JP4278481B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP4278481B2
JP4278481B2 JP2003362961A JP2003362961A JP4278481B2 JP 4278481 B2 JP4278481 B2 JP 4278481B2 JP 2003362961 A JP2003362961 A JP 2003362961A JP 2003362961 A JP2003362961 A JP 2003362961A JP 4278481 B2 JP4278481 B2 JP 4278481B2
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Japan
Prior art keywords
film
insulating film
hole
semiconductor device
wiring
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Expired - Fee Related
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JP2003362961A
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English (en)
Japanese (ja)
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JP2005129677A (ja
JP2005129677A5 (https=
Inventor
勝一 福井
隆夫 鴨島
淳子 泉谷
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Renesas Technology Corp
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Renesas Technology Corp
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Publication date
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Priority to JP2003362961A priority Critical patent/JP4278481B2/ja
Publication of JP2005129677A publication Critical patent/JP2005129677A/ja
Publication of JP2005129677A5 publication Critical patent/JP2005129677A5/ja
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Publication of JP4278481B2 publication Critical patent/JP4278481B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/071—Manufacture or treatment of dielectric parts thereof
    • H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
    • H10W20/083—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts the openings being via holes penetrating underlying conductors

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2003362961A 2003-10-23 2003-10-23 半導体装置の製造方法 Expired - Fee Related JP4278481B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003362961A JP4278481B2 (ja) 2003-10-23 2003-10-23 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003362961A JP4278481B2 (ja) 2003-10-23 2003-10-23 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2005129677A JP2005129677A (ja) 2005-05-19
JP2005129677A5 JP2005129677A5 (https=) 2006-11-30
JP4278481B2 true JP4278481B2 (ja) 2009-06-17

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ID=34642416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003362961A Expired - Fee Related JP4278481B2 (ja) 2003-10-23 2003-10-23 半導体装置の製造方法

Country Status (1)

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JP (1) JP4278481B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8432037B2 (en) 2004-06-10 2013-04-30 Renesas Electronics Corporation Semiconductor device with a line and method of fabrication thereof
JP4786680B2 (ja) * 2004-06-10 2011-10-05 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4832807B2 (ja) * 2004-06-10 2011-12-07 ルネサスエレクトロニクス株式会社 半導体装置
EP2221864B1 (en) * 2005-12-02 2018-04-11 Ulvac, Inc. Method for forming Cu film
US7488679B2 (en) * 2006-07-31 2009-02-10 International Business Machines Corporation Interconnect structure and process of making the same
KR102357474B1 (ko) * 2010-02-26 2022-02-08 가부시키가이샤 한도오따이 에네루기 켄큐쇼 액정 표시 장치

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Publication number Publication date
JP2005129677A (ja) 2005-05-19

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