JP4260849B2 - 固体撮像装置およびそれを備えた電子機器 - Google Patents
固体撮像装置およびそれを備えた電子機器 Download PDFInfo
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- JP4260849B2 JP4260849B2 JP2007085925A JP2007085925A JP4260849B2 JP 4260849 B2 JP4260849 B2 JP 4260849B2 JP 2007085925 A JP2007085925 A JP 2007085925A JP 2007085925 A JP2007085925 A JP 2007085925A JP 4260849 B2 JP4260849 B2 JP 4260849B2
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- 238000003384 imaging method Methods 0.000 title claims description 66
- 230000003287 optical effect Effects 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 description 91
- 230000001070 adhesive effect Effects 0.000 description 84
- 239000011521 glass Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 5
- 230000000717 retained effect Effects 0.000 description 3
- 241000135309 Processus Species 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
- G02B7/08—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/022—Mountings, adjusting means, or light-tight connections, for optical elements for lenses lens and mount having complementary engagement means, e.g. screw/thread
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Description
外部の光を固体撮像素子の受光面に導くレンズと、レンズ位置を調整する位置調整部と、そのレンズおよび位置調整部を内部に保持するレンズホルダとを備え、位置調整部がレンズホルダに接着された光学ユニットを備えた固体撮像装置であって、
レンズホルダおよび位置調整部は、いずれも光路上に開口が形成されており、
レンズホルダにおける位置調整部の保持面、または、位置調整部における上記保持面との対向面に、上記保持面または対向面上の上記開口から放射状に伸びる複数の突起が形成されていることを特徴としている。
撮像ユニット1は、レンズユニット2によって形成される被写体像を、電気信号に変換する撮像部である。つまり、撮像ユニット1は、レンズユニット2から入射された入射光を光電変換するセンサデバイスである。
配線基板11は、図示しないパターニングされた配線を有する基板である。配線基板11は、例えば、プリント基板,またはセラミック基板などである。
次に、レンズユニット2について説明する。図4は、レンズユニット2の断面図である。レンズユニット2は、被写体像を形成する撮影光学系(光学構造体)である。つまり、レンズユニット2は、外部からの光を撮像ユニット1の受光面(撮像面)へ導くための光路画定器である。
2 レンズユニット(光学ユニット)
3 接着剤
11 配線基板
12 DSP
13 スペーサ
14 固体撮像素子
15 ワイヤ
30 接着剤
40 レンズ
50 レンズホルダ
51 第1ホルダ(レンズホルダ)
52 第2ホルダ(レンズホルダ)
53 開口
60 AF/Zoomモジュール(位置調整部)
61 駆動部
61a コイル
61b 突起
62 可動部
63 開口
70 リッドガラス
100 カメラモジュール(固体撮像装置)
Claims (7)
- 固体撮像素子を備えた撮像ユニット、および、
外部の光を固体撮像素子の受光面に導くレンズと、レンズ位置を調整する位置調整部と、そのレンズおよび位置調整部を内部に保持するレンズホルダとを備え、位置調整部がレンズホルダに接着された光学ユニットを備えた固体撮像装置であって、
レンズホルダおよび位置調整部は、いずれも光路上に開口が形成されており、
レンズホルダにおける位置調整部の保持面、または、位置調整部における上記保持面との対向面に、上記保持面または対向面上の上記開口から放射状に伸びる複数の突起が形成されていることを特徴とする固体撮像装置。 - 複数の突起の各突起は、上記開口からレンズホルダまたは位置調整部の外縁部へ、弓状に伸びていることを特徴とする請求項1に記載の固体撮像装置。
- 隣り合う2つの突起間の幅が、上記開口からレンズホルダまたは位置調整部の外縁部へ向かって、広くなっていることを特徴とする請求項1または2に記載の固体撮像装置。
- 複数の突起が、渦巻き状に形成されていることを特徴とする請求項1〜3のいずれか1項に記載の固体撮像装置。
- 上記保持面または対向面上の突起形成領域が、突起非形成領域よりも広くなっていることを特徴とする請求項1に記載の固体撮像装置。
- 上記保持面または対向面上の突起形成領域が、突起非形成領域よりも狭くなっていることを特徴とする請求項1に記載の固体撮像装置。
- 請求項1〜6のいずれか1項に記載の固体撮像装置を備えた電子機器。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007085925A JP4260849B2 (ja) | 2007-03-28 | 2007-03-28 | 固体撮像装置およびそれを備えた電子機器 |
TW097110575A TWI352833B (en) | 2007-03-28 | 2008-03-25 | Solid-state imaging device and electronic device i |
KR1020080028423A KR100951624B1 (ko) | 2007-03-28 | 2008-03-27 | 고체 촬상 장치 및 그것을 구비한 전자기기 |
CN2008100879009A CN101277388B (zh) | 2007-03-28 | 2008-03-27 | 固态摄像装置和具有该装置的电子设备 |
US12/079,520 US7626774B2 (en) | 2007-03-28 | 2008-03-27 | Solid-state imaging device and electronic device including same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007085925A JP4260849B2 (ja) | 2007-03-28 | 2007-03-28 | 固体撮像装置およびそれを備えた電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008245155A JP2008245155A (ja) | 2008-10-09 |
JP4260849B2 true JP4260849B2 (ja) | 2009-04-30 |
Family
ID=39793851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007085925A Expired - Fee Related JP4260849B2 (ja) | 2007-03-28 | 2007-03-28 | 固体撮像装置およびそれを備えた電子機器 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7626774B2 (ja) |
JP (1) | JP4260849B2 (ja) |
KR (1) | KR100951624B1 (ja) |
CN (1) | CN101277388B (ja) |
TW (1) | TWI352833B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5505618B2 (ja) | 2008-12-25 | 2014-05-28 | 株式会社リコー | 光源装置、光走査装置及び画像形成装置 |
US20110002055A1 (en) * | 2009-07-02 | 2011-01-06 | Chan Yi-Liang | Lens structure for miniature lens driving mechanism and manufacturing method thereof |
US8866964B2 (en) * | 2011-09-09 | 2014-10-21 | Verint Systems Inc. | Assemblies and methods for reducing the complexity of camera mounting assemblies |
JP5900798B2 (ja) * | 2012-04-04 | 2016-04-06 | 株式会社リコー | 光走査装置および画像形成装置 |
JP5945933B2 (ja) * | 2012-05-08 | 2016-07-05 | 株式会社リコー | 光走査装置および画像形成装置 |
DE102015117611A1 (de) * | 2015-10-16 | 2017-04-20 | Connaught Electronics Ltd. | Linseneinrichtung für eine Kamera eines Kraftfahrzeugs mit verbessertem Klebebereich, Kamera, Kraftfahrzeug sowie Verfahren |
JP7412182B2 (ja) * | 2020-01-10 | 2024-01-12 | 三菱電機株式会社 | はんだ板材、および光素子用パッケージの製造方法 |
CN113471153B (zh) * | 2021-06-30 | 2022-11-11 | 上海中航光电子有限公司 | 封装结构及封装方法、摄像头模组及电子设备 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4034031B2 (ja) * | 2000-08-01 | 2008-01-16 | 三菱電機株式会社 | 撮像装置 |
JP2004146946A (ja) * | 2002-10-22 | 2004-05-20 | Sony Corp | 固体撮像装置及びその製造方法 |
JP2005070609A (ja) | 2003-08-27 | 2005-03-17 | Sankyo Seiki Mfg Co Ltd | レンズ駆動装置の駆動方法およびレンズ駆動装置ならびにカメラ |
JP2005236754A (ja) | 2004-02-20 | 2005-09-02 | Toko Inc | イメージセンサモジュール |
JP2006120993A (ja) | 2004-10-25 | 2006-05-11 | Toppan Forms Co Ltd | Icチップおよびこれが実装されたシート |
US7555210B2 (en) * | 2005-02-28 | 2009-06-30 | Siimpel, Inc. | Axial snubbers for camera |
-
2007
- 2007-03-28 JP JP2007085925A patent/JP4260849B2/ja not_active Expired - Fee Related
-
2008
- 2008-03-25 TW TW097110575A patent/TWI352833B/zh not_active IP Right Cessation
- 2008-03-27 KR KR1020080028423A patent/KR100951624B1/ko not_active IP Right Cessation
- 2008-03-27 CN CN2008100879009A patent/CN101277388B/zh not_active Expired - Fee Related
- 2008-03-27 US US12/079,520 patent/US7626774B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2008245155A (ja) | 2008-10-09 |
US20080239522A1 (en) | 2008-10-02 |
US7626774B2 (en) | 2009-12-01 |
KR100951624B1 (ko) | 2010-04-09 |
CN101277388B (zh) | 2010-06-09 |
KR20080088462A (ko) | 2008-10-02 |
TW200907456A (en) | 2009-02-16 |
TWI352833B (en) | 2011-11-21 |
CN101277388A (zh) | 2008-10-01 |
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