JP4255616B2 - 電界放出表示装置及びその製造方法 - Google Patents
電界放出表示装置及びその製造方法 Download PDFInfo
- Publication number
- JP4255616B2 JP4255616B2 JP2000512225A JP2000512225A JP4255616B2 JP 4255616 B2 JP4255616 B2 JP 4255616B2 JP 2000512225 A JP2000512225 A JP 2000512225A JP 2000512225 A JP2000512225 A JP 2000512225A JP 4255616 B2 JP4255616 B2 JP 4255616B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- aluminum
- display device
- field emission
- band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J3/00—Details of electron-optical or ion-optical arrangements or of ion traps common to two or more basic types of discharge tubes or lamps
- H01J3/02—Electron guns
- H01J3/021—Electron guns using a field emission, photo emission, or secondary emission electron source
- H01J3/022—Electron guns using a field emission, photo emission, or secondary emission electron source with microengineered cathode, e.g. Spindt-type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
- H01J1/02—Main electrodes
- H01J1/30—Cold cathodes, e.g. field-emissive cathode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/022—Manufacture of electrodes or electrode systems of cold cathodes
- H01J9/025—Manufacture of electrodes or electrode systems of cold cathodes of field emission cathodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/02—Manufacture of electrodes or electrode systems
- H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/30—Cold cathodes
- H01J2201/304—Field emission cathodes
- H01J2201/30403—Field emission cathodes characterised by the emitter shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2329/00—Electron emission display panels, e.g. field emission display panels
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
- Electrodes For Cathode-Ray Tubes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/932,318 | 1997-09-17 | ||
| US08/932,318 US5894188A (en) | 1997-09-17 | 1997-09-17 | Dual-layer metal for flat panel display |
| PCT/US1998/018786 WO1999014780A1 (en) | 1997-09-17 | 1998-09-10 | Dual-layer metal for flat panel display |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001516942A JP2001516942A (ja) | 2001-10-02 |
| JP2001516942A5 JP2001516942A5 (enExample) | 2006-01-05 |
| JP4255616B2 true JP4255616B2 (ja) | 2009-04-15 |
Family
ID=25462137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000512225A Expired - Fee Related JP4255616B2 (ja) | 1997-09-17 | 1998-09-10 | 電界放出表示装置及びその製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US5894188A (enExample) |
| EP (1) | EP1016113B1 (enExample) |
| JP (1) | JP4255616B2 (enExample) |
| KR (1) | KR20010023850A (enExample) |
| DE (1) | DE69839124T2 (enExample) |
| WO (1) | WO1999014780A1 (enExample) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5894188A (en) * | 1997-09-17 | 1999-04-13 | Candescent Technologies Corporation | Dual-layer metal for flat panel display |
| US6433473B1 (en) * | 1998-10-29 | 2002-08-13 | Candescent Intellectual Property Services, Inc. | Row electrode anodization |
| US6822386B2 (en) * | 1999-03-01 | 2004-11-23 | Micron Technology, Inc. | Field emitter display assembly having resistor layer |
| US6462467B1 (en) * | 1999-08-11 | 2002-10-08 | Sony Corporation | Method for depositing a resistive material in a field emission cathode |
| US7052350B1 (en) * | 1999-08-26 | 2006-05-30 | Micron Technology, Inc. | Field emission device having insulated column lines and method manufacture |
| US6635983B1 (en) * | 1999-09-02 | 2003-10-21 | Micron Technology, Inc. | Nitrogen and phosphorus doped amorphous silicon as resistor for field emission device baseplate |
| US6710525B1 (en) * | 1999-10-19 | 2004-03-23 | Candescent Technologies Corporation | Electrode structure and method for forming electrode structure for a flat panel display |
| US20020184970A1 (en) * | 2001-12-13 | 2002-12-12 | Wickersham Charles E. | Sptutter targets and methods of manufacturing same to reduce particulate emission during sputtering |
| KR100783304B1 (ko) | 2000-05-11 | 2007-12-10 | 토소우 에스엠디, 인크 | 음파 위상 변화 검출을 이용하여 스퍼터 타겟들에서 비파괴 청결도를 평가하는 방법 및 장치 |
| US6800877B2 (en) * | 2000-05-26 | 2004-10-05 | Exaconnect Corp. | Semi-conductor interconnect using free space electron switch |
| US6801002B2 (en) * | 2000-05-26 | 2004-10-05 | Exaconnect Corp. | Use of a free space electron switch in a telecommunications network |
| US7064500B2 (en) * | 2000-05-26 | 2006-06-20 | Exaconnect Corp. | Semi-conductor interconnect using free space electron switch |
| US6407516B1 (en) | 2000-05-26 | 2002-06-18 | Exaconnect Inc. | Free space electron switch |
| US6545425B2 (en) | 2000-05-26 | 2003-04-08 | Exaconnect Corp. | Use of a free space electron switch in a telecommunications network |
| KR20030029049A (ko) * | 2000-05-31 | 2003-04-11 | 켄데스센트 테크날러지스 코퍼레이션 | 다층 전극 구조 및 그것의 형성방법 |
| US6796867B2 (en) * | 2000-10-27 | 2004-09-28 | Science Applications International Corporation | Use of printing and other technology for micro-component placement |
| US6570335B1 (en) | 2000-10-27 | 2003-05-27 | Science Applications International Corporation | Method and system for energizing a micro-component in a light-emitting panel |
| US6620012B1 (en) * | 2000-10-27 | 2003-09-16 | Science Applications International Corporation | Method for testing a light-emitting panel and the components therein |
| US6545422B1 (en) * | 2000-10-27 | 2003-04-08 | Science Applications International Corporation | Socket for use with a micro-component in a light-emitting panel |
| US6801001B2 (en) * | 2000-10-27 | 2004-10-05 | Science Applications International Corporation | Method and apparatus for addressing micro-components in a plasma display panel |
| US6762566B1 (en) | 2000-10-27 | 2004-07-13 | Science Applications International Corporation | Micro-component for use in a light-emitting panel |
| US6764367B2 (en) * | 2000-10-27 | 2004-07-20 | Science Applications International Corporation | Liquid manufacturing processes for panel layer fabrication |
| US6822626B2 (en) | 2000-10-27 | 2004-11-23 | Science Applications International Corporation | Design, fabrication, testing, and conditioning of micro-components for use in a light-emitting panel |
| US6612889B1 (en) * | 2000-10-27 | 2003-09-02 | Science Applications International Corporation | Method for making a light-emitting panel |
| US6935913B2 (en) * | 2000-10-27 | 2005-08-30 | Science Applications International Corporation | Method for on-line testing of a light emitting panel |
| US7288014B1 (en) | 2000-10-27 | 2007-10-30 | Science Applications International Corporation | Design, fabrication, testing, and conditioning of micro-components for use in a light-emitting panel |
| KR100841915B1 (ko) * | 2001-04-04 | 2008-06-30 | 토소우 에스엠디, 인크 | 알루미늄 또는 알루미늄 합금 스퍼터링 타겟 내의알루미늄 산화물 함유물에 대한 임계 크기 결정 방법 |
| US6632117B1 (en) * | 2001-06-26 | 2003-10-14 | Candescent Intellectual Property Services, Inc. | Frit protection in sealing process for flat panel displays |
| US6565400B1 (en) * | 2001-06-26 | 2003-05-20 | Candescent Technologies Corporation | Frit protection in sealing process for flat panel displays |
| KR100923000B1 (ko) * | 2001-08-09 | 2009-10-22 | 토소우 에스엠디, 인크 | 크기와 위치에 의해 분류되는 흠의 형태에 의한 타켓 청정도 특성을 비파괴적으로 결정하기 위한 방법 및 장치 |
| US6406926B1 (en) * | 2001-08-15 | 2002-06-18 | Motorola, Inc. | Method of forming a vacuum micro-electronic device |
| US7064475B2 (en) * | 2002-12-26 | 2006-06-20 | Canon Kabushiki Kaisha | Electron source structure covered with resistance film |
| US20050189164A1 (en) * | 2004-02-26 | 2005-09-01 | Chang Chi L. | Speaker enclosure having outer flared tube |
| US11483053B2 (en) | 2018-06-01 | 2022-10-25 | Telefonaktiebolaget Lm Ericsson (Publ) | Approaches for beam selection |
| EP3888258B1 (en) | 2018-11-30 | 2022-08-10 | Telefonaktiebolaget Lm Ericsson (Publ) | Approaches for beam selection |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5144191A (en) * | 1991-06-12 | 1992-09-01 | Mcnc | Horizontal microelectronic field emission devices |
| WO1994020975A1 (en) * | 1993-03-11 | 1994-09-15 | Fed Corporation | Emitter tip structure and field emission device comprising same, and method of making same |
| US5601466A (en) * | 1995-04-19 | 1997-02-11 | Texas Instruments Incorporated | Method for fabricating field emission device metallization |
| AU6273396A (en) * | 1995-06-13 | 1997-01-09 | Advanced Vision Technologies, Inc. | Laminar composite lateral field-emission cathode and fabrica tion process |
| US5780960A (en) * | 1996-12-18 | 1998-07-14 | Texas Instruments Incorporated | Micro-machined field emission microtips |
| US5894188A (en) * | 1997-09-17 | 1999-04-13 | Candescent Technologies Corporation | Dual-layer metal for flat panel display |
-
1997
- 1997-09-17 US US08/932,318 patent/US5894188A/en not_active Expired - Lifetime
-
1998
- 1998-09-10 WO PCT/US1998/018786 patent/WO1999014780A1/en not_active Ceased
- 1998-09-10 JP JP2000512225A patent/JP4255616B2/ja not_active Expired - Fee Related
- 1998-09-10 EP EP98945990A patent/EP1016113B1/en not_active Expired - Lifetime
- 1998-09-10 DE DE69839124T patent/DE69839124T2/de not_active Expired - Lifetime
- 1998-09-10 KR KR1020007002527A patent/KR20010023850A/ko not_active Withdrawn
- 1998-10-29 US US09/183,601 patent/US6019657A/en not_active Expired - Lifetime
-
1999
- 1999-11-09 US US09/437,346 patent/US6225732B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US5894188A (en) | 1999-04-13 |
| EP1016113B1 (en) | 2008-02-13 |
| EP1016113A4 (en) | 2005-08-17 |
| JP2001516942A (ja) | 2001-10-02 |
| DE69839124D1 (de) | 2008-03-27 |
| EP1016113A1 (en) | 2000-07-05 |
| US6019657A (en) | 2000-02-01 |
| WO1999014780A1 (en) | 1999-03-25 |
| DE69839124T2 (de) | 2009-03-05 |
| KR20010023850A (ko) | 2001-03-26 |
| US6225732B1 (en) | 2001-05-01 |
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