JP4323930B2 - 薬液処理方法 - Google Patents

薬液処理方法 Download PDF

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Publication number
JP4323930B2
JP4323930B2 JP2003387880A JP2003387880A JP4323930B2 JP 4323930 B2 JP4323930 B2 JP 4323930B2 JP 2003387880 A JP2003387880 A JP 2003387880A JP 2003387880 A JP2003387880 A JP 2003387880A JP 4323930 B2 JP4323930 B2 JP 4323930B2
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Japan
Prior art keywords
chemical
cell
solution
substrate
silicon wafer
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Expired - Fee Related
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JP2003387880A
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English (en)
Japanese (ja)
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JP2005150512A (ja
JP2005150512A5 (enExample
Inventor
慶明 泊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2003387880A priority Critical patent/JP4323930B2/ja
Priority to TW092135430A priority patent/TWI229367B/zh
Priority to US10/737,766 priority patent/US20040129384A1/en
Priority to KR1020030097228A priority patent/KR100553422B1/ko
Publication of JP2005150512A publication Critical patent/JP2005150512A/ja
Publication of JP2005150512A5 publication Critical patent/JP2005150512A5/ja
Priority to US12/239,191 priority patent/US8075791B2/en
Application granted granted Critical
Publication of JP4323930B2 publication Critical patent/JP4323930B2/ja
Priority to US13/231,734 priority patent/US9017567B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)
JP2003387880A 2002-12-26 2003-11-18 薬液処理方法 Expired - Fee Related JP4323930B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003387880A JP4323930B2 (ja) 2003-11-18 2003-11-18 薬液処理方法
TW092135430A TWI229367B (en) 2002-12-26 2003-12-15 Chemical treatment apparatus and chemical treatment method
US10/737,766 US20040129384A1 (en) 2002-12-26 2003-12-18 Chemical treatment apparatus and chemical treatment method
KR1020030097228A KR100553422B1 (ko) 2002-12-26 2003-12-26 약액처리장치 및 약액처리방법
US12/239,191 US8075791B2 (en) 2002-12-26 2008-09-26 Chemical treatment method
US13/231,734 US9017567B2 (en) 2002-12-26 2011-09-13 Chemical treatment method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003387880A JP4323930B2 (ja) 2003-11-18 2003-11-18 薬液処理方法

Publications (3)

Publication Number Publication Date
JP2005150512A JP2005150512A (ja) 2005-06-09
JP2005150512A5 JP2005150512A5 (enExample) 2007-01-11
JP4323930B2 true JP4323930B2 (ja) 2009-09-02

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ID=34695111

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003387880A Expired - Fee Related JP4323930B2 (ja) 2002-12-26 2003-11-18 薬液処理方法

Country Status (1)

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JP (1) JP4323930B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100882910B1 (ko) 2007-07-19 2009-02-10 삼성모바일디스플레이주식회사 식각장치
KR102505435B1 (ko) * 2016-03-17 2023-03-03 삼성전기주식회사 도금장치
WO2022254485A1 (ja) * 2021-05-31 2022-12-08 株式会社荏原製作所 プリウェットモジュール、およびプリウェット方法
JP6990346B1 (ja) * 2021-05-31 2022-01-13 株式会社荏原製作所 プリウェットモジュール、およびプリウェット方法
TWI769848B (zh) * 2021-06-04 2022-07-01 日商荏原製作所股份有限公司 鍍覆裝置之預濕模組及鍍覆處理之預濕方法

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JP2005150512A (ja) 2005-06-09

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