SG11202100089PA - Detection device and detection method - Google Patents

Detection device and detection method

Info

Publication number
SG11202100089PA
SG11202100089PA SG11202100089PA SG11202100089PA SG11202100089PA SG 11202100089P A SG11202100089P A SG 11202100089PA SG 11202100089P A SG11202100089P A SG 11202100089PA SG 11202100089P A SG11202100089P A SG 11202100089PA SG 11202100089P A SG11202100089P A SG 11202100089PA
Authority
SG
Singapore
Prior art keywords
detection
detection device
detection method
Prior art date
Application number
SG11202100089PA
Inventor
Lu Chen
Youwei Huang
Gaozeng Cui
Timmy Wang
Original Assignee
Skyverse Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Skyverse Technology Co Ltd filed Critical Skyverse Technology Co Ltd
Publication of SG11202100089PA publication Critical patent/SG11202100089PA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1717—Systems in which incident light is modified in accordance with the properties of the material investigated with a modulation of one or more physical properties of the sample during the optical investigation, e.g. electro-reflectance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/86—Investigating moving sheets
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/952—Inspecting the exterior surface of cylindrical bodies or wires
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G01N2021/0106—General arrangement of respective parts
    • G01N2021/0112—Apparatus in one mechanical, optical or electronic block
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1717—Systems in which incident light is modified in accordance with the properties of the material investigated with a modulation of one or more physical properties of the sample during the optical investigation, e.g. electro-reflectance
    • G01N2021/1725—Modulation of properties by light, e.g. photoreflectance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8848—Polarisation of light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8861—Determining coordinates of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8874—Taking dimensions of defect into account
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/068—Optics, miscellaneous
    • G01N2201/0683—Brewster plate; polarisation controlling elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/104—Mechano-optical scan, i.e. object and beam moving
    • G01N2201/1042—X, Y scan, i.e. object moving in X, beam in Y
SG11202100089PA 2018-07-06 2019-07-08 Detection device and detection method SG11202100089PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201810737921.4A CN110687051B (en) 2018-07-06 2018-07-06 Detection equipment and method
PCT/CN2019/094976 WO2020007370A1 (en) 2018-07-06 2019-07-08 Detecting device and method

Publications (1)

Publication Number Publication Date
SG11202100089PA true SG11202100089PA (en) 2021-02-25

Family

ID=69060736

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202100089PA SG11202100089PA (en) 2018-07-06 2019-07-08 Detection device and detection method

Country Status (5)

Country Link
US (1) US11940377B2 (en)
KR (1) KR102516040B1 (en)
CN (2) CN110687051B (en)
SG (1) SG11202100089PA (en)
WO (1) WO2020007370A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113514477A (en) * 2020-04-10 2021-10-19 深圳中科飞测科技股份有限公司 Optical equipment and alignment method and detection method thereof
CN112215372B (en) * 2020-10-21 2023-04-07 电子科技大学 Computer-aided system for equipment detection in petroleum drilling system
CN112883601B (en) * 2021-01-13 2023-05-02 歌尔股份有限公司 Surface defect detection method, device, equipment and storage medium
CN115561179A (en) * 2021-07-02 2023-01-03 三赢科技（深圳）有限公司 Optical module applied to mobile equipment and mobile equipment
CN113533352B (en) * 2021-08-20 2023-02-10 合肥御微半导体技术有限公司 Detection system and detection method for surface defects
CN117197617A (en) * 2023-09-19 2023-12-08 芯率智能科技(苏州)有限公司 Defect classification method and system for repeated defects
CN117080108B (en) * 2023-10-18 2024-02-02 无锡卓海科技股份有限公司 Wafer detection device and detection method

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1016895B (en) * 1989-11-23 1992-06-03 清华大学 Contactless integrated measuring unit for mechanical vibration
US5032734A (en) 1990-10-15 1991-07-16 Vti, Inc. Method and apparatus for nondestructively measuring micro defects in materials
US5883710A (en) * 1994-12-08 1999-03-16 Kla-Tencor Corporation Scanning system for inspecting anomalies on surfaces
DE19626261A1 (en) * 1995-06-30 1997-01-02 Nikon Corp IC pattern and metal surface test object observation differential interference microscope
KR100301067B1 (en) 1999-08-23 2001-11-01 윤종용 Method for detecting micro scratch and device adopting the same
US6753961B1 (en) * 2000-09-18 2004-06-22 Therma-Wave, Inc. Spectroscopic ellipsometer without rotating components
CN1692296A (en) * 2002-09-30 2005-11-02 独立行政法人科学技术振兴机构 Cofocal microscope, fluorescence measuring method and polarized light measuring metod using cofocal microscope
KR100766178B1 (en) * 2006-01-18 2007-10-10 광주과학기술원 Apparatus for refractive index profile measurement of optical waveguide
US7701577B2 (en) * 2007-02-21 2010-04-20 Asml Netherlands B.V. Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
JP2010197352A (en) 2009-02-27 2010-09-09 Hitachi High-Technologies Corp Defect inspection method and defect inspecting apparatus
CN201732057U (en) * 2009-05-06 2011-02-02 许忠保 Differential interference phase contrast tomography microscope
CN101666630B (en) * 2009-10-30 2011-06-22 哈尔滨工业大学深圳研究生院 Method and device for detecting precision wafer based on parallel optical flat splitting polarized beam and phase-shifting interferometry
JP5713264B2 (en) * 2009-11-20 2015-05-07 独立行政法人産業技術総合研究所 Defect inspection method, wafer or semiconductor element quality control method, and defect inspection apparatus
US8854628B2 (en) 2010-09-22 2014-10-07 Zygo Corporation Interferometric methods for metrology of surfaces, films and underresolved structures
CN102759533B (en) 2011-04-27 2015-03-04 中国科学院微电子研究所 Wafer detecting method and wafer detecting device
KR20130072535A (en) 2011-12-22 2013-07-02 삼성전기주식회사 Non-invasive inspecting apparatus for defects and inspecting method using the same
JP5773939B2 (en) * 2012-04-27 2015-09-02 株式会社日立ハイテクノロジーズ Defect inspection apparatus and defect inspection method
JP6328468B2 (en) * 2014-03-31 2018-05-23 株式会社日立ハイテクノロジーズ Defect inspection apparatus and inspection method
JP2015206642A (en) * 2014-04-18 2015-11-19 株式会社日立ハイテクノロジーズ Method for observing defect and device thereof
TWI542864B (en) * 2014-12-30 2016-07-21 財團法人工業技術研究院 A system for measuring anisotropy, a method for measuring anisotropy and a calibration method thereof
CN106153626B (en) * 2015-04-13 2019-02-22 无锡迈福光学科技有限公司 A kind of surface blemish optical detection apparatus and its detection method
WO2017108411A1 (en) * 2015-12-23 2017-06-29 Asml Netherlands B.V. Metrology method and apparatus
KR20180028787A (en) * 2016-09-09 2018-03-19 삼성전자주식회사 Defect inspection system and method, and method for fabricating semiconductor using the inspection method
CN207351398U (en) * 2017-07-17 2018-05-11 哈尔滨工业大学深圳研究生院 The coaxial microscopic three-dimensional topography measurement device of integrated full-automatic
US10830709B2 (en) * 2018-09-28 2020-11-10 Onto Innovation Inc. Interferometer with pixelated phase shift mask
KR20220030067A (en) * 2020-09-02 2022-03-10 삼성전자주식회사 Wafer inspection apparatus and system including same

Also Published As

Publication number Publication date
KR20210034001A (en) 2021-03-29
CN110687051B (en) 2022-06-21
KR102516040B1 (en) 2023-03-30
CN115165758A (en) 2022-10-11
WO2020007370A1 (en) 2020-01-09
US11940377B2 (en) 2024-03-26
CN110687051A (en) 2020-01-14
US20210270725A1 (en) 2021-09-02

Similar Documents

Publication Publication Date Title
EP4149036C0 (en) Monitoring method and device
EP3467802A4 (en) Object detection method and object detection device
EP3401671A4 (en) Detection device and detection method
SG11202100089PA (en) Detection device and detection method
IL271806A (en) Cutting-tool detection method and device
SG11202100206TA (en) Configuration method and device
GB2578226B (en) Sensor device and method
EP3401672A4 (en) Flaw detection device and flaw detection method
GB2573752B (en) Sensor device and method
GB2564929B (en) Sensor device and method
SG11202011193PA (en) Detection device and detection system
SG11202011154RA (en) Detection device and detection system
SG11202100352YA (en) Interaction method and device
EP3561442A4 (en) Sheet-edge detection device and sheet-edge detection method
EP3460469A4 (en) Detection device and detection method
EP3816829A4 (en) Detection device and detection method
EP3611476A4 (en) Position detection device and position detection method
EP3611478A4 (en) Position detection device and position detection method
EP3570057A4 (en) Relay-welding detection device and detection method
EP3672281C0 (en) Hearing device with own-voice detection and related method
GB201818884D0 (en) Forthing device and method thereof
GB201807414D0 (en) Testing device and method
SG11202002072PA (en) Analysis device and analysis method
EP3489661A4 (en) Detection method and detection device
EP3732926A4 (en) Method and device for nprach detection