JP4238130B2 - 工具の劣化を測定するための装置及び方法 - Google Patents

工具の劣化を測定するための装置及び方法 Download PDF

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Publication number
JP4238130B2
JP4238130B2 JP2003503397A JP2003503397A JP4238130B2 JP 4238130 B2 JP4238130 B2 JP 4238130B2 JP 2003503397 A JP2003503397 A JP 2003503397A JP 2003503397 A JP2003503397 A JP 2003503397A JP 4238130 B2 JP4238130 B2 JP 4238130B2
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JP
Japan
Prior art keywords
tool
sample
cutting tool
semiconductor
state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2003503397A
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English (en)
Japanese (ja)
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JP2004530886A5 (https=
JP2004530886A (ja
Inventor
ロエズネル、ミハエル
シュネーガンズ、マンフレート
ワリス、ダービット
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qimonda Dresden & CoOhg GmbH
Infineon Technologies AG
Original Assignee
Qimonda Dresden & CoOhg GmbH
Infineon Technologies AG
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Publication of JP2004530886A5 publication Critical patent/JP2004530886A5/ja
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/09Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
    • B23Q17/0904Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool before or after machining
    • B23Q17/0909Detection of broken tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23QDETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/24Arrangements for observing, indicating or measuring on machine tools using optics or electromagnetic waves
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/06Grinders for cutting-off
    • B24B27/0683Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
    • B24B49/183Wear compensation without the presence of dressing tools
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/65Raman scattering

Landscapes

  • Mechanical Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
JP2003503397A 2001-06-08 2002-05-02 工具の劣化を測定するための装置及び方法 Expired - Fee Related JP4238130B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/877,531 US6633379B2 (en) 2001-06-08 2001-06-08 Apparatus and method for measuring the degradation of a tool
PCT/US2002/013875 WO2002100592A1 (en) 2001-06-08 2002-05-02 Apparatus and method for measuring tool degradation

Publications (3)

Publication Number Publication Date
JP2004530886A JP2004530886A (ja) 2004-10-07
JP2004530886A5 JP2004530886A5 (https=) 2006-01-05
JP4238130B2 true JP4238130B2 (ja) 2009-03-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003503397A Expired - Fee Related JP4238130B2 (ja) 2001-06-08 2002-05-02 工具の劣化を測定するための装置及び方法

Country Status (7)

Country Link
US (1) US6633379B2 (https=)
EP (1) EP1399291B1 (https=)
JP (1) JP4238130B2 (https=)
KR (1) KR20040039201A (https=)
DE (1) DE60227807D1 (https=)
TW (1) TWI291395B (https=)
WO (1) WO2002100592A1 (https=)

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TWI717302B (zh) * 2020-07-30 2021-01-21 頂極科技股份有限公司 半導體製程零配件的質變檢測系統及方法
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Also Published As

Publication number Publication date
KR20040039201A (ko) 2004-05-10
TWI291395B (en) 2007-12-21
JP2004530886A (ja) 2004-10-07
DE60227807D1 (de) 2008-09-04
WO2002100592A1 (en) 2002-12-19
US6633379B2 (en) 2003-10-14
US20020186370A1 (en) 2002-12-12
TW200417721A (en) 2004-09-16
EP1399291A1 (en) 2004-03-24
EP1399291B1 (en) 2008-07-23

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