JP4273739B2 - 誘電加熱接着用樹脂組成物、ホットメルト接着剤、被接着材の接着方法、ホットメルト接着剤の被接着材として用いられる被接着用樹脂組成物および接着複合体 - Google Patents

誘電加熱接着用樹脂組成物、ホットメルト接着剤、被接着材の接着方法、ホットメルト接着剤の被接着材として用いられる被接着用樹脂組成物および接着複合体 Download PDF

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JP4273739B2
JP4273739B2 JP2002302186A JP2002302186A JP4273739B2 JP 4273739 B2 JP4273739 B2 JP 4273739B2 JP 2002302186 A JP2002302186 A JP 2002302186A JP 2002302186 A JP2002302186 A JP 2002302186A JP 4273739 B2 JP4273739 B2 JP 4273739B2
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adhesive
resin composition
present
dielectric
resin
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JP2002302186A
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Japanese (ja)
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JP2003193009A5 (enExample
JP2003193009A (ja
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法 葭原
聡 谷口
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Toyobo Co Ltd
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Toyobo Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2002302186A 2001-10-16 2002-10-16 誘電加熱接着用樹脂組成物、ホットメルト接着剤、被接着材の接着方法、ホットメルト接着剤の被接着材として用いられる被接着用樹脂組成物および接着複合体 Expired - Fee Related JP4273739B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002302186A JP4273739B2 (ja) 2001-10-16 2002-10-16 誘電加熱接着用樹脂組成物、ホットメルト接着剤、被接着材の接着方法、ホットメルト接着剤の被接着材として用いられる被接着用樹脂組成物および接着複合体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-318174 2001-10-16
JP2001318174 2001-10-16
JP2002302186A JP4273739B2 (ja) 2001-10-16 2002-10-16 誘電加熱接着用樹脂組成物、ホットメルト接着剤、被接着材の接着方法、ホットメルト接着剤の被接着材として用いられる被接着用樹脂組成物および接着複合体

Related Child Applications (1)

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JP2003161068A Division JP4097566B2 (ja) 2001-10-16 2003-06-05 接着複合体の解体方法

Publications (3)

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JP2003193009A JP2003193009A (ja) 2003-07-09
JP2003193009A5 JP2003193009A5 (enExample) 2004-07-15
JP4273739B2 true JP4273739B2 (ja) 2009-06-03

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JP2002302186A Expired - Fee Related JP4273739B2 (ja) 2001-10-16 2002-10-16 誘電加熱接着用樹脂組成物、ホットメルト接着剤、被接着材の接着方法、ホットメルト接着剤の被接着材として用いられる被接着用樹脂組成物および接着複合体

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JP (1) JP4273739B2 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4051605B2 (ja) * 2002-02-15 2008-02-27 東洋紡績株式会社 樹脂組成物、それを用いた接着剤およびその接着方法
US20040249042A1 (en) * 2003-06-09 2004-12-09 Motorola, Inc. Microwave removable coating
KR100884511B1 (ko) 2003-09-30 2009-02-18 가부시키가이샤 닛폰 쇼쿠바이 복합유전체용 수지 조성물 및 복합유전체, 그 유전체를사용한 전기회로기판
JP2005131759A (ja) * 2003-10-31 2005-05-26 Denso Corp 融解・凝固式組成物および融解・凝固式ワーク固定剤ならびにこれらの被覆体
CN100584915C (zh) * 2004-02-18 2010-01-27 三菱树脂株式会社 粘合剂及使用该粘合剂的电气材料用包覆膜
JP2010006908A (ja) * 2008-06-25 2010-01-14 Denso Corp 接着剤、接着構造体及び高周波誘電加熱接着装置
US20120202057A1 (en) 2009-09-02 2012-08-09 Kaneka Corporation Hot-melt adhesive material for induction heating
JP6123047B2 (ja) * 2012-02-17 2017-05-10 埼玉県 樹脂接合方法
MX363710B (es) * 2013-05-23 2019-03-29 Bostik Inc Adhesivo termofusible basado en homopolimeros de polipropileno de bajo punto de fusion.
KR101728717B1 (ko) 2015-12-24 2017-04-20 한국신발피혁연구원 접착공정을 단축시킬 수 있는 유도가열이 가능한 피착재 조성물을 이용한 유도가열 방법
KR101860998B1 (ko) * 2016-04-22 2018-07-02 부경대학교 산학협력단 유도 가열 가능한 접착 필름 및 이를 이용한 접착 장치
EP3533848A4 (en) 2016-10-27 2020-09-30 LINTEC Corporation DIELECTRIC HEATED BOND FILM AND BINDING METHOD USING IT
US20200010730A1 (en) 2017-02-09 2020-01-09 Lintec Corporation Dielectric heating adhesive film and adhesion method using dielectric heating adhesive film
KR102776201B1 (ko) * 2018-09-20 2025-03-07 도레이 카부시키가이샤 열가소성 폴리에스테르 수지 조성물 및 성형품
JP7312539B2 (ja) * 2018-10-31 2023-07-21 リンテック株式会社 高周波誘電加熱接着シート
WO2021039661A1 (ja) * 2019-08-23 2021-03-04 株式会社クラレ 複合成形体の製造方法
KR20220082010A (ko) * 2019-10-10 2022-06-16 엘지전자 주식회사 유도 가열형 접착제 및 이의 제조 방법
CN115996998A (zh) * 2020-06-30 2023-04-21 琳得科株式会社 高频介电加热粘接片

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