JP2004259944A - Method for manufacturing inductance element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for easily manufacturing a small and light inductance element by saving a space without winding a wire or forming a conductive pattern on a printed wiring board. <P>SOLUTION: A lower side lead frame 6 where a plurality of patterns 5 are radially formed is overlapped with an upper side lead frame 7 where a plurality of patterns 15 are radially formed. The pattern 15 bonds one end (one end part 5A) on the center side of the pattern 5 and the other end (bonding part 8) on the outer peripheral side of the other pattern adjacent to the pattern 5. The patterns 5 and 15 form a winding part 1 in a toroidal shape by cutting it near the outer side of the other end of the pattern 5. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a light-weight and simple-to-manufacture method for manufacturing an inductance element that can be mounted on a substrate or the like in a space-saving manner.
[0002]
[Prior art]
Conventionally, as a method of manufacturing this kind of inductance element, a method of winding a wire such as a copper wire with a magnetic material such as ferrite as a core core is known. Such an inductance element takes time and effort to wind a wire around a core, and it is difficult to reduce the size of the element. Therefore, in recent years, as shown in Patent Document 1, for example, an upper wiring layer forming a plurality of conductor patterns, an intermediate layer having a contact portion such as a through hole, and a lower wiring layer forming a plurality of conductor patterns are sequentially arranged. A toroidal coil is formed in a single multilayer substrate by stacking and spirally connecting conductor patterns of an upper wiring layer and a lower wiring layer via a contact portion of an intermediate layer. I have.
[0003]
Further, in Patent Document 2, an arrangement region of a donut-shaped core is provided on the surface of a wiring board, a wiring film as a conductive pattern is formed so as to cross the arrangement region, and both ends of the wiring film protruding from the arrangement region. A toroidal coil is disclosed in which a terminal insertion hole is provided in an upper side, and an upper wiring element made of a jumper wire is connected between the terminal insertion holes so as to straddle the donut-shaped core.
[0004]
[Patent Document 1]
JP-A-2002-289436 (specification paragraph numbers [0033] to [0036], etc.)
[Patent Document 2]
JP-A-8-203762 (paragraph numbers [0012] to [0013] and the like in the specification)
[0005]
[Problems to be solved by the invention]
However, since the work of winding the wire around the circular core as described above is performed manually, it takes a lot of time and labor, and increases the production cost of the inductance element. Further, when an inductance element is manufactured from a multilayer substrate as in Patent Document 1, each printed wiring board must be laminated after forming a conductor pattern on the printed wiring board, and the manufacturing is troublesome. In addition, since a certain thickness is required for the printed wiring board, it is not possible to reduce the size of the inductance element. In the case of a toroidal inductance element, a magnetic pattern corresponding to the core is further formed on the printed wiring board. And the manufacturing process is significantly increased. Also, when a design change occurs, the printed circuit board must be re-created from the printed circuit board, and a quick response cannot be performed.
[0006]
On the other hand, even when an inductance element is manufactured by a combination of a printed wiring board and a jumper wire as in Patent Document 2, a doughnut-shaped core, which is a magnetic material, is formed on a printed wiring board after forming a conductor pattern. It takes time and effort to arrange in a predetermined area and then perform jumper wiring, and the size of the inductance element cannot be reduced due to the use of the printed wiring board. Furthermore, since the conductor pattern is provided on the printed wiring board, there is a problem that when the design is changed, it must be re-created from the board.
[0007]
The present invention has been made in view of the above-described problems, and has as its object to easily produce a space-saving, compact, and lightweight inductance element without winding a wire or forming a conductive pattern on a printed wiring board. An object of the present invention is to provide a method for manufacturing an inductance element.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a method for manufacturing an inductance element according to claim 1 includes a first thin metal member having a plurality of first patterns formed radially and a second thin metal member having a plurality of second patterns formed radially. A sheet metal member is superimposed, and a space between one end on the center side of the first pattern and the other end on the outer peripheral side of another first pattern adjacent to the first pattern is formed by the second pattern. An unnecessary portion of the first and second sheet metal members is cut and joined, and a toroidal winding portion is formed by the first pattern and the second pattern.
[0009]
The toroidal winding thus obtained is formed only by the first pattern and the second pattern formed on the two thin metal members. Therefore, the productivity can be improved and the size and weight of the inductance element can be easily reduced, as compared with a conventional case where a wire is wound or a conductive pattern is formed on a printed wiring board.
[0010]
In the method of manufacturing an inductance element according to claim 2, a core is interposed between the first thin metal member and the second thin metal member, and the first thin metal member and the second thin metal member are connected to each other. Are superimposed.
[0011]
In order to manufacture an inductance element containing a core, when the first sheet metal member and the second sheet metal member are overlapped, it is only necessary to interpose a core core therebetween in advance. Therefore, an inductance element having a core can be easily manufactured.
[0012]
According to a third aspect of the present invention, in the method of manufacturing an inductance element, the first thin metal member and the second thin metal member are lead frames.
[0013]
In order to form the first pattern and the second pattern on these thin metal members, existing lead frame manufacturing techniques can be used. Therefore, no special capital investment is required.
[0014]
According to a fourth aspect of the present invention, there is provided a method of manufacturing an inductance element, wherein a core is disposed on a first thin metal member having a plurality of first patterns formed radially so as to straddle the core. Connecting a first end on the center side of the first pattern and the other end on the outer peripheral side of another first pattern adjacent to the first pattern with a conductive wire, An unnecessary portion of the metal member is cut to form a toroidal winding portion by the first pattern and the wire.
[0015]
The toroidal-shaped winding portion thus obtained is formed only of the first pattern formed on the first sheet metal member and a wire connecting the adjacent patterns. Therefore, the productivity can be improved and the size and weight of the inductance element can be easily reduced, as compared with a conventional case where a wire is wound or a conductive pattern is formed on a printed wiring board. Further, the inductance element having the core can be easily manufactured only by disposing the core in a predetermined position of the first thin metal member in advance.
[0016]
According to a fifth aspect of the present invention, in the method of manufacturing an inductance element, the first thin metal member is a lead frame.
[0017]
In order to form a pattern on a thin metal member, an existing lead frame manufacturing technique can be used. Therefore, no special capital investment is required.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of an inductance element and a method of manufacturing the same according to the present invention will be described with reference to the accompanying drawings. FIG. 1 shows an appearance of an inductance element in a completed state. Reference numeral 1 denotes a winding portion of an inductance element formed in a toroidal shape. As shown in FIGS. 2 and 3, a frame member made of a thin metal plate is used. 9 is formed by vertically joining lead frames 6 and 7 having a predetermined pattern shape formed from 9. Reference numeral 2 denotes a magnetic or dielectric core such as ferrite. Reference numeral 3 denotes a lead portion, which is a connection portion of an inductance element composed of the lower lead frame 6 or the upper lead frame 7 like the winding portion 1, and is used for connection with an external circuit. It is soldered directly to a component mounting pad of a board (not shown) or inserted into a through hole of a printed board and connected by soldering. Note that the winding portion 1 itself may be used as the connection portion without using the lead portion 3.
[0019]
2 and 3 show the frame member 9 before the formation of the winding portion 1. FIG. In the figure, a frame material 9 is made of a strip of a thin metal base material having excellent mechanical strength, electrical conductivity, thermal conductivity and corrosion resistance, such as a Cu-based material or an Fe-based material. The first lower lead frame 6 (FIG. 2) that forms the lower side of the winding part 1 and the second upper lead frame 7 that forms the upper side of the winding part 1 are formed by processing means such as etching, laser, or the like. One or more are formed. Although the manufacturing procedure of the lead frames 6 and 7 is not described in detail here, the manufacturing technology of the lead frame incorporated in a general semiconductor package may be applied as it is.
[0020]
The first lead frame 6 is formed with a plurality of radial patterns 5 which are substantially lower surfaces of the winding portions 1 around the hollow portion 4 from which the frame material 9 is cut. In each pattern 5, one end 5A of the pattern 5 facing the hollow portion 4 is independent, while the other end 5B on the outer peripheral side is connected. One end 5A of the pattern 5 is joined to one end 15A of a pattern 15 in a second lead frame 7 described later, and the other end of the pattern 5 is adjacent to another end of the pattern 15 connected to the one end 5A. The pattern 15 is joined. The joint 8 at the other end of the pattern 5 is indicated by a broken line in FIG.
[0021]
The second lead frame 7 also has a plurality of radial patterns 15 which are substantially upper surfaces of the winding portion 1 centered on the hollow portions 14 from which the frame material 9 has been cut. In each of the patterns 15, one end 15A of the pattern 15 facing the hollow portion 14 is independent, while the other end 15B on the outer peripheral side is connected. Each pattern 15 is formed so as to connect one end 5 </ b> A of one pattern 5 in the first lead frame 6 to a joint 8 of another pattern 5 adjacent to the one pattern 5. The other end of the pattern 15 is joined to the joint 8 at the other end of the pattern 5, and the joint 18 is indicated by a broken line in FIG.
[0022]
In the present embodiment, the pair of lead portions 3 is provided using a part of the pattern 15 formed on the second lead frame 7. Of course, the lead wire 3 can also be formed into a desired shape together with the other patterns 15 by the above-described processing means when the second lead frame 7 is manufactured from the frame material 9. The width from one end 5A to the joint 8 of each pattern 5 and the width from one end 15B to the joint 18 of each pattern 15 are formed to be the same, however, in order to facilitate a soldering operation described later. Preferably, the width of the pattern 5 of the lower lead frame 6 is wider than the width of the pattern 15 of the upper lead frame 7.
[0023]
Next, a preferred method of manufacturing the inductance element according to the present embodiment will be described with reference to FIGS. First, in a lead frame manufacturing process, a frame material 9 which is a thin metal base material is processed by pressing, etching or laser cutting, so that a lower lead frame 6 and an upper lead frame having desired patterns having radial patterns 5 and 15 are formed. 7 is manufactured. A plurality of lower lead frames 6 and upper lead frames 7 are formed on the frame member 9. The lower lead frames 6 and the upper lead frames 7 may be cut individually according to the external shape of the lead frames 6, 7, or may be formed by continuous lead frames 6, 7. It may be used as it is.
[0024]
In the next end joining step, the lower lead frame 6 and the upper lead frame 7 are connected by soldering. When manufacturing the inductance element with the core 2, first, the upper lead frame 7 is cut from the frame material 9 according to the outer shape, and each upper lead frame is cut along the outer shape of the ring-shaped core 2. Each pattern 15 of No. 7 is bent. This is for the purpose of positioning the core 2 and facilitating the positioning of the ends 5A and 15A and the joints 8 and 18. For example, as shown in FIG. 4, when the cross-sectional shape of the core core 2 is square, each pattern 15 of the upper lead frame 7 is bent and formed into a substantially U-shape. On the other hand, if the cross-sectional shape of the core core 2 is round, each pattern 15 of the upper lead frame 7 may be bent and formed into a substantially U shape. When the core 2 has a thin flat plate shape, the bending may be omitted.
[0025]
Next, the core core 2 is placed in the arrangement area between the one end 5A of the pattern 5 and the joint 8 in the lower lead frame 6, and the upper lead frame in which the portion of the pattern 15 is bent so as to enclose the core 2 7 is superimposed. Then, one end 5A of each pattern 5 of the lower lead frame 6 and one end 15A of each pattern 15 of the upper lead frame 7 corresponding thereto are connected by a conductive joining member 10 such as solder. At the same time, the joint 8 of each pattern 5 of the lower lead frame 6 and the joint 18 of each pattern 15 of the upper lead frame 7 corresponding thereto are similarly joined by the joint member 10 (see FIG. 5). In this case, in the present embodiment, the widths of the patterns 5 and 15 are different, and the exposed portions 19 are formed on the upper surfaces of the wide patterns 5 at the end portions 5A and 15A and the joint portions 8 and 18 of the patterns 5 and 15. Therefore, these portions can be reliably connected by the joining member 10 using the exposed portions 19. In addition, since connection of each part here is joining of metals, it can be implemented by welding or caulking.
[0026]
In the last end cutting step, unnecessary lower lead frame 6 and upper lead frame 7 are cut in the vicinity of the outer periphery of joints 8 and 18 in order to obtain desired winding portion 1. Also, the lead wire 3 is cut to a required length. FIG. 6 shows the cut portion 20 by a broken line. In FIG. 6, the core 2 is indicated by a dashed line for convenience.
[0027]
The winding portion 1 of the inductance element obtained as described above is not formed by winding a wire or connecting conductive patterns formed on a printed wiring board by lamination. The lead frames 6 and 7 are extremely thin as compared with a multilayer printed wiring board, so that the size and weight of the inductance element can be reduced.
[0028]
In the end joining step, the ends 5A and 15A of the patterns 5 and 15 and the joining portions 8 and 18 are joined without interposing the core 2 between the lead frames 6 and 7, and finally empty. A core inductance element may be manufactured. Also in this case, in order to secure a necessary air core area, it is preferable to bend one of the lead frames 6 and 7.
[0029]
Furthermore, the lead frames 6 and 7 may be manufactured by bonding an insulating material to the back surface of the frame member 9 in advance so that the upper part and the lower part of the winding part 1 do not directly contact the core 2. .
[0030]
The completed inductance element is mounted on the board by, for example, directly soldering the lead portion 3 to a component mounting pad on the board or inserting it into a through hole and soldering. Alternatively, the inductance element can be directly mounted on a lead frame and used as an inductance body.
[0031]
As described above, in the present embodiment, the lower lead frame 6 as the first thin metal member in which the plurality of first patterns 5 are formed radially and the plurality of second patterns 15 are formed radially. The upper lead frame 7 as the formed second thin metal member is overlapped, and one end (one end 5A) on the center side of the pattern 5 and the other on the outer peripheral side of another pattern 5 adjacent to the pattern 5 The end (joining portion 8) is joined by a pattern 15 and cut near the outside of the other end of the pattern 5 to form the toroidal winding 1 by the patterns 5 and 15.
[0032]
The toroidal winding part 1 obtained in this way is constituted only by the patterns 5 and 15 formed on the lead frames 6 and 7 which are two thin metal members. Therefore, the productivity can be improved and the size and weight of the inductance element can be easily reduced, as compared with a conventional case where a wire is wound or a conductive pattern is formed on a printed wiring board.
[0033]
In the present embodiment, the core 2 is interposed between the lead frames 6 and 7 in the manufacturing process of stacking the lead frames 6 and 7.
[0034]
In order to manufacture an inductance element containing the core 2, it is only necessary to interpose the core 2 beforehand when the lead frames 6, 7 are overlapped. Therefore, an inductance element having the core 2 can be easily manufactured.
[0035]
Further, in this embodiment, the first thin metal member and the second thin metal member are lead frames 6 and 7. That is, in order to form the patterns 5 and 15, an existing lead frame manufacturing technique can be used. Therefore, there is an advantage that no special capital investment is required.
[0036]
Next, a second embodiment of the present invention will be described with reference to FIGS. The same portions as those in the first embodiment are denoted by the same reference numerals, and the description of the common portions will be omitted because they are duplicated.
[0037]
FIG. 7 shows a completed state of the inductance element in the present embodiment. In this figure, in the present embodiment, instead of the upper lead frame 7 of the first embodiment, a conductive portion is provided between one end 5A of the adjacent patterns 5, 5 formed from the lower lead frame 6 and the joint portion 8. Are connected by wire bonding.
[0038]
As shown in FIG. 8, the lower lead frame 6 is first manufactured by using the same lead frame manufacturing technique as in the first embodiment, and then, in the next end joining step, the lower lead frame 6 is manufactured. The core core 2 is placed and fixed at the center of the frame 6 using a fixing means 11 such as an adhesive, and one end 5A of one pattern 5 and another adjacent pattern 5 are arranged so as to straddle the core 2. Are sequentially joined by the wire 12.
[0039]
The wire bonding for connecting the wire 12 is automatically performed by a machine using a technique used for wiring a chip inside a semiconductor such as an IC and a lead frame to an inner frame. By performing this wire bonding, the labor for manufacturing the upper lead frame 7 and the labor for joining with the lower lead frame 6 can be saved, and the weight can be further reduced. In addition, since wire bonding itself can be automatically performed by a machine, it is possible to manufacture an extremely small inductance element.
[0040]
Then, in the last end cutting step, unnecessary lower lead frame 6 is cut in the vicinity of the outer periphery of joint 8 to obtain the inductance element shown in FIG.
[0041]
In the example shown in FIG. 8, the core core 2 is disposed at the center of the lower lead frame 6 in a plate shape, and the wire bonding by the wire 12 is performed. However, as shown in FIG. 6 is cut out from the frame material 9 and bent along the outer shape of the core core 2 so that one end 5A of each pattern 5 and the joining portion 8 are substantially at the same height as the upper surface of the core core 2 to perform wire bonding. It becomes easier to carry out, and the production efficiency increases.
[0042]
As described above, in the present embodiment, the core core 2 is disposed on the lower lead frame 6 as the first thin metal member in which the plurality of patterns 5 as the first patterns are formed radially, and the core core 2 is straddled. As described above, a conductive wire 12 is connected between one end on the center side of the pattern 5 (one end portion 5A) and the other end (joining portion 8) on the outer peripheral side of another pattern 5 adjacent to the pattern 5. Then, unnecessary portions of the lower lead frame 6 are cut, and the toroidal winding portion 1 is formed by the pattern 5 and the wire 12 to manufacture an inductance element.
[0043]
The toroidal-shaped winding portion 1 obtained in this manner is formed only by the pattern 5 formed on the lower lead frame 6 and the wire 12 connecting the adjacent pattern 5. Therefore, the productivity can be improved and the size and weight of the inductance element can be easily reduced, as compared with a conventional case where a wire is wound or a conductive pattern is formed on a printed wiring board. Further, the inductance element having the core 2 can be easily manufactured only by disposing the core 2 in a predetermined position of the lower lead frame 6 in advance.
[0044]
Further, the present embodiment is characterized in that the lower lead frame 6 is a lead frame. That is, the existing lead frame manufacturing technology can be used to form the pattern 5. Therefore, there is an advantage that no special capital investment is required.
[0045]
It should be noted that the present invention is not limited to the above embodiment, and can be appropriately changed within the scope of the present invention. By changing the width and number of radiation patterns formed on a thin metal plate, various inductance elements can be manufactured.
[0046]
【The invention's effect】
According to the first aspect of the present invention, it is possible to easily manufacture a space-saving, small and lightweight inductance element without winding a wire or forming a conductive pattern on a printed wiring board.
[0047]
According to the second aspect of the present invention, when the first sheet metal member and the second sheet metal member are overlapped, the inductance element having the core is easily manufactured simply by interposing the core beforehand. it can.
[0048]
According to the third aspect of the present invention, the first pattern and the second pattern serving as the winding portion can be easily manufactured by the existing lead frame technology.
[0049]
According to the fourth aspect of the invention, it is possible to easily manufacture a space-saving, compact and lightweight inductance element without winding a wire or forming a conductive pattern on a printed wiring board. Further, the inductance element having the core can be easily manufactured simply by disposing the core in the determined position of the first thin metal member.
[0050]
According to the fifth aspect of the present invention, the first pattern serving as the winding portion can be easily manufactured by the existing lead frame technology.
[Brief description of the drawings]
FIG. 1 is a perspective view of a completed state of an inductance element according to a first embodiment of the present invention.
FIG. 2 is a plan view showing a state in which a lower lead frame is formed on a frame material.
FIG. 3 is a plan view showing a state in which an upper lead frame is formed on a frame material;
FIG. 4 is a cross-sectional view of a main part before soldering connection in a state where the upper lead frame is overlapped with the above.
FIG. 5 is a plan view of a main part immediately after the soldering connection.
FIG. 6 is a plan view immediately after the end cutting step is completed.
FIG. 7 is a perspective view showing a completed state of an inductance element according to a second embodiment of the present invention.
FIG. 8 is a sectional view of a main part immediately after connection by wire bonding according to the first embodiment;
FIG. 9 is a cross-sectional view of a main part immediately after connection by wire bonding showing another modified example of the embodiment.
[Explanation of symbols]
1 winding part 2 core core 5 pattern (first pattern)
6. Lower lead frame (first thin metal member)
7. Upper lead frame (second thin metal member)
12 wires 15 patterns (second pattern)

Claims (5)

A first sheet metal member having a plurality of first patterns formed radially and a second sheet metal member having a plurality of second patterns formed radially;
The second pattern is joined between one end on the center side of the first pattern and the other end on the outer peripheral side of another first pattern adjacent to the first pattern, respectively,
An indunk wherein an unnecessary portion of the first sheet metal member and the second sheet metal member is cut to form a toroidal winding portion by the first pattern and the second pattern. A method for manufacturing a closet element. 2. The first thin metal member and the second thin metal member are overlapped with a core interposed between the first thin metal member and the second thin metal member. A manufacturing method of the inductance element according to the above. 3. The method according to claim 1, wherein the first thin metal member and the second thin metal member are lead frames. A core is disposed on a first sheet metal member having a plurality of first patterns formed radially,
A conductive wire is connected between one end on the center side of the first pattern and the other end on the outer peripheral side of another first pattern adjacent to the first pattern so as to straddle the core. And
An unnecessary part of the first sheet metal member is cut, and a toroidal winding is formed by the first pattern and the wire. The method according to claim 4, wherein the first thin metal member is a lead frame.

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