JP4287589B2 - 装置、クランプ機構、アーム組立体及び方法 - Google Patents

装置、クランプ機構、アーム組立体及び方法 Download PDF

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Publication number
JP4287589B2
JP4287589B2 JP2000513311A JP2000513311A JP4287589B2 JP 4287589 B2 JP4287589 B2 JP 4287589B2 JP 2000513311 A JP2000513311 A JP 2000513311A JP 2000513311 A JP2000513311 A JP 2000513311A JP 4287589 B2 JP4287589 B2 JP 4287589B2
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Japan
Prior art keywords
lever
workpiece
clamp
robot arm
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2000513311A
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English (en)
Japanese (ja)
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JP2001517562A5 (https=
JP2001517562A (ja
Inventor
ピーター， エフ． エビング，
サティシュ サンダー，
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Applied Materials Inc
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Applied Materials Inc
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Publication date
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Publication of JP2001517562A5 publication Critical patent/JP2001517562A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
JP2000513311A 1997-09-22 1998-08-19 装置、クランプ機構、アーム組立体及び方法 Expired - Fee Related JP4287589B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/935,293 1997-09-22
US08/935,293 US6155773A (en) 1997-09-22 1997-09-22 Substrate clamping apparatus
PCT/US1998/017234 WO1999016111A1 (en) 1997-09-22 1998-08-19 Substrate clamping apparatus

Publications (3)

Publication Number Publication Date
JP2001517562A JP2001517562A (ja) 2001-10-09
JP2001517562A5 JP2001517562A5 (https=) 2008-03-06
JP4287589B2 true JP4287589B2 (ja) 2009-07-01

Family

ID=25466878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000513311A Expired - Fee Related JP4287589B2 (ja) 1997-09-22 1998-08-19 装置、クランプ機構、アーム組立体及び方法

Country Status (3)

Country Link
US (1) US6155773A (https=)
JP (1) JP4287589B2 (https=)
WO (1) WO1999016111A1 (https=)

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US6513848B1 (en) 1999-09-17 2003-02-04 Applied Materials, Inc. Hydraulically actuated wafer clamp
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US6817640B2 (en) * 2001-06-28 2004-11-16 Applied Materials, Inc. Four-bar linkage wafer clamping mechanism
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US7140655B2 (en) * 2001-09-04 2006-11-28 Multimetrixs Llc Precision soft-touch gripping mechanism for flat objects
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US7499767B2 (en) * 2003-02-20 2009-03-03 Applied Materials, Inc. Methods and apparatus for positioning a substrate relative to a support stage
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JP2005209954A (ja) * 2004-01-23 2005-08-04 Kawasaki Heavy Ind Ltd 基板保持装置
US7290813B2 (en) * 2004-12-16 2007-11-06 Asyst Technologies, Inc. Active edge grip rest pad
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US20060130767A1 (en) 2004-12-22 2006-06-22 Applied Materials, Inc. Purged vacuum chuck with proximity pins
CN1824592B (zh) * 2005-02-25 2012-02-29 细美事有限公司 晶片传送装置
US20060236941A1 (en) * 2005-04-20 2006-10-26 Applied Materials, Inc. Passive wafer support for particle free wafer acceleration
US7712808B2 (en) * 2005-09-29 2010-05-11 Brooks Automation, Inc. End effector with centering grip
US20080190364A1 (en) * 2007-02-13 2008-08-14 Applied Materials, Inc. Substrate support assembly
JP4871910B2 (ja) * 2007-05-16 2012-02-08 株式会社日立ハイテクノロジーズ ディスクチャック機構およびディスクハンドリングロボット
JP4959427B2 (ja) * 2007-06-05 2012-06-20 日本電産サンキョー株式会社 産業用ロボット
KR100949686B1 (ko) * 2007-11-14 2010-03-26 주식회사 테스 기판 이송 장치 및 이를 포함한 기판 처리 장치
KR101188244B1 (ko) * 2008-03-05 2012-10-05 히라따기꼬오 가부시키가이샤 워크이재장치
CN102186639B (zh) * 2008-10-17 2013-06-12 株式会社爱发科 输送装置及真空装置
US8749053B2 (en) 2009-06-23 2014-06-10 Intevac, Inc. Plasma grid implant system for use in solar cell fabrications
US8801069B2 (en) * 2010-02-26 2014-08-12 Brooks Automation, Inc. Robot edge contact gripper
US9449862B2 (en) 2011-06-03 2016-09-20 Tel Nexx, Inc. Parallel single substrate processing system
MY175007A (en) 2011-11-08 2020-06-02 Intevac Inc Substrate processing system and method
US9318332B2 (en) 2012-12-19 2016-04-19 Intevac, Inc. Grid for plasma ion implant
US9536764B2 (en) 2015-01-27 2017-01-03 Lam Research Corporation End effector for wafer transfer system and method of transferring wafers
US11075105B2 (en) * 2017-09-21 2021-07-27 Applied Materials, Inc. In-situ apparatus for semiconductor process module
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Also Published As

Publication number Publication date
JP2001517562A (ja) 2001-10-09
US6155773A (en) 2000-12-05
WO1999016111A1 (en) 1999-04-01

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