JP4294775B2 - マイクロ波プラズマ処理装置 - Google Patents
マイクロ波プラズマ処理装置 Download PDFInfo
- Publication number
- JP4294775B2 JP4294775B2 JP34177998A JP34177998A JP4294775B2 JP 4294775 B2 JP4294775 B2 JP 4294775B2 JP 34177998 A JP34177998 A JP 34177998A JP 34177998 A JP34177998 A JP 34177998A JP 4294775 B2 JP4294775 B2 JP 4294775B2
- Authority
- JP
- Japan
- Prior art keywords
- microwave
- temperature
- tubular member
- sealing
- sealing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012545 processing Methods 0.000 title claims description 138
- 238000007789 sealing Methods 0.000 claims description 107
- 238000012546 transfer Methods 0.000 claims description 37
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 238000005259 measurement Methods 0.000 claims description 9
- 230000001902 propagating effect Effects 0.000 claims description 9
- 238000001228 spectrum Methods 0.000 claims description 9
- 238000001514 detection method Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000000523 sample Substances 0.000 description 34
- 239000007789 gas Substances 0.000 description 27
- 235000011194 food seasoning agent Nutrition 0.000 description 26
- 230000005684 electric field Effects 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 238000005530 etching Methods 0.000 description 4
- 239000013307 optical fiber Substances 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000009529 body temperature measurement Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Plasma Technology (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34177998A JP4294775B2 (ja) | 1998-12-01 | 1998-12-01 | マイクロ波プラズマ処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34177998A JP4294775B2 (ja) | 1998-12-01 | 1998-12-01 | マイクロ波プラズマ処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000167385A JP2000167385A (ja) | 2000-06-20 |
| JP2000167385A5 JP2000167385A5 (enExample) | 2006-03-23 |
| JP4294775B2 true JP4294775B2 (ja) | 2009-07-15 |
Family
ID=18348703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34177998A Expired - Fee Related JP4294775B2 (ja) | 1998-12-01 | 1998-12-01 | マイクロ波プラズマ処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4294775B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7437965B2 (ja) | 2020-02-21 | 2024-02-26 | 東京エレクトロン株式会社 | プラズマ処理装置及び部材温度判定方法 |
| CN114405431B (zh) * | 2022-01-22 | 2024-04-09 | 山西同杰化学试剂有限公司 | 一种多联化学合成反应器 |
-
1998
- 1998-12-01 JP JP34177998A patent/JP4294775B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000167385A (ja) | 2000-06-20 |
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