JP4311809B2 - 半導体基板の乾燥装置および半導体基板の乾燥方法 - Google Patents

半導体基板の乾燥装置および半導体基板の乾燥方法 Download PDF

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Publication number
JP4311809B2
JP4311809B2 JP10843699A JP10843699A JP4311809B2 JP 4311809 B2 JP4311809 B2 JP 4311809B2 JP 10843699 A JP10843699 A JP 10843699A JP 10843699 A JP10843699 A JP 10843699A JP 4311809 B2 JP4311809 B2 JP 4311809B2
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Japan
Prior art keywords
semiconductor substrate
drying
nozzle
center
semiconductor wafer
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Expired - Fee Related
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JP10843699A
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English (en)
Japanese (ja)
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JP2000031107A5 (enExample
JP2000031107A (ja
Inventor
和己 浅田
勇人 岩元
輝臣 南
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Tokyo Electron Ltd
Sony Corp
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Tokyo Electron Ltd
Sony Corp
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Priority to JP10843699A priority Critical patent/JP4311809B2/ja
Publication of JP2000031107A publication Critical patent/JP2000031107A/ja
Publication of JP2000031107A5 publication Critical patent/JP2000031107A5/ja
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Publication of JP4311809B2 publication Critical patent/JP4311809B2/ja
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  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP10843699A 1998-05-07 1999-04-15 半導体基板の乾燥装置および半導体基板の乾燥方法 Expired - Fee Related JP4311809B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10843699A JP4311809B2 (ja) 1998-05-07 1999-04-15 半導体基板の乾燥装置および半導体基板の乾燥方法

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP12493598 1998-05-07
JP10-124933 1998-05-07
JP10-124935 1998-05-07
JP12493398 1998-05-07
JP12493498 1998-05-07
JP10-124934 1998-05-07
JP10843699A JP4311809B2 (ja) 1998-05-07 1999-04-15 半導体基板の乾燥装置および半導体基板の乾燥方法

Publications (3)

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JP2000031107A JP2000031107A (ja) 2000-01-28
JP2000031107A5 JP2000031107A5 (enExample) 2006-03-30
JP4311809B2 true JP4311809B2 (ja) 2009-08-12

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JP10843699A Expired - Fee Related JP4311809B2 (ja) 1998-05-07 1999-04-15 半導体基板の乾燥装置および半導体基板の乾燥方法

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4931042B2 (ja) * 2006-04-10 2012-05-16 株式会社ジェイ・イー・ティ 基板処理装置
JP2012039163A (ja) * 2011-11-24 2012-02-23 Jet Co Ltd 基板処理装置
CN114562874B (zh) * 2022-03-02 2023-07-04 浙江光特科技有限公司 一种用于晶圆清洗后烘干处理装置
CN114914176A (zh) * 2022-05-07 2022-08-16 北京北方华创微电子装备有限公司 晶圆干燥方法以及半导体干燥设备
CN116544144B (zh) * 2023-05-16 2023-10-27 江苏亚电科技有限公司 具有喷气功能的晶圆清洗干燥升降机构

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