SG11202104391RA - Wire non-attachment inspection system, wire non-attachment detection device, and wire non-attachment detection method - Google Patents
Wire non-attachment inspection system, wire non-attachment detection device, and wire non-attachment detection methodInfo
- Publication number
- SG11202104391RA SG11202104391RA SG11202104391RA SG11202104391RA SG11202104391RA SG 11202104391R A SG11202104391R A SG 11202104391RA SG 11202104391R A SG11202104391R A SG 11202104391RA SG 11202104391R A SG11202104391R A SG 11202104391RA SG 11202104391R A SG11202104391R A SG 11202104391RA
- Authority
- SG
- Singapore
- Prior art keywords
- wire non
- attachment
- attachment detection
- inspection system
- wire
- Prior art date
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/20—Analysis of motion
- G06T7/254—Analysis of motion involving subtraction of images
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
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- G—PHYSICS
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- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
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- G06T7/20—Analysis of motion
- G06T7/269—Analysis of motion using gradient-based methods
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
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- H04N7/183—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a single remote source
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- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
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- H04R1/028—Casings; Cabinets ; Supports therefor; Mountings therein associated with devices performing functions other than acoustics, e.g. electric candles
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- G06T2207/00—Indexing scheme for image analysis or image enhancement
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- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Multimedia (AREA)
- Quality & Reliability (AREA)
- Signal Processing (AREA)
- Acoustics & Sound (AREA)
- Manufacturing & Machinery (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019046296 | 2019-03-13 | ||
PCT/JP2020/010693 WO2020184644A1 (en) | 2019-03-13 | 2020-03-12 | Wire non-attachment inspection system, wire non-attachment detection device, and wire non-attachment detection method |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202104391RA true SG11202104391RA (en) | 2021-05-28 |
Family
ID=72426656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202104391RA SG11202104391RA (en) | 2019-03-13 | 2020-03-12 | Wire non-attachment inspection system, wire non-attachment detection device, and wire non-attachment detection method |
Country Status (7)
Country | Link |
---|---|
US (1) | US20220130026A1 (en) |
JP (1) | JP7019231B2 (en) |
KR (1) | KR102413267B1 (en) |
CN (1) | CN112997307A (en) |
SG (1) | SG11202104391RA (en) |
TW (1) | TWI760708B (en) |
WO (1) | WO2020184644A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116171485A (en) | 2021-05-10 | 2023-05-26 | 雅马哈智能机器控股株式会社 | Defect detection device and defect detection method |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5532739A (en) * | 1993-10-06 | 1996-07-02 | Cognex Corporation | Automated optical inspection apparatus |
JPH09181140A (en) * | 1995-12-26 | 1997-07-11 | Toshiba Microelectron Corp | Semiconductor integrated circuit assembly inspection equipment and inspection method |
JPH09213752A (en) | 1996-01-31 | 1997-08-15 | Kaijo Corp | Bonding failure detecting circuit for wire bonding device |
JP2000137026A (en) * | 1998-10-30 | 2000-05-16 | Suzuki Motor Corp | Abnormality inspection method, and joining quality inspection system for wire bonding device |
TWI282133B (en) * | 2005-12-23 | 2007-06-01 | Advanced Semiconductor Eng | Method of wire bonding the chip with a plurality of solder pads |
JP2008084881A (en) * | 2006-09-25 | 2008-04-10 | Toshiba Corp | Manufacturing process and inspection method of electronic device |
JP4952464B2 (en) * | 2007-09-13 | 2012-06-13 | トヨタ自動車株式会社 | Bonding wire inspection apparatus and bonding wire inspection method |
JP4275724B1 (en) * | 2008-07-16 | 2009-06-10 | 株式会社新川 | Bonding quality determination method, bonding quality determination device, and bonding apparatus |
JP2010056106A (en) | 2008-08-26 | 2010-03-11 | Nec Electronics Corp | Wire bonding device and wire bonding method using same |
JP4625858B2 (en) * | 2008-09-10 | 2011-02-02 | 株式会社カイジョー | Wire bonding method, wire bonding apparatus, and wire bonding control program |
TWI518814B (en) * | 2013-04-15 | 2016-01-21 | 新川股份有限公司 | Semiconductor device and manufacturing method thereof |
JP2015114242A (en) * | 2013-12-12 | 2015-06-22 | 株式会社新川 | Wire bonding inspection method and wire bonding inspection device |
TWI562252B (en) * | 2014-02-17 | 2016-12-11 | Shinkawa Kk | Detecting discharging device, wire bonding device and detecting discharging method |
JP5950994B2 (en) | 2014-12-26 | 2016-07-13 | 株式会社新川 | Mounting device |
JP6351551B2 (en) * | 2015-07-14 | 2018-07-04 | 三菱電機株式会社 | Semiconductor device, degradation evaluation method for semiconductor device, and system including semiconductor device |
WO2018110417A1 (en) * | 2016-12-14 | 2018-06-21 | 株式会社新川 | Wire bonding device and wire bonding method |
JP2019100951A (en) * | 2017-12-06 | 2019-06-24 | 新電元工業株式会社 | Inspection method of semiconductor device, and inspection apparatus |
-
2020
- 2020-03-12 KR KR1020217001424A patent/KR102413267B1/en active IP Right Grant
- 2020-03-12 TW TW109108246A patent/TWI760708B/en active
- 2020-03-12 JP JP2021505118A patent/JP7019231B2/en active Active
- 2020-03-12 CN CN202080005972.3A patent/CN112997307A/en active Pending
- 2020-03-12 US US17/428,963 patent/US20220130026A1/en not_active Abandoned
- 2020-03-12 WO PCT/JP2020/010693 patent/WO2020184644A1/en active Application Filing
- 2020-03-12 SG SG11202104391RA patent/SG11202104391RA/en unknown
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US20220130026A1 (en) | 2022-04-28 |
CN112997307A (en) | 2021-06-18 |
WO2020184644A1 (en) | 2020-09-17 |
TWI760708B (en) | 2022-04-11 |
TW202103292A (en) | 2021-01-16 |
KR20210021057A (en) | 2021-02-24 |
JP7019231B2 (en) | 2022-02-15 |
KR102413267B1 (en) | 2022-06-27 |
JPWO2020184644A1 (en) | 2021-06-03 |
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