JP4281960B2 - 半田を用いた接合方法および接合装置 - Google Patents

半田を用いた接合方法および接合装置 Download PDF

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Publication number
JP4281960B2
JP4281960B2 JP2004236398A JP2004236398A JP4281960B2 JP 4281960 B2 JP4281960 B2 JP 4281960B2 JP 2004236398 A JP2004236398 A JP 2004236398A JP 2004236398 A JP2004236398 A JP 2004236398A JP 4281960 B2 JP4281960 B2 JP 4281960B2
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JP
Japan
Prior art keywords
electrode
solder ball
solder
laser
path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004236398A
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English (en)
Japanese (ja)
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JP2005123581A (ja
JP2005123581A5 (enExample
Inventor
修 進藤
亨 水野
哲 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SAE Magnetics HK Ltd
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SAE Magnetics HK Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SAE Magnetics HK Ltd filed Critical SAE Magnetics HK Ltd
Priority to JP2004236398A priority Critical patent/JP4281960B2/ja
Publication of JP2005123581A publication Critical patent/JP2005123581A/ja
Publication of JP2005123581A5 publication Critical patent/JP2005123581A5/ja
Application granted granted Critical
Publication of JP4281960B2 publication Critical patent/JP4281960B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2004236398A 2003-09-26 2004-08-16 半田を用いた接合方法および接合装置 Expired - Lifetime JP4281960B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004236398A JP4281960B2 (ja) 2003-09-26 2004-08-16 半田を用いた接合方法および接合装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003334729 2003-09-26
JP2004236398A JP4281960B2 (ja) 2003-09-26 2004-08-16 半田を用いた接合方法および接合装置

Publications (3)

Publication Number Publication Date
JP2005123581A JP2005123581A (ja) 2005-05-12
JP2005123581A5 JP2005123581A5 (enExample) 2006-08-17
JP4281960B2 true JP4281960B2 (ja) 2009-06-17

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ID=34622063

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004236398A Expired - Lifetime JP4281960B2 (ja) 2003-09-26 2004-08-16 半田を用いた接合方法および接合装置

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JP (1) JP4281960B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007118072A (ja) * 2005-10-31 2007-05-17 Shinka Jitsugyo Kk 半田付け方法及び装置
JP2008187056A (ja) * 2007-01-30 2008-08-14 Shinka Jitsugyo Kk 半田付け方法及び装置
JP4982198B2 (ja) * 2007-01-30 2012-07-25 新科實業有限公司 半田ノズル及びこれを備えた半田付け装置
DE102008017180B4 (de) * 2008-04-02 2020-07-02 Pac Tech - Packaging Technologies Gmbh Vorrichtung zur Applikation eines elektronischen Bauelements
JP6400318B2 (ja) * 2014-03-28 2018-10-03 株式会社谷黒組 チップ部品及びその製造方法
CN110911331A (zh) * 2018-09-14 2020-03-24 东莞市中麒光电技术有限公司 一种转移并便于led芯片固定的吸嘴及单颗led芯片转移、固定于背板的方法
KR102561680B1 (ko) * 2021-08-10 2023-07-31 주식회사 코윈디에스티 라인 빔 레이저를 이용한 솔더 볼의 부착 방법 및 그 장치

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Publication number Publication date
JP2005123581A (ja) 2005-05-12

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