DE69839124T2 - Doppelschichtmetall für eine flache anzeigetafel - Google Patents

Doppelschichtmetall für eine flache anzeigetafel Download PDF

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Publication number
DE69839124T2
DE69839124T2 DE69839124T DE69839124T DE69839124T2 DE 69839124 T2 DE69839124 T2 DE 69839124T2 DE 69839124 T DE69839124 T DE 69839124T DE 69839124 T DE69839124 T DE 69839124T DE 69839124 T2 DE69839124 T2 DE 69839124T2
Authority
DE
Germany
Prior art keywords
layer
metal
aluminum
cladding
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69839124T
Other languages
German (de)
English (en)
Other versions
DE69839124D1 (de
Inventor
Kishore K. San Jose Chakravorty
Swayambu San Jose RAMANI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69839124D1 publication Critical patent/DE69839124D1/de
Application granted granted Critical
Publication of DE69839124T2 publication Critical patent/DE69839124T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J3/00—Details of electron-optical or ion-optical arrangements or of ion traps common to two or more basic types of discharge tubes or lamps
    • H01J3/02—Electron guns
    • H01J3/021—Electron guns using a field emission, photo emission, or secondary emission electron source
    • H01J3/022—Electron guns using a field emission, photo emission, or secondary emission electron source with microengineered cathode, e.g. Spindt-type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/02—Main electrodes
    • H01J1/30—Cold cathodes, e.g. field-emissive cathode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/022—Manufacture of electrodes or electrode systems of cold cathodes
    • H01J9/025—Manufacture of electrodes or electrode systems of cold cathodes of field emission cathodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2201/00—Electrodes common to discharge tubes
    • H01J2201/30—Cold cathodes
    • H01J2201/304—Field emission cathodes
    • H01J2201/30403—Field emission cathodes characterised by the emitter shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00—Electron emission display panels, e.g. field emission display panels

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cathode-Ray Tubes And Fluorescent Screens For Display (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
DE69839124T 1997-09-17 1998-09-10 Doppelschichtmetall für eine flache anzeigetafel Expired - Lifetime DE69839124T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/932,318 US5894188A (en) 1997-09-17 1997-09-17 Dual-layer metal for flat panel display
US932318 1997-09-17
PCT/US1998/018786 WO1999014780A1 (en) 1997-09-17 1998-09-10 Dual-layer metal for flat panel display

Publications (2)

Publication Number Publication Date
DE69839124D1 DE69839124D1 (de) 2008-03-27
DE69839124T2 true DE69839124T2 (de) 2009-03-05

Family

ID=25462137

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69839124T Expired - Lifetime DE69839124T2 (de) 1997-09-17 1998-09-10 Doppelschichtmetall für eine flache anzeigetafel

Country Status (6)

Country Link
US (3) US5894188A (enExample)
EP (1) EP1016113B1 (enExample)
JP (1) JP4255616B2 (enExample)
KR (1) KR20010023850A (enExample)
DE (1) DE69839124T2 (enExample)
WO (1) WO1999014780A1 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5894188A (en) * 1997-09-17 1999-04-13 Candescent Technologies Corporation Dual-layer metal for flat panel display
US6433473B1 (en) * 1998-10-29 2002-08-13 Candescent Intellectual Property Services, Inc. Row electrode anodization
US6822386B2 (en) * 1999-03-01 2004-11-23 Micron Technology, Inc. Field emitter display assembly having resistor layer
US6462467B1 (en) * 1999-08-11 2002-10-08 Sony Corporation Method for depositing a resistive material in a field emission cathode
US7052350B1 (en) * 1999-08-26 2006-05-30 Micron Technology, Inc. Field emission device having insulated column lines and method manufacture
US6635983B1 (en) * 1999-09-02 2003-10-21 Micron Technology, Inc. Nitrogen and phosphorus doped amorphous silicon as resistor for field emission device baseplate
US6710525B1 (en) * 1999-10-19 2004-03-23 Candescent Technologies Corporation Electrode structure and method for forming electrode structure for a flat panel display
US20020184970A1 (en) * 2001-12-13 2002-12-12 Wickersham Charles E. Sptutter targets and methods of manufacturing same to reduce particulate emission during sputtering
KR100783304B1 (ko) 2000-05-11 2007-12-10 토소우 에스엠디, 인크 음파 위상 변화 검출을 이용하여 스퍼터 타겟들에서 비파괴 청결도를 평가하는 방법 및 장치
US6800877B2 (en) * 2000-05-26 2004-10-05 Exaconnect Corp. Semi-conductor interconnect using free space electron switch
US6801002B2 (en) * 2000-05-26 2004-10-05 Exaconnect Corp. Use of a free space electron switch in a telecommunications network
US7064500B2 (en) * 2000-05-26 2006-06-20 Exaconnect Corp. Semi-conductor interconnect using free space electron switch
US6407516B1 (en) 2000-05-26 2002-06-18 Exaconnect Inc. Free space electron switch
US6545425B2 (en) 2000-05-26 2003-04-08 Exaconnect Corp. Use of a free space electron switch in a telecommunications network
KR20030029049A (ko) * 2000-05-31 2003-04-11 켄데스센트 테크날러지스 코퍼레이션 다층 전극 구조 및 그것의 형성방법
US6796867B2 (en) * 2000-10-27 2004-09-28 Science Applications International Corporation Use of printing and other technology for micro-component placement
US6570335B1 (en) 2000-10-27 2003-05-27 Science Applications International Corporation Method and system for energizing a micro-component in a light-emitting panel
US6620012B1 (en) * 2000-10-27 2003-09-16 Science Applications International Corporation Method for testing a light-emitting panel and the components therein
US6545422B1 (en) * 2000-10-27 2003-04-08 Science Applications International Corporation Socket for use with a micro-component in a light-emitting panel
US6801001B2 (en) * 2000-10-27 2004-10-05 Science Applications International Corporation Method and apparatus for addressing micro-components in a plasma display panel
US6762566B1 (en) 2000-10-27 2004-07-13 Science Applications International Corporation Micro-component for use in a light-emitting panel
US6764367B2 (en) * 2000-10-27 2004-07-20 Science Applications International Corporation Liquid manufacturing processes for panel layer fabrication
US6822626B2 (en) 2000-10-27 2004-11-23 Science Applications International Corporation Design, fabrication, testing, and conditioning of micro-components for use in a light-emitting panel
US6612889B1 (en) * 2000-10-27 2003-09-02 Science Applications International Corporation Method for making a light-emitting panel
US6935913B2 (en) * 2000-10-27 2005-08-30 Science Applications International Corporation Method for on-line testing of a light emitting panel
US7288014B1 (en) 2000-10-27 2007-10-30 Science Applications International Corporation Design, fabrication, testing, and conditioning of micro-components for use in a light-emitting panel
KR100841915B1 (ko) * 2001-04-04 2008-06-30 토소우 에스엠디, 인크 알루미늄 또는 알루미늄 합금 스퍼터링 타겟 내의알루미늄 산화물 함유물에 대한 임계 크기 결정 방법
US6632117B1 (en) * 2001-06-26 2003-10-14 Candescent Intellectual Property Services, Inc. Frit protection in sealing process for flat panel displays
US6565400B1 (en) * 2001-06-26 2003-05-20 Candescent Technologies Corporation Frit protection in sealing process for flat panel displays
KR100923000B1 (ko) * 2001-08-09 2009-10-22 토소우 에스엠디, 인크 크기와 위치에 의해 분류되는 흠의 형태에 의한 타켓 청정도 특성을 비파괴적으로 결정하기 위한 방법 및 장치
US6406926B1 (en) * 2001-08-15 2002-06-18 Motorola, Inc. Method of forming a vacuum micro-electronic device
US7064475B2 (en) * 2002-12-26 2006-06-20 Canon Kabushiki Kaisha Electron source structure covered with resistance film
US20050189164A1 (en) * 2004-02-26 2005-09-01 Chang Chi L. Speaker enclosure having outer flared tube
US11483053B2 (en) 2018-06-01 2022-10-25 Telefonaktiebolaget Lm Ericsson (Publ) Approaches for beam selection
EP3888258B1 (en) 2018-11-30 2022-08-10 Telefonaktiebolaget Lm Ericsson (Publ) Approaches for beam selection

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5144191A (en) * 1991-06-12 1992-09-01 Mcnc Horizontal microelectronic field emission devices
WO1994020975A1 (en) * 1993-03-11 1994-09-15 Fed Corporation Emitter tip structure and field emission device comprising same, and method of making same
US5601466A (en) * 1995-04-19 1997-02-11 Texas Instruments Incorporated Method for fabricating field emission device metallization
AU6273396A (en) * 1995-06-13 1997-01-09 Advanced Vision Technologies, Inc. Laminar composite lateral field-emission cathode and fabrica tion process
US5780960A (en) * 1996-12-18 1998-07-14 Texas Instruments Incorporated Micro-machined field emission microtips
US5894188A (en) * 1997-09-17 1999-04-13 Candescent Technologies Corporation Dual-layer metal for flat panel display

Also Published As

Publication number Publication date
US5894188A (en) 1999-04-13
EP1016113B1 (en) 2008-02-13
EP1016113A4 (en) 2005-08-17
JP4255616B2 (ja) 2009-04-15
JP2001516942A (ja) 2001-10-02
DE69839124D1 (de) 2008-03-27
EP1016113A1 (en) 2000-07-05
US6019657A (en) 2000-02-01
WO1999014780A1 (en) 1999-03-25
KR20010023850A (ko) 2001-03-26
US6225732B1 (en) 2001-05-01

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