JP4286514B2 - 半導体製造装置及び温度制御方法、半導体製造方法 - Google Patents

半導体製造装置及び温度制御方法、半導体製造方法 Download PDF

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Publication number
JP4286514B2
JP4286514B2 JP2002283020A JP2002283020A JP4286514B2 JP 4286514 B2 JP4286514 B2 JP 4286514B2 JP 2002283020 A JP2002283020 A JP 2002283020A JP 2002283020 A JP2002283020 A JP 2002283020A JP 4286514 B2 JP4286514 B2 JP 4286514B2
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Prior art keywords
temperature
heater
control
furnace
cascade
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Expired - Lifetime
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JP2002283020A
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Japanese (ja)
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JP2004119804A5 (enExample
JP2004119804A (ja
Inventor
和夫 田中
正昭 上野
英人 山口
充弘 松田
稔 中野
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Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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Publication of JP2004119804A5 publication Critical patent/JP2004119804A5/ja
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JP2002283020A 2002-09-27 2002-09-27 半導体製造装置及び温度制御方法、半導体製造方法 Expired - Lifetime JP4286514B2 (ja)

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JP2002283020A JP4286514B2 (ja) 2002-09-27 2002-09-27 半導体製造装置及び温度制御方法、半導体製造方法

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JP2002283020A JP4286514B2 (ja) 2002-09-27 2002-09-27 半導体製造装置及び温度制御方法、半導体製造方法

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JP2004119804A JP2004119804A (ja) 2004-04-15
JP2004119804A5 JP2004119804A5 (enExample) 2005-10-13
JP4286514B2 true JP4286514B2 (ja) 2009-07-01

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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7006900B2 (en) * 2002-11-14 2006-02-28 Asm International N.V. Hybrid cascade model-based predictive control system
JP4555647B2 (ja) * 2004-09-21 2010-10-06 株式会社日立国際電気 基板処理装置、半導体装置の製造方法、温度制御方法
JP4783029B2 (ja) * 2005-01-31 2011-09-28 株式会社日立国際電気 熱処理装置及び基板の製造方法
JP4878801B2 (ja) * 2005-09-26 2012-02-15 株式会社日立国際電気 基板処理装置、半導体装置の製造方法
JP5017722B2 (ja) * 2006-12-12 2012-09-05 東洋自動機株式会社 袋詰め包装におけるスチーム置換脱気装置及び方法
JP4411341B2 (ja) * 2007-02-19 2010-02-10 東京エレクトロン株式会社 縦型熱処理装置用の熱交換器及び縦型熱処理装置
JP5734081B2 (ja) * 2010-10-18 2015-06-10 株式会社日立国際電気 基板処理装置、基板処理装置の温度制御方法、及び基板処理装置の加熱方法
CN102063057B (zh) * 2010-10-28 2012-09-05 北京大学 一种微机械谐振式器件闭环驱动用的pid控制装置
KR101302156B1 (ko) 2013-05-08 2013-08-30 (주)테키스트 반도체 제조 설비를 위한 실시간 열량 모니터링 기반 열전소자 온도제어 시스템
JP6087323B2 (ja) * 2014-07-31 2017-03-01 東京エレクトロン株式会社 熱処理装置、熱処理方法及びその熱処理方法を実行させるためのプログラムを記録した記録媒体
US11043402B2 (en) 2017-09-12 2021-06-22 Kokusai Electric Corporation Cooling unit, heat insulating structure, and substrate processing apparatus
JP6752851B2 (ja) * 2017-09-12 2020-09-09 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ クーリングユニット、基板処理装置、および半導体装置の製造方法
KR102608535B1 (ko) * 2019-01-07 2023-11-30 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 반도체 장치의 제조 방법 및 히터 유닛
CN114459149A (zh) * 2021-12-28 2022-05-10 中国航天空气动力技术研究院 一种蓄热式风洞电预热加热器系统及控制方法

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