KR101035239B1 - 본딩 양부 판정 방법 및 본딩 양부 판정 장치 및 본딩 장치 - Google Patents

본딩 양부 판정 방법 및 본딩 양부 판정 장치 및 본딩 장치 Download PDF

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Publication number
KR101035239B1
KR101035239B1 KR1020107027140A KR20107027140A KR101035239B1 KR 101035239 B1 KR101035239 B1 KR 101035239B1 KR 1020107027140 A KR1020107027140 A KR 1020107027140A KR 20107027140 A KR20107027140 A KR 20107027140A KR 101035239 B1 KR101035239 B1 KR 101035239B1
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KR
South Korea
Prior art keywords
bonding
ultrasonic horn
signal
load
vibration
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KR1020107027140A
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English (en)
Korean (ko)
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KR20100135974A (ko
Inventor
노부유키 아오야기
코헤이 세야마
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가부시키가이샤 신가와
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Assigned to 가부시키가이샤 신가와 reassignment 가부시키가이샤 신가와 권리의 전부이전등록 Assignors: 야마하 모터 로보틱스 홀딩스 가부시키가이샤
Assigned to 야마하 로보틱스 가부시키가이샤 reassignment 야마하 로보틱스 가부시키가이샤 권리의 전부이전등록 Assignors: 가부시키가이샤 신가와
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07183—Means for monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Quality & Reliability (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
KR1020107027140A 2008-07-16 2008-12-16 본딩 양부 판정 방법 및 본딩 양부 판정 장치 및 본딩 장치 Active KR101035239B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008184386A JP4275724B1 (ja) 2008-07-16 2008-07-16 ボンディング良否判定方法およびボンディング良否判定装置ならびにボンディング装置
JPJP-P-2008-184386 2008-07-16

Publications (2)

Publication Number Publication Date
KR20100135974A KR20100135974A (ko) 2010-12-27
KR101035239B1 true KR101035239B1 (ko) 2011-05-18

Family

ID=40821547

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107027140A Active KR101035239B1 (ko) 2008-07-16 2008-12-16 본딩 양부 판정 방법 및 본딩 양부 판정 장치 및 본딩 장치

Country Status (6)

Country Link
US (1) US8181527B2 (https=)
JP (1) JP4275724B1 (https=)
KR (1) KR101035239B1 (https=)
CN (1) CN102099903B (https=)
TW (1) TW201005848A (https=)
WO (1) WO2010007702A1 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8899469B2 (en) * 2013-03-04 2014-12-02 Kulicke And Soffa Industries, Inc. Automatic rework processes for non-stick conditions in wire bonding operations
US9981337B2 (en) * 2014-05-13 2018-05-29 Sonics & Materials, Inc. Diagnostic system and method for testing integrity of stack during ultrasonic welding
JP6575161B2 (ja) * 2015-06-16 2019-09-18 富士電機株式会社 良否判断装置、ワイヤボンダ装置及び良否判断方法
KR102206867B1 (ko) * 2016-09-07 2021-01-25 가부시키가이샤 신가와 와이어 본딩 장치
JP6664300B2 (ja) * 2016-09-21 2020-03-13 三菱電機株式会社 ワイヤボンディング良否判定装置およびワイヤボンディング良否判定方法
JP7008370B2 (ja) * 2018-07-11 2022-02-14 株式会社新川 ワイヤボンディング装置
CN112585732B (zh) * 2018-08-06 2024-10-11 株式会社新川 接合头
SG11202104391RA (en) * 2019-03-13 2021-05-28 Shinkawa Kk Wire non-attachment inspection system, wire non-attachment detection device, and wire non-attachment detection method
US11581285B2 (en) * 2019-06-04 2023-02-14 Kulicke And Soffa Industries, Inc. Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
JP7488656B2 (ja) * 2019-09-19 2024-05-22 株式会社東芝 ワイヤボンディング装置及びワイヤボンディング方法
US11610860B2 (en) 2019-09-19 2023-03-21 Kabushiki Kaisha Toshiba Wire bonding apparatus and wire bonding method
CN113852893B (zh) * 2020-06-28 2024-11-05 北京小米移动软件有限公司 数据处理方法及装置、终端和存储介质
JP7577501B2 (ja) * 2020-10-07 2024-11-05 株式会社東芝 超音波接合装置、制御装置及び制御方法
JP7794821B2 (ja) 2020-11-05 2026-01-06 クリック アンド ソッファ インダストリーズ、インク． ワイヤボンディング装置におけるボンディング力の精度を監視する方法を含む、ワイヤボンディング装置を動作させる方法、および関連する方法
US11741747B2 (en) 2021-01-13 2023-08-29 Ford Global Technologies, Llc Material spectroscopy
US11443527B2 (en) 2021-01-13 2022-09-13 Ford Global Technologies, Llc Material spectroscopy
CN113399813B (zh) * 2021-07-13 2022-05-03 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） 适用于压焊机的超声波换能装置
US11691214B2 (en) * 2021-10-17 2023-07-04 Shinkawa Ltd. Ultrasound horn
CN118743004A (zh) * 2022-03-25 2024-10-01 株式会社新川 半导体装置制造装置及检查方法
CN115219416B (zh) * 2022-07-19 2025-07-04 吉林冠腾自动化技术有限公司 一种运载工具粘接结构健康状态离线检测装置及其检测方法
CN117637510B (zh) * 2023-11-29 2024-10-29 重庆理工大学 一种半导体检测装置
JP2025122515A (ja) * 2024-02-08 2025-08-21 株式会社東芝 ワイヤボンディング装置、制御装置、及び制御方法
CN118706966A (zh) * 2024-08-02 2024-09-27 广州佑田精密电机有限公司 一种电机的虚焊检测系统及其检测方法
CN121650265A (zh) * 2026-02-06 2026-03-13 余姚泰速自动化科技有限公司 一种汽车保险杠的配合焊接方法及系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002118136A (ja) * 2000-10-12 2002-04-19 Matsushita Electric Ind Co Ltd バンプボンディング装置
JP2008021839A (ja) * 2006-07-13 2008-01-31 Shinkawa Ltd ワイヤボンディング装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2752890B2 (ja) 1993-09-03 1998-05-18 日本電気株式会社 ワイヤボンディング装置
JP3818932B2 (ja) 2002-03-04 2006-09-06 株式会社カイジョー ワイヤボンディング装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002118136A (ja) * 2000-10-12 2002-04-19 Matsushita Electric Ind Co Ltd バンプボンディング装置
JP2008021839A (ja) * 2006-07-13 2008-01-31 Shinkawa Ltd ワイヤボンディング装置

Also Published As

Publication number Publication date
JP2010027699A (ja) 2010-02-04
US8181527B2 (en) 2012-05-22
US20110146408A1 (en) 2011-06-23
JP4275724B1 (ja) 2009-06-10
WO2010007702A1 (ja) 2010-01-21
CN102099903B (zh) 2013-05-01
CN102099903A (zh) 2011-06-15
TW201005848A (en) 2010-02-01
TWI373816B (https=) 2012-10-01
KR20100135974A (ko) 2010-12-27

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