JP4255645B2 - 検査方法及び検査装置 - Google Patents
検査方法及び検査装置 Download PDFInfo
- Publication number
- JP4255645B2 JP4255645B2 JP2002066275A JP2002066275A JP4255645B2 JP 4255645 B2 JP4255645 B2 JP 4255645B2 JP 2002066275 A JP2002066275 A JP 2002066275A JP 2002066275 A JP2002066275 A JP 2002066275A JP 4255645 B2 JP4255645 B2 JP 4255645B2
- Authority
- JP
- Japan
- Prior art keywords
- inspection
- circuit
- element substrate
- circuit elements
- display substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007689 inspection Methods 0.000 title claims description 195
- 238000000034 method Methods 0.000 title claims description 98
- 239000000758 substrate Substances 0.000 claims description 230
- 230000005684 electric field Effects 0.000 claims description 56
- 230000007547 defect Effects 0.000 claims description 35
- 238000007493 shaping process Methods 0.000 claims description 25
- 238000005520 cutting process Methods 0.000 claims description 24
- 239000007788 liquid Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 35
- 230000002950 deficient Effects 0.000 description 27
- 239000010408 film Substances 0.000 description 20
- 239000004973 liquid crystal related substance Substances 0.000 description 20
- 210000004027 cell Anatomy 0.000 description 17
- 239000013078 crystal Substances 0.000 description 15
- 239000000523 sample Substances 0.000 description 14
- 239000003990 capacitor Substances 0.000 description 11
- 230000003287 optical effect Effects 0.000 description 10
- 238000005070 sampling Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 238000012544 monitoring process Methods 0.000 description 9
- 239000000428 dust Substances 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 230000007261 regionalization Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 230000005697 Pockels effect Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000005674 electromagnetic induction Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Images
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Tests Of Electronic Circuits (AREA)
- Liquid Crystal (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002066275A JP4255645B2 (ja) | 2001-03-19 | 2002-03-12 | 検査方法及び検査装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001-79598 | 2001-03-19 | ||
| JP2001079598 | 2001-03-19 | ||
| JP2002066275A JP4255645B2 (ja) | 2001-03-19 | 2002-03-12 | 検査方法及び検査装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007032820A Division JP4757810B2 (ja) | 2001-03-19 | 2007-02-14 | 半導体装置、検査装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002350513A JP2002350513A (ja) | 2002-12-04 |
| JP2002350513A5 JP2002350513A5 (enrdf_load_stackoverflow) | 2005-10-27 |
| JP4255645B2 true JP4255645B2 (ja) | 2009-04-15 |
Family
ID=26611611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002066275A Expired - Fee Related JP4255645B2 (ja) | 2001-03-19 | 2002-03-12 | 検査方法及び検査装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4255645B2 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7205986B2 (en) | 2002-12-18 | 2007-04-17 | Semiconductor Energy Laboratory Co., Ltd. | Image display device and testing method of the same |
| WO2004086070A1 (ja) | 2003-03-25 | 2004-10-07 | Semiconductor Energy Laboratory Co. Ltd. | 半導体装置の検査回路、および検査方法 |
| US7518602B2 (en) | 2004-12-06 | 2009-04-14 | Semiconductor Energy Laboratory Co., Ltd. | Test circuit and display device having the same |
| TWI560456B (en) * | 2009-03-20 | 2016-12-01 | Bravechips Microelectronics | Method of parallel ic test and wafer containing same function dies under test and ic chips containing same function blocks under test |
| CN111640219B (zh) * | 2020-06-04 | 2022-11-18 | 许昌开普电气研究院有限公司 | 基于架空线路的巡线机器人控制系统及方法 |
| CN115810317B (zh) * | 2021-09-13 | 2025-03-18 | 重庆康佳光电科技有限公司 | 电路背板检测装置及电路背板检测方法 |
-
2002
- 2002-03-12 JP JP2002066275A patent/JP4255645B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002350513A (ja) | 2002-12-04 |
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