JP4275724B1 - ボンディング良否判定方法およびボンディング良否判定装置ならびにボンディング装置 - Google Patents

ボンディング良否判定方法およびボンディング良否判定装置ならびにボンディング装置 Download PDF

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Publication number
JP4275724B1
JP4275724B1 JP2008184386A JP2008184386A JP4275724B1 JP 4275724 B1 JP4275724 B1 JP 4275724B1 JP 2008184386 A JP2008184386 A JP 2008184386A JP 2008184386 A JP2008184386 A JP 2008184386A JP 4275724 B1 JP4275724 B1 JP 4275724B1
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Japan
Prior art keywords
bonding
signal
ultrasonic horn
load
ultrasonic
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Active
Application number
JP2008184386A
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English (en)
Japanese (ja)
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JP2010027699A (ja
Inventor
伸幸 青柳
耕平 瀬山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
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Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2008184386A priority Critical patent/JP4275724B1/ja
Priority to TW97144642A priority patent/TW201005848A/zh
Priority to CN2008801304172A priority patent/CN102099903B/zh
Priority to PCT/JP2008/072814 priority patent/WO2010007702A1/ja
Priority to KR1020107027140A priority patent/KR101035239B1/ko
Application granted granted Critical
Publication of JP4275724B1 publication Critical patent/JP4275724B1/ja
Publication of JP2010027699A publication Critical patent/JP2010027699A/ja
Priority to US13/005,746 priority patent/US8181527B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Quality & Reliability (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2008184386A 2008-07-16 2008-07-16 ボンディング良否判定方法およびボンディング良否判定装置ならびにボンディング装置 Active JP4275724B1 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008184386A JP4275724B1 (ja) 2008-07-16 2008-07-16 ボンディング良否判定方法およびボンディング良否判定装置ならびにボンディング装置
TW97144642A TW201005848A (en) 2008-07-16 2008-11-19 Method for judging pass/fail of bonding, apparatus for judging pass/fail of bonding, and bonding apparatus
CN2008801304172A CN102099903B (zh) 2008-07-16 2008-12-16 焊接好坏判定方法，焊接好坏判定装置以及焊接装置
PCT/JP2008/072814 WO2010007702A1 (ja) 2008-07-16 2008-12-16 ボンディング良否判定方法およびボンディング良否判定装置ならびにボンディング装置
KR1020107027140A KR101035239B1 (ko) 2008-07-16 2008-12-16 본딩 양부 판정 방법 및 본딩 양부 판정 장치 및 본딩 장치
US13/005,746 US8181527B2 (en) 2008-07-16 2011-01-13 Method and apparatus for pass/fail determination of bonding and bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008184386A JP4275724B1 (ja) 2008-07-16 2008-07-16 ボンディング良否判定方法およびボンディング良否判定装置ならびにボンディング装置

Publications (2)

Publication Number Publication Date
JP4275724B1 true JP4275724B1 (ja) 2009-06-10
JP2010027699A JP2010027699A (ja) 2010-02-04

Family

ID=40821547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008184386A Active JP4275724B1 (ja) 2008-07-16 2008-07-16 ボンディング良否判定方法およびボンディング良否判定装置ならびにボンディング装置

Country Status (6)

Country Link
US (1) US8181527B2 (https=)
JP (1) JP4275724B1 (https=)
KR (1) KR101035239B1 (https=)
CN (1) CN102099903B (https=)
TW (1) TW201005848A (https=)
WO (1) WO2010007702A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220134469A1 (en) * 2020-11-05 2022-05-05 Kulicke And Soffa Industries, Inc. Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods
US11610860B2 (en) 2019-09-19 2023-03-21 Kabushiki Kaisha Toshiba Wire bonding apparatus and wire bonding method

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8899469B2 (en) * 2013-03-04 2014-12-02 Kulicke And Soffa Industries, Inc. Automatic rework processes for non-stick conditions in wire bonding operations
US9981337B2 (en) * 2014-05-13 2018-05-29 Sonics & Materials, Inc. Diagnostic system and method for testing integrity of stack during ultrasonic welding
JP6575161B2 (ja) * 2015-06-16 2019-09-18 富士電機株式会社 良否判断装置、ワイヤボンダ装置及び良否判断方法
KR102206867B1 (ko) * 2016-09-07 2021-01-25 가부시키가이샤 신가와 와이어 본딩 장치
JP6664300B2 (ja) * 2016-09-21 2020-03-13 三菱電機株式会社 ワイヤボンディング良否判定装置およびワイヤボンディング良否判定方法
JP7008370B2 (ja) * 2018-07-11 2022-02-14 株式会社新川 ワイヤボンディング装置
CN112585732B (zh) * 2018-08-06 2024-10-11 株式会社新川 接合头
SG11202104391RA (en) * 2019-03-13 2021-05-28 Shinkawa Kk Wire non-attachment inspection system, wire non-attachment detection device, and wire non-attachment detection method
US11581285B2 (en) * 2019-06-04 2023-02-14 Kulicke And Soffa Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
JP7488656B2 (ja) * 2019-09-19 2024-05-22 株式会社東芝 ワイヤボンディング装置及びワイヤボンディング方法
CN113852893B (zh) * 2020-06-28 2024-11-05 北京小米移动软件有限公司 数据处理方法及装置、终端和存储介质
JP7577501B2 (ja) * 2020-10-07 2024-11-05 株式会社東芝 超音波接合装置、制御装置及び制御方法
US11741747B2 (en) 2021-01-13 2023-08-29 Ford Global Technologies, Llc Material spectroscopy
US11443527B2 (en) 2021-01-13 2022-09-13 Ford Global Technologies, Llc Material spectroscopy
CN113399813B (zh) * 2021-07-13 2022-05-03 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 适用于压焊机的超声波换能装置
US11691214B2 (en) * 2021-10-17 2023-07-04 Shinkawa Ltd. Ultrasound horn
CN118743004A (zh) * 2022-03-25 2024-10-01 株式会社新川 半导体装置制造装置及检查方法
CN115219416B (zh) * 2022-07-19 2025-07-04 吉林冠腾自动化技术有限公司 一种运载工具粘接结构健康状态离线检测装置及其检测方法
CN117637510B (zh) * 2023-11-29 2024-10-29 重庆理工大学 一种半导体检测装置
JP2025122515A (ja) * 2024-02-08 2025-08-21 株式会社東芝 ワイヤボンディング装置、制御装置、及び制御方法
CN118706966A (zh) * 2024-08-02 2024-09-27 广州佑田精密电机有限公司 一种电机的虚焊检测系统及其检测方法
CN121650265A (zh) * 2026-02-06 2026-03-13 余姚泰速自动化科技有限公司 一种汽车保险杠的配合焊接方法及系统

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2752890B2 (ja) 1993-09-03 1998-05-18 日本電気株式会社 ワイヤボンディング装置
JP2002118136A (ja) * 2000-10-12 2002-04-19 Matsushita Electric Ind Co Ltd バンプボンディング装置
JP3818932B2 (ja) 2002-03-04 2006-09-06 株式会社カイジョー ワイヤボンディング装置
JP4679454B2 (ja) * 2006-07-13 2011-04-27 株式会社新川 ワイヤボンディング装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11610860B2 (en) 2019-09-19 2023-03-21 Kabushiki Kaisha Toshiba Wire bonding apparatus and wire bonding method
US20220134469A1 (en) * 2020-11-05 2022-05-05 Kulicke And Soffa Industries, Inc. Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods
US11597031B2 (en) * 2020-11-05 2023-03-07 Kulicke And Soffa Industries, Inc. Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods
US11865633B2 (en) 2020-11-05 2024-01-09 Kulicke And Soffa Industries, Inc. Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods

Also Published As

Publication number Publication date
JP2010027699A (ja) 2010-02-04
US8181527B2 (en) 2012-05-22
US20110146408A1 (en) 2011-06-23
WO2010007702A1 (ja) 2010-01-21
CN102099903B (zh) 2013-05-01
CN102099903A (zh) 2011-06-15
TW201005848A (en) 2010-02-01
TWI373816B (https=) 2012-10-01
KR101035239B1 (ko) 2011-05-18
KR20100135974A (ko) 2010-12-27

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