JP4302279B2 - 固体撮像装置及びその製造方法 - Google Patents

固体撮像装置及びその製造方法 Download PDF

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Publication number
JP4302279B2
JP4302279B2 JP2000054551A JP2000054551A JP4302279B2 JP 4302279 B2 JP4302279 B2 JP 4302279B2 JP 2000054551 A JP2000054551 A JP 2000054551A JP 2000054551 A JP2000054551 A JP 2000054551A JP 4302279 B2 JP4302279 B2 JP 4302279B2
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Japan
Prior art keywords
solid
imaging device
state imaging
adhesive
state
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Expired - Lifetime
Application number
JP2000054551A
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English (en)
Japanese (ja)
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JP2001244280A5 (enExample
JP2001244280A (ja
Inventor
英治 渡辺
丈嗣 西田
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Fujifilm Corp
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Fujifilm Corp
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Publication date
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Priority to JP2000054551A priority Critical patent/JP4302279B2/ja
Priority to US09/781,217 priority patent/US6664125B2/en
Publication of JP2001244280A publication Critical patent/JP2001244280A/ja
Publication of JP2001244280A5 publication Critical patent/JP2001244280A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Die Bonding (AREA)
JP2000054551A 2000-02-29 2000-02-29 固体撮像装置及びその製造方法 Expired - Lifetime JP4302279B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2000054551A JP4302279B2 (ja) 2000-02-29 2000-02-29 固体撮像装置及びその製造方法
US09/781,217 US6664125B2 (en) 2000-02-29 2001-02-13 Solid-state image pickup device and a method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000054551A JP4302279B2 (ja) 2000-02-29 2000-02-29 固体撮像装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2001244280A JP2001244280A (ja) 2001-09-07
JP2001244280A5 JP2001244280A5 (enExample) 2008-05-15
JP4302279B2 true JP4302279B2 (ja) 2009-07-22

Family

ID=18575790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000054551A Expired - Lifetime JP4302279B2 (ja) 2000-02-29 2000-02-29 固体撮像装置及びその製造方法

Country Status (2)

Country Link
US (1) US6664125B2 (enExample)
JP (1) JP4302279B2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004327559A (ja) * 2003-04-22 2004-11-18 Matsushita Electric Ind Co Ltd 電子部品固着剤
JP3993862B2 (ja) * 2003-10-10 2007-10-17 松下電器産業株式会社 光学デバイスおよびその製造方法
JP3838573B2 (ja) 2003-10-23 2006-10-25 松下電器産業株式会社 固体撮像装置
US20050260789A1 (en) * 2004-05-21 2005-11-24 Texas Instruments Incorporated Method and system for applying an adhesive substance on an electronic device
KR100712509B1 (ko) 2004-06-10 2007-04-30 삼성전자주식회사 이미지 센서 패키지 조립 방법 및 이에 의해 조립된 패키지구조
DE102004037610B3 (de) * 2004-08-03 2006-03-16 Infineon Technologies Ag Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung
JP2007208045A (ja) * 2006-02-02 2007-08-16 Sony Corp 撮像装置、カメラモジュール、電子機器および撮像装置の製造方法
JP2007294793A (ja) * 2006-04-27 2007-11-08 Fujifilm Corp イメージセンサチップの固定方法
US7894924B2 (en) * 2006-11-09 2011-02-22 Matthews Resources, Inc. System and method for internet based automated memorial design and manufacturing
JP2008181951A (ja) * 2007-01-23 2008-08-07 Nec Electronics Corp 固体撮像装置
JP2009295703A (ja) * 2008-06-04 2009-12-17 Yokogawa Electric Corp デバイス収納装置
JP6110673B2 (ja) * 2012-02-17 2017-04-05 エスアイアイ・セミコンダクタ株式会社 光センサ装置
KR101332082B1 (ko) * 2012-06-18 2013-11-22 삼성전기주식회사 카메라 모듈의 제조장치
US10332173B2 (en) 2013-08-27 2019-06-25 Matthews International Corporation Systems, methods, and computer-readable media for generating a memorial product
JP2017139258A (ja) 2016-02-01 2017-08-10 ソニー株式会社 撮像素子パッケージ及び撮像装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5423889A (en) * 1994-06-24 1995-06-13 Harris Corporation Process for manufacturing a multi-port adhesive dispensing tool
JP3805031B2 (ja) * 1995-10-20 2006-08-02 キヤノン株式会社 光電変換装置
US6069027A (en) * 1997-05-21 2000-05-30 Lsi Logic Corporation Fixture for lid-attachment for encapsulated packages
US6255140B1 (en) * 1998-10-19 2001-07-03 Industrial Technology Research Institute Flip chip chip-scale package

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Publication number Publication date
US6664125B2 (en) 2003-12-16
JP2001244280A (ja) 2001-09-07
US20010017405A1 (en) 2001-08-30

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