive paste or plating, the resistance of the entire inductor electrode 6 can be reduced. As a result, the characteristics (for example, inductance value) of the inductor component 1e can be improved. Furthermore, the distance between the mother substrate and the coil portion can be shortened, and the resistance can be reduced.
 <第6実施形態>
 本発明の第6実施形態にかかるインダクタ部品について、図13を参照して説明する。なお、図13(a)はインダクタ部品を配線基板の主面と平行な方向から見たときの図であって、内部構造がわかるように樹脂層の一部を図示省略している。また、図13(b)はインダクタ部品を下面側から見た底面図、図13(c)はインダクタ部品を上面側から見た平面図である。
<Sixth Embodiment>
An inductor component according to a sixth embodiment of the present invention will be described with reference to FIG. FIG. 13A is a view of the inductor component as viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen. FIG. 13B is a bottom view of the inductor component viewed from the lower surface side, and FIG. 13C is a plan view of the inductor component viewed from the upper surface side.
 この実施形態のインダクタ部品1fが、図1を参照して説明した第1実施形態のインダクタ部品1aと異なるところは、図13に示すように、第1、第2金属板である配線板8g、8hと配線基板2に設けられた配線電極13とでインダクタ電極6が構成されていることである。その他の構成は、第1実施形態のインダクタ部品1aと同じであるため、同一符号を付すことにより説明を省略する。 The inductor component 1f of this embodiment differs from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that a wiring board 8g that is a first and second metal plate, as shown in FIG. 8h and the wiring electrode 13 provided on the wiring board 2 constitute the inductor electrode 6. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.
 インダクタ部品1fは、配線基板2の下面2bに配線電極13が設けられている。また、インダクタ電極6は、2枚の配線板8g、8hとを有し、配線板8g、8hのそれぞれの一部により形成された第1屈曲部7c、第2屈曲部7dが配線基板2の下面2bに設けられた配線電極13に接触することにより、コイルコア5の棒状部5bの周囲を巻回するコイルが形成される。両屈曲部7c、7dは、配線基板2の上面2aに平行な方向から見たときに、配線板8g、8hのそれぞれの端部80g、80h(図14(a)参照)がL字状に屈曲されて形成され、両屈曲部7c、7dのそれぞれの先端部分70c、70dが配線基板2の下面2bにおいて配線電極13と電気的に接続されている。このとき、図13(b)に示すように、インダクタ部品1fの配線基板2の下面2bを含む面において、配線電極13に両屈曲部7c、7dの先端部分70c、70dが重なるように接触されてインダクタ電極が形成されている。また、図13(c)に示すように、両配線板8g、8hには、それぞれの中央部分より線幅が細い支持部82g、84g、82h、84hが一体的に形成され、樹脂層3の側面に露出している。 The inductor component 1 f is provided with a wiring electrode 13 on the lower surface 2 b of the wiring board 2. The inductor electrode 6 includes two wiring boards 8g and 8h, and the first bent portion 7c and the second bent portion 7d formed by a part of each of the wiring boards 8g and 8h are provided on the wiring board 2. By contacting the wiring electrode 13 provided on the lower surface 2b, a coil is formed that winds around the rod-shaped portion 5b of the coil core 5. The two bent portions 7c and 7d have L-shaped ends 80g and 80h (see FIG. 14A) of the wiring boards 8g and 8h when viewed from a direction parallel to the upper surface 2a of the wiring board 2. The bent portions 7c and 7d are electrically connected to the wiring electrode 13 on the lower surface 2b of the wiring board 2 by being bent. At this time, as shown in FIG. 13B, on the surface including the lower surface 2b of the wiring board 2 of the inductor component 1f, the wiring electrode 13 is contacted so that the tip portions 70c and 70d of both bent portions 7c and 7d overlap. Thus, an inductor electrode is formed. As shown in FIG. 13 (c), both wiring boards 8g and 8h are integrally formed with support portions 82g, 84g, 82h and 84h whose line widths are narrower than the center portions of the respective wiring boards 8g and 8h. It is exposed on the side.
 (インダクタ部品の製造方法)
 次に、図14および図15を参照してインダクタ部品1fの製造方法について説明する。なお、図14(a)、図14(b)は枠で支持された状態の配線板8g、8hの平面図、図14(c)は枠で支持された状態の配線板8g、8hの断面図、図15はインダクタ部品1fの製造方法を説明するための図である。
(Manufacturing method of inductor parts)
Next, a method for manufacturing the inductor component 1f will be described with reference to FIGS. 14A and 14B are plan views of the wiring boards 8g and 8h supported by the frame, and FIG. 14C is a cross section of the wiring boards 8g and 8h supported by the frame. FIGS. 15A and 15B are diagrams for explaining a method of manufacturing the inductor component 1f.
 まず、図14(a)に示すように配線板8g、8hを準備する。配線板8g、8hは、Cuなどで形成された1枚の金属板をエッチングすることにより形成することができる。このとき、枠11aと配線板8g、8hおよび各支持部82g、84g、82h、84hを残してエッチングで除去し、両配線板8g、8hがそれぞれ各支持部82g、84g、82h、84hで支持されたエッチングプレート12cを形成する。また、両配線板8g、8hのそれぞれの端部80g、80hには、後で折り曲げ加工をするための切れ込みを形成する(図14(a)の点線部分)。なお、配線板8g、8hの形成は、エッチングに限らず、例えば、パンチング加工など、種々の方法を用いることができる。 First, as shown in FIG. 14A, wiring boards 8g and 8h are prepared. The wiring boards 8g and 8h can be formed by etching one metal plate made of Cu or the like. At this time, the frame 11a, the wiring boards 8g and 8h and the support portions 82g, 84g, 82h and 84h are removed by etching, and both the wiring boards 8g and 8h are supported by the support portions 82g, 84g, 82h and 84h, respectively. The etched plate 12c is formed. Further, notches for later bending are formed in the respective end portions 80g and 80h of both wiring boards 8g and 8h (dotted line portions in FIG. 14A). The formation of the wiring boards 8g and 8h is not limited to etching, and various methods such as punching can be used.
 次に、図14(b)、図14(c)に示すように、エッチングプレート12cの配線板8g、8hのそれぞれの端部80g、80hに折り曲げ加工を施し、両屈曲部7c、7dを形成する。両屈曲部7c、7dの形成には、例えば、配線板8g、8hを冶具等で固定し、両配線板8g、8hのそれぞれの端部80g、80hの所定位置に型材を配置して圧力をかけることで、端部80g、80hを所定の形状に屈曲させる方法がある。 Next, as shown in FIGS. 14B and 14C, the end portions 80g and 80h of the wiring boards 8g and 8h of the etching plate 12c are bent to form both bent portions 7c and 7d. To do. For forming both the bent portions 7c and 7d, for example, the wiring boards 8g and 8h are fixed with a jig or the like, and a mold material is arranged at a predetermined position of each end portion 80g and 80h of the both wiring boards 8g and 8h. There is a method of bending the end portions 80g and 80h into a predetermined shape by applying.
 次に、図15(a)、図15(b)に示すように、両屈曲部7c、7dを形成したエッチングプレート12cに、上面および下面に絶縁膜10が配置されたコイルコア5を配置する。このとき、コイルコアの棒状部5bを両屈曲部7c、7dの間に配置する。次に、図15(c)、図15(d)に示すように、コイルコア5を配置したエッチングプレート12cと、上面2aに部品4が実装され下面2bに配線電極13が設けられた配線基板2とを接合する。エッチングプレート12cと配線基板2とは、半田により接合することができる。このとき、両屈曲部7c、7dの先端部分70c、70dが配線電極13に接触し、両屈曲部7c、7dが配線電極13を介して電気的に接続されるようにして、インダクタ電極6を形成する。なお、エッチングプレート12cの表面は、接合しやすくするために、Ni/AuめっきやZn、Cr等により表面処理が施されていてもよい。 Next, as shown in FIGS. 15 (a) and 15 (b), the coil core 5 having the insulating film 10 disposed on the upper surface and the lower surface is disposed on the etching plate 12c formed with both bent portions 7c and 7d. At this time, the rod-shaped portion 5b of the coil core is disposed between the two bent portions 7c and 7d. Next, as shown in FIGS. 15C and 15D, an etching plate 12c on which the coil core 5 is arranged, and a wiring board 2 in which the component 4 is mounted on the upper surface 2a and the wiring electrode 13 is provided on the lower surface 2b. And join. The etching plate 12c and the wiring board 2 can be joined by solder. At this time, the tip portions 70c and 70d of both bent portions 7c and 7d are in contact with the wiring electrode 13, and both the bent portions 7c and 7d are electrically connected via the wiring electrode 13, so that the inductor electrode 6 is Form. The surface of the etching plate 12c may be subjected to surface treatment by Ni / Au plating, Zn, Cr or the like in order to facilitate bonding.
 その後、図15(e)に示すように、配線基板2とインダクタ電極6をエポキシ樹脂等の樹脂で被覆し、樹脂層3を形成する。樹脂層3の形成には、例えば、モールド方式やディスペンス方式を使用することができる。その後、エッチングプレートの枠11aを除去し、必要に応じてダイサーカット等を行い、インダクタ部品1fが完成する。 Thereafter, as shown in FIG. 15E, the wiring board 2 and the inductor electrode 6 are covered with a resin such as an epoxy resin to form the resin layer 3. For the formation of the resin layer 3, for example, a mold method or a dispense method can be used. Thereafter, the frame 11a of the etching plate is removed, and dicer cutting or the like is performed as necessary to complete the inductor component 1f.
 したがって、上記した実施形態によれば、配線板8g、8hと配線電極13だけで容易にインダクタ電極6を形成することができる。また、コイル径の大きなインダクタ電極6を形成することができるため、インダクタ部品1fの特性(例えば、インダクタンス値)を向上することができる。また、両屈曲部7c、7dの先端部分70c、70dと配線電極13が露出しているため、マザー基板と接合させることにより放熱特性を向上させることができる。 Therefore, according to the above-described embodiment, the inductor electrode 6 can be easily formed only by the wiring boards 8g and 8h and the wiring electrode 13. In addition, since the inductor electrode 6 having a large coil diameter can be formed, the characteristics (for example, inductance value) of the inductor component 1f can be improved. Moreover, since the front end portions 70c and 70d of both the bent portions 7c and 7d and the wiring electrode 13 are exposed, the heat dissipation characteristics can be improved by bonding to the mother substrate.
 (屈曲部の変形例)
 上記した実施形態では、両屈曲部7c、7dは、それぞれの先端部分70c、70dがさらに屈曲されて、配線基板2の上面2aに平行な方向から見たときに、L字状に形成され、その先端部分70c、70dが配線基板2の下面2bにおいて接触することでインダクタ電極6が形成されているが、図16(a)に示すように、両屈曲部7c、7dが配線基板2の上面2aに平行な方向から見たときに、直線状(I字状)に形成されていてもよい。この場合、両屈曲部7c、7dが配線基板2の内部を通り、配線電極13に接触することでインダクタ電極6が形成される。この場合、上記した実施形態の場合よりも配線基板2の実装面積を大きくすることができるため、より多くの部品を実装することが可能である。なお、図16(b)に示すように、配線電極13は配線基板2の内部に設けられていてもよい。
(Modified example of bent part)
In the above-described embodiment, both the bent portions 7c and 7d are formed in an L shape when viewed from a direction parallel to the upper surface 2a of the wiring board 2 by further bending the respective tip portions 70c and 70d. The inductor electrode 6 is formed by the tip portions 70c and 70d coming into contact with the lower surface 2b of the wiring board 2, but both bent portions 7c and 7d are formed on the upper surface of the wiring board 2 as shown in FIG. When viewed from a direction parallel to 2a, it may be linear (I-shaped). In this case, both the bent portions 7c and 7d pass through the inside of the wiring board 2 and come into contact with the wiring electrode 13, whereby the inductor electrode 6 is formed. In this case, since the mounting area of the wiring board 2 can be made larger than in the case of the above-described embodiment, more components can be mounted. Note that the wiring electrode 13 may be provided inside the wiring board 2 as shown in FIG.
 <第7実施形態>
 本発明の第7実施形態にかかるインダクタ部品について、図17を参照して説明する。なお、図17はインダクタ部品を配線基板の主面と平行な方向から見たときの図であって、内部構造がわかるように樹脂層の一部を図示省略している。
<Seventh embodiment>
An inductor component according to a seventh embodiment of the present invention will be described with reference to FIG. FIG. 17 is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen.
 この実施形態のインダクタ部品1gが、図1を参照して説明した第1実施形態のインダクタ部品1aと異なるところは、図17に示すように、両配線板8g、8hと配線基板2に設けられた配線電極13とビア導体14a、14bとでインダクタ電極が構成されていることである。その他の構成は、第1実施形態のインダクタ部品1aと同じであるため、同一符号を付すことにより説明を省略する。 The inductor component 1g of this embodiment differs from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that both wiring boards 8g and 8h and the wiring board 2 are provided as shown in FIG. The wiring electrode 13 and the via conductors 14a and 14b constitute an inductor electrode. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.
 この場合、インダクタ電極6は、両配線板8g、8hと配線基板2の内部に設けられた配線電極13とがビア導体14a、14bを介して電気的に接続されることにより形成される。すなわち、配線基板2の上面2aにおいて、第1屈曲部7cの先端部分70cと配線電極13の一端がビア導体14a(本発明の「第1ビア導体」に相当する)により接続され、第2屈曲部7dの先端部分70dと配線電極13の他端がビア導体14b(本発明の「第2ビア導体」に相当する)により接続されることで、両配線板8g、8hと配線電極13が電気的に接続されて、インダクタ電極6が形成される。 In this case, the inductor electrode 6 is formed by electrically connecting both the wiring boards 8g and 8h and the wiring electrode 13 provided inside the wiring board 2 via the via conductors 14a and 14b. That is, on the upper surface 2 a of the wiring board 2, the tip end portion 70 c of the first bent portion 7 c and one end of the wiring electrode 13 are connected by the via conductor 14 a (corresponding to the “first via conductor” of the present invention), and the second bent portion The front end portion 70d of the portion 7d and the other end of the wiring electrode 13 are connected by a via conductor 14b (corresponding to the “second via conductor” of the present invention), so that both the wiring boards 8g and 8h and the wiring electrode 13 are electrically connected. Are connected to each other to form the inductor electrode 6.
 この構成によると、両配線板8g、8hと配線電極13とを、ビア導体14a、14bを介して電気的に接続することにより容易にインダクタ電極6を形成することができる。このとき、コイル径の大きなインダクタ電極6を形成することができるため、インダクタ部品1gの特性(例えば、インダクタンス値)を向上することができる。 According to this configuration, the inductor electrode 6 can be easily formed by electrically connecting the wiring boards 8g and 8h and the wiring electrode 13 via the via conductors 14a and 14b. At this time, since the inductor electrode 6 having a large coil diameter can be formed, the characteristics (for example, inductance value) of the inductor component 1g can be improved.
 <第8実施形態>
 本発明の第8実施形態にかかるインダクタ部品について、図18を参照して説明する。なお、図18(a)はインダクタ部品を配線基板の主面と平行な方向から見たときの図であって、内部構造がわかるように樹脂層の一部を図示省略している。また、図18(b)はインダクタ部品の下面の平面図である。
<Eighth Embodiment>
An inductor component according to an eighth embodiment of the present invention will be described with reference to FIG. FIG. 18A is a view of the inductor component viewed from a direction parallel to the main surface of the wiring board, and a part of the resin layer is not shown so that the internal structure can be seen. FIG. 18B is a plan view of the lower surface of the inductor component.
 この実施形態のインダクタ部品1hが、図1を参照して説明した第1実施形態のインダクタ部品1aと異なるところは、図18に示すように、両配線板8g、8hとそれぞれの一部である両屈曲部7c、7dだけでインダクタ電極が形成されていることである。その他の構成は、第1実施形態のインダクタ部品1aと同じであるため、同一符号を付すことにより説明を省略する。 The inductor component 1h of this embodiment is different from the inductor component 1a of the first embodiment described with reference to FIG. 1 in that both wiring boards 8g and 8h are part of each, as shown in FIG. That is, the inductor electrode is formed only by the two bent portions 7c and 7d. Since other configurations are the same as those of the inductor component 1a of the first embodiment, the description thereof is omitted by giving the same reference numerals.
 この場合、インダクタ電極6は、両屈曲部7c、7dが配線板8g、8hのそれぞれの一部を、配線基板2の上面2aに平行な方向から見たときに、L字状に屈曲されて形成されており、両屈曲部7c、7dのそれぞれの先端部分70c、70dどうしが突き合わされた状態で接触されて電気的に接続されることにより、インダクタ電極6が形成される。 In this case, the inductor electrode 6 is bent in an L shape when both bent portions 7c and 7d are viewed from a direction parallel to the upper surface 2a of the wiring board 2 when a part of each of the wiring boards 8g and 8h is viewed. The inductor electrode 6 is formed by being formed and contacted and electrically connected in a state where the tip portions 70c and 70d of the bent portions 7c and 7d face each other.
 この構成によると、両配線板8g、8hだけでインダクタ電極6を形成することができる。 According to this configuration, the inductor electrode 6 can be formed only by the both wiring boards 8g and 8h.
 なお、本発明は上記した各実施形態に限定されるものではなく、その趣旨を逸脱しない限りにおいて、上記したもの以外に種々の変更を行なうことが可能である。例えば、上記した各実施形態では、インダクタ電極6がコイルを形成する場合について説明したが、インダクタ素子として使用されるものであればよい。また、コイルコア5がない構成であってもよい。 The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit of the invention. For example, in each of the above-described embodiments, the case where the inductor electrode 6 forms a coil has been described, but it may be used as long as it is used as an inductor element. Moreover, the structure without the coil core 5 may be sufficient.
 また、インダクタ電極6の巻数は適宜変更することができる。この場合、巻数に応じて金属ピンおよび配線板の数を変更するとよい。 Further, the number of turns of the inductor electrode 6 can be changed as appropriate. In this case, the number of metal pins and wiring boards may be changed according to the number of turns.
 また、接続部位7a、7bの形状は、上記した形状の以外に、例えば、切り起こしリブ、円環状リブ等の形状であっても構わない。 Further, the shape of the connection portions 7a and 7b may be, for example, a shape such as a cut-and-raised rib or an annular rib other than the above-described shape.
 本発明は、インダクタ電極が樹脂層とインダクタ電極を備える種々のインダクタ部品に広く適用することができる。 The present invention can be widely applied to various inductor components in which the inductor electrode includes a resin layer and an inductor electrode.
 1a~1g  インダクタ部品
 2  配線基板
 3  樹脂層
 4  部品
 5  コイルコア
 5a  環状部
 5b  棒状部
 6  インダクタ部品
 7a、7b  接続部位(第1接続部位、第2接続部位)
 7c、7d  屈曲部(第1屈曲部、第2屈曲部)
 8a、8b  上側配線板(第1金属板、第3金属板)
 8c  下側配線板(第2金属板)
 8g、8h  配線板(第1金属板、第2金属板)
 9a、9b  金属ピン
 13  配線電極
 14a、14b  ビア導体(第1ビア導体、第2ビア導体)
DESCRIPTION OF SYMBOLS 1a-1g Inductor components 2 Wiring board 3 Resin layer 4 Components 5 Coil core 5a Annular part 5b Bar-shaped part 6 Inductor parts 7a, 7b Connection part (1st connection part, 2nd connection part)
7c, 7d bent portion (first bent portion, second bent portion)
8a, 8b Upper wiring board (first metal plate, third metal plate)
8c Lower wiring board (second metal plate)
8g, 8h Wiring board (first metal plate, second metal plate)
9a, 9b Metal pin 13 Wiring electrode 14a, 14b Via conductor (first via conductor, second via conductor)

Claims (15)

  1.  主面を有する樹脂層と、
     インダクタ電極とを備え、
     前記インダクタ電極は、
     前記樹脂層の内部に配置された第1金属板と、
     前記樹脂層の前記主面に垂直な方向から見たときに、前記第1金属板と重なる部分を有する第2金属板とを有し、
     前記第1金属板および前記第2金属板の前記重なる部分において、前記両金属板のうち一方の金属板の一部により形成されて、他方の金属板に接続される第1接続部位を有する
     ことを特徴とするインダクタ部品。
    A resin layer having a main surface;
    An inductor electrode,
    The inductor electrode is
    A first metal plate disposed inside the resin layer;
    A second metal plate having a portion overlapping with the first metal plate when viewed from a direction perpendicular to the main surface of the resin layer;
    The overlapping portion of the first metal plate and the second metal plate has a first connection part that is formed by a part of one of the two metal plates and connected to the other metal plate. Inductor parts characterized by
  2.  前記第1接続部位は、前記樹脂層の前記主面と平行な方向から見たときに、前記一方の金属板の端部をL字状に屈曲したものであることを特徴とする請求項1に記載のインダクタ部品。 2. The first connection portion is obtained by bending an end portion of the one metal plate into an L shape when viewed from a direction parallel to the main surface of the resin layer. Inductor components as described in 1.
  3.  前記第1接続部位は、前記一方の金属板の前記一部を前記他方の金属板に向かって凹状の断面形状で屈曲したものであることを特徴とする請求項1に記載のインダクタ部品。 2. The inductor component according to claim 1, wherein the first connection part is formed by bending the part of the one metal plate with a concave cross-sectional shape toward the other metal plate.
  4.  前記第1接続部位は、前記一方の金属板の前記一部を前記他方の金属板に向かって厚くしたものであることを特徴とする請求項1に記載のインダクタ部品。 2. The inductor component according to claim 1, wherein the first connection part is formed by thickening the part of the one metal plate toward the other metal plate.
  5.  前記第1接続部位は、前記一方の金属板の前記一部を凹陥したものであることを特徴とする請求項1に記載のインダクタ部品。 2. The inductor component according to claim 1, wherein the first connection portion is a recess of the part of the one metal plate.
  6.  一方主面が前記樹脂層の前記主面に当接する配線基板と、
     前記配線基板の前記一方主面に実装されて前記樹脂層に封止される部品とをさらに備え、
     前記インダクタ電極は、
     前記樹脂層の内部に配設され、一端が前記第1金属板および前記第2金属板のうち一方の金属板に接続され、他端が前記樹脂層の前記主面に露出して前記配線基板に接続される金属ピンをさらに有することを特徴とする請求項1ないし5のいずれかに記載のインダクタ部品。
    On the other hand, a wiring board whose main surface is in contact with the main surface of the resin layer;
    A component mounted on the one main surface of the wiring board and sealed with the resin layer;
    The inductor electrode is
    The wiring board is disposed inside the resin layer, one end is connected to one of the first metal plate and the second metal plate, and the other end is exposed on the main surface of the resin layer. The inductor component according to claim 1, further comprising a metal pin connected to.
  7.  前記インダクタ電極は、
     前記樹脂層の主面に垂直な方向で前記第1金属板と略同じ位置に配置され、前記重なる部分とは異なる箇所で前記第2金属板と重なる部分を有する第3金属板をさらに有し、
     前記第2金属板および前記第3金属板の前記重なる部分において、前記第2金属板および第3金属板のうち一方の金属板の一部により形成されて、他方の金属板に接触する第2接続部位を有することにより、前記インダクタ電極が、前記樹脂層の前記主面と略平行な方向に巻回軸を有するコイルを成すことを特徴とする請求項1ないし6のいずれかに記載のインダクタ部品。
    The inductor electrode is
    A third metal plate further disposed at substantially the same position as the first metal plate in a direction perpendicular to the main surface of the resin layer, and having a portion overlapping the second metal plate at a location different from the overlapping portion; ,
    The second metal plate is formed by a part of one of the second metal plate and the third metal plate in the overlapping portion of the second metal plate and the third metal plate, and is in contact with the other metal plate. 7. The inductor according to claim 1, wherein the inductor electrode forms a coil having a winding axis in a direction substantially parallel to the main surface of the resin layer. parts.
  8.  前記第1金属板および前記第2金属板の少なくとも一方は、前記樹脂層の前記一方主面に垂直な方向から見たときに、端縁の一部が前記樹脂層の周縁に達するように形成されていることを特徴とする請求項1ないし7のいずれかに記載のインダクタ部品。 At least one of the first metal plate and the second metal plate is formed such that a part of the edge reaches the periphery of the resin layer when viewed from a direction perpendicular to the one main surface of the resin layer. The inductor component according to claim 1, wherein the inductor component is provided.
  9.  前記第1接続部位と前記第2接続部位との間であって、前記第1金属板と前記第2金属板との間に配置されたコイルコアを有することを特徴とする請求項1ないし8のいずれかに記載のインダクタ部品。 The coil core disposed between the first connection portion and the second connection portion and between the first metal plate and the second metal plate, according to claim 1, further comprising: a coil core disposed between the first metal plate and the second metal plate. The inductor component according to any one of the above.
  10.  前記コイルコアは、前記樹脂層の前記一方主面に対して垂直な方向から見たときに、環状部と、前記環状部の内側領域を2分するように設けられた棒状部とが合成されたような形状を有し、
     前記棒状部は、前記第1接続部位と前記第2接続部位との間に配置されるとともに、前記棒状部の軸方向が前記コイルの前記巻回軸と略平行な方向となるように配置されていることを特徴とする請求項9に記載のインダクタ部品。
    When the coil core is viewed from a direction perpendicular to the one main surface of the resin layer, an annular portion and a rod-like portion provided so as to bisect the inner region of the annular portion are synthesized. Has a shape like
    The rod-shaped portion is disposed between the first connection portion and the second connection portion, and is disposed so that an axial direction of the rod-shaped portion is substantially parallel to the winding axis of the coil. The inductor component according to claim 9, wherein:
  11.  平板枠に支持された状態の第1金属板を加工することにより、前記第1金属板の一方面に接続部位が形成されてなる第1構造体を形成する工程と、
     平板枠に支持された状態の第2金属板の一方面を前記接続部位の先端に接続し、前記第1金属板の前記第2金属板との対向面に金属ピンの一端を接続することにより、前記第1金属板、前記第2金属板および前記金属ピンを有するインダクタ電極が形成されてなる第2構造体を形成する工程と、
     一方主面に部品が実装された配線基板の当該一方主面に、前記金属ピンの他端を接続させることにより、前記配線基板の前記一方主面と前記第2金属板との間に部品が配置されてなる第3構造体を形成する工程と、
     前記第3構造体を樹脂で封止することにより、前記第3構造体と樹脂層とを有する第4構造体を形成する工程と、
     前記第1金属板の前記平板枠と、前記第2金属板の前記平板枠とを除去するように前記第4構造体を加工する工程と
     を備えることを特徴とするインダクタ部品の製造方法。
    Forming a first structure in which a connection part is formed on one surface of the first metal plate by processing the first metal plate supported by the flat frame; and
    By connecting one surface of the second metal plate supported by the flat frame to the tip of the connection portion and connecting one end of the metal pin to the surface of the first metal plate facing the second metal plate. Forming a second structure in which an inductor electrode having the first metal plate, the second metal plate and the metal pin is formed;
    By connecting the other end of the metal pin to the one main surface of the wiring substrate on which the component is mounted on the one main surface, the component is placed between the one main surface of the wiring substrate and the second metal plate. Forming a third structure that is disposed; and
    Forming a fourth structure having the third structure and a resin layer by sealing the third structure with a resin;
    And a step of processing the fourth structure so as to remove the flat plate frame of the first metal plate and the flat plate frame of the second metal plate.
  12.  配線基板と、
     前記配線基板の一方主面に実装された部品と、
     前記配線基板の前記一方主面に積層され、前記部品を被覆する樹脂層と、
     前記樹脂層の内部に配置され、前記配線基板の前記一方主面に垂直な方向から見たときに、前記部品と重なる部分を有するコイルコアと、
     前記コイルコアを巻回するインダクタ電極とを備え、
     前記インダクタ電極は、前記配線基板の前記一方主面に垂直な方向から見たときに、それぞれ少なくとも一部が前記コイルコアと重なるように前記樹脂層に配置された第1金属板および第2金属板を有し、
     前記第1金属板は、その一部が前記配線基板の他方主面に向かって屈曲され前記樹脂層の内部に配設された第1屈曲部を有し、前記第2金属板は、その一部が前記配線基板の他方主面に向かって屈曲され前記樹脂層の内部に配設された第2屈曲部を有し、前記第1屈曲部の先端部分と前記第2屈曲部の先端部分が電気的に接続されていること
    を特徴とするインダクタ部品。
    A wiring board;
    Components mounted on one main surface of the wiring board;
    A resin layer laminated on the one main surface of the wiring board and covering the component;
    A coil core disposed inside the resin layer and having a portion overlapping the component when viewed from a direction perpendicular to the one main surface of the wiring board;
    An inductor electrode for winding the coil core;
    The inductor electrode has a first metal plate and a second metal plate arranged on the resin layer so that at least a part of the inductor electrode overlaps the coil core when viewed from a direction perpendicular to the one main surface of the wiring board. Have
    The first metal plate has a first bent portion that is partially bent toward the other main surface of the wiring board and disposed inside the resin layer, and the second metal plate is A second bent portion that is bent toward the other main surface of the wiring substrate and disposed inside the resin layer, and a tip portion of the first bent portion and a tip portion of the second bent portion are An inductor component characterized by being electrically connected.
  13.  前記第1屈曲部の先端部分と前記第2屈曲部の先端部分とは、前記配線基板に設けられた配線電極を介して接続されていることを特徴とする請求項12に記載のインダクタ部品。 13. The inductor component according to claim 12, wherein a tip portion of the first bent portion and a tip portion of the second bent portion are connected via a wiring electrode provided on the wiring board.
  14.  前記配線電極は、前記配線基板の内部に設けられ、
     前記第1屈曲部の先端部分と当該配線電極の一端とが第1ビア導体により接続され、
     前記第2屈曲部の先端部分と当該配線電極の他端とが第2ビア導体により接続されることを特徴とする請求項13に記載のインダクタ部品。
    The wiring electrode is provided inside the wiring board,
    A tip portion of the first bent portion and one end of the wiring electrode are connected by a first via conductor;
    The inductor component according to claim 13, wherein a tip end portion of the second bent portion and the other end of the wiring electrode are connected by a second via conductor.
  15.  前記第1屈曲部の先端部分と前記第2屈曲部の先端部分とが直接接続されていることを特徴とする請求項12に記載のインダクタ部品。 The inductor component according to claim 12, wherein a tip portion of the first bent portion and a tip portion of the second bent portion are directly connected.
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