JP4304713B2 - 光導波路デバイスの製造方法 - Google Patents

光導波路デバイスの製造方法 Download PDF

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Publication number
JP4304713B2
JP4304713B2 JP2000208578A JP2000208578A JP4304713B2 JP 4304713 B2 JP4304713 B2 JP 4304713B2 JP 2000208578 A JP2000208578 A JP 2000208578A JP 2000208578 A JP2000208578 A JP 2000208578A JP 4304713 B2 JP4304713 B2 JP 4304713B2
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Japan
Prior art keywords
optical waveguide
substrate
manufacturing
waveguide device
reference mark
Prior art date
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Expired - Fee Related
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JP2000208578A
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English (en)
Japanese (ja)
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JP2002022414A5 (enExample
JP2002022414A (ja
Inventor
敏裕 黒田
宏 増田
信生 宮寺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2000208578A priority Critical patent/JP4304713B2/ja
Publication of JP2002022414A publication Critical patent/JP2002022414A/ja
Publication of JP2002022414A5 publication Critical patent/JP2002022414A5/ja
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Publication of JP4304713B2 publication Critical patent/JP4304713B2/ja
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  • Length Measuring Devices By Optical Means (AREA)
  • Optical Integrated Circuits (AREA)
JP2000208578A 2000-07-10 2000-07-10 光導波路デバイスの製造方法 Expired - Fee Related JP4304713B2 (ja)

Priority Applications (1)

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JP2000208578A JP4304713B2 (ja) 2000-07-10 2000-07-10 光導波路デバイスの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000208578A JP4304713B2 (ja) 2000-07-10 2000-07-10 光導波路デバイスの製造方法

Publications (3)

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JP2002022414A JP2002022414A (ja) 2002-01-23
JP2002022414A5 JP2002022414A5 (enExample) 2007-03-08
JP4304713B2 true JP4304713B2 (ja) 2009-07-29

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JP2000208578A Expired - Fee Related JP4304713B2 (ja) 2000-07-10 2000-07-10 光導波路デバイスの製造方法

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JP (1) JP4304713B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004014048B4 (de) * 2004-03-19 2008-10-30 Sirona Dental Systems Gmbh Vermessungseinrichtung und Verfahren nach dem Grundprinzip der konfokalen Mikroskopie
DE102005023351A1 (de) * 2005-05-17 2006-11-30 Micro-Epsilon Messtechnik Gmbh & Co Kg Vorrichtung und Verfahren zum Vermessen von Oberflächen
JP4774246B2 (ja) * 2005-07-19 2011-09-14 ショット アクチエンゲゼルシャフト 光分散を用いた熱ガラス体厚の無接触光学測定方法及び装置
JP4888807B2 (ja) * 2006-07-26 2012-02-29 オプトウエア株式会社 走査型形状計測機
JP4962134B2 (ja) * 2007-05-17 2012-06-27 オムロン株式会社 計測装置
DE102008017481B4 (de) * 2008-04-03 2013-10-24 Sirona Dental Systems Gmbh Vorrichtung und Verfahren zur optischen 3D-Vermessung und zur Farbmessung
JP5790178B2 (ja) * 2011-03-14 2015-10-07 オムロン株式会社 共焦点計測装置
JP2014219536A (ja) * 2013-05-08 2014-11-20 日立化成株式会社 光導波路
JP6420600B2 (ja) * 2014-09-02 2018-11-07 株式会社ミツトヨ 光学観察装置及び光学観察方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06232228A (ja) * 1993-02-02 1994-08-19 Fujitsu Ltd 段差パターンの位置ずれ検査方法とそのための装置
JP3208555B2 (ja) * 1994-10-11 2001-09-17 日立電線株式会社 ハイブリッド光集積回路の製造方法
JPH109827A (ja) * 1996-06-24 1998-01-16 Omron Corp 高さ判別装置および方法
JPH11133309A (ja) * 1997-10-29 1999-05-21 Nippon Telegr & Teleph Corp <Ntt> 顕微鏡装置、寸法測定方法及びその装置
JPH11337775A (ja) * 1998-05-27 1999-12-10 Oki Electric Ind Co Ltd 実装基板，実装基板の製造方法，及び光モジュールの製造方法

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JP2002022414A (ja) 2002-01-23

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